Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2462) > Сторінка 30 з 42
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||
|---|---|---|---|---|---|---|---|
 |
PA0134-S | Chip Quik Inc. |
 Description: LLP-8 BODY STENCIL |
товар відсутній |
|||
 |
PA0135 | Chip Quik Inc. |
Description: LLP-10 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP |
товар відсутній |
|||
 |
PA0135-S | Chip Quik Inc. |
Description: LLP-10 STENCIL |
товар відсутній |
|||
 |
PA0136 | Chip Quik Inc. |
Description: LLP-12 TO DIP-12 SMT ADAPTER |
товар відсутній |
|||
 |
PA0136-S | Chip Quik Inc. |
Description: LLP-12 STENCIL |
товар відсутній |
|||
 |
PA0137 | Chip Quik Inc. |
Description: LLP-14 TO DIP-14 SMT ADAPTER |
товар відсутній |
|||
 |
PA0137-S | Chip Quik Inc. |
Description: LLP-14 STENCIL |
товар відсутній |
|||
 |
PA0138 | Chip Quik Inc. |
Description: LLP-16 TO DIP-16 SMT ADAPTER |
товар відсутній |
|||
 |
PA0138-S | Chip Quik Inc. |
Description: LLP-16 STENCIL |
товар відсутній |
|||
 |
PA0139 | Chip Quik Inc. |
Description: LLP-20 TO DIP-20 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0139-S | Chip Quik Inc. |
Description: LLP-20 STENCIL |
товар відсутній |
|||
 |
PA0140 | Chip Quik Inc. |
Description: LLP-24 TO DIP-24 SMT ADAPTER |
товар відсутній |
|||
 |
PA0140-S | Chip Quik Inc. |
Description: LLP-24 STENCIL |
товар відсутній |
|||
 |
PA0141 | Chip Quik Inc. |
Description: LLP-28 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP |
товар відсутній |
|||
 |
PA0141-S | Chip Quik Inc. |
Description: LLP-28 STENCIL |
товар відсутній |
|||
 |
PA0142 | Chip Quik Inc. |
Description: LLP-32 TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0142-S | Chip Quik Inc. |
Description: LLP-32 STENCIL |
товар відсутній |
|||
 |
PA0143 | Chip Quik Inc. |
Description: LLP-36 TO DIP-36 SMT ADAPTER |
товар відсутній |
|||
 |
PA0143-S | Chip Quik Inc. |
Description: LLP-36 STENCIL |
товар відсутній |
|||
 |
PA0144 | Chip Quik Inc. |
Description: LLP-40 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0144-S | Chip Quik Inc. |
Description: LLP-40 STENCIL |
товар відсутній |
|||
 |
PA0145 | Chip Quik Inc. |
Description: LLP-44 TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0145-S | Chip Quik Inc. |
Description: LLP-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LLP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
товар відсутній |
|||
 |
PA0146 | Chip Quik Inc. |
Description: LLP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0146-S | Chip Quik Inc. |
Description: LLP-48 STENCIL |
товар відсутній |
|||
 |
PA0147 | Chip Quik Inc. |
Description: LLP-54 TO DIP-54 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0147-S | Chip Quik Inc. |
Description: LLP-54 STENCIL |
товар відсутній |
|||
 |
PA0148 | Chip Quik Inc. |
Description: LLP-56 TO DIP-56 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP Part Status: Active |
товар відсутній |
|||
 |
PA0148-S | Chip Quik Inc. |
Description: LLP-56 STENCIL |
товар відсутній |
|||
 |
PA0149 | Chip Quik Inc. |
Description: LLP-60 TO DIP-60 SMT ADAPTER |
товар відсутній |
|||
 |
PA0149-S | Chip Quik Inc. |
Description: LLP-60 STENCIL |
товар відсутній |
|||
 |
PA0150 | Chip Quik Inc. |
Description: LLP-64 TO DIP-64 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LLP |
товар відсутній |
|||
 |
PA0150-S | Chip Quik Inc. |
Description: LLP-64 STENCIL |
товар відсутній |
|||
 |
PA0151 | Chip Quik Inc. |
Description: LLP-68 TO DIP-68 SMT ADAPTER |
товар відсутній |
|||
 |
PA0151-S | Chip Quik Inc. |
Description: LLP-68 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LLP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 68 |
товар відсутній |
|||
 |
PA0152 | Chip Quik Inc. |
Description: MICROSMD-4 BGA-4 0.5 MM PITCH Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
товар відсутній |
|||
 |
PA0152-S | Chip Quik Inc. |
Description: MICROSMD-4 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
товар відсутній |
|||
 |
PA0153 | Chip Quik Inc. |
Description: MICROSMD-5 BGA-5 0.5 MM PITCH Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
товар відсутній |
|||
 |
PA0153-S | Chip Quik Inc. |
Description: MICROSMD-5 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.055" L x 0.042" W (1.39mm x 1.06mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 5 |
товар відсутній |
|||
 |
PA0154 | Chip Quik Inc. |
Description: MICROSMD-6 BGA-6 0.5 MM PITCH Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0154-S | Chip Quik Inc. |
Description: MICROSMD-6 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.063" L x 0.037" W (1.61mm x 0.95mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
товар відсутній |
|||
 |
PA0155 | Chip Quik Inc. |
Description: MICROSMD-8 BGA-8 0.5 MM PITCH Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
товар відсутній |
|||
 |
PA0155-S | Chip Quik Inc. |
Description: MICROSMD-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.054" L x 0.054" W (1.36mm x 1.36mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
товар відсутній |
|||
 |
PA0157 | Chip Quik Inc. |
Description: MICROSMD-10 BGA-10 0.5 MM PITCH Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
товар відсутній |
|||
 |
PA0157-S | Chip Quik Inc. |
Description: MICROSMD-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.098" L x 0.089" W (2.50mm x 2.25mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 10 |
товар відсутній |
|||
 |
PA0159 | Chip Quik Inc. |
Description: MICROSMD-14 BGA-14 0.5 MM PITCH Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
товар відсутній |
|||
 |
PA0159-S | Chip Quik Inc. |
Description: MICROSMD-14 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: BGA Inner Dimension: 0.094" L x 0.083" W (2.40mm x 2.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 14 |
товар відсутній |
|||
 |
PA0168 | Chip Quik Inc. |
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC Part Status: Active |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0168C | Chip Quik Inc. |
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Number of Positions: 8 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MiniSOIC Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0168-S | Chip Quik Inc. |
Description: MINI SOIC-8 STENCIL |
товар відсутній |
|||
 |
PA0169 | Chip Quik Inc. |
Description: MINI SOIC-10 TO DIP-10 SMT ADAPT Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC |
товар відсутній |
|||
 |
PA0169-S | Chip Quik Inc. |
Description: MINI SOIC-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: Mini SOIC Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 10 |
товар відсутній |
|||
 |
PA0170 | Chip Quik Inc. |
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC EP Part Status: Active |
товар відсутній |
|||
 |
PA0170C | Chip Quik Inc. |
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Number of Positions: 8 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MiniSOIC Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0170-S | Chip Quik Inc. |
Description: MINI SOIC-8 EXP PAD STENCIL |
товар відсутній |
|||
 |
PA0171 | Chip Quik Inc. |
Description: MINI SOIC-10 EXP PAD TO DIP-10 S Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC EP |
товар відсутній |
|||
 |
PA0171-S | Chip Quik Inc. |
Description: MINI SOIC-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: Mini SOIC Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm) Number of Positions: 10 |
товар відсутній |
|||
 |
PA0172 | Chip Quik Inc. |
Description: POS-8 TO DIP-8 SMT ADAPTER |
товар відсутній |
|||
 |
PA0172-S | Chip Quik Inc. |
Description: POS-8 STENCIL |
товар відсутній |
|||
 |
PA0173 | Chip Quik Inc. |
Description: PSOP-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PSOP Part Status: Active |
товар відсутній |
| PA0135 |
|
Виробник: Chip Quik Inc.
Description: LLP-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Description: LLP-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
товар відсутній
| PA0139 |
|
Виробник: Chip Quik Inc.
Description: LLP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0141 |
|
Виробник: Chip Quik Inc.
Description: LLP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Description: LLP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
товар відсутній
| PA0142 |
|
Виробник: Chip Quik Inc.
Description: LLP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0144 |
|
Виробник: Chip Quik Inc.
Description: LLP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0145 |
|
Виробник: Chip Quik Inc.
Description: LLP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0145-S |
|
Виробник: Chip Quik Inc.
Description: LLP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LLP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: LLP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LLP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
| PA0146 |
|
Виробник: Chip Quik Inc.
Description: LLP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0147 |
|
Виробник: Chip Quik Inc.
Description: LLP-54 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-54 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0148 |
|
Виробник: Chip Quik Inc.
Description: LLP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
Description: LLP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Part Status: Active
товар відсутній
| PA0150 |
|
Виробник: Chip Quik Inc.
Description: LLP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
Description: LLP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LLP
товар відсутній
| PA0151-S |
|
Виробник: Chip Quik Inc.
Description: LLP-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LLP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 68
Description: LLP-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LLP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 68
товар відсутній
| PA0152 |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-4 BGA-4 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-4 BGA-4 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
товар відсутній
| PA0152-S |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: MICROSMD-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
товар відсутній
| PA0153 |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-5 BGA-5 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-5 BGA-5 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
товар відсутній
| PA0153-S |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-5 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.055" L x 0.042" W (1.39mm x 1.06mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 5
Description: MICROSMD-5 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.055" L x 0.042" W (1.39mm x 1.06mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 5
товар відсутній
| PA0154 |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-6 BGA-6 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-6 BGA-6 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 295.3 грн |
| PA0154-S |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.063" L x 0.037" W (1.61mm x 0.95mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: MICROSMD-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.063" L x 0.037" W (1.61mm x 0.95mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
товар відсутній
| PA0155 |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-8 BGA-8 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-8 BGA-8 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
товар відсутній
| PA0155-S |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.054" L x 0.054" W (1.36mm x 1.36mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: MICROSMD-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.054" L x 0.054" W (1.36mm x 1.36mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товар відсутній
| PA0157 |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-10 BGA-10 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-10 BGA-10 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
товар відсутній
| PA0157-S |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.098" L x 0.089" W (2.50mm x 2.25mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Description: MICROSMD-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.098" L x 0.089" W (2.50mm x 2.25mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товар відсутній
| PA0159 |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-14 BGA-14 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-14 BGA-14 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
товар відсутній
| PA0159-S |
|
Виробник: Chip Quik Inc.
Description: MICROSMD-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.094" L x 0.083" W (2.40mm x 2.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 14
Description: MICROSMD-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.094" L x 0.083" W (2.40mm x 2.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 14
товар відсутній
| PA0168 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 225.1 грн |
| PA0168C |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 435.7 грн |
| PA0169 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 TO DIP-10 SMT ADAPT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Description: MINI SOIC-10 TO DIP-10 SMT ADAPT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
товар відсутній
| PA0169-S |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товар відсутній
| PA0170 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
Part Status: Active
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
Part Status: Active
товар відсутній
| PA0170C |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 471.56 грн |
| PA0171 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 EXP PAD TO DIP-10 S
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
Description: MINI SOIC-10 EXP PAD TO DIP-10 S
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
товар відсутній
| PA0171-S |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm)
Number of Positions: 10
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm)
Number of Positions: 10
товар відсутній
| PA0173 |
|
Виробник: Chip Quik Inc.
Description: PSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PSOP
Part Status: Active
Description: PSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PSOP
Part Status: Active
товар відсутній