Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2462) > Сторінка 27 з 42
Фото | Назва | Виробник | Інформація |
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PA0059-S | Chip Quik Inc. |
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товар відсутній |
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PA0060 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN THIN Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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PA0060C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0060-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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PA0061 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
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PA0061C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0061-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 16 |
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PA0062 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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PA0062-S | Chip Quik Inc. |
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PA0063 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 111 шт: термін постачання 21-31 дні (днів) |
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PA0063C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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PA0063-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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PA0064 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN THIN Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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PA0064C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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PA0064-S | Chip Quik Inc. |
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PA0065 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0065C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0065-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
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PA0066 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
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PA0066-S | Chip Quik Inc. |
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PA0067 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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PA0067C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm) Number of Positions: 32 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0067-S | Chip Quik Inc. |
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PA0068 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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PA0068-S | Chip Quik Inc. |
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PA0069 | Chip Quik Inc. |
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PA0069-S | Chip Quik Inc. |
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PA0070 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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PA0070-S | Chip Quik Inc. |
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PA0071 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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PA0071C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Number of Positions: 40 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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PA0071-S | Chip Quik Inc. |
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PA0072 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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PA0072-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 44 |
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PA0073 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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PA0073C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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PA0073-S | Chip Quik Inc. |
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PA0074 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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PA0074-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 56 |
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PA0075 | Chip Quik Inc. |
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PA0075-S | Chip Quik Inc. |
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PA0076 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
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PA0076-S | Chip Quik Inc. |
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PA0077 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP |
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PA0077-S | Chip Quik Inc. |
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PA0078 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
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PA0078-S | Chip Quik Inc. |
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PA0079 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
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PA0079-S | Chip Quik Inc. |
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PA0080 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
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PA0080-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TVSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
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PA0081 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
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PA0081-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TVSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
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PA0082 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SOT-323 Part Status: Active |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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PA0082-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 3 |
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PA0083 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, TO-236 Part Status: Active |
на замовлення 124 шт: термін постачання 21-31 дні (днів) |
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PA0083C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm) Number of Positions: 4 Pitch: 0.037" (0.95mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23, TO-236 Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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PA0083-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.037" (0.95mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 3 |
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PA0084 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.059" (1.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-89 |
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PA0084-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.059" (1.50mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.079" W (4.00mm x 2.00mm) Number of Positions: 3 |
товар відсутній |
PA0060 |
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Виробник: Chip Quik Inc.
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 341.08 грн |
PA0060C |
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Виробник: Chip Quik Inc.
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 548.63 грн |
PA0060-S |
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Виробник: Chip Quik Inc.
Description: QFN-16-THIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: QFN-16-THIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 816.46 грн |
PA0061 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 69 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 341.08 грн |
PA0061C |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 548.63 грн |
PA0061-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
товар відсутній
PA0062 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
PA0063 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 111 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 372.37 грн |
PA0063C |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-20 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 592.12 грн |
PA0063-S |
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Виробник: Chip Quik Inc.
Description: STENCIL QFN-20 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: STENCIL QFN-20 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 824.85 грн |
PA0064 |
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Виробник: Chip Quik Inc.
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 408.23 грн |
PA0064C |
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Виробник: Chip Quik Inc.
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 619.59 грн |
PA0065 |
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Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 525.74 грн |
PA0065C |
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Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 739.39 грн |
PA0065-S |
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Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0066 |
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Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
PA0067 |
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Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 53 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 591.36 грн |
PA0067C |
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Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-32 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 802.72 грн |
PA0068 |
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Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
PA0070 |
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Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
PA0071 |
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Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 746.26 грн |
PA0071C |
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Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-40 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-40 TO DIP-40 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 959.91 грн |
PA0072 |
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Виробник: Chip Quik Inc.
Description: QFN-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
PA0072-S |
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Виробник: Chip Quik Inc.
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
товар відсутній
PA0073 |
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Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
PA0073C |
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Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-48 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-48 TO DIP-48 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 51 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1098.78 грн |
PA0074 |
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Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
PA0074-S |
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Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 56
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 56
товар відсутній
PA0076 |
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Виробник: Chip Quik Inc.
Description: TVSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товар відсутній
PA0077 |
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Виробник: Chip Quik Inc.
Description: TVSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Description: TVSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
товар відсутній
PA0078 |
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Виробник: Chip Quik Inc.
Description: TVSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товар відсутній
PA0079 |
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Виробник: Chip Quik Inc.
Description: TVSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товар відсутній
PA0080 |
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Виробник: Chip Quik Inc.
Description: TVSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товар відсутній
PA0080-S |
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Виробник: Chip Quik Inc.
Description: TVSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TVSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0081 |
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Виробник: Chip Quik Inc.
Description: TVSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товар відсутній
PA0081-S |
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Виробник: Chip Quik Inc.
Description: TVSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TVSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній
PA0082 |
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Виробник: Chip Quik Inc.
Description: SC70-3/SOT-323 TO DIP-4 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-323
Part Status: Active
Description: SC70-3/SOT-323 TO DIP-4 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-323
Part Status: Active
на замовлення 55 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 192.29 грн |
PA0082-S |
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Виробник: Chip Quik Inc.
Description: SC70-3/SOT-323 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
Description: SC70-3/SOT-323 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
товар відсутній
PA0083 |
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Виробник: Chip Quik Inc.
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
на замовлення 124 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 191.52 грн |
PA0083C |
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Виробник: Chip Quik Inc.
Description: SOT23 TO DIP-4 SMT ADAPTER (0.95
Packaging: Bulk
Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)
Number of Positions: 4
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
Description: SOT23 TO DIP-4 SMT ADAPTER (0.95
Packaging: Bulk
Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)
Number of Positions: 4
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 400.6 грн |
PA0083-S |
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Виробник: Chip Quik Inc.
Description: SOT23/TO-236 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
Description: SOT23/TO-236 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
товар відсутній
PA0084 |
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Виробник: Chip Quik Inc.
Description: SOT-89 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Description: SOT-89 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
товар відсутній
PA0084-S |
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Виробник: Chip Quik Inc.
Description: SOT-89 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.079" W (4.00mm x 2.00mm)
Number of Positions: 3
Description: SOT-89 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.079" W (4.00mm x 2.00mm)
Number of Positions: 3
товар відсутній