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PA0206-S PA0206-S Chip Quik Inc. PA0206.pdf Description: DFN-16 STENCIL
товар відсутній
PA0207 PA0207 Chip Quik Inc. PA0207.pdf Description: TSOP-40 I TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0207-S PA0207-S Chip Quik Inc. PA0207-S.pdf Description: TSOP-40 I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 40
товар відсутній
PA0208 PA0208 Chip Quik Inc. PA0208.pdf Description: TSOP-48 I TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+596.7 грн
PA0208C PA0208C Chip Quik Inc. PA0208C.pdf Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
1+810.35 грн
PA0208-S PA0208-S Chip Quik Inc. PA0208-S.pdf Description: TSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0209 PA0209 Chip Quik Inc. PA0209.pdf Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0209-S PA0209-S Chip Quik Inc. PA0209-S.pdf Description: TSOP-50 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 50
товар відсутній
PA0210 PA0210 Chip Quik Inc. PA0210.pdf Description: TSOP-54 II TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+668.43 грн
PA0210C PA0210C Chip Quik Inc. PA0210C.pdf Description: TSOP-54 (II) TO DIP-54 SMT ADAPT
Packaging: Bulk
Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm)
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)
1+879.79 грн
PA0210-S PA0210-S Chip Quik Inc. PA0210-S.pdf Description: TSOP-54 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 54
товар відсутній
PA0211 PA0211 Chip Quik Inc. PA0211.pdf Description: TSOP-56 I TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+678.35 грн
PA0211-S PA0211-S Chip Quik Inc. PA0211-S.pdf Description: TSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 56
товар відсутній
PA0212 PA0212 Chip Quik Inc. PA0212.pdf Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товар відсутній
PA0212-S PA0212-S Chip Quik Inc. PA0212-S.pdf Description: TSOP-66 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 66
товар відсутній
PA0213 PA0213 Chip Quik Inc. PA0213.pdf Description: TSOP-86 II TO DIP-86 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm)
Material: FR4 Epoxy Glass
Number of Positions: 86
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0213-S PA0213-S Chip Quik Inc. PA0213-S.pdf Description: TSOP-86 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 86
товар відсутній
PA0214 PA0214 Chip Quik Inc. PA0214.pdf Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0214C PA0214C Chip Quik Inc. PA0214C.pdf Description: PLCC-32 TO DIP-32 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
1+1109.47 грн
PA0214-S PA0214-S Chip Quik Inc. PA0214-S.pdf Description: PLCC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
PA0214SOCKET PA0214SOCKET Chip Quik Inc. PA0214SOCKET.pdf Description: PLCC-32 SOCKET TO DIP-32 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
1+1272.76 грн
PA0216 PA0216 Chip Quik Inc. PA0216.pdf Description: TSOP-32 II TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0216-S PA0216-S Chip Quik Inc. PA0216-S.pdf Description: TSOP-32 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
PA0217 PA0217 Chip Quik Inc. PA0217.pdf Description: TSOP-44 II TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0217-S PA0217-S Chip Quik Inc. PA0217-S.pdf Description: TSOP-44 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
PA0218 PA0218 Chip Quik Inc. PA0218.pdf Description: TSOP-28 I TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товар відсутній
PA0218-S PA0218-S Chip Quik Inc. PA0218-S.pdf Description: TSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0219 PA0219 Chip Quik Inc. PA0219.pdf Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0219C-P PA0219C-P Chip Quik Inc. PA0219C-P.pdf Description: PLCC-52 TO PGA-52 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+853.08 грн
PA0219C-P-R PA0219C-P-R Chip Quik Inc. PA0219C-P-R.pdf Description: PLCC-52 TO PGA-52 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0219C-P-R-SOCKET PA0219C-P-R-SOCKET Chip Quik Inc. PA0219C-P-R-SOCKET.pdf Description: PLCC-52 SOCKET TO PGA-52 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+1407.82 грн
PA0219C-P-SOCKET PA0219C-P-SOCKET Chip Quik Inc. PA0219C-P-SOCKET.pdf Description: PLCC-52 SOCKET TO PGA-52 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+1407.82 грн
PA0219-S PA0219-S Chip Quik Inc. PA0219-S.pdf Description: PLCC-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 52
товар відсутній
PA0219SOCKET PA0219SOCKET Chip Quik Inc. PA0219SOCKET.pdf Description: PLCC-52 SOCKET TO DIP-52 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+1493.28 грн
PA0220 Chip Quik Inc. PA0220.pdf Description: TQFP-144 TO PGA-144 SMT ADAPTER
товар відсутній
PA0220-S PA0220-S Chip Quik Inc. PA0220-S.pdf Description: TQFP-144 (0.4MM PITCH, 16X16MM B
товар відсутній
PA0221 PA0221 Chip Quik Inc. PA0221.pdf Description: TQFP-128 TO DIP-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.400" x 6.400" (35.56mm x 162.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
PA0221-S PA0221-S Chip Quik Inc. PA0221-S.pdf Description: TQFP-128 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 128
товар відсутній
PA0223 PA0223 Chip Quik Inc. PA0223.pdf Description: TQFP-100 TO DIP-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+1372.72 грн
PA0223-S PA0223-S Chip Quik Inc. PA0223-S.pdf Description: TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 100
товар відсутній
PA0224 PA0224 Chip Quik Inc. PA0224.pdf Description: SOP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
товар відсутній
PA0224-S PA0224-S Chip Quik Inc. PA0224.pdf Description: SOP-40 STENCIL
товар відсутній
PA0225 PA0225 Chip Quik Inc. PA0225.pdf Description: LSOP-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.063" (1.60mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LSOP
товар відсутній
PA0225-S PA0225-S Chip Quik Inc. PA0225-S.pdf Description: LSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.063" (1.60mm)
Type: LSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товар відсутній
PA0226 PA0226 Chip Quik Inc. PA0226.pdf Description: SSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0226-S PA0226-S Chip Quik Inc. PA0226-S.pdf Description: SSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній
PA0227 PA0227 Chip Quik Inc. PA0227.pdf Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
1+550.15 грн
PA0227-S PA0227-S Chip Quik Inc. PA0227-S.pdf Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0228 PA0228 Chip Quik Inc. PA0228.pdf Description: TSOP-32I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0228-S PA0228-S Chip Quik Inc. PA0228-S.pdf Description: TSOP-32I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
PA0229 PA0229 Chip Quik Inc. PA0229.pdf Description: TSOP-56II TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0229-S PA0229-S Chip Quik Inc. PA0229-S.pdf Description: TSOP-56II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Number of Positions: 56
товар відсутній
PA0230 PA0230 Chip Quik Inc. PA0230.pdf Description: TQFP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
PA0230-S PA0230-S Chip Quik Inc. PA0230-S.pdf Description: TQFP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній
PA0235 PA0235 Chip Quik Inc. PA0235.pdf Description: LQFP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
товар відсутній
PA0235-S PA0235-S Chip Quik Inc. PA0235.pdf Description: LQFP-40 STENCIL
товар відсутній
PA0237 PA0237 Chip Quik Inc. PA0237.pdf Description: SOIC-36 TO DIP-36 SMT ADAPTER
товар відсутній
PA0237-S PA0237-S Chip Quik Inc. PA0237.pdf Description: SOIC-36 STENCIL
товар відсутній
PA0238 PA0238 Chip Quik Inc. PA0238.pdf Description: SOIC-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
PA0238-S PA0238-S Chip Quik Inc. PA0238.pdf Description: SOIC-44 STENCIL
товар відсутній
PA0206-S PA0206.pdf
PA0206-S
Виробник: Chip Quik Inc.
Description: DFN-16 STENCIL
товар відсутній
PA0207 PA0207.pdf
PA0207
Виробник: Chip Quik Inc.
Description: TSOP-40 I TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0207-S PA0207-S.pdf
PA0207-S
Виробник: Chip Quik Inc.
Description: TSOP-40 I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 40
товар відсутній
PA0208 PA0208.pdf
PA0208
Виробник: Chip Quik Inc.
Description: TSOP-48 I TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+596.7 грн
PA0208C PA0208C.pdf
PA0208C
Виробник: Chip Quik Inc.
Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+810.35 грн
PA0208-S PA0208-S.pdf
PA0208-S
Виробник: Chip Quik Inc.
Description: TSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0209 PA0209.pdf
PA0209
Виробник: Chip Quik Inc.
Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0209-S PA0209-S.pdf
PA0209-S
Виробник: Chip Quik Inc.
Description: TSOP-50 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 50
товар відсутній
PA0210 PA0210.pdf
PA0210
Виробник: Chip Quik Inc.
Description: TSOP-54 II TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+668.43 грн
PA0210C PA0210C.pdf
PA0210C
Виробник: Chip Quik Inc.
Description: TSOP-54 (II) TO DIP-54 SMT ADAPT
Packaging: Bulk
Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm)
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+879.79 грн
PA0210-S PA0210-S.pdf
PA0210-S
Виробник: Chip Quik Inc.
Description: TSOP-54 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 54
товар відсутній
PA0211 PA0211.pdf
PA0211
Виробник: Chip Quik Inc.
Description: TSOP-56 I TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+678.35 грн
PA0211-S PA0211-S.pdf
PA0211-S
Виробник: Chip Quik Inc.
Description: TSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 56
товар відсутній
PA0212 PA0212.pdf
PA0212
Виробник: Chip Quik Inc.
Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товар відсутній
PA0212-S PA0212-S.pdf
PA0212-S
Виробник: Chip Quik Inc.
Description: TSOP-66 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 66
товар відсутній
PA0213 PA0213.pdf
PA0213
Виробник: Chip Quik Inc.
Description: TSOP-86 II TO DIP-86 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm)
Material: FR4 Epoxy Glass
Number of Positions: 86
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0213-S PA0213-S.pdf
PA0213-S
Виробник: Chip Quik Inc.
Description: TSOP-86 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 86
товар відсутній
PA0214 PA0214.pdf
PA0214
Виробник: Chip Quik Inc.
Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0214C PA0214C.pdf
PA0214C
Виробник: Chip Quik Inc.
Description: PLCC-32 TO DIP-32 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1109.47 грн
PA0214-S PA0214-S.pdf
PA0214-S
Виробник: Chip Quik Inc.
Description: PLCC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
PA0214SOCKET PA0214SOCKET.pdf
PA0214SOCKET
Виробник: Chip Quik Inc.
Description: PLCC-32 SOCKET TO DIP-32 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1272.76 грн
PA0216 PA0216.pdf
PA0216
Виробник: Chip Quik Inc.
Description: TSOP-32 II TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0216-S PA0216-S.pdf
PA0216-S
Виробник: Chip Quik Inc.
Description: TSOP-32 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
PA0217 PA0217.pdf
PA0217
Виробник: Chip Quik Inc.
Description: TSOP-44 II TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0217-S PA0217-S.pdf
PA0217-S
Виробник: Chip Quik Inc.
Description: TSOP-44 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
PA0218 PA0218.pdf
PA0218
Виробник: Chip Quik Inc.
Description: TSOP-28 I TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товар відсутній
PA0218-S PA0218-S.pdf
PA0218-S
Виробник: Chip Quik Inc.
Description: TSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0219 PA0219.pdf
PA0219
Виробник: Chip Quik Inc.
Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0219C-P PA0219C-P.pdf
PA0219C-P
Виробник: Chip Quik Inc.
Description: PLCC-52 TO PGA-52 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+853.08 грн
PA0219C-P-R PA0219C-P-R.pdf
PA0219C-P-R
Виробник: Chip Quik Inc.
Description: PLCC-52 TO PGA-52 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0219C-P-R-SOCKET PA0219C-P-R-SOCKET.pdf
PA0219C-P-R-SOCKET
Виробник: Chip Quik Inc.
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1407.82 грн
PA0219C-P-SOCKET PA0219C-P-SOCKET.pdf
PA0219C-P-SOCKET
Виробник: Chip Quik Inc.
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1407.82 грн
PA0219-S PA0219-S.pdf
PA0219-S
Виробник: Chip Quik Inc.
Description: PLCC-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 52
товар відсутній
PA0219SOCKET PA0219SOCKET.pdf
PA0219SOCKET
Виробник: Chip Quik Inc.
Description: PLCC-52 SOCKET TO DIP-52 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1493.28 грн
PA0220 PA0220.pdf
Виробник: Chip Quik Inc.
Description: TQFP-144 TO PGA-144 SMT ADAPTER
товар відсутній
PA0220-S PA0220-S.pdf
PA0220-S
Виробник: Chip Quik Inc.
Description: TQFP-144 (0.4MM PITCH, 16X16MM B
товар відсутній
PA0221 PA0221.pdf
PA0221
Виробник: Chip Quik Inc.
Description: TQFP-128 TO DIP-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.400" x 6.400" (35.56mm x 162.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
PA0221-S PA0221-S.pdf
PA0221-S
Виробник: Chip Quik Inc.
Description: TQFP-128 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 128
товар відсутній
PA0223 PA0223.pdf
PA0223
Виробник: Chip Quik Inc.
Description: TQFP-100 TO DIP-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1372.72 грн
PA0223-S PA0223-S.pdf
PA0223-S
Виробник: Chip Quik Inc.
Description: TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 100
товар відсутній
PA0224 PA0224.pdf
PA0224
Виробник: Chip Quik Inc.
Description: SOP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
товар відсутній
PA0224-S PA0224.pdf
PA0224-S
Виробник: Chip Quik Inc.
Description: SOP-40 STENCIL
товар відсутній
PA0225 PA0225.pdf
PA0225
Виробник: Chip Quik Inc.
Description: LSOP-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.063" (1.60mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LSOP
товар відсутній
PA0225-S PA0225-S.pdf
PA0225-S
Виробник: Chip Quik Inc.
Description: LSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.063" (1.60mm)
Type: LSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товар відсутній
PA0226 PA0226.pdf
PA0226
Виробник: Chip Quik Inc.
Description: SSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0226-S PA0226-S.pdf
PA0226-S
Виробник: Chip Quik Inc.
Description: SSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній
PA0227 PA0227.pdf
PA0227
Виробник: Chip Quik Inc.
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+550.15 грн
PA0227-S PA0227-S.pdf
PA0227-S
Виробник: Chip Quik Inc.
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0228 PA0228.pdf
PA0228
Виробник: Chip Quik Inc.
Description: TSOP-32I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0228-S PA0228-S.pdf
PA0228-S
Виробник: Chip Quik Inc.
Description: TSOP-32I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
PA0229 PA0229.pdf
PA0229
Виробник: Chip Quik Inc.
Description: TSOP-56II TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0229-S PA0229-S.pdf
PA0229-S
Виробник: Chip Quik Inc.
Description: TSOP-56II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Number of Positions: 56
товар відсутній
PA0230 PA0230.pdf
PA0230
Виробник: Chip Quik Inc.
Description: TQFP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
PA0230-S PA0230-S.pdf
PA0230-S
Виробник: Chip Quik Inc.
Description: TQFP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній
PA0235 PA0235.pdf
PA0235
Виробник: Chip Quik Inc.
Description: LQFP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
товар відсутній
PA0235-S PA0235.pdf
PA0235-S
Виробник: Chip Quik Inc.
Description: LQFP-40 STENCIL
товар відсутній
PA0237 PA0237.pdf
PA0237
Виробник: Chip Quik Inc.
Description: SOIC-36 TO DIP-36 SMT ADAPTER
товар відсутній
PA0237-S PA0237.pdf
PA0237-S
Виробник: Chip Quik Inc.
Description: SOIC-36 STENCIL
товар відсутній
PA0238 PA0238.pdf
PA0238
Виробник: Chip Quik Inc.
Description: SOIC-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
PA0238-S PA0238.pdf
PA0238-S
Виробник: Chip Quik Inc.
Description: SOIC-44 STENCIL
товар відсутній
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