Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2477) > Сторінка 26 з 42
Фото | Назва | Виробник | Інформація |
Доступність |
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PA0030C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Number of Positions: 24 Pitch: 0.025" (0.64mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PA0030-S | Chip Quik Inc. |
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PA0031 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP |
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PA0031-S | Chip Quik Inc. |
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PA0032 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 465 шт: термін постачання 21-31 дні (днів) |
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PA0032C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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PA0032-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
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PA0033 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 225 шт: термін постачання 21-31 дні (днів) |
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PA0033C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 116 шт: термін постачання 21-31 дні (днів) |
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PA0033-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
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PA0034 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 185 шт: термін постачання 21-31 дні (днів) |
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PA0034C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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PA0034-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0035 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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PA0035C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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PA0035-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
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PA0036 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 94 шт: термін постачання 21-31 дні (днів) |
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PA0036C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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PA0036C-N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Number of Positions: 24 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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PA0036-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 24 |
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PA0037 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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PA0037C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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PA0037-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
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PA0038 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
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PA0038-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 30 |
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PA0039 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PA0039C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.900" L x 0.400" W (48.26mm x 10.16mm) Number of Positions: 38 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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PA0039-S | Chip Quik Inc. |
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PA0040 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0040C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PA0040-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
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PA0041 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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PA0041C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm) Number of Positions: 56 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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PA0041-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
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PA0042 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: VSSOP Part Status: Active |
на замовлення 404 шт: термін постачання 21-31 дні (днів) |
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PA0042C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: VSSOP Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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PA0042-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: VSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
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PA0043 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: VSOP Part Status: Active |
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PA0043C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Number of Positions: 8 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: VSOP Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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PA0043-S | Chip Quik Inc. |
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PA0044 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: VSOP Part Status: Active |
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PA0044-S | Chip Quik Inc. |
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PA0045 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: VSOP Part Status: Active |
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PA0045-S | Chip Quik Inc. |
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PA0046 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: VSOP Part Status: Active |
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PA0046-S | Chip Quik Inc. |
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PA0047 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: VSOP |
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PA0047-S | Chip Quik Inc. |
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PA0048 | Chip Quik Inc. |
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PA0048-S | Chip Quik Inc. |
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PA0049 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN, MLP Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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PA0049C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Number of Positions: 6 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: DFN, MLP Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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PA0049-S | Chip Quik Inc. |
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PA0050 | Chip Quik Inc. |
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PA0050-S | Chip Quik Inc. |
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PA0051 | Chip Quik Inc. |
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PA0051-S | Chip Quik Inc. |
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PA0052 | Chip Quik Inc. |
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PA0052-S | Chip Quik Inc. |
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PA0053 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MLP, MLF |
товар відсутній |
PA0030C |
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Виробник: Chip Quik Inc.
Description: QSOP-24 TO DIP-24 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-24 TO DIP-24 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 615.08 грн |
PA0031 |
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Виробник: Chip Quik Inc.
Description: QSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Description: QSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
товар відсутній
PA0032 |
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Виробник: Chip Quik Inc.
Description: TSSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 465 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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2+ | 222.77 грн |
PA0032C |
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Виробник: Chip Quik Inc.
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 432.61 грн |
PA0032-S |
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Виробник: Chip Quik Inc.
Description: TSSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: TSSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
PA0033 |
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Виробник: Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 225 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 257.74 грн |
PA0033C |
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Виробник: Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14 TO DIP-14 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 116 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 467.59 грн |
PA0033-S |
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Виробник: Chip Quik Inc.
Description: TSSOP-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: TSSOP-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
товар відсутній
PA0034 |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 185 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 292.72 грн |
PA0034C |
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Виробник: Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16 TO DIP-16 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 502.56 грн |
PA0034-S |
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Виробник: Chip Quik Inc.
Description: STENCIL TSSOP-16 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: STENCIL TSSOP-16 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.48 грн |
PA0035 |
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Виробник: Chip Quik Inc.
Description: TSSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 110 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 335.29 грн |
PA0035C |
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Виробник: Chip Quik Inc.
Description: TSSOP-20 TO DIP-20 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20 TO DIP-20 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 51 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 545.14 грн |
PA0035-S |
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Виробник: Chip Quik Inc.
Description: TSSOP-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: TSSOP-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
товар відсутній
PA0036 |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 94 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 370.27 грн |
PA0036C |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-24 TO DIP-24 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-24 TO DIP-24 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
PA0036C-N |
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Виробник: Chip Quik Inc.
Description: TSSOP-24 TO DIP-24 NARROW SMT AD
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-24 TO DIP-24 NARROW SMT AD
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
PA0036-S |
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Виробник: Chip Quik Inc.
Description: TSSOP-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
Description: TSSOP-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
товар відсутній
PA0037 |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |
PA0037C |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-28 TO DIP-28 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28 TO DIP-28 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 615.08 грн |
PA0037-S |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: TSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0038 |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товар відсутній
PA0038-S |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 30
Description: TSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 30
товар відсутній
PA0039 |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 488.11 грн |
PA0039C |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-38 TO DIP-38 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.900" L x 0.400" W (48.26mm x 10.16mm)
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-38 TO DIP-38 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.900" L x 0.400" W (48.26mm x 10.16mm)
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 694.16 грн |
PA0040 |
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Виробник: Chip Quik Inc.
Description: TSSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 523.85 грн |
PA0040C |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-48 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 736.73 грн |
PA0040-S |
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Виробник: Chip Quik Inc.
Description: TSSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TSSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0041 |
![]() |
Виробник: Chip Quik Inc.
Description: TSSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 628.77 грн |
PA0041C |
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Виробник: Chip Quik Inc.
Description: TSSOP-56 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-56 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 838.61 грн |
PA0041-S |
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Виробник: Chip Quik Inc.
Description: TSSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TSSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній
PA0042 |
![]() |
Виробник: Chip Quik Inc.
Description: VSSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSSOP
Part Status: Active
Description: VSSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSSOP
Part Status: Active
на замовлення 404 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 222.77 грн |
PA0042C |
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Виробник: Chip Quik Inc.
Description: VSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: VSSOP
Part Status: Active
Description: VSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: VSSOP
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 432.61 грн |
PA0042-S |
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Виробник: Chip Quik Inc.
Description: VSSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: VSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: VSSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: VSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
PA0043 |
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Виробник: Chip Quik Inc.
Description: VSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
Description: VSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
товар відсутній
PA0043C |
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Виробник: Chip Quik Inc.
Description: VSOP-8 TO DIP-8 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
Description: VSOP-8 TO DIP-8 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 432.61 грн |
PA0044 |
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Виробник: Chip Quik Inc.
Description: VSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
Description: VSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
товар відсутній
PA0045 |
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Виробник: Chip Quik Inc.
Description: VSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
Description: VSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
товар відсутній
PA0046 |
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Виробник: Chip Quik Inc.
Description: VSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
Description: VSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Part Status: Active
товар відсутній
PA0047 |
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Виробник: Chip Quik Inc.
Description: VSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
Description: VSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: VSOP
товар відсутній
PA0049 |
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Виробник: Chip Quik Inc.
Description: MLP/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN, MLP
Part Status: Active
Description: MLP/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN, MLP
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 222.77 грн |
PA0049C |
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Виробник: Chip Quik Inc.
Description: MLP/DFN-6 TO DIP-6 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, MLP
Part Status: Active
Description: MLP/DFN-6 TO DIP-6 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, MLP
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 432.61 грн |
PA0053 |
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Виробник: Chip Quik Inc.
Description: MLP/MLF-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MLP, MLF
Description: MLP/MLF-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MLP, MLF
товар відсутній