Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2490) > Сторінка 19 з 42
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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IPC0147 | Chip Quik Inc. |
 Description: HSOP-48 TO DIP-52 SMT ADAPTERPackaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: HSOP Part Status: Active |
товару немає в наявності |
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IPC0147-S | Chip Quik Inc. |
Description: HSOP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HSOP Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
товару немає в наявності |
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IPC0148 | Chip Quik Inc. |
Description: PLCC-4 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.059" (1.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PLCC |
товару немає в наявності |
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IPC0148-S | Chip Quik Inc. |
Description: PLCC-4 STENCIL |
товару немає в наявності |
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IPC0149 | Chip Quik Inc. |
Description: SSOP-32 TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
товару немає в наявності |
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IPC0149-S | Chip Quik Inc. |
Description: SSOP-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: SSOP Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
товару немає в наявності |
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IPC0150 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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IPC0150-S | Chip Quik Inc. |
Description: DFN-10 STENCIL |
товару немає в наявності |
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IPC0151 | Chip Quik Inc. |
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MSOP |
товару немає в наявності |
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| IPC0151-S | Chip Quik Inc. |
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 12 |
товару немає в наявності |
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IPC0152 | Chip Quik Inc. |
Description: DFN-18 TO DIP-22 SMT ADAPTER |
товару немає в наявності |
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IPC0152-S | Chip Quik Inc. |
Description: DFN-18 STENCIL |
товару немає в наявності |
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IPC0153 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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IPC0153-S | Chip Quik Inc. |
Description: DFN-6 STENCIL |
товару немає в наявності |
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IPC0154 | Chip Quik Inc. |
Description: QFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0154-S | Chip Quik Inc. |
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm) Number of Positions: 12 |
товару немає в наявності |
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IPC0155 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0156 | Chip Quik Inc. |
Description: TSSOP-44 TO DIP-48 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товару немає в наявності |
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IPC0156-S | Chip Quik Inc. |
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: TSSOP Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm) Number of Positions: 44 |
товару немає в наявності |
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IPC0157 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0158 | Chip Quik Inc. |
Description: QFN-24 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0158-S | Chip Quik Inc. |
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X |
товару немає в наявності |
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IPC0159 | Chip Quik Inc. |
Description: DFN-22 TO DIP-26 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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| IPC0160 | Chip Quik Inc. |
Description: MQFP-44 TO DIP-44 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MQFP Part Status: Active |
товару немає в наявності |
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IPC0160-S | Chip Quik Inc. |
Description: MQFP-44 (0.8MM PITCH, 10X10MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: MQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
товару немає в наявності |
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| IPC0161 | Chip Quik Inc. |
Description: LGA-10 TO DIP-10 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA |
товару немає в наявності |
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IPC0161-S | Chip Quik Inc. |
Description: LGA-10 (0.65MM PITCH, 3X3MM BODY Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 10 |
товару немає в наявності |
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| IPC0162 | Chip Quik Inc. |
Description: SSOP-24 TO DIP-24 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
товару немає в наявності |
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IPC0162-S | Chip Quik Inc. |
Description: SSOP-24 (1MM PITCH, 13X6MM BODY) Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: SSOP Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 24 |
товару немає в наявності |
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| IPC0163 | Chip Quik Inc. |
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
товару немає в наявності |
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IPC0163-S | Chip Quik Inc. |
Description: SOIC-32 (1.27MM PITCH, 20.4X11.3 Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
товару немає в наявності |
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| IPC0164 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.018" (0.45mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0164-S | Chip Quik Inc. |
Description: DFN-8 (0.45MM PITCH, 2X3MM BODY) Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Type: DFN Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.065" L x 0.053" W (1.65mm x 1.35mm) Number of Positions: 8 |
товару немає в наявності |
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IPC0165 | Chip Quik Inc. |
Description: SON-6 TO DIP-10 SMT ADAPTER (0.6 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP |
товару немає в наявності |
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IPC0165-S | Chip Quik Inc. |
Description: SON-6 (0.65MM PITCH, 2X2MM BODY) Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SON Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.067" L x 0.041" W (1.70mm x 1.05mm) Number of Positions: 6 |
товару немає в наявності |
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| IPC0167 | Chip Quik Inc. |
Description: SOP-36 TO DIP-36 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.800" W (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOP |
товару немає в наявності |
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IPC0167-S | Chip Quik Inc. |
Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOP Inner Dimension: 0.504" L x 0.295" W (12.80mm x 7.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 36 |
товару немає в наявності |
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| IPC0168 | Chip Quik Inc. |
Description: POWERPAD-16/POWERSOIC-16 TO DIP- Packaging: Bulk Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PowerSOIC Part Status: Active |
товару немає в наявності |
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IPC0168-S | Chip Quik Inc. |
Description: POWERPAD-16/POWERSOIC-16 (1.27MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PowerSOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm) Number of Positions: 16 |
товару немає в наявності |
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| IPC0169 | Chip Quik Inc. |
Description: SOIC-44 TO DIP-44 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
товару немає в наявності |
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| IPC0169-S | Chip Quik Inc. |
Description: SOIC-44 (1.27MM PITCH, 28.1X13.2 Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Inner Dimension: 1.106" L x 0.520" W (28.10mm x 13.20mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 44 |
товару немає в наявності |
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| IPC0170 | Chip Quik Inc. |
Description: BGA-24 TO DIP-24 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
товару немає в наявності |
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| IPC0170-S | Chip Quik Inc. | Description: BGA-24 (1MM PITCH, 8X6MM BODY) S |
товару немає в наявності |
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| IPC0171 | Chip Quik Inc. |
Description: BGA-25 TO DIP-25 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 25 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
товару немає в наявності |
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| IPC0171-S | Chip Quik Inc. | Description: BGA-25 (1MM PITCH, 8X6MM BODY) S |
товару немає в наявності |
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| IPC0172 | Chip Quik Inc. |
Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE |
товару немає в наявності |
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| IPC0172-S | Chip Quik Inc. | Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM |
товару немає в наявності |
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| IPC0173 | Chip Quik Inc. |
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER |
товару немає в наявності |
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| IPC0173-S | Chip Quik Inc. | Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X |
товару немає в наявності |
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| IPC0174 | Chip Quik Inc. |
Description: QFN-16 TO DIP-20 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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| IPC0174-S | Chip Quik Inc. |
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm) Number of Positions: 16 |
товару немає в наявності |
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| IPC0175 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 2 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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| IPC0175-S | Chip Quik Inc. | Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X |
товару немає в наявності |
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| IPC0176 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0176C | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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| IPC0176-S | Chip Quik Inc. | Description: DFN-12 (0.5MM PITCH, 3X3MM BODY) |
товару немає в наявності |
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| IPC0177 | Chip Quik Inc. |
Description: TSSOP-48 (LONG PINS) TO DIP-48 S Packaging: Bulk Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товару немає в наявності |
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| IPC0177-S | Chip Quik Inc. |
Description: TSSOP-48 (LONG PINS) (0.5MM PITC Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
товару немає в наявності |
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| IPC0178 | Chip Quik Inc. |
Description: TSSOP-56 (LONG PINS) TO DIP-56 S Packaging: Bulk Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товару немає в наявності |
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| IPC0178-S | Chip Quik Inc. |
Description: TSSOP-56 (LONG PINS) (0.5MM PITC Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
товару немає в наявності |
| IPC0147 |
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Виробник: Chip Quik Inc.
Description: HSOP-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
Description: HSOP-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
товару немає в наявності
| IPC0147-S |
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Виробник: Chip Quik Inc.
Description: HSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: HSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товару немає в наявності
| IPC0148 |
|
Виробник: Chip Quik Inc.
Description: PLCC-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Description: PLCC-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
товару немає в наявності
| IPC0149 |
|
Виробник: Chip Quik Inc.
Description: SSOP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товару немає в наявності
| IPC0149-S |
|
Виробник: Chip Quik Inc.
Description: SSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: SSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товару немає в наявності
| IPC0150 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 409.19 грн |
| IPC0151 |
|
Виробник: Chip Quik Inc.
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
товару немає в наявності
| IPC0151-S |
Виробник: Chip Quik Inc.
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
товару немає в наявності
| IPC0153 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 339.33 грн |
| IPC0154 |
|
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0154-S |
Виробник: Chip Quik Inc.
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm)
Number of Positions: 12
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm)
Number of Positions: 12
товару немає в наявності
| IPC0155 |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0156 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товару немає в наявності
| IPC0156-S |
Виробник: Chip Quik Inc.
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Number of Positions: 44
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Number of Positions: 44
товару немає в наявності
| IPC0157 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0158 |
|
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0158-S |
|
Виробник: Chip Quik Inc.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
товару немає в наявності
| IPC0159 |
|
Виробник: Chip Quik Inc.
Description: DFN-22 TO DIP-26 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-22 TO DIP-26 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0160 |
|
Виробник: Chip Quik Inc.
Description: MQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MQFP
Part Status: Active
Description: MQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MQFP
Part Status: Active
товару немає в наявності
| IPC0160-S |
Виробник: Chip Quik Inc.
Description: MQFP-44 (0.8MM PITCH, 10X10MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: MQFP-44 (0.8MM PITCH, 10X10MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товару немає в наявності
| IPC0161 |
|
Виробник: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
товару немає в наявності
| IPC0161-S |
Виробник: Chip Quik Inc.
Description: LGA-10 (0.65MM PITCH, 3X3MM BODY
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Description: LGA-10 (0.65MM PITCH, 3X3MM BODY
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товару немає в наявності
| IPC0162 |
|
Виробник: Chip Quik Inc.
Description: SSOP-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товару немає в наявності
| IPC0162-S |
Виробник: Chip Quik Inc.
Description: SSOP-24 (1MM PITCH, 13X6MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: SSOP
Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
Description: SSOP-24 (1MM PITCH, 13X6MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: SSOP
Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
товару немає в наявності
| IPC0163 |
|
Виробник: Chip Quik Inc.
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товару немає в наявності
| IPC0163-S |
Виробник: Chip Quik Inc.
Description: SOIC-32 (1.27MM PITCH, 20.4X11.3
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: SOIC-32 (1.27MM PITCH, 20.4X11.3
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товару немає в наявності
| IPC0164 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.018" (0.45mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.018" (0.45mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0164-S |
Виробник: Chip Quik Inc.
Description: DFN-8 (0.45MM PITCH, 2X3MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.065" L x 0.053" W (1.65mm x 1.35mm)
Number of Positions: 8
Description: DFN-8 (0.45MM PITCH, 2X3MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.065" L x 0.053" W (1.65mm x 1.35mm)
Number of Positions: 8
товару немає в наявності
| IPC0165 |
|
Виробник: Chip Quik Inc.
Description: SON-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Description: SON-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
товару немає в наявності
| IPC0165-S |
Виробник: Chip Quik Inc.
Description: SON-6 (0.65MM PITCH, 2X2MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SON
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.067" L x 0.041" W (1.70mm x 1.05mm)
Number of Positions: 6
Description: SON-6 (0.65MM PITCH, 2X2MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SON
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.067" L x 0.041" W (1.70mm x 1.05mm)
Number of Positions: 6
товару немає в наявності
| IPC0167 |
|
Виробник: Chip Quik Inc.
Description: SOP-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.800" W (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Description: SOP-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.800" W (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
товару немає в наявності
| IPC0167-S |
Виробник: Chip Quik Inc.
Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOP
Inner Dimension: 0.504" L x 0.295" W (12.80mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 36
Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOP
Inner Dimension: 0.504" L x 0.295" W (12.80mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 36
товару немає в наявності
| IPC0168 |
|
Виробник: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
товару немає в наявності
| IPC0168-S |
Виробник: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 16
Description: POWERPAD-16/POWERSOIC-16 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 16
товару немає в наявності
| IPC0169 |
|
Виробник: Chip Quik Inc.
Description: SOIC-44 TO DIP-44 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-44 TO DIP-44 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товару немає в наявності
| IPC0169-S |
Виробник: Chip Quik Inc.
Description: SOIC-44 (1.27MM PITCH, 28.1X13.2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 1.106" L x 0.520" W (28.10mm x 13.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
Description: SOIC-44 (1.27MM PITCH, 28.1X13.2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 1.106" L x 0.520" W (28.10mm x 13.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
товару немає в наявності
| IPC0170 |
|
Виробник: Chip Quik Inc.
Description: BGA-24 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-24 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товару немає в наявності
| IPC0170-S |
Виробник: Chip Quik Inc.
Description: BGA-24 (1MM PITCH, 8X6MM BODY) S
Description: BGA-24 (1MM PITCH, 8X6MM BODY) S
товару немає в наявності
| IPC0171 |
|
Виробник: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товару немає в наявності
| IPC0171-S |
Виробник: Chip Quik Inc.
Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
товару немає в наявності
| IPC0172 |
|
Виробник: Chip Quik Inc.
Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
товару немає в наявності
| IPC0172-S |
Виробник: Chip Quik Inc.
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
товару немає в наявності
| IPC0173 |
|
Виробник: Chip Quik Inc.
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER
товару немає в наявності
| IPC0173-S |
Виробник: Chip Quik Inc.
Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
товару немає в наявності
| IPC0174 |
|
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0174-S |
|
Виробник: Chip Quik Inc.
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 16
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 16
товару немає в наявності
| IPC0175 |
|
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0175-S |
Виробник: Chip Quik Inc.
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
товару немає в наявності
| IPC0176 |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0176C |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 667.92 грн |
| IPC0176-S |
Виробник: Chip Quik Inc.
Description: DFN-12 (0.5MM PITCH, 3X3MM BODY)
Description: DFN-12 (0.5MM PITCH, 3X3MM BODY)
товару немає в наявності
| IPC0177 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товару немає в наявності
| IPC0177-S |
Виробник: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TSSOP-48 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товару немає в наявності
| IPC0178 |
|
Виробник: Chip Quik Inc.
Description: TSSOP-56 (LONG PINS) TO DIP-56 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-56 (LONG PINS) TO DIP-56 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товару немає в наявності
| IPC0178-S |
Виробник: Chip Quik Inc.
Description: TSSOP-56 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TSSOP-56 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товару немає в наявності