Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2462) > Сторінка 18 з 42
| Фото | Назва | Виробник | Інформація |
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IPC0126 | Chip Quik Inc. |
 Description: QFN-20 TO DIP-24 SMT ADAPTERPackaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
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IPC0126-S | Chip Quik Inc. |
Description: QFN-20 STENCIL |
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IPC0127 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0127-S | Chip Quik Inc. |
Description: DFN-12 STENCIL |
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IPC0128 | Chip Quik Inc. |
Description: QFN-42 TO DIP-46 SMT ADAPTER |
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IPC0128-S | Chip Quik Inc. |
Description: QFN-42 STENCIL |
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IPC0129 | Chip Quik Inc. |
Description: SOT-886 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-886 |
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IPC0129-S | Chip Quik Inc. |
Description: SOT-886 STENCIL |
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IPC0130 | Chip Quik Inc. |
Description: SOT-666 TO DIP-6 SMT ADAPTER |
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IPC0130-S | Chip Quik Inc. |
Description: SOT-666 STENCIL |
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IPC0131 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0131-S | Chip Quik Inc. |
Description: DFN-12 STENCIL |
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IPC0132 | Chip Quik Inc. |
Description: HSOP-44 TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: HSOP Part Status: Active |
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IPC0132-S | Chip Quik Inc. |
Description: HSOP-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HSOP Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
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IPC0133 | Chip Quik Inc. |
Description: TQFP-64 TO DIP-64 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
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IPC0133-S | Chip Quik Inc. |
Description: TQFP-64 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: TQFP Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 64 |
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IPC0134 | Chip Quik Inc. |
Description: TQFP-44 TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
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IPC0134-S | Chip Quik Inc. |
Description: TQFP-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
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IPC0135 | Chip Quik Inc. |
Description: TQFP-44 TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
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IPC0135-S | Chip Quik Inc. |
Description: TQFP-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
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IPC0136 | Chip Quik Inc. |
Description: TQFP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
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IPC0136-S | Chip Quik Inc. |
Description: TQFP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.551" L x 0.394" W (14.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
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IPC0137 | Chip Quik Inc. |
Description: TQFP-60 TO DIP-60 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP |
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IPC0137-S | Chip Quik Inc. |
Description: TQFP-60 STENCIL |
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IPC0138 | Chip Quik Inc. |
Description: TQFP-64 TO DIP-64 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
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IPC0138-S | Chip Quik Inc. |
Description: TQFP-64 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 64 |
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| IPC0139 | Chip Quik Inc. |
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0 Packaging: Bulk Number of Positions: 80 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
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| IPC0139-S | Chip Quik Inc. |
Description: TQFP-80 (0.8MM PITCH, 14X20MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 80 |
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IPC0140 | Chip Quik Inc. |
Description: SSOP-36 TO DIP-36 SMT ADAPTER |
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IPC0140-S | Chip Quik Inc. |
Description: SSOP-36 STENCIL |
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IPC0141 | Chip Quik Inc. |
Description: POWERSSO-36 TO DIP-40 SMT ADAPTE Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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IPC0141-S | Chip Quik Inc. |
Description: POWERSSO-36 STENCIL |
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IPC0142 | Chip Quik Inc. |
Description: SOP-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOP Part Status: Active |
на замовлення 75 шт: термін постачання 21-31 дні (днів) |
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IPC0142C | Chip Quik Inc. |
Description: SOP-8 TO DIP-8 SMT ADAPTER (2.54 Packaging: Bulk Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm) Number of Positions: 8 Pitch: 0.100" (2.54mm) Proto Board Type: SMD to DIP Package Accepted: SOP Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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IPC0142-S | Chip Quik Inc. |
Description: SOP-8 STENCIL |
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IPC0143 | Chip Quik Inc. |
Description: QFN-16 TO DIP-20 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
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IPC0143-S | Chip Quik Inc. |
Description: QFN-16 STENCIL |
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IPC0144 | Chip Quik Inc. |
Description: QFN-56 TO DIP-60 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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IPC0144-S | Chip Quik Inc. |
Description: QFN-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm) Number of Positions: 56 |
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IPC0145 | Chip Quik Inc. |
Description: QFN-36 TO DIP-36 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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IPC0145-S | Chip Quik Inc. |
Description: QFN-36 STENCIL |
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IPC0146 | Chip Quik Inc. |
Description: QFN-56 TO DIP-60 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
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IPC0146-S | Chip Quik Inc. |
Description: QFN-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.433" L x 0.197" W (11.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.330" L x 0.096" W (8.38mm x 2.45mm) Number of Positions: 56 |
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IPC0147 | Chip Quik Inc. |
Description: HSOP-48 TO DIP-52 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: HSOP Part Status: Active |
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IPC0147-S | Chip Quik Inc. |
Description: HSOP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HSOP Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
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IPC0148 | Chip Quik Inc. |
Description: PLCC-4 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.059" (1.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PLCC |
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IPC0148-S | Chip Quik Inc. |
Description: PLCC-4 STENCIL |
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IPC0149 | Chip Quik Inc. |
Description: SSOP-32 TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
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IPC0149-S | Chip Quik Inc. |
Description: SSOP-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: SSOP Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
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IPC0150 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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IPC0150-S | Chip Quik Inc. |
Description: DFN-10 STENCIL |
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IPC0151 | Chip Quik Inc. |
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MSOP |
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| IPC0151-S | Chip Quik Inc. |
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 12 |
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IPC0152 | Chip Quik Inc. |
Description: DFN-18 TO DIP-22 SMT ADAPTER |
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IPC0152-S | Chip Quik Inc. |
Description: DFN-18 STENCIL |
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IPC0153 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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IPC0153-S | Chip Quik Inc. |
Description: DFN-6 STENCIL |
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IPC0154 | Chip Quik Inc. |
Description: QFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
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IPC0154-S | Chip Quik Inc. |
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm) Number of Positions: 12 |
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IPC0155 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
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| IPC0126 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
| IPC0127 |
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Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0129 |
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Виробник: Chip Quik Inc.
Description: SOT-886 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-886
Description: SOT-886 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-886
товар відсутній
| IPC0131 |
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Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0132 |
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Виробник: Chip Quik Inc.
Description: HSOP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
Description: HSOP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
товар відсутній
| IPC0132-S |
|
Виробник: Chip Quik Inc.
Description: HSOP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: HSOP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
| IPC0133 |
|
Виробник: Chip Quik Inc.
Description: TQFP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
| IPC0133-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
Description: TQFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
товар відсутній
| IPC0134 |
|
Виробник: Chip Quik Inc.
Description: TQFP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
| IPC0134-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: TQFP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
| IPC0135 |
|
Виробник: Chip Quik Inc.
Description: TQFP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
| IPC0135-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: TQFP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
| IPC0136 |
|
Виробник: Chip Quik Inc.
Description: TQFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
| IPC0136-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.394" W (14.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TQFP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.394" W (14.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
| IPC0137 |
|
Виробник: Chip Quik Inc.
Description: TQFP-60 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Description: TQFP-60 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
товар відсутній
| IPC0138 |
|
Виробник: Chip Quik Inc.
Description: TQFP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
| IPC0138-S |
|
Виробник: Chip Quik Inc.
Description: TQFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
Description: TQFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
товар відсутній
| IPC0139 |
|
Виробник: Chip Quik Inc.
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
| IPC0139-S |
Виробник: Chip Quik Inc.
Description: TQFP-80 (0.8MM PITCH, 14X20MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
Description: TQFP-80 (0.8MM PITCH, 14X20MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
товар відсутній
| IPC0141 |
|
Виробник: Chip Quik Inc.
Description: POWERSSO-36 TO DIP-40 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSO-36 TO DIP-40 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 746.26 грн |
| IPC0142 |
|
Виробник: Chip Quik Inc.
Description: SOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
Description: SOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
на замовлення 75 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 247.99 грн |
| IPC0142C |
|
Виробник: Chip Quik Inc.
Description: SOP-8 TO DIP-8 SMT ADAPTER (2.54
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
Description: SOP-8 TO DIP-8 SMT ADAPTER (2.54
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 461.64 грн |
| IPC0143 |
|
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
| IPC0144 |
|
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
| IPC0144-S |
|
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm)
Number of Positions: 56
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm)
Number of Positions: 56
товар відсутній
| IPC0145 |
|
Виробник: Chip Quik Inc.
Description: QFN-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 738.63 грн |
| IPC0146 |
|
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
| IPC0146-S |
|
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.197" W (11.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.330" L x 0.096" W (8.38mm x 2.45mm)
Number of Positions: 56
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.197" W (11.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.330" L x 0.096" W (8.38mm x 2.45mm)
Number of Positions: 56
товар відсутній
| IPC0147 |
|
Виробник: Chip Quik Inc.
Description: HSOP-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
Description: HSOP-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
товар відсутній
| IPC0147-S |
|
Виробник: Chip Quik Inc.
Description: HSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: HSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
| IPC0148 |
|
Виробник: Chip Quik Inc.
Description: PLCC-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Description: PLCC-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
товар відсутній
| IPC0149 |
|
Виробник: Chip Quik Inc.
Description: SSOP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
| IPC0149-S |
|
Виробник: Chip Quik Inc.
Description: SSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: SSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
| IPC0150 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 403.65 грн |
| IPC0151 |
|
Виробник: Chip Quik Inc.
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
товар відсутній
| IPC0151-S |
Виробник: Chip Quik Inc.
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
товар відсутній
| IPC0153 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 337.27 грн |
| IPC0154 |
|
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
| IPC0154-S |
Виробник: Chip Quik Inc.
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm)
Number of Positions: 12
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm)
Number of Positions: 12
товар відсутній
| IPC0155 |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній