Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2490) > Сторінка 17 з 42
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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IPC0088C | Chip Quik Inc. |
 Description: DFN-10 TO DIP-10 SMT ADAPTER (0.Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Number of Positions: 10 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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IPC0088-S | Chip Quik Inc. |
Description: DFN-10 STENCIL |
товару немає в наявності |
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IPC0089 | Chip Quik Inc. |
Description: DFN-22 TO DIP-26 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0089-S | Chip Quik Inc. |
Description: DFN-22 STENCIL |
товару немає в наявності |
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IPC0090 | Chip Quik Inc. |
Description: LGA-12 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
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IPC0090-S | Chip Quik Inc. |
Description: LGA-12 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
товару немає в наявності |
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IPC0091 | Chip Quik Inc. |
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO Part Status: Active |
товару немає в наявності |
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IPC0091-S | Chip Quik Inc. |
Description: POWERSSOP-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 28 |
товару немає в наявності |
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IPC0092 | Chip Quik Inc. |
Description: POWERSSOP-30 TO DIP-34 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO |
товару немає в наявності |
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IPC0092-S | Chip Quik Inc. |
Description: POWERSSOP-30 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 30 |
товару немає в наявності |
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IPC0093 | Chip Quik Inc. |
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO |
товару немає в наявності |
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IPC0093-S | Chip Quik Inc. |
Description: POWERSSOP-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 32 |
товару немає в наявності |
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IPC0094 | Chip Quik Inc. |
Description: POWERSSOP-38 TO DIP-42 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO Part Status: Active |
товару немає в наявності |
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IPC0094-S | Chip Quik Inc. |
Description: POWERSSOP-38 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 38 |
товару немає в наявності |
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IPC0095 | Chip Quik Inc. |
Description: QFN-36 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
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IPC0095-S | Chip Quik Inc. |
Description: QFN-36 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm) Number of Positions: 36 |
товару немає в наявності |
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IPC0096 | Chip Quik Inc. |
Description: LGA-12 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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IPC0096C | Chip Quik Inc. |
Description: LGA-12 TO DIP-12 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 86 шт: термін постачання 21-31 дні (днів) |
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IPC0096-S | Chip Quik Inc. |
Description: LGA-12 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
товару немає в наявності |
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IPC0097 | Chip Quik Inc. |
Description: QFN-48 TO DIP-52 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
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IPC0097-S | Chip Quik Inc. |
Description: QFN-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.268" L x 0.268" W (6.80mm x 6.80mm) Number of Positions: 48 |
товару немає в наявності |
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IPC0098 | Chip Quik Inc. |
Description: LGA-28 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.022" (0.55mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
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IPC0098-S | Chip Quik Inc. |
Description: LGA-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.022" (0.55mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товару немає в наявності |
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IPC0099 | Chip Quik Inc. |
Description: QFN-44 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
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IPC0099-S | Chip Quik Inc. |
Description: QFN-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.254" L x 0.254" W (6.45mm x 6.45mm) Number of Positions: 44 |
товару немає в наявності |
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IPC0100 | Chip Quik Inc. |
Description: QFN-32 TO DIP-36 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0100-S | Chip Quik Inc. |
Description: QFN-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 32 |
товару немає в наявності |
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IPC0101 | Chip Quik Inc. |
Description: QFN-56 TO DIP-60 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
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IPC0101-S | Chip Quik Inc. |
Description: QFN-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm) Number of Positions: 56 |
товару немає в наявності |
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IPC0102 | Chip Quik Inc. |
Description: QFN-20 TO DIP-20 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0102-S | Chip Quik Inc. |
Description: QFN-20 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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IPC0103 | Chip Quik Inc. |
Description: LGA-10 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0103-S | Chip Quik Inc. |
Description: LGA-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 10 |
товару немає в наявності |
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IPC0104 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.018" (0.45mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0104-S | Chip Quik Inc. |
Description: DFN-12 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Type: DFN Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.094" L x 0.025" W (2.39mm x 0.64mm) Number of Positions: 12 |
товару немає в наявності |
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IPC0105 | Chip Quik Inc. |
Description: LGA-28 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA |
товару немає в наявності |
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IPC0105-S | Chip Quik Inc. |
Description: LGA-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товару немає в наявності |
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IPC0106 | Chip Quik Inc. |
Description: DFN-14 TO DIP-18 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
товару немає в наявності |
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IPC0106-S | Chip Quik Inc. |
Description: DFN-14 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm) Number of Positions: 14 |
товару немає в наявності |
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IPC0107 | Chip Quik Inc. |
Description: QFN-24 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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IPC0107-S | Chip Quik Inc. |
Description: QFN-24 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.087" L x 0.087" W (2.20mm x 2.20mm) Number of Positions: 24 |
товару немає в наявності |
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IPC0108 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.018" (0.45mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0108-S | Chip Quik Inc. |
Description: QFN-20 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm) Number of Positions: 20 |
товару немає в наявності |
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IPC0109 | Chip Quik Inc. |
Description: LGA-28 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.024" (0.60mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA |
товару немає в наявності |
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IPC0109-S | Chip Quik Inc. |
Description: LGA-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.024" (0.60mm) Type: LGA Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товару немає в наявності |
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IPC0110 | Chip Quik Inc. |
Description: QFN-16 TO DIP-20 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0110-S | Chip Quik Inc. |
Description: QFN-16 STENCIL |
товару немає в наявності |
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IPC0111 | Chip Quik Inc. |
Description: HSOP-44 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.200" x 2.400" (30.48mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: HSOP Part Status: Active |
товару немає в наявності |
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IPC0111-S | Chip Quik Inc. |
Description: HSOP-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HSOP Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm) Number of Positions: 44 |
товару немає в наявності |
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IPC0112 | Chip Quik Inc. |
Description: DFN-24 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
товару немає в наявності |
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IPC0112-S | Chip Quik Inc. |
Description: DFN-24 STENCIL |
товару немає в наявності |
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IPC0113 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
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IPC0113-S | Chip Quik Inc. |
Description: QFN-20 STENCIL |
товару немає в наявності |
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IPC0114 | Chip Quik Inc. |
Description: POWERSSO-28 TO DIP-32 SMT ADAPTE Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO Part Status: Active |
товару немає в наявності |
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IPC0114-S | Chip Quik Inc. |
Description: POWERSSO-28 STENCIL |
товару немає в наявності |
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IPC0115 | Chip Quik Inc. |
Description: DFN-14 TO DIP-18 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
товару немає в наявності |
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IPC0115-S | Chip Quik Inc. |
Description: DFN-14 STENCIL |
товару немає в наявності |
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IPC0116 | Chip Quik Inc. |
Description: HSOP-30 TO DIP-34 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.200" x 1.700" (30.48mm x 43.18mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: HSOP |
товару немає в наявності |
|||
 |
IPC0116-S | Chip Quik Inc. |
Description: HSOP-30 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HSOP Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm) Number of Positions: 30 |
товару немає в наявності |
|||
 |
IPC0117 | Chip Quik Inc. |
Description: QFN-14 TO DIP-18 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
| IPC0088C |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 585.77 грн |
| IPC0089 |
|
Виробник: Chip Quik Inc.
Description: DFN-22 TO DIP-26 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-22 TO DIP-26 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0090 |
|
Виробник: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
| IPC0090-S |
|
Виробник: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
товару немає в наявності
| IPC0091 |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
товару немає в наявності
| IPC0091-S |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 28
Description: POWERSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 28
товару немає в наявності
| IPC0092 |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-30 TO DIP-34 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Description: POWERSSOP-30 TO DIP-34 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
товару немає в наявності
| IPC0092-S |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
товару немає в наявності
| IPC0093 |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
товару немає в наявності
| IPC0093-S |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 32
Description: POWERSSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 32
товару немає в наявності
| IPC0094 |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-38 TO DIP-42 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSOP-38 TO DIP-42 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
товару немає в наявності
| IPC0094-S |
|
Виробник: Chip Quik Inc.
Description: POWERSSOP-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 38
Description: POWERSSOP-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 38
товару немає в наявності
| IPC0095 |
|
Виробник: Chip Quik Inc.
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
| IPC0095-S |
|
Виробник: Chip Quik Inc.
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm)
Number of Positions: 36
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm)
Number of Positions: 36
товару немає в наявності
| IPC0096 |
|
Виробник: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 433.76 грн |
| IPC0096C |
|
Виробник: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 86 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 640.28 грн |
| IPC0096-S |
|
Виробник: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
товару немає в наявності
| IPC0097 |
|
Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
| IPC0097-S |
|
Виробник: Chip Quik Inc.
Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.268" L x 0.268" W (6.80mm x 6.80mm)
Number of Positions: 48
Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.268" L x 0.268" W (6.80mm x 6.80mm)
Number of Positions: 48
товару немає в наявності
| IPC0098 |
|
Виробник: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
| IPC0098-S |
|
Виробник: Chip Quik Inc.
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товару немає в наявності
| IPC0099 |
|
Виробник: Chip Quik Inc.
Description: QFN-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
| IPC0099-S |
|
Виробник: Chip Quik Inc.
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.254" L x 0.254" W (6.45mm x 6.45mm)
Number of Positions: 44
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.254" L x 0.254" W (6.45mm x 6.45mm)
Number of Positions: 44
товару немає в наявності
| IPC0100 |
|
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0100-S |
|
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 32
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 32
товару немає в наявності
| IPC0101 |
|
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
| IPC0101-S |
|
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm)
Number of Positions: 56
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm)
Number of Positions: 56
товару немає в наявності
| IPC0102 |
|
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0102-S |
|
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 799.2 грн |
| IPC0103 |
|
Виробник: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 399.21 грн |
| IPC0103-S |
|
Виробник: Chip Quik Inc.
Description: LGA-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Description: LGA-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
товару немає в наявності
| IPC0104 |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0104-S |
|
Виробник: Chip Quik Inc.
Description: DFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.025" W (2.39mm x 0.64mm)
Number of Positions: 12
Description: DFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.025" W (2.39mm x 0.64mm)
Number of Positions: 12
товару немає в наявності
| IPC0105 |
|
Виробник: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
товару немає в наявності
| IPC0105-S |
|
Виробник: Chip Quik Inc.
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товару немає в наявності
| IPC0106 |
|
Виробник: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товару немає в наявності
| IPC0106-S |
|
Виробник: Chip Quik Inc.
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 14
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 14
товару немає в наявності
| IPC0107 |
|
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 631.07 грн |
| IPC0107-S |
|
Виробник: Chip Quik Inc.
Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.087" L x 0.087" W (2.20mm x 2.20mm)
Number of Positions: 24
Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.087" L x 0.087" W (2.20mm x 2.20mm)
Number of Positions: 24
товару немає в наявності
| IPC0108 |
|
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0108-S |
|
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm)
Number of Positions: 20
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm)
Number of Positions: 20
товару немає в наявності
| IPC0109 |
|
Виробник: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.024" (0.60mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.024" (0.60mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
товару немає в наявності
| IPC0109-S |
|
Виробник: Chip Quik Inc.
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.024" (0.60mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.024" (0.60mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товару немає в наявності
| IPC0110 |
|
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0111 |
|
Виробник: Chip Quik Inc.
Description: HSOP-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.200" x 2.400" (30.48mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
Description: HSOP-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.200" x 2.400" (30.48mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
товару немає в наявності
| IPC0111-S |
|
Виробник: Chip Quik Inc.
Description: HSOP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm)
Number of Positions: 44
Description: HSOP-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm)
Number of Positions: 44
товару немає в наявності
| IPC0112 |
|
Виробник: Chip Quik Inc.
Description: DFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товару немає в наявності
| IPC0113 |
|
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
| IPC0114 |
|
Виробник: Chip Quik Inc.
Description: POWERSSO-28 TO DIP-32 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSO-28 TO DIP-32 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
товару немає в наявності
| IPC0115 |
|
Виробник: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товару немає в наявності
| IPC0116 |
|
Виробник: Chip Quik Inc.
Description: HSOP-30 TO DIP-34 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.200" x 1.700" (30.48mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Description: HSOP-30 TO DIP-34 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.200" x 1.700" (30.48mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
товару немає в наявності
| IPC0116-S |
|
Виробник: Chip Quik Inc.
Description: HSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm)
Number of Positions: 30
Description: HSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm)
Number of Positions: 30
товару немає в наявності
| IPC0117 |
|
Виробник: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності