Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2488) > Сторінка 29 з 42
| Фото | Назва | Виробник | Інформація |
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PA0100 | Chip Quik Inc. |
 Description: LGA-16 TO DIP-16 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товар відсутній |
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PA0100-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: LGA Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товар відсутній |
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PA0101 | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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PA0101C | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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PA0101-S | Chip Quik Inc. |
Description: STENCIL LGA-14 3X5MM .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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PA0102 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товар відсутній |
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PA0102-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: LGA Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товар відсутній |
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PA0103 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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PA0103C | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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PA0103-S | Chip Quik Inc. |
Description: STENCIL LGA-16 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PA0104 | Chip Quik Inc. |
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5 Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, MQFP, TQFP Part Status: Active |
товар відсутній |
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PA0104-S | Chip Quik Inc. |
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 52 |
товар відсутній |
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PA0105 | Chip Quik Inc. |
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20 Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
товар відсутній |
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PA0105C | Chip Quik Inc. |
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0105-S | Chip Quik Inc. |
Description: PLCC-20/LCC-20/JLCC-20 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
товар відсутній |
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PA0105SOCKET | Chip Quik Inc. |
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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PA0106 | Chip Quik Inc. |
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28 Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0106C | Chip Quik Inc. |
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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PA0106C-P | Chip Quik Inc. |
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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PA0106C-P-R | Chip Quik Inc. |
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PA0106C-P-R-SOCKET | Chip Quik Inc. |
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 O Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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PA0106C-P-SOCKET | Chip Quik Inc. |
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 I Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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PA0106-S | Chip Quik Inc. |
Description: PLCC-28/LCC-28/JLCC-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 28 |
товар відсутній |
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PA0106SOCKET | Chip Quik Inc. |
Description: PLCC-28 SOCKET TO DIP-28 ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0107 | Chip Quik Inc. |
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44 Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PA0107C | Chip Quik Inc. |
Description: PLCC-44 TO DIP-44 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PA0107C-P | Chip Quik Inc. |
Description: PLCC-44 TO PGA-44 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PA0107C-P-R | Chip Quik Inc. |
Description: PLCC-44 TO PGA-44 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PA0107C-P-R2 | Chip Quik Inc. |
Description: PLCC-44 TO PGA-44 PIN 1 OUT R2 S Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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PA0107C-P-R2-SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PA0107C-P-R-SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0107C-P-SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0107-S | Chip Quik Inc. |
Description: PLCC-44/LCC-44/JLCC-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 44 |
товар відсутній |
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PA0107SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO DIP-44 ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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| PA0108 | Chip Quik Inc. |
Description: PLCC-68 TO PGA-68 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
товар відсутній |
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PA0108C | Chip Quik Inc. |
Description: PLCC-68 TO PGA-68 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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PA0108C-R | Chip Quik Inc. |
Description: PLCC-68 TO PGA-68 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0108C-R-SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 O Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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PA0108C-SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 I Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0108-S | Chip Quik Inc. |
Description: PLCC-68/JLCC-68/LCC-68 (1.27MM P Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 68 |
товар відсутній |
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| PA0108SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO PGA-68 ADAPTER Packaging: Bulk Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: PLCC Part Status: Active |
товар відсутній |
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PA0109 | Chip Quik Inc. |
Description: TQFP-100/VQFP-100 TO DIP-100 SMT Packaging: Bulk Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP, VQFP Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0109C | Chip Quik Inc. |
Description: TQFP-100/VQFP-100 TO DIP-100 SMT Packaging: Bulk Size / Dimension: 5.000" L x 0.700" W (127.00mm x 17.78mm) Number of Positions: 100 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TQFP, VQFP Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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PA0109-S | Chip Quik Inc. |
Description: VQFP-100/TQFP-100 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 100 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0110 | Chip Quik Inc. |
Description: TQFP-80/LQFP-80 TO DIP-80 SMT Packaging: Bulk Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0110C | Chip Quik Inc. |
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 4.000" L x 0.700" W (101.60mm x 17.78mm) Number of Positions: 80 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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PA0110-S | Chip Quik Inc. |
Description: STENCIL TQFP-80 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 80 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| PA0111 | Chip Quik Inc. |
Description: PLCC-84 TO PGA-84 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
товар відсутній |
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PA0111C | Chip Quik Inc. |
Description: PLCC-84 TO PGA-84 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0111C-R | Chip Quik Inc. |
Description: PLCC-84 TO PGA-84 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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PA0111C-R-SOCKET | Chip Quik Inc. |
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 O Packaging: Bulk Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm) Number of Positions: 84 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0111C-SOCKET | Chip Quik Inc. |
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I Packaging: Bulk Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm) Number of Positions: 84 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0111-S | Chip Quik Inc. |
Description: PLCC-84/JLCC-84/LCC-84 (1.27MM P Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 1.181" L x 1.181" W (30.00mm x 30.00mm) Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm) Part Status: Active Number of Positions: 84 |
товар відсутній |
|||
| PA0111SOCKET | Chip Quik Inc. |
Description: PLCC-84 SOCKET TO PGA-84 ADAPTER Packaging: Bulk Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: PLCC Part Status: Active |
товар відсутній |
||||
 |
PA0113 | Chip Quik Inc. |
Description: TQFP-64/QFP-64 TO DIP-64 SMT Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PQFP, TQFP Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0113C | Chip Quik Inc. |
Description: TQFP-64 TO DIP-64 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm) Number of Positions: 64 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: PQFP, TQFP Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
|
||
 |
PA0113-S | Chip Quik Inc. |
Description: TQFP-64/QFP-64 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 64 |
товар відсутній |
|||
 |
PA0114 | Chip Quik Inc. |
Description: QFP-80 TO DIP-80 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PQFP |
товар відсутній |
|||
 |
PA0114-S | Chip Quik Inc. |
Description: PQFP-80 STENCIL |
товар відсутній |
|||
 |
PA0115 | Chip Quik Inc. |
Description: CSP-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: CSP |
товар відсутній |
| PA0100 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товар відсутній
| PA0100-S |
|
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
| PA0101 |
|
Виробник: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 51 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 334.59 грн |
| PA0101C |
|
Виробник: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 559.47 грн |
| PA0101-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 810.03 грн |
| PA0102 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товар відсутній
| PA0102-S |
|
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
| PA0103 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 439.64 грн |
| PA0103C |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 648.96 грн |
| PA0103-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 810.03 грн |
| PA0104 |
|
Виробник: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
товар відсутній
| PA0104-S |
|
Виробник: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 52
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 52
товар відсутній
| PA0105 |
|
Виробник: Chip Quik Inc.
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
| PA0105C |
|
Виробник: Chip Quik Inc.
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 943.09 грн |
| PA0105-S |
|
Виробник: Chip Quik Inc.
Description: PLCC-20/LCC-20/JLCC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: PLCC-20/LCC-20/JLCC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
товар відсутній
| PA0105SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1103.38 грн |
| PA0106 |
|
Виробник: Chip Quik Inc.
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 810.03 грн |
| PA0106C |
|
Виробник: Chip Quik Inc.
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1019.34 грн |
| PA0106C-P |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 627.95 грн |
| PA0106C-P-R |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 627.95 грн |
| PA0106C-P-R-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1117.39 грн |
| PA0106C-P-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1117.39 грн |
| PA0106-S |
|
Виробник: Chip Quik Inc.
Description: PLCC-28/LCC-28/JLCC-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
Description: PLCC-28/LCC-28/JLCC-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
товар відсутній
| PA0106SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1173.41 грн |
| PA0107 |
|
Виробник: Chip Quik Inc.
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1026.35 грн |
| PA0107C |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 TO DIP-44 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO DIP-44 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1236.44 грн |
| PA0107C-P |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 TO PGA-44 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO PGA-44 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 768.01 грн |
| PA0107C-P-R |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 TO PGA-44 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO PGA-44 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 768.01 грн |
| PA0107C-P-R2 |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 TO PGA-44 PIN 1 OUT R2 S
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO PGA-44 PIN 1 OUT R2 S
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 768.01 грн |
| PA0107C-P-R2-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1138.4 грн |
| PA0107C-P-R-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1138.4 грн |
| PA0107C-P-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1138.4 грн |
| PA0107-S |
|
Виробник: Chip Quik Inc.
Description: PLCC-44/LCC-44/JLCC-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 44
Description: PLCC-44/LCC-44/JLCC-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 44
товар відсутній
| PA0107SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-44 SOCKET TO DIP-44 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO DIP-44 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1397.51 грн |
| PA0108 |
|
Виробник: Chip Quik Inc.
Description: PLCC-68 TO PGA-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 TO PGA-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
| PA0108C |
|
Виробник: Chip Quik Inc.
Description: PLCC-68 TO PGA-68 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 TO PGA-68 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 74 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 908.07 грн |
| PA0108C-R |
|
Виробник: Chip Quik Inc.
Description: PLCC-68 TO PGA-68 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 TO PGA-68 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 908.07 грн |
| PA0108C-R-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 O
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 O
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1257.45 грн |
| PA0108C-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 I
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 I
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1257.45 грн |
| PA0108-S |
Виробник: Chip Quik Inc.
Description: PLCC-68/JLCC-68/LCC-68 (1.27MM P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 68
Description: PLCC-68/JLCC-68/LCC-68 (1.27MM P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 68
товар відсутній
| PA0108SOCKET |
Виробник: Chip Quik Inc.
Description: PLCC-68 SOCKET TO PGA-68 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Part Status: Active
Description: PLCC-68 SOCKET TO PGA-68 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Part Status: Active
товар відсутній
| PA0109 |
|
Виробник: Chip Quik Inc.
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1362.5 грн |
| PA0109C |
|
Виробник: Chip Quik Inc.
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 5.000" L x 0.700" W (127.00mm x 17.78mm)
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 5.000" L x 0.700" W (127.00mm x 17.78mm)
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1571.81 грн |
| PA0109-S |
|
Виробник: Chip Quik Inc.
Description: VQFP-100/TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
Description: VQFP-100/TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 810.03 грн |
| PA0110 |
|
Виробник: Chip Quik Inc.
Description: TQFP-80/LQFP-80 TO DIP-80 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-80/LQFP-80 TO DIP-80 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1130.62 грн |
| PA0110C |
|
Виробник: Chip Quik Inc.
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 4.000" L x 0.700" W (101.60mm x 17.78mm)
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 4.000" L x 0.700" W (101.60mm x 17.78mm)
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1345.38 грн |
| PA0110-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL TQFP-80 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
Description: STENCIL TQFP-80 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 832.59 грн |
| PA0111 |
|
Виробник: Chip Quik Inc.
Description: PLCC-84 TO PGA-84 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 TO PGA-84 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
| PA0111C |
|
Виробник: Chip Quik Inc.
Description: PLCC-84 TO PGA-84 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 TO PGA-84 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1117.39 грн |
| PA0111C-R |
|
Виробник: Chip Quik Inc.
Description: PLCC-84 TO PGA-84 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 TO PGA-84 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 53 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1117.39 грн |
| PA0111C-R-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 O
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 O
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1390.51 грн |
| PA0111C-SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 SOCKET TO PGA-84 PIN 1 I
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1390.51 грн |
| PA0111-S |
Виробник: Chip Quik Inc.
Description: PLCC-84/JLCC-84/LCC-84 (1.27MM P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 1.181" L x 1.181" W (30.00mm x 30.00mm)
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 84
Description: PLCC-84/JLCC-84/LCC-84 (1.27MM P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 1.181" L x 1.181" W (30.00mm x 30.00mm)
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Part Status: Active
Number of Positions: 84
товар відсутній
| PA0111SOCKET |
Виробник: Chip Quik Inc.
Description: PLCC-84 SOCKET TO PGA-84 ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Part Status: Active
Description: PLCC-84 SOCKET TO PGA-84 ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Part Status: Active
товар відсутній
| PA0113 |
|
Виробник: Chip Quik Inc.
Description: TQFP-64/QFP-64 TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP, TQFP
Part Status: Active
Description: TQFP-64/QFP-64 TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP, TQFP
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1103.38 грн |
| PA0113C |
|
Виробник: Chip Quik Inc.
Description: TQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: PQFP, TQFP
Part Status: Active
Description: TQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: PQFP, TQFP
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1313.48 грн |
| PA0113-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-64/QFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
Description: TQFP-64/QFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
товар відсутній
| PA0114 |
|
Виробник: Chip Quik Inc.
Description: QFP-80 TO DIP-80 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP
Description: QFP-80 TO DIP-80 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP
товар відсутній
| PA0115 |
|
Виробник: Chip Quik Inc.
Description: CSP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: CSP
Description: CSP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: CSP
товар відсутній