Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2477) > Сторінка 12 з 42
| Фото | Назва | Виробник | Інформація |
Доступність |
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FPC080P010 | Chip Quik Inc. |
 Description: FPC/FFC SMT CONNECTOR 0.8 MMPackaging: Bulk Size / Dimension: 0.900" x 0.650" (22.86mm x 16.51mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
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FPC080P010-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.618" L x 0.157" W (15.70mm x 4.00mm) Number of Positions: 10 |
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FPC080P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM Packaging: Bulk Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
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FPC080P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.933" L x 0.157" W (23.70mm x 4.00mm) Number of Positions: 20 |
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FPC080P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM Packaging: Bulk Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
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FPC080P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm) Number of Positions: 30 |
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FPC080P040 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
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FPC080P040-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.563" L x 0.157" W (39.70mm x 4.00mm) Number of Positions: 40 |
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FPC100P010 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 0.850" (22.86mm x 21.59mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
на замовлення 132 шт: термін постачання 21-31 дні (днів) |
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FPC100P010-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm) Number of Positions: 10 |
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FPC100P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
на замовлення 77 шт: термін постачання 21-31 дні (днів) |
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FPC100P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.167" L x 0.157" W (29.65mm x 4.00mm) Number of Positions: 20 |
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FPC100P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 1.650" (22.86mm x 41.91mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
на замовлення 141 шт: термін постачання 21-31 дні (днів) |
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FPC100P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.561" L x 0.157" W (39.65mm x 4.00mm) Number of Positions: 30 |
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FPC100P040 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
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FPC100P040-DPT | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR (1 MM PITC Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: FFC/FPC Connector |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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FPC100P040-DPT-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR (1 MM PITC Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Number of Positions: 40 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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FPC100P040-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.955" L x 0.157" W (49.65mm x 4.00mm) Number of Positions: 40 |
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FPC125P010 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1.25 MM Packaging: Bulk Size / Dimension: 0.900" x 0.950" (22.86mm x 24.13mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
на замовлення 76 шт: термін постачання 21-31 дні (днів) |
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FPC125P010-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.872" L x 0.157" W (22.15mm x 4.00mm) Number of Positions: 10 |
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FPC125P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI Packaging: Bulk Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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FPC125P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.364" L x 0.157" W (34.65mm x 4.00mm) Number of Positions: 20 |
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FPC125P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI Packaging: Bulk Size / Dimension: 0.900" x 1.950" (22.86mm x 49.53mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
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FPC125P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.856" L x 0.157" W (47.15mm x 4.00mm) Number of Positions: 30 |
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GA100-10G | Chip Quik Inc. |
Description: GALLIUM METAL 99.99% PURE 10G IN Packaging: Bulk Composition: Ga100 Type: Solder Paste Melting Point: 85.57°F (29.76°C) Form: Syringe, 0.35 oz (9.922g) Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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GA100-50G | Chip Quik Inc. |
Description: GALLIUM METAL 99.99% PURE 50G IN Packaging: Bulk Composition: Ga100 Type: Solder Paste Melting Point: 85.57°F (29.76°C) Form: Syringe, 1.8 oz (51.029g) Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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GEN-DR035-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 40 Packaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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GEN-DR035-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 40 Packaging: Bulk Material: Stainless Steel Number of Positions: 40 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm) Number of Positions: 40 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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GEN-DR035-P60 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 60 Packaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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GEN-DR035-P60-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 60 Packaging: Bulk Material: Stainless Steel Number of Positions: 60 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm) Number of Positions: 60 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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| GEN-DR040-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.40MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: 0.4mm Connector Part Status: Active |
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| GEN-DR040-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.4MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 40 |
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GEN-DR040-P60 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.40MM PITCH 60 Packaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: 0.4mm Connector Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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GEN-DR040-P60-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.4MM PITCH 60- Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 60 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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| GEN-DR045-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.45MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.018" (0.45mm) Proto Board Type: SMD to DIP Package Accepted: 0.45mm Connector Part Status: Active |
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| GEN-DR045-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.45MM PITCH 40 Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Part Status: Active Number of Positions: 40 |
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| GEN-DR050-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.50MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector |
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| GEN-DR050-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.5MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Number of Positions: 40 |
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GEN-DR0635-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.635MM PITCH 4 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.025" (0.64mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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GEN-DR0635-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.635MM PITCH 4 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Part Status: Active Number of Positions: 40 |
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GEN-DR0635-P60 | Chip Quik Inc. |
Description: 0.635MM 60-PIN TO DIP-60 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.025" (0.64mm) Proto Board Type: Connector to DIP Package Accepted: 0.635mm Header Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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GEN-DR0635-P60-S | Chip Quik Inc. |
Description: 0.635MM PITCH 60-PIN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Part Status: Active Number of Positions: 60 |
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| GEN-DR065-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.65MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: 0.65mm Connector Part Status: Active |
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| GEN-DR065-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.65MM PITCH 40 Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Part Status: Active Number of Positions: 40 |
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| GEN-DR070-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.70MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.028" (0.70mm) Proto Board Type: SMD to DIP Package Accepted: 0.7mm Connector |
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| GEN-DR070-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.7MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.028" (0.70mm) Number of Positions: 40 |
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| GEN-DR080-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.80MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: 0.8mm Connector Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| GEN-DR080-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.8MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Part Status: Active Number of Positions: 40 |
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| GEN-DR100-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 1.00MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.039" (1.00mm) Proto Board Type: SMD to DIP Package Accepted: 1mm Connector Part Status: Active |
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| GEN-DR100-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 1.0MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Part Status: Active Number of Positions: 40 |
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| GEN-DR127-P40 | Chip Quik Inc. | Description: GENERIC DUAL ROW 1.27MM PITCH 40 |
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| GEN-DR127-P40-S | Chip Quik Inc. | Description: GENERIC DUAL ROW 1.27MM PITCH 40 |
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GEN-DR150-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 1.5 MM PITCH 40 Packaging: Bulk Material: Stainless Steel Pitch: 0.059" (1.50mm) Inner Dimension: 0.354" L x 0.038" W (9.00mm x 0.97mm) Number of Positions: 40 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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| GEN-DR200-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 2.00MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.079" (2.00mm) Proto Board Type: SMD to DIP Package Accepted: 2mm Connector Part Status: Active |
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| GEN-DR200-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 2.0MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.079" (2.00mm) Part Status: Active Number of Positions: 40 |
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| GEN-DR508-P20 | Chip Quik Inc. | Description: GENERIC DUAL ROW 5.08MM PITCH 20 |
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| GEN-DR508-P20-S | Chip Quik Inc. | Description: GENERIC DUAL ROW 5.08MM PITCH 20 |
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| HDR100IMP06F-G-V-ST | Chip Quik Inc. |
Description: 0.1" 6 PIN VERTICAL FEMALE STACK Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 6 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Number of Rows: 1 |
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HDR100IMP08F-G-V-ST | Chip Quik Inc. |
Description: 0.1" 8 PIN VERTICAL FEMALE STACK Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 8 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Number of Rows: 1 |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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| HDR100IMP10F-G-V-SM-DR | Chip Quik Inc. |
Description: CONN HDR 10POS 0.1 GOLD SMD Packaging: Bulk Connector Type: Header Mounting Type: Surface Mount Number of Positions: 10 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Insulation Height: 0.205" (5.20mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
товар відсутній |
| FPC080P010 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.650" (22.86mm x 16.51mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.650" (22.86mm x 16.51mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
товар відсутній
| FPC080P010-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.618" L x 0.157" W (15.70mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.618" L x 0.157" W (15.70mm x 4.00mm)
Number of Positions: 10
товар відсутній
| FPC080P020 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
товар відсутній
| FPC080P020-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.933" L x 0.157" W (23.70mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.933" L x 0.157" W (23.70mm x 4.00mm)
Number of Positions: 20
товар відсутній
| FPC080P030 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
товар відсутній
| FPC080P030-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm)
Number of Positions: 30
товар відсутній
| FPC080P040 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
товар відсутній
| FPC080P040-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.563" L x 0.157" W (39.70mm x 4.00mm)
Number of Positions: 40
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.563" L x 0.157" W (39.70mm x 4.00mm)
Number of Positions: 40
товар відсутній
| FPC100P010 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 0.850" (22.86mm x 21.59mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 0.850" (22.86mm x 21.59mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
на замовлення 132 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 259.26 грн |
| FPC100P010-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm)
Number of Positions: 10
товар відсутній
| FPC100P020 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
на замовлення 77 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 336.05 грн |
| FPC100P020-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.167" L x 0.157" W (29.65mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.167" L x 0.157" W (29.65mm x 4.00mm)
Number of Positions: 20
товар відсутній
| FPC100P030 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.650" (22.86mm x 41.91mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.650" (22.86mm x 41.91mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
на замовлення 141 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 406.76 грн |
| FPC100P030-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.561" L x 0.157" W (39.65mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.561" L x 0.157" W (39.65mm x 4.00mm)
Number of Positions: 30
товар відсутній
| FPC100P040 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
товар відсутній
| FPC100P040-DPT |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR (1 MM PITC
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: FFC/FPC Connector
Description: FPC/FFC SMT CONNECTOR (1 MM PITC
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: FFC/FPC Connector
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 593.8 грн |
| 5+ | 557.01 грн |
| 10+ | 541.86 грн |
| 25+ | 494.43 грн |
| FPC100P040-DPT-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR (1 MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Number of Positions: 40
Description: FPC/FFC SMT CONNECTOR (1 MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Number of Positions: 40
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 916.92 грн |
| 5+ | 858.95 грн |
| 10+ | 835.08 грн |
| FPC100P040-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.955" L x 0.157" W (49.65mm x 4.00mm)
Number of Positions: 40
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.955" L x 0.157" W (49.65mm x 4.00mm)
Number of Positions: 40
товар відсутній
| FPC125P010 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1.25 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.950" (22.86mm x 24.13mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1.25 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.950" (22.86mm x 24.13mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
на замовлення 76 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 261.54 грн |
| FPC125P010-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.872" L x 0.157" W (22.15mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.872" L x 0.157" W (22.15mm x 4.00mm)
Number of Positions: 10
товар відсутній
| FPC125P020 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 339.86 грн |
| FPC125P020-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.364" L x 0.157" W (34.65mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.364" L x 0.157" W (34.65mm x 4.00mm)
Number of Positions: 20
товар відсутній
| FPC125P030 |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.950" (22.86mm x 49.53mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.950" (22.86mm x 49.53mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
товар відсутній
| FPC125P030-S |
|
Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.856" L x 0.157" W (47.15mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.856" L x 0.157" W (47.15mm x 4.00mm)
Number of Positions: 30
товар відсутній
| GA100-10G |
|
Виробник: Chip Quik Inc.
Description: GALLIUM METAL 99.99% PURE 10G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 0.35 oz (9.922g)
Part Status: Active
Description: GALLIUM METAL 99.99% PURE 10G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 0.35 oz (9.922g)
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1691.67 грн |
| 5+ | 1581.28 грн |
| GA100-50G |
|
Виробник: Chip Quik Inc.
Description: GALLIUM METAL 99.99% PURE 50G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 1.8 oz (51.029g)
Part Status: Active
Description: GALLIUM METAL 99.99% PURE 50G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 1.8 oz (51.029g)
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5573.02 грн |
| GEN-DR035-P40 |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 782.35 грн |
| 10+ | 713.11 грн |
| GEN-DR035-P40-S |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 40
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 40
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1601.2 грн |
| 10+ | 1413.26 грн |
| GEN-DR035-P60 |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1175.43 грн |
| 10+ | 1070.32 грн |
| GEN-DR035-P60-S |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 60
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 60
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1601.2 грн |
| 10+ | 1413.26 грн |
| GEN-DR040-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.40MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.40MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
товар відсутній
| GEN-DR040-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.4MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.4MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR040-P60 |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.40MM PITCH 60
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.40MM PITCH 60
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1052.26 грн |
| GEN-DR040-P60-S |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.4MM PITCH 60-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Description: GENERIC DUAL ROW 0.4MM PITCH 60-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1473.47 грн |
| GEN-DR045-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.018" (0.45mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.45mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.018" (0.45mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.45mm Connector
Part Status: Active
товар відсутній
| GEN-DR045-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR050-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.50MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Description: GENERIC DUAL ROW 0.50MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
товар відсутній
| GEN-DR050-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.5MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Description: GENERIC DUAL ROW 0.5MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 40
товар відсутній
| GEN-DR0635-P40 |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.635MM PITCH 4
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: GENERIC DUAL ROW 0.635MM PITCH 4
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 698.72 грн |
| GEN-DR0635-P40-S |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.635MM PITCH 4
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.635MM PITCH 4
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR0635-P60 |
|
Виробник: Chip Quik Inc.
Description: 0.635MM 60-PIN TO DIP-60
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.025" (0.64mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.635mm Header
Part Status: Active
Description: 0.635MM 60-PIN TO DIP-60
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.025" (0.64mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.635mm Header
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1048.46 грн |
| GEN-DR0635-P60-S |
|
Виробник: Chip Quik Inc.
Description: 0.635MM PITCH 60-PIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Part Status: Active
Number of Positions: 60
Description: 0.635MM PITCH 60-PIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Part Status: Active
Number of Positions: 60
товар відсутній
| GEN-DR065-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.65MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.65mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.65MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.65mm Connector
Part Status: Active
товар відсутній
| GEN-DR065-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.65MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.65MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR070-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.70MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.028" (0.70mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.7mm Connector
Description: GENERIC DUAL ROW 0.70MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.028" (0.70mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.7mm Connector
товар відсутній
| GEN-DR070-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.7MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.028" (0.70mm)
Number of Positions: 40
Description: GENERIC DUAL ROW 0.7MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.028" (0.70mm)
Number of Positions: 40
товар відсутній
| GEN-DR080-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.80MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.8mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.80MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.8mm Connector
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 692.64 грн |
| GEN-DR080-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.8MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.8MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR100-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 1.00MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Proto Board Type: SMD to DIP
Package Accepted: 1mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 1.00MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Proto Board Type: SMD to DIP
Package Accepted: 1mm Connector
Part Status: Active
товар відсутній
| GEN-DR100-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 1.0MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 1.0MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR127-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 1.27MM PITCH 40
Description: GENERIC DUAL ROW 1.27MM PITCH 40
товар відсутній
| GEN-DR150-P40-S |
|
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 1.5 MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.354" L x 0.038" W (9.00mm x 0.97mm)
Number of Positions: 40
Description: GENERIC DUAL ROW 1.5 MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.354" L x 0.038" W (9.00mm x 0.97mm)
Number of Positions: 40
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1586.75 грн |
| 5+ | 1485.37 грн |
| 10+ | 1400.44 грн |
| GEN-DR200-P40 |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 2.00MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.079" (2.00mm)
Proto Board Type: SMD to DIP
Package Accepted: 2mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 2.00MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.079" (2.00mm)
Proto Board Type: SMD to DIP
Package Accepted: 2mm Connector
Part Status: Active
товар відсутній
| GEN-DR200-P40-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 2.0MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.079" (2.00mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 2.0MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.079" (2.00mm)
Part Status: Active
Number of Positions: 40
товар відсутній
| GEN-DR508-P20-S |
Виробник: Chip Quik Inc.
Description: GENERIC DUAL ROW 5.08MM PITCH 20
Description: GENERIC DUAL ROW 5.08MM PITCH 20
товар відсутній
| HDR100IMP06F-G-V-ST |
Виробник: Chip Quik Inc.
Description: 0.1" 6 PIN VERTICAL FEMALE STACK
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 6
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Number of Rows: 1
Description: 0.1" 6 PIN VERTICAL FEMALE STACK
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 6
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Number of Rows: 1
товар відсутній
| HDR100IMP08F-G-V-ST |
Виробник: Chip Quik Inc.
Description: 0.1" 8 PIN VERTICAL FEMALE STACK
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 8
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Number of Rows: 1
Description: 0.1" 8 PIN VERTICAL FEMALE STACK
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 8
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Number of Rows: 1
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 34.97 грн |
| HDR100IMP10F-G-V-SM-DR |
|
Виробник: Chip Quik Inc.
Description: CONN HDR 10POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Insulation Height: 0.205" (5.20mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN HDR 10POS 0.1 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Insulation Height: 0.205" (5.20mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній