Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2477) > Сторінка 16 з 42
Фото | Назва | Виробник | Інформація |
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IPC0065 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0065-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.087" W (3.00mm x 2.20mm) Number of Positions: 8 |
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IPC0066 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0066-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.094" L x 0.033" W (2.40mm x 0.85mm) Number of Positions: 10 |
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IPC0067 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 43 шт: термін постачання 21-31 дні (днів) |
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IPC0067-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.079" L x 0.059" W (2.00mm x 1.50mm) Number of Positions: 10 |
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IPC0068 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0068-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 10 |
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IPC0069 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0069-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm) Number of Positions: 10 |
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IPC0070 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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IPC0070C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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IPC0070-S | Chip Quik Inc. |
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IPC0071 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0071-S | Chip Quik Inc. |
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IPC0072 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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IPC0072-S | Chip Quik Inc. |
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IPC0073 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0073-S | Chip Quik Inc. |
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IPC0074 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0074-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm) Number of Positions: 16 |
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IPC0075 | Chip Quik Inc. |
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IPC0075-S | Chip Quik Inc. |
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IPC0076 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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IPC0076C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Number of Positions: 12 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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IPC0076-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm) Number of Positions: 8 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0077 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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IPC0077C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 14 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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IPC0077-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm) Number of Positions: 10 |
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IPC0078 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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IPC0078C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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IPC0078-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm) Number of Positions: 12 |
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IPC0079 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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IPC0079C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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IPC0079-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm) Number of Positions: 16 |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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IPC0080 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.018" (0.45mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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IPC0080-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm) Number of Positions: 28 |
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IPC0081 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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IPC0081-S | Chip Quik Inc. |
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IPC0082 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
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IPC0082-S | Chip Quik Inc. |
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IPC0083 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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IPC0083C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Number of Positions: 10 Pitch: 0.037" (0.95mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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IPC0083-S | Chip Quik Inc. |
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IPC0084 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0084C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm) Number of Positions: 18 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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IPC0084-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm) Number of Positions: 14 |
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IPC0085 | Chip Quik Inc. |
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IPC0085-S | Chip Quik Inc. |
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IPC0086 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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IPC0086-S | Chip Quik Inc. |
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IPC0087 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0087-S | Chip Quik Inc. |
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IPC0088 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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IPC0088C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Number of Positions: 10 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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IPC0088-S | Chip Quik Inc. |
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IPC0089 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0089-S | Chip Quik Inc. |
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IPC0090 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
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IPC0090-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
товар відсутній |
IPC0065 |
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Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0065-S |
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Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.087" W (3.00mm x 2.20mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.087" W (3.00mm x 2.20mm)
Number of Positions: 8
товар відсутній
IPC0066 |
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Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0066-S |
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Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.094" L x 0.033" W (2.40mm x 0.85mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.094" L x 0.033" W (2.40mm x 0.85mm)
Number of Positions: 10
товар відсутній
IPC0067 |
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Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 43 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |
IPC0067-S |
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Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.079" L x 0.059" W (2.00mm x 1.50mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.079" L x 0.059" W (2.00mm x 1.50mm)
Number of Positions: 10
товар відсутній
IPC0068 |
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Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0068-S |
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Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 10
товар відсутній
IPC0069 |
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Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0069-S |
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Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 10
товар відсутній
IPC0070 |
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Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 446.3 грн |
IPC0070C |
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Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 658.42 грн |
IPC0071 |
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Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0072 |
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Виробник: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 482.03 грн |
IPC0073 |
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Виробник: Chip Quik Inc.
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0074 |
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Виробник: Chip Quik Inc.
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0074-S |
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Виробник: Chip Quik Inc.
Description: DFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm)
Number of Positions: 16
Description: DFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm)
Number of Positions: 16
товар відсутній
IPC0076 |
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Виробник: Chip Quik Inc.
Description: MSOP-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 370.27 грн |
IPC0076C |
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Виробник: Chip Quik Inc.
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
IPC0076-S |
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Виробник: Chip Quik Inc.
Description: MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 8
Description: MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 8
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.48 грн |
IPC0077 |
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Виробник: Chip Quik Inc.
Description: MSOP-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |
IPC0077C |
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Виробник: Chip Quik Inc.
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 615.08 грн |
IPC0077-S |
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Виробник: Chip Quik Inc.
Description: MSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 10
Description: MSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 10
товар відсутній
IPC0078 |
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Виробник: Chip Quik Inc.
Description: MSOP-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 440.21 грн |
IPC0078C |
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Виробник: Chip Quik Inc.
Description: MSOP-12 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-12 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 650.06 грн |
IPC0078-S |
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Виробник: Chip Quik Inc.
Description: MSOP-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 12
Description: MSOP-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 12
товар відсутній
IPC0079 |
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Виробник: Chip Quik Inc.
Description: MSOP-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 80 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 482.03 грн |
IPC0079C |
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Виробник: Chip Quik Inc.
Description: MSOP-16 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-16 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 691.88 грн |
IPC0079-S |
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Виробник: Chip Quik Inc.
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 813.52 грн |
IPC0080 |
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Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0080-S |
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Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
товар відсутній
IPC0081 |
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Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0082 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0083 |
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Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 336.05 грн |
IPC0083C |
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Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.9
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.9
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 546.66 грн |
IPC0084 |
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Виробник: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0084C |
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Виробник: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Number of Positions: 18
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Number of Positions: 18
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 691.88 грн |
IPC0084-S |
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Виробник: Chip Quik Inc.
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm)
Number of Positions: 14
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm)
Number of Positions: 14
товар відсутній
IPC0086 |
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Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 374.83 грн |
IPC0087 |
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Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0088 |
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Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 370.27 грн |
IPC0088C |
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Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
IPC0089 |
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Виробник: Chip Quik Inc.
Description: DFN-22 TO DIP-26 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-22 TO DIP-26 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0090 |
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Виробник: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товар відсутній
IPC0090-S |
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Виробник: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
товар відсутній