Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2488) > Сторінка 21 з 42
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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IPC0218 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товар відсутній |
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IPC0219 | Chip Quik Inc. |
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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IPC0219-S | Chip Quik Inc. |
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1 Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: DFN/SON Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
товар відсутній |
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IPC0220 | Chip Quik Inc. |
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
товар відсутній |
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IPC0221 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товар відсутній |
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IPC0222 | Chip Quik Inc. |
Description: QFN-12 TO DIP-16 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 21 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товар відсутній |
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IPC0222-S | Chip Quik Inc. |
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: QFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 12 |
товар відсутній |
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IPC0224 | Chip Quik Inc. | Description: LED-2 TO DIP-4 SMT ADAPTER (0.57 |
товар відсутній |
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IPC0225 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
товар відсутній |
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IPC0226 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
товар відсутній |
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IPC0227 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.85 |
товар відсутній |
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IPC0228 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.8 |
товар відсутній |
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IPC0229 | Chip Quik Inc. |
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.043" (1.10mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED, PLCC Part Status: Active |
товар відсутній |
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IPC0229-S | Chip Quik Inc. |
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X Packaging: Bulk Material: Stainless Steel Pitch: 0.043" (1.10mm) Type: LED/PLCC Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
товар відсутній |
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IPC0230 | Chip Quik Inc. |
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN, LED |
товар відсутній |
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IPC0231 | Chip Quik Inc. | Description: LED-3 TO DIP-4 SMT ADAPTER (1.1 |
товар відсутній |
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IPC0232 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
товар відсутній |
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IPC0232-S | Chip Quik Inc. |
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 64 |
товар відсутній |
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IPC0233 | Chip Quik Inc. |
Description: HTQFP-100 TO DIP-104 SMT ADAPTER Packaging: Bulk Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
товар відсутній |
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IPC0233-S | Chip Quik Inc. |
Description: HTQFP-100 (0.5 MM PITCH 14 X 14 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 100 |
товар відсутній |
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IPC0234 | Chip Quik Inc. |
Description: HTQFP-80 TO DIP-84 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товар відсутній |
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IPC0234-S | Chip Quik Inc. |
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm) Number of Positions: 80 |
товар відсутній |
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IPC0235 | Chip Quik Inc. |
Description: HTQFP-44 TO DIP-48 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товар відсутній |
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IPC0235-S | Chip Quik Inc. |
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 44 |
товар відсутній |
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IPC0236 | Chip Quik Inc. |
Description: HTQFP-52 TO DIP-56 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товар відсутній |
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IPC0236-S | Chip Quik Inc. |
Description: HTQFP-52 (0.65 MM PITCH 10 X 10 Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 52 |
товар відсутній |
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IPC0237 | Chip Quik Inc. |
Description: HTQFP-48 TO DIP-52 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
товар відсутній |
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IPC0237-S | Chip Quik Inc. |
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 48 |
товар відсутній |
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IPC0238 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
товар відсутній |
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IPC0238-S | Chip Quik Inc. |
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 64 |
товар відсутній |
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IPC0242 | Chip Quik Inc. |
Description: MODULE-29 TO DIP-32 SMT ADAPTER Packaging: Bulk Part Status: Active Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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IPC0242-S | Chip Quik Inc. |
Description: MODULE-29 (1.016 MM PITCH, 21.72 Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: Module Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 29 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0243 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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IPC0243-S | Chip Quik Inc. |
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45 Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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IPC0244 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35 Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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IPC0244-S | Chip Quik Inc. |
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6 Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0245 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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IPC0245-S | Chip Quik Inc. |
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88 Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0246 | Chip Quik Inc. |
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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IPC0246-S | Chip Quik Inc. |
Description: MODULE-5 (0.822 MM PITCH, 3.5 X Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: Module Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0247 | Chip Quik Inc. |
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.038" (0.97mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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IPC0247-S | Chip Quik Inc. |
Description: MODULE-6 (0.966 MM PITCH, 3.76 X Packaging: Bulk Material: Stainless Steel Pitch: 0.038" (0.97mm) Type: Module Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0248 | Chip Quik Inc. |
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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IPC0248-S | Chip Quik Inc. |
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0249 | Chip Quik Inc. |
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER Packaging: Bulk Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 70 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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IPC0249-S | Chip Quik Inc. |
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 70 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0250 | Chip Quik Inc. |
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3. Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.156" (3.96mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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IPC0250-S | Chip Quik Inc. |
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X Packaging: Bulk Material: Stainless Steel Pitch: 0.150" (3.81mm) Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0251 | Chip Quik Inc. |
Description: DFN-18 TO DIP-22 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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IPC0251-S | Chip Quik Inc. |
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 18 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0252 | Chip Quik Inc. |
Description: POWERPAK 1212-8 SINGLE TO DIP-8 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
товар відсутній |
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IPC0252-S | Chip Quik Inc. |
Description: POWERPAK 1212-8 SINGLE (0.65 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerPAK Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0253 | Chip Quik Inc. |
Description: POWERPAK 1212-8 DOUBLE TO DIP-8 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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IPC0254 | Chip Quik Inc. |
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.059" (1.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-89 Part Status: Active |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
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IPC0254-S | Chip Quik Inc. |
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6 Packaging: Bulk Material: Stainless Steel Pitch: 0.059" (1.50mm) Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0255 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6 Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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IPC0255-S | Chip Quik Inc. |
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5 Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0256 | Chip Quik Inc. |
Description: LGA-28 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Part Status: Active Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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IPC0256-S | Chip Quik Inc. |
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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IPC0257 | Chip Quik Inc. |
Description: QFN-34 TO DIP-38 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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IPC0218 |
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0219 |
Виробник: Chip Quik Inc.
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 354.82 грн |
5+ | 332.69 грн |
IPC0219-S |
Виробник: Chip Quik Inc.
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: DFN/SON
Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: DFN/SON
Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
IPC0220 |
Виробник: Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0221 |
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0222 |
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0222-S |
Виробник: Chip Quik Inc.
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товар відсутній
IPC0229 |
Виробник: Chip Quik Inc.
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
товар відсутній
IPC0229-S |
Виробник: Chip Quik Inc.
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
товар відсутній
IPC0230 |
Виробник: Chip Quik Inc.
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
товар відсутній
IPC0232 |
Виробник: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0232-S |
Виробник: Chip Quik Inc.
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
товар відсутній
IPC0233 |
Виробник: Chip Quik Inc.
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0233-S |
Виробник: Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
товар відсутній
IPC0234 |
Виробник: Chip Quik Inc.
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0234-S |
Виробник: Chip Quik Inc.
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
товар відсутній
IPC0235 |
Виробник: Chip Quik Inc.
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0235-S |
Виробник: Chip Quik Inc.
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
товар відсутній
IPC0236 |
Виробник: Chip Quik Inc.
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0236-S |
Виробник: Chip Quik Inc.
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
товар відсутній
IPC0237 |
Виробник: Chip Quik Inc.
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0237-S |
Виробник: Chip Quik Inc.
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
товар відсутній
IPC0238 |
Виробник: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0238-S |
Виробник: Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
товар відсутній
IPC0242 |
Виробник: Chip Quik Inc.
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 838.04 грн |
IPC0242-S |
Виробник: Chip Quik Inc.
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 822.48 грн |
IPC0243 |
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 343.93 грн |
IPC0243-S |
Виробник: Chip Quik Inc.
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 853.6 грн |
IPC0244 |
Виробник: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 262.23 грн |
IPC0244-S |
Виробник: Chip Quik Inc.
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0245 |
Виробник: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 287.13 грн |
IPC0245-S |
Виробник: Chip Quik Inc.
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0246 |
Виробник: Chip Quik Inc.
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 292.58 грн |
IPC0246-S |
Виробник: Chip Quik Inc.
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0247 |
Виробник: Chip Quik Inc.
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 313.58 грн |
IPC0247-S |
Виробник: Chip Quik Inc.
Description: MODULE-6 (0.966 MM PITCH, 3.76 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: Module
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: MODULE-6 (0.966 MM PITCH, 3.76 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: Module
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0248 |
Виробник: Chip Quik Inc.
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 652.07 грн |
IPC0248-S |
Виробник: Chip Quik Inc.
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0249 |
Виробник: Chip Quik Inc.
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1148.51 грн |
IPC0249-S |
Виробник: Chip Quik Inc.
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0250 |
Виробник: Chip Quik Inc.
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 378.95 грн |
IPC0250-S |
Виробник: Chip Quik Inc.
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0251 |
Виробник: Chip Quik Inc.
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
на замовлення 46 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 561.03 грн |
IPC0251-S |
Виробник: Chip Quik Inc.
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 18
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 18
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0252 |
Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 SINGLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: POWERPAK 1212-8 SINGLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
товар відсутній
IPC0252-S |
Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 SINGLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: POWERPAK 1212-8 SINGLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 901.85 грн |
IPC0253 |
Виробник: Chip Quik Inc.
Description: POWERPAK 1212-8 DOUBLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: POWERPAK 1212-8 DOUBLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 379.72 грн |
IPC0254 |
Виробник: Chip Quik Inc.
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.059" (1.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Part Status: Active
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.059" (1.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Part Status: Active
на замовлення 65 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 188.31 грн |
IPC0254-S |
Виробник: Chip Quik Inc.
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0255 |
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 343.93 грн |
IPC0255-S |
Виробник: Chip Quik Inc.
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 853.6 грн |
IPC0256 |
Виробник: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 810.03 грн |
IPC0256-S |
Виробник: Chip Quik Inc.
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 855.16 грн |
IPC0257 |
Виробник: Chip Quik Inc.
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 732.99 грн |