Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2477) > Сторінка 25 з 42
Фото | Назва | Виробник | Інформація |
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PA0008 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 291 шт: термін постачання 21-31 дні (днів) |
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PA0008C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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PA0008C-N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.550" W (25.40mm x 13.97mm) Number of Positions: 20 Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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PA0008-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
товар відсутній |
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PA0009 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 230 шт: термін постачання 21-31 дні (днів) |
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PA0009C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
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PA0009C-N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.550" W (30.48mm x 13.97mm) Number of Positions: 24 Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PA0009-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 24 |
товар відсутній |
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PA0010 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOP Part Status: Active |
товар відсутній |
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PA0010-S | Chip Quik Inc. |
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PA0011 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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PA0011C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 436 шт: термін постачання 21-31 дні (днів) |
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PA0011C-N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.550" W (35.56mm x 13.97mm) Number of Positions: 28 Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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PA0011-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товар відсутній |
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PA0012 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
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PA0012-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
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PA0013 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
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PA0013-S | Chip Quik Inc. |
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PA0014 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
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PA0014-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Number of Positions: 54 |
товар відсутній |
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PA0015 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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PA0015-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
товар відсутній |
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PA0016 | Chip Quik Inc. |
![]() ![]() Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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PA0016-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
товар відсутній |
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PA0017 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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PA0017C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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PA0017-S | Chip Quik Inc. |
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PA0018 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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PA0018C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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PA0018-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 20 |
товар відсутній |
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PA0019 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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PA0019C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Number of Positions: 24 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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PA0019-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 24 |
товар відсутній |
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PA0020 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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PA0020C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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PA0020C-N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
товар відсутній |
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PA0020-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 28 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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PA0021 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
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PA0021-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 30 |
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PA0022 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0022-S | Chip Quik Inc. |
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PA0023 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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PA0023-S | Chip Quik Inc. |
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PA0024 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
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PA0024-S | Chip Quik Inc. |
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PA0025 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
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PA0025-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
товар відсутній |
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PA0026 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 136 шт: термін постачання 21-31 дні (днів) |
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PA0026C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 82 шт: термін постачання 21-31 дні (днів) |
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PA0026-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: uMAX Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
товар відсутній |
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PA0027 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
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PA0027C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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PA0027-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: uMAX Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 10 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0028 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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PA0028C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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PA0028-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: QSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 16 |
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PA0029 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
товар відсутній |
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PA0029C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.025" (0.64mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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PA0029-S | Chip Quik Inc. |
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PA0030 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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PA0008 |
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Виробник: Chip Quik Inc.
Description: SOIC-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 291 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 327.69 грн |
PA0008C |
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Виробник: Chip Quik Inc.
Description: SOIC-20 TO DIP-20 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-20 TO DIP-20 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 161 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 537.53 грн |
PA0008C-N |
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Виробник: Chip Quik Inc.
Description: SOIC-20 TO DIP-20 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.000" L x 0.550" W (25.40mm x 13.97mm)
Number of Positions: 20
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-20 TO DIP-20 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.000" L x 0.550" W (25.40mm x 13.97mm)
Number of Positions: 20
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 537.53 грн |
PA0008-S |
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Виробник: Chip Quik Inc.
Description: SOIC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: SOIC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
товар відсутній
PA0009 |
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Виробник: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 230 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 370.27 грн |
PA0009C |
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Виробник: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
PA0009C-N |
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Виробник: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.200" L x 0.550" W (30.48mm x 13.97mm)
Number of Positions: 24
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-24 TO DIP-24 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.200" L x 0.550" W (30.48mm x 13.97mm)
Number of Positions: 24
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 574.79 грн |
PA0009-S |
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Виробник: Chip Quik Inc.
Description: SOIC-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Description: SOIC-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
товар відсутній
PA0010 |
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Виробник: Chip Quik Inc.
Description: SOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
Description: SOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
товар відсутній
PA0011 |
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Виробник: Chip Quik Inc.
Description: SOIC-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |
PA0011C |
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Виробник: Chip Quik Inc.
Description: SOIC-28 TO DIP-28 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-28 TO DIP-28 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 436 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 615.08 грн |
PA0011C-N |
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Виробник: Chip Quik Inc.
Description: SOIC-28 TO DIP-28 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.400" L x 0.550" W (35.56mm x 13.97mm)
Number of Positions: 28
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-28 TO DIP-28 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.400" L x 0.550" W (35.56mm x 13.97mm)
Number of Positions: 28
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 615.08 грн |
PA0011-S |
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Виробник: Chip Quik Inc.
Description: SOIC-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: SOIC-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0012 |
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Виробник: Chip Quik Inc.
Description: SOIC-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
PA0012-S |
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Виробник: Chip Quik Inc.
Description: SOIC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: SOIC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
PA0013 |
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Виробник: Chip Quik Inc.
Description: SOIC-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
PA0014 |
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Виробник: Chip Quik Inc.
Description: SOIC-54 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-54 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
PA0014-S |
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Виробник: Chip Quik Inc.
Description: SOIC-54 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Number of Positions: 54
Description: SOIC-54 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Number of Positions: 54
товар відсутній
PA0015 |
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Виробник: Chip Quik Inc.
Description: SSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 244.06 грн |
PA0015-S |
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Виробник: Chip Quik Inc.
Description: SSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: SSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
PA0016 | ![]() |
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Виробник: Chip Quik Inc.
Description: SSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 285.87 грн |
PA0016-S |
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Виробник: Chip Quik Inc.
Description: SSOP-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: SSOP-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
товар відсутній
PA0017 |
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Виробник: Chip Quik Inc.
Description: SSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 285.87 грн |
PA0017C |
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Виробник: Chip Quik Inc.
Description: SSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 495.72 грн |
PA0018 |
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Виробник: Chip Quik Inc.
Description: SSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 335.29 грн |
PA0018C |
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Виробник: Chip Quik Inc.
Description: SSOP-20 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-20 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 545.14 грн |
PA0018-S |
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Виробник: Chip Quik Inc.
Description: SSOP-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
Description: SSOP-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
PA0019 |
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Виробник: Chip Quik Inc.
Description: SSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 371.03 грн |
PA0019C |
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Виробник: Chip Quik Inc.
Description: SSOP-24 TO DIP-24 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-24 TO DIP-24 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
PA0019-S |
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Виробник: Chip Quik Inc.
Description: SSOP-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
Description: SSOP-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
товар відсутній
PA0020 |
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Виробник: Chip Quik Inc.
Description: SSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |
PA0020C |
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Виробник: Chip Quik Inc.
Description: SSOP-28 TO DIP-28 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-28 TO DIP-28 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 615.08 грн |
PA0020C-N |
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Виробник: Chip Quik Inc.
Description: SSOP-28 TO DIP-28 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-28 TO DIP-28 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0020-S |
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Виробник: Chip Quik Inc.
Description: STENCIL SSOP-28 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
Description: STENCIL SSOP-28 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.48 грн |
PA0021 |
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Виробник: Chip Quik Inc.
Description: SSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0021-S |
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Виробник: Chip Quik Inc.
Description: SSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 30
Description: SSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 30
товар відсутній
PA0022 |
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Виробник: Chip Quik Inc.
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 504.84 грн |
PA0023 |
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Виробник: Chip Quik Inc.
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 504.84 грн |
PA0024 |
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Виробник: Chip Quik Inc.
Description: SSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0025 |
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Виробник: Chip Quik Inc.
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0025-S |
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Виробник: Chip Quik Inc.
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0026 |
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Виробник: Chip Quik Inc.
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 136 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 244.06 грн |
PA0026C |
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Виробник: Chip Quik Inc.
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 82 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 453.9 грн |
PA0026-S |
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Виробник: Chip Quik Inc.
Description: UMAX-8/USOP-8/MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: UMAX-8/USOP-8/MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
PA0027 |
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Виробник: Chip Quik Inc.
Description: UMAX-10/USOP-10/MSOP-10TODIP-10
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-10/USOP-10/MSOP-10TODIP-10
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 92 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 285.87 грн |
PA0027C |
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Виробник: Chip Quik Inc.
Description: UMAX-10/USOP-10/MSOP-10 TO DIP-1
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-10/USOP-10/MSOP-10 TO DIP-1
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 495.72 грн |
PA0027-S |
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Виробник: Chip Quik Inc.
Description: STENCIL MSOP-10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
Description: STENCIL MSOP-10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.48 грн |
PA0028 |
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Виробник: Chip Quik Inc.
Description: QSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 335.29 грн |
PA0028C |
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Виробник: Chip Quik Inc.
Description: QSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 551.98 грн |
PA0028-S |
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Виробник: Chip Quik Inc.
Description: QSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: QSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
Description: QSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: QSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
товар відсутній
PA0029 |
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Виробник: Chip Quik Inc.
Description: QSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товар відсутній
PA0029C |
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Виробник: Chip Quik Inc.
Description: QSOP-20 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-20 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
PA0030 |
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Виробник: Chip Quik Inc.
Description: QSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |