Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2462) > Сторінка 28 з 42
| Фото | Назва | Виробник | Інформація |
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PA0085 | Chip Quik Inc. |
 Description: SOT23-6/SC59-6 TO DIP-6 SMT ADAPPackaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, SC-59 Part Status: Active |
на замовлення 133 шт: термін постачання 21-31 дні (днів) |
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PA0085C | Chip Quik Inc. |
Description: SOT23-6 TO DIP-6 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 78 шт: термін постачання 21-31 дні (днів) |
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PA0085-S | Chip Quik Inc. |
Description: SOT23-6/SC59-6 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.037" (0.95mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
товар відсутній |
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PA0086 | Chip Quik Inc. |
Description: SOT23-5/SC59-5/SC-74A TO DIP-6 Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, SC-59, SC-74A Part Status: Active |
на замовлення 274 шт: термін постачання 21-31 дні (днів) |
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PA0086C | Chip Quik Inc. |
Description: SOT23-5 TO DIP-6 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 112 шт: термін постачання 21-31 дні (днів) |
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PA0086-S | Chip Quik Inc. |
Description: SOT23-5/SC59-5/SC-74A STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.037" (0.95mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
товар відсутній |
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PA0087 | Chip Quik Inc. |
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SC-88, SOT-363 Part Status: Active |
на замовлення 549 шт: термін постачання 21-31 дні (днів) |
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PA0087C | Chip Quik Inc. |
Description: SC70-6 TO DIP-6 SMT ADAPTER (0.6 Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SC70-6 Part Status: Active |
на замовлення 88 шт: термін постачання 21-31 дні (днів) |
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PA0087-S | Chip Quik Inc. |
Description: SC70-6/SOT-363 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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PA0088 | Chip Quik Inc. |
Description: SC70-5/SOT-353 TO DIP-6 SMT ADAP Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SOT-353 Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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PA0088C | Chip Quik Inc. |
Description: SC70-5 TO DIP-6 SMT ADAPTER (0.6 Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SC70-5 Part Status: Active |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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PA0088-S | Chip Quik Inc. |
Description: SC70-5/SOT-353 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
товар відсутній |
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PA0089 | Chip Quik Inc. |
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, TSOT Part Status: Active |
на замовлення 255 шт: термін постачання 21-31 дні (днів) |
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PA0089C | Chip Quik Inc. |
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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PA0089-S | Chip Quik Inc. |
Description: SOT23-8/TSOT-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
товар відсутній |
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PA0090 | Chip Quik Inc. |
Description: TSOC-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOC Part Status: Active |
на замовлення 141 шт: термін постачання 21-31 дні (днів) |
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PA0090-S | Chip Quik Inc. |
Description: TSOC-6 STENCIL |
товар відсутній |
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PA0091 | Chip Quik Inc. |
Description: TQFP-32/LQFP-32 TO DIP-32 SMT Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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PA0091C | Chip Quik Inc. |
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm) Number of Positions: 32 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0091-S | Chip Quik Inc. |
Description: STENCIL TQFP-32 .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
товар відсутній |
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PA0092 | Chip Quik Inc. |
Description: TQFP-32 TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0092C | Chip Quik Inc. |
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm) Number of Positions: 32 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0092-S | Chip Quik Inc. |
Description: TQFP-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
товар відсутній |
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PA0093 | Chip Quik Inc. |
Description: LQFP-44/QFP-44/VQFP-44/TQFP-44 Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, PQFP, TQFP, VQFP Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0093C | Chip Quik Inc. |
Description: TQFP-44 TO DIP-44 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm) Number of Positions: 44 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, PQFP, TQFP, VQFP Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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PA0093-S | Chip Quik Inc. |
Description: STENCIL LQFP-44 .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0094 | Chip Quik Inc. |
Description: LQFP-48/TQFP-48 TO DIP-48 SMT Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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PA0094C | Chip Quik Inc. |
Description: TQFP-48 TO DIP-48 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0094-S | Chip Quik Inc. |
Description: STENCIL LQFP-48 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0095 | Chip Quik Inc. |
Description: QFP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PQFP Part Status: Active |
товар відсутній |
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PA0095-S | Chip Quik Inc. |
Description: PQFP-48 STENCIL |
товар відсутній |
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PA0096 | Chip Quik Inc. |
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64 Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP, VQFP Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0096C | Chip Quik Inc. |
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm) Number of Positions: 64 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP, VQFP Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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PA0096-S | Chip Quik Inc. |
Description: STENCIL VQFP-64 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 64 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0097 | Chip Quik Inc. |
Description: TSOP-32 I TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
товар відсутній |
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PA0097-S | Chip Quik Inc. |
Description: TSOP-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
товар відсутній |
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PA0098 | Chip Quik Inc. |
Description: LGA-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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PA0098-S | Chip Quik Inc. |
Description: LGA-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
товар відсутній |
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PA0099 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товар відсутній |
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PA0099-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товар відсутній |
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PA0100 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товар відсутній |
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PA0100-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: LGA Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товар відсутній |
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PA0101 | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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PA0101C | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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PA0101-S | Chip Quik Inc. |
Description: STENCIL LGA-14 3X5MM .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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PA0102 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товар відсутній |
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PA0102-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: LGA Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товар відсутній |
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PA0103 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0103C | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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PA0103-S | Chip Quik Inc. |
Description: STENCIL LGA-16 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PA0104 | Chip Quik Inc. |
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5 Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, MQFP, TQFP Part Status: Active |
товар відсутній |
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PA0104-S | Chip Quik Inc. |
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 52 |
товар відсутній |
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PA0105 | Chip Quik Inc. |
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20 Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
товар відсутній |
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PA0105C | Chip Quik Inc. |
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0105-S | Chip Quik Inc. |
Description: PLCC-20/LCC-20/JLCC-20 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
товар відсутній |
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PA0105SOCKET | Chip Quik Inc. |
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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PA0106 | Chip Quik Inc. |
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28 Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0106C | Chip Quik Inc. |
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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PA0106C-P | Chip Quik Inc. |
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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PA0106C-P-R | Chip Quik Inc. |
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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| PA0085 |
|
Виробник: Chip Quik Inc.
Description: SOT23-6/SC59-6 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59
Part Status: Active
Description: SOT23-6/SC59-6 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59
Part Status: Active
на замовлення 133 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 191.52 грн |
| PA0085C |
|
Виробник: Chip Quik Inc.
Description: SOT23-6 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23-6 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 78 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 405.18 грн |
| PA0085-S |
|
Виробник: Chip Quik Inc.
Description: SOT23-6/SC59-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: SOT23-6/SC59-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
| PA0086 |
|
Виробник: Chip Quik Inc.
Description: SOT23-5/SC59-5/SC-74A TO DIP-6
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59, SC-74A
Part Status: Active
Description: SOT23-5/SC59-5/SC-74A TO DIP-6
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59, SC-74A
Part Status: Active
на замовлення 274 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 191.52 грн |
| PA0086C |
|
Виробник: Chip Quik Inc.
Description: SOT23-5 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23-5 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 112 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 400.6 грн |
| PA0086-S |
|
Виробник: Chip Quik Inc.
Description: SOT23-5/SC59-5/SC-74A STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SOT23-5/SC59-5/SC-74A STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
товар відсутній
| PA0087 |
|
Виробник: Chip Quik Inc.
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SC-88, SOT-363
Part Status: Active
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SC-88, SOT-363
Part Status: Active
на замовлення 549 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 191.52 грн |
| PA0087C |
|
Виробник: Chip Quik Inc.
Description: SC70-6 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-6
Part Status: Active
Description: SC70-6 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-6
Part Status: Active
на замовлення 88 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 400.6 грн |
| PA0087-S |
|
Виробник: Chip Quik Inc.
Description: SC70-6/SOT-363 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: SC70-6/SOT-363 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 827.9 грн |
| PA0088 |
|
Виробник: Chip Quik Inc.
Description: SC70-5/SOT-353 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-353
Part Status: Active
Description: SC70-5/SOT-353 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-353
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 189.23 грн |
| PA0088C |
|
Виробник: Chip Quik Inc.
Description: SC70-5 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-5
Part Status: Active
Description: SC70-5 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-5
Part Status: Active
на замовлення 80 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 400.6 грн |
| PA0088-S |
|
Виробник: Chip Quik Inc.
Description: SC70-5/SOT-353 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SC70-5/SOT-353 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
товар відсутній
| PA0089 |
|
Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TSOT
Part Status: Active
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TSOT
Part Status: Active
на замовлення 255 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 226.62 грн |
| PA0089C |
|
Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 435.7 грн |
| PA0089-S |
|
Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: SOT23-8/TSOT-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товар відсутній
| PA0090 |
|
Виробник: Chip Quik Inc.
Description: TSOC-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOC
Part Status: Active
Description: TSOC-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOC
Part Status: Active
на замовлення 141 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 191.52 грн |
| PA0091 |
|
Виробник: Chip Quik Inc.
Description: TQFP-32/LQFP-32 TO DIP-32 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-32/LQFP-32 TO DIP-32 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 525.74 грн |
| PA0091C |
|
Виробник: Chip Quik Inc.
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 739.39 грн |
| PA0091-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL TQFP-32 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: STENCIL TQFP-32 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
| PA0092 |
|
Виробник: Chip Quik Inc.
Description: TQFP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 596.7 грн |
| PA0092C |
|
Виробник: Chip Quik Inc.
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 810.35 грн |
| PA0092-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: TQFP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
| PA0093 |
|
Виробник: Chip Quik Inc.
Description: LQFP-44/QFP-44/VQFP-44/TQFP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
Description: LQFP-44/QFP-44/VQFP-44/TQFP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 746.26 грн |
| PA0093C |
|
Виробник: Chip Quik Inc.
Description: TQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
Description: TQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 959.91 грн |
| PA0093-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL LQFP-44 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: STENCIL LQFP-44 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 827.9 грн |
| PA0094 |
|
Виробник: Chip Quik Inc.
Description: LQFP-48/TQFP-48 TO DIP-48 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: LQFP-48/TQFP-48 TO DIP-48 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 974.41 грн |
| PA0094C |
|
Виробник: Chip Quik Inc.
Description: TQFP-48 TO DIP-48 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-48 TO DIP-48 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1175.85 грн |
| PA0094-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL LQFP-48 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: STENCIL LQFP-48 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 824.85 грн |
| PA0095 |
|
Виробник: Chip Quik Inc.
Description: QFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP
Part Status: Active
Description: QFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP
Part Status: Active
товар відсутній
| PA0096 |
|
Виробник: Chip Quik Inc.
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1112.52 грн |
| PA0096C |
|
Виробник: Chip Quik Inc.
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1323.88 грн |
| PA0096-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL VQFP-64 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
Description: STENCIL VQFP-64 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 816.46 грн |
| PA0097 |
|
Виробник: Chip Quik Inc.
Description: TSOP-32 I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-32 I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
| PA0097-S |
|
Виробник: Chip Quik Inc.
Description: TSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: TSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
| PA0098 |
|
Виробник: Chip Quik Inc.
Description: LGA-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 319.72 грн |
| PA0098-S |
|
Виробник: Chip Quik Inc.
Description: LGA-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: LGA-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
| PA0099 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товар відсутній
| PA0099-S |
|
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
| PA0100 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товар відсутній
| PA0100-S |
|
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
| PA0101 |
|
Виробник: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 334.21 грн |
| PA0101C |
|
Виробник: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 548.63 грн |
| PA0101-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 816.46 грн |
| PA0102 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товар відсутній
| PA0102-S |
|
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
| PA0103 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 443.33 грн |
| PA0103C |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 654.69 грн |
| PA0103-S |
|
Виробник: Chip Quik Inc.
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 816.46 грн |
| PA0104 |
|
Виробник: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
товар відсутній
| PA0104-S |
|
Виробник: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 52
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 52
товар відсутній
| PA0105 |
|
Виробник: Chip Quik Inc.
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
| PA0105C |
|
Виробник: Chip Quik Inc.
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 959.91 грн |
| PA0105-S |
|
Виробник: Chip Quik Inc.
Description: PLCC-20/LCC-20/JLCC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: PLCC-20/LCC-20/JLCC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
товар відсутній
| PA0105SOCKET |
|
Виробник: Chip Quik Inc.
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 102 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1123.2 грн |
| PA0106 |
|
Виробник: Chip Quik Inc.
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 824.85 грн |
| PA0106C |
|
Виробник: Chip Quik Inc.
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1038.5 грн |
| PA0106C-P |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 639.43 грн |
| PA0106C-P-R |
|
Виробник: Chip Quik Inc.
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 639.43 грн |