Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2477) > Сторінка 31 з 42
| Фото | Назва | Виробник | Інформація |
Доступність |
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PA0168C | Chip Quik Inc. |
 Description: MINI SOIC-8 TO DIP-8 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Number of Positions: 8 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MiniSOIC Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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PA0168-S | Chip Quik Inc. |
Description: MINI SOIC-8 STENCIL |
товар відсутній |
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PA0169 | Chip Quik Inc. |
Description: MINI SOIC-10 TO DIP-10 SMT ADAPT Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC |
товар відсутній |
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PA0169-S | Chip Quik Inc. |
Description: MINI SOIC-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: Mini SOIC Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 10 |
товар відсутній |
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PA0170 | Chip Quik Inc. |
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC EP Part Status: Active |
товар відсутній |
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PA0170C | Chip Quik Inc. |
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Number of Positions: 8 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MiniSOIC Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PA0170-S | Chip Quik Inc. |
Description: MINI SOIC-8 EXP PAD STENCIL |
товар відсутній |
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PA0171 | Chip Quik Inc. |
Description: MINI SOIC-10 EXP PAD TO DIP-10 S Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MiniSOIC EP |
товар відсутній |
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PA0171-S | Chip Quik Inc. |
Description: MINI SOIC-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: Mini SOIC Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm) Number of Positions: 10 |
товар відсутній |
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PA0172 | Chip Quik Inc. |
Description: POS-8 TO DIP-8 SMT ADAPTER |
товар відсутній |
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PA0172-S | Chip Quik Inc. |
Description: POS-8 STENCIL |
товар відсутній |
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PA0173 | Chip Quik Inc. |
Description: PSOP-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PSOP Part Status: Active |
товар відсутній |
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PA0173C | Chip Quik Inc. |
Description: PSOP-8 TO DIP-8 SMT ADAPTER (50 Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Number of Positions: 8 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: PSOP Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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PA0173-S | Chip Quik Inc. |
Description: PSOP-8 STENCIL |
товар відсутній |
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PA0174 | Chip Quik Inc. |
Description: SOT-223-4 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.091" (2.30mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-223 Part Status: Active |
на замовлення 67 шт: термін постачання 21-31 дні (днів) |
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PA0174C | Chip Quik Inc. |
Description: SOT-223-4 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.091" (2.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-223 Part Status: Active |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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PA0174-S | Chip Quik Inc. |
Description: SOT-223-4 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.091" (2.30mm) Type: SOT/SC Inner Dimension: 0.256" L x 0.140" W (6.50mm x 3.56mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.130" L x 0.079" W (3.30mm x 2.00mm) Number of Positions: 3 |
товар відсутній |
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PA0175 | Chip Quik Inc. |
Description: SOT-223-5 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.059" (1.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-223 |
товар відсутній |
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PA0175-S | Chip Quik Inc. |
Description: SOT-223-5 STENCIL |
товар відсутній |
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PA0177 | Chip Quik Inc. |
Description: SOT-523F TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-523F Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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PA0177-S | Chip Quik Inc. |
Description: SOT-523F STENCIL |
товар відсутній |
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PA0178 | Chip Quik Inc. |
Description: SOT-563F TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-563F Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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PA0178C | Chip Quik Inc. |
Description: SOT-563F TO DIP-6 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Number of Positions: 6 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: SOT-563 Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PA0178-S | Chip Quik Inc. |
Description: SOT-563F STENCIL |
товар відсутній |
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PA0179 | Chip Quik Inc. |
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SuperSOT Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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PA0179-S | Chip Quik Inc. |
Description: SUPERSOT-3 STENCIL |
товар відсутній |
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PA0180 | Chip Quik Inc. |
Description: SUPERSOT-6/TSOT-6 TO DIP-6 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SuperSOT, TSOT Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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PA0180C | Chip Quik Inc. |
Description: SUPERSOT-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Number of Positions: 6 Pitch: 0.037" (0.95mm) Proto Board Type: SMD to DIP Package Accepted: SOT-6, TSOT-6 Part Status: Active |
на замовлення 43 шт: термін постачання 21-31 дні (днів) |
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PA0180-S | Chip Quik Inc. |
Description: SUPERSOT-6/TSOT-6 STENCIL |
товар відсутній |
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PA0181 | Chip Quik Inc. |
Description: SUPERSOT-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SuperSOT |
товар відсутній |
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PA0181-S | Chip Quik Inc. |
Description: SUPERSOT-8 STENCIL |
товар відсутній |
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PA0182 | Chip Quik Inc. |
Description: SSOP-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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PA0182C | Chip Quik Inc. |
Description: SSOP-16 TO DIP-16 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.025" (0.64mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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PA0182-S | Chip Quik Inc. |
Description: SSOP-16 STENCIL |
товар відсутній |
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PA0183 | Chip Quik Inc. |
Description: TO-252 DPAK TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.091" (2.30mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-252 (DPAK) Part Status: Active |
на замовлення 159 шт: термін постачання 21-31 дні (днів) |
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PA0183-S | Chip Quik Inc. |
Description: TO-252 STENCIL |
товар відсутній |
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PA0184 | Chip Quik Inc. |
Description: TO-263-3 DDPAK/D2PAK TO DIP-6 SM Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
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PA0184-S | Chip Quik Inc. |
Description: TO-263-3 STENCIL |
товар відсутній |
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PA0185 | Chip Quik Inc. |
Description: TO-263-5 DDPAK/D2PAK TO DIP-10 Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.067" (1.70mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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PA0185-S | Chip Quik Inc. |
Description: TO-263-5 STENCIL |
товар відсутній |
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PA0186 | Chip Quik Inc. |
Description: TO-263-7 DDPAK/D2PAK TO DIP-14 Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 7 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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PA0186-S | Chip Quik Inc. |
Description: TO-263-7 STENCIL |
товар відсутній |
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PA0187 | Chip Quik Inc. |
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 9 Pitch: 0.038" (0.97mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
товар відсутній |
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PA0187-S | Chip Quik Inc. |
Description: TO-263-9 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.038" (0.97mm) Type: TO/DDPAK Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm) Number of Positions: 9 |
товар відсутній |
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PA0188 | Chip Quik Inc. |
Description: LQFP-144 TO PGA-144 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm) Material: FR4 Epoxy Glass Number of Positions: 144 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: LQFP Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0188-S | Chip Quik Inc. |
Description: STENCIL TQFP-144 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 144 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0189 | Chip Quik Inc. |
Description: LQFP-176 TO PGA-176 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm) Material: FR4 Epoxy Glass Number of Positions: 176 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: LQFP Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0189-S | Chip Quik Inc. |
Description: LQFP-176 (0.5MM PITCH, 24X24MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LQFP Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 176 |
товар відсутній |
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PA0190 | Chip Quik Inc. |
Description: TQFP-128 TO PGA-128 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm) Material: FR4 Epoxy Glass Number of Positions: 128 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: TQFP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PA0190-S | Chip Quik Inc. |
Description: TQFP-128 (0.4MM PITCH, 14X14MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 128 |
товар відсутній |
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PA0191 | Chip Quik Inc. |
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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PA0191-S | Chip Quik Inc. |
Description: TSSOP-10-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm) Number of Positions: 10 |
товар відсутній |
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PA0192 | Chip Quik Inc. |
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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PA0192-S | Chip Quik Inc. |
Description: TSSOP-14-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm) Number of Positions: 14 |
товар відсутній |
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PA0193 | Chip Quik Inc. |
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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PA0193-S | Chip Quik Inc. |
Description: TSSOP-16-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm) Number of Positions: 16 |
товар відсутній |
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PA0194 | Chip Quik Inc. |
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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PA0194C | Chip Quik Inc. |
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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PA0194-S | Chip Quik Inc. |
Description: TSSOP-20-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm) Number of Positions: 20 |
товар відсутній |
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PA0195 | Chip Quik Inc. |
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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| PA0168C |
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Виробник: Chip Quik Inc.
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
Description: MINI SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 432.61 грн |
| PA0169 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 TO DIP-10 SMT ADAPT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Description: MINI SOIC-10 TO DIP-10 SMT ADAPT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
товар відсутній
| PA0169-S |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товар відсутній
| PA0170 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
Part Status: Active
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
Part Status: Active
товар відсутній
| PA0170C |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 467.59 грн |
| PA0171 |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 EXP PAD TO DIP-10 S
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
Description: MINI SOIC-10 EXP PAD TO DIP-10 S
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MiniSOIC EP
товар відсутній
| PA0171-S |
|
Виробник: Chip Quik Inc.
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm)
Number of Positions: 10
Description: MINI SOIC-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: Mini SOIC
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.067" W (8.00mm x 1.70mm)
Number of Positions: 10
товар відсутній
| PA0173 |
|
Виробник: Chip Quik Inc.
Description: PSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PSOP
Part Status: Active
Description: PSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PSOP
Part Status: Active
товар відсутній
| PA0173C |
|
Виробник: Chip Quik Inc.
Description: PSOP-8 TO DIP-8 SMT ADAPTER (50
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: PSOP
Part Status: Active
Description: PSOP-8 TO DIP-8 SMT ADAPTER (50
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: PSOP
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 432.61 грн |
| PA0174 |
|
Виробник: Chip Quik Inc.
Description: SOT-223-4 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.091" (2.30mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-223
Part Status: Active
Description: SOT-223-4 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.091" (2.30mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-223
Part Status: Active
на замовлення 67 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 187.79 грн |
| PA0174C |
|
Виробник: Chip Quik Inc.
Description: SOT-223-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.091" (2.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-223
Part Status: Active
Description: SOT-223-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.091" (2.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-223
Part Status: Active
на замовлення 161 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 397.64 грн |
| PA0174-S |
|
Виробник: Chip Quik Inc.
Description: SOT-223-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.091" (2.30mm)
Type: SOT/SC
Inner Dimension: 0.256" L x 0.140" W (6.50mm x 3.56mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.130" L x 0.079" W (3.30mm x 2.00mm)
Number of Positions: 3
Description: SOT-223-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.091" (2.30mm)
Type: SOT/SC
Inner Dimension: 0.256" L x 0.140" W (6.50mm x 3.56mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.130" L x 0.079" W (3.30mm x 2.00mm)
Number of Positions: 3
товар відсутній
| PA0175 |
|
Виробник: Chip Quik Inc.
Description: SOT-223-5 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-223
Description: SOT-223-5 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-223
товар відсутній
| PA0177 |
|
Виробник: Chip Quik Inc.
Description: SOT-523F TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-523F
Part Status: Active
Description: SOT-523F TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-523F
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 222.01 грн |
| PA0178 |
|
Виробник: Chip Quik Inc.
Description: SOT-563F TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-563F
Part Status: Active
Description: SOT-563F TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-563F
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 292.72 грн |
| PA0178C |
|
Виробник: Chip Quik Inc.
Description: SOT-563F TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-563
Part Status: Active
Description: SOT-563F TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-563
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 504.84 грн |
| PA0179 |
|
Виробник: Chip Quik Inc.
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SuperSOT
Part Status: Active
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SuperSOT
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 187.03 грн |
| PA0180 |
|
Виробник: Chip Quik Inc.
Description: SUPERSOT-6/TSOT-6 TO DIP-6 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SuperSOT, TSOT
Part Status: Active
Description: SUPERSOT-6/TSOT-6 TO DIP-6 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SuperSOT, TSOT
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 222.77 грн |
| PA0180C |
|
Виробник: Chip Quik Inc.
Description: SUPERSOT-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-6, TSOT-6
Part Status: Active
Description: SUPERSOT-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-6, TSOT-6
Part Status: Active
на замовлення 43 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 432.61 грн |
| PA0181 |
|
Виробник: Chip Quik Inc.
Description: SUPERSOT-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SuperSOT
Description: SUPERSOT-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SuperSOT
товар відсутній
| PA0182 |
|
Виробник: Chip Quik Inc.
Description: SSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 257.74 грн |
| PA0182C |
|
Виробник: Chip Quik Inc.
Description: SSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 467.59 грн |
| PA0183 |
|
Виробник: Chip Quik Inc.
Description: TO-252 DPAK TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.091" (2.30mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-252 (DPAK)
Part Status: Active
Description: TO-252 DPAK TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.091" (2.30mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-252 (DPAK)
Part Status: Active
на замовлення 159 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 257.74 грн |
| PA0184 |
|
Виробник: Chip Quik Inc.
Description: TO-263-3 DDPAK/D2PAK TO DIP-6 SM
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-3 DDPAK/D2PAK TO DIP-6 SM
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
на замовлення 84 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 294.24 грн |
| PA0185 |
|
Виробник: Chip Quik Inc.
Description: TO-263-5 DDPAK/D2PAK TO DIP-10
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.067" (1.70mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Description: TO-263-5 DDPAK/D2PAK TO DIP-10
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.067" (1.70mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
на замовлення 53 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 336.05 грн |
| PA0186 |
|
Виробник: Chip Quik Inc.
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 370.27 грн |
| PA0187 |
|
Виробник: Chip Quik Inc.
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Pitch: 0.038" (0.97mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Pitch: 0.038" (0.97mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
товар відсутній
| PA0187-S |
|
Виробник: Chip Quik Inc.
Description: TO-263-9 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: TO/DDPAK
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Number of Positions: 9
Description: TO-263-9 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: TO/DDPAK
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Number of Positions: 9
товар відсутній
| PA0188 |
|
Виробник: Chip Quik Inc.
Description: LQFP-144 TO PGA-144 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Description: LQFP-144 TO PGA-144 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1088.75 грн |
| PA0188-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL TQFP-144 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 144
Description: STENCIL TQFP-144 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 144
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 813.52 грн |
| PA0189 |
|
Виробник: Chip Quik Inc.
Description: LQFP-176 TO PGA-176 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 176
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Description: LQFP-176 TO PGA-176 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 176
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1154.9 грн |
| PA0189-S |
Виробник: Chip Quik Inc.
Description: LQFP-176 (0.5MM PITCH, 24X24MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LQFP
Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 176
Description: LQFP-176 (0.5MM PITCH, 24X24MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LQFP
Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 176
товар відсутній
| PA0190 |
|
Виробник: Chip Quik Inc.
Description: TQFP-128 TO PGA-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
Description: TQFP-128 TO PGA-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1084.19 грн |
| PA0190-S |
Виробник: Chip Quik Inc.
Description: TQFP-128 (0.4MM PITCH, 14X14MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 128
Description: TQFP-128 (0.4MM PITCH, 14X14MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 128
товар відсутній
| PA0191 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 292.72 грн |
| PA0191-S |
|
Виробник: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
товар відсутній
| PA0192 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 335.29 грн |
| PA0192-S |
|
Виробник: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
товар відсутній
| PA0193 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 370.27 грн |
| PA0193-S |
|
Виробник: Chip Quik Inc.
Description: TSSOP-16-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 16
Description: TSSOP-16-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 16
товар відсутній
| PA0194 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 405.24 грн |
| PA0194C |
|
Виробник: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 615.08 грн |
| PA0194-S |
|
Виробник: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm)
Number of Positions: 20
Description: TSSOP-20-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm)
Number of Positions: 20
товар відсутній
| PA0195 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 482.03 грн |