Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2462) > Сторінка 13 з 42

Обрати Сторінку:   [  << Попередня Сторінка ]  1 4 8 9 10 11 12 13 14 15 16 17 18 20 24 28 32 36 40 42  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
HDR100MET40F-G-V-TH HDR100MET40F-G-V-TH Chip Quik Inc. HDR100MET40F-G-V-TH.pdf Description: 1.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.079" (2.00mm)
Number of Rows: 1
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
2+156.42 грн
Мінімальне замовлення: 2
HDR100MET40M-G-RA-TH HDR100MET40M-G-RA-TH Chip Quik Inc. HDR100MET40M-G-RA-TH.pdf Description: CONN HEADER R/A 40POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.050" (1.27mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.071" (1.80mm)
товар відсутній
HDR100MET40M-G-V-TH HDR100MET40M-G-V-TH Chip Quik Inc. HDR100MET40M-G-V-TH.pdf Description: 1.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.039" (1.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.197" (5.00mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.079" (2.00mm)
на замовлення 79 шт:
термін постачання 21-31 дні (днів)
3+128.19 грн
Мінімальне замовлення: 3
HDR100MET80F-G-V-SM Chip Quik Inc. Description: 1.00 MM 80 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Insulation Height: 0.089" (2.26mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
товар відсутній
HDR100MET80M-G-V-SM Chip Quik Inc. Description: CONN HEADER SMD 80POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.039" (1.00mm)
Contact Length - Mating: 0.075" (1.90mm)
товар відсутній
HDR127MET10F-G-V-SM-DR Chip Quik Inc. HDR127MET10F-G-V-SM-DR.pdf Description: CONN HDR 10POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товар відсутній
HDR127MET20F-G-V-SM-DR Chip Quik Inc. HDR127MET20F-G-V-SM-DR.pdf Description: CONN HDR 20POS 0.05 GOLD SMD
товар відсутній
HDR127MET40F-G-RA-TH HDR127MET40F-G-RA-TH Chip Quik Inc. HDR127MET40F-G-RA-TH.pdf Description: CONN HDR 40POS 0.05 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.094" (2.40mm)
Insulation Height: 0.071" (1.80mm)
Number of Rows: 1
на замовлення 131 шт:
термін постачання 21-31 дні (днів)
3+110.64 грн
Мінімальне замовлення: 3
HDR127MET40F-G-V-SM-DR Chip Quik Inc. HDR127MET40F-G-V-SM-DR.pdf Description: CONN HDR 40POS 0.05 GOLD SMD
товар відсутній
HDR127MET40F-G-V-TH Chip Quik Inc. Description: 1.27 MM 40 PIN VERTICAL FEMALE H
товар відсутній
HDR127MET40M-G-RA-TH HDR127MET40M-G-RA-TH Chip Quik Inc. HDR127MET40M-G-RA-TH.pdf Description: CONN HEADER R/A 40POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.083" (2.10mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
3+103.77 грн
Мінімальне замовлення: 3
HDR127MET40M-G-V-TH Chip Quik Inc. Description: 1.27 MM 40 PIN VERTICAL MALE HEA
товар відсутній
HDR127MET80F-G-V-SM HDR127MET80F-G-V-SM Chip Quik Inc. HDR127MET80F-G-V-SM.pdf Description: CONN HDR 80POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 109 шт:
термін постачання 21-31 дні (днів)
2+159.48 грн
Мінімальне замовлення: 2
HDR127MET80F-G-V-TH Chip Quik Inc. Description: 1.27 MM 80 PIN VERTICAL FEMALE H
товар відсутній
HDR127MET80M-G-V-SM HDR127MET80M-G-V-SM Chip Quik Inc. HDR127MET80M-G-V-SM.pdf Description: CONN HEADER SMD 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
на замовлення 198 шт:
термін постачання 21-31 дні (днів)
3+145.74 грн
Мінімальне замовлення: 3
HDR127MET80M-G-V-TH Chip Quik Inc. Description: CONN HEADER VERT 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.268" (6.80mm)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
3+145.74 грн
Мінімальне замовлення: 3
HDR200MET10F-G-V-SM-DR Chip Quik Inc. HDR200MET10F-G-V-SM-DR.pdf Description: CONN HDR 10POS 0.079 GOLD SMD
товар відсутній
HDR200MET20F-G-V-SM-DR Chip Quik Inc. HDR200MET20F-G-V-SM-DR.pdf Description: CONN HDR 20POS 0.079 GOLD SMD
товар відсутній
HDR200MET40F-G-RA-TH HDR200MET40F-G-RA-TH Chip Quik Inc. HDR200MET40F-G-RA-TH.pdf Description: CONN HDR 40P 0.079 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.108" (2.75mm)
Number of Rows: 1
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
4+98.43 грн
Мінімальне замовлення: 4
HDR200MET40F-G-V-SM-DR Chip Quik Inc. HDR200MET40F-G-V-SM-DR.pdf Description: CONN HDR 40POS 0.079 GOLD SMD
товар відсутній
HDR200MET40F-G-V-TH HDR200MET40F-G-V-TH Chip Quik Inc. HDR200MET40F-G-V-TH.pdf Description: 2.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.169" (4.30mm)
Number of Rows: 1
на замовлення 530 шт:
термін постачання 21-31 дні (днів)
3+132.77 грн
Мінімальне замовлення: 3
HDR200MET40M-G-RA-TH HDR200MET40M-G-RA-TH Chip Quik Inc. HDR200MET40M-G-RA-TH.pdf Description: CONN HEADER R/A 40POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
3+106.06 грн
Мінімальне замовлення: 3
HDR200MET40M-G-V-TH HDR200MET40M-G-V-TH Chip Quik Inc. HDR200MET40M-G-V-TH.pdf Description: 2.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.110" (2.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.343" (8.70mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.154" (3.90mm)
на замовлення 177 шт:
термін постачання 21-31 дні (днів)
4+83.93 грн
Мінімальне замовлення: 4
HDR200MET80F-G-V-SM Chip Quik Inc. Description: 2.00 MM 80 PIN VERTICAL FEMALE H
товар відсутній
HDR200MET80M-G-V-SM HDR200MET80M-G-V-SM Chip Quik Inc. HDR200MET80M-G-V-SM.pdf Description: CONN HEADER SMD 80POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 133 шт:
термін постачання 21-31 дні (днів)
2+174.74 грн
Мінімальне замовлення: 2
HDR-ETD HDR-ETD Chip Quik Inc. HDR-ETD.pdf Description: CONN HEADER R/A 40POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40, 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 41 шт:
термін постачання 21-31 дні (днів)
3+121.32 грн
Мінімальне замовлення: 3
HDR-SOICN-80 HDR-SOICN-80 Chip Quik Inc. HDR-SOICN-80.pdf Description: SMT TO SOIC-NARROW HEADER (1.27M
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+400.6 грн
5+ 375.47 грн
10+ 365.33 грн
25+ 333.34 грн
50+ 314.32 грн
100+ 304.78 грн
HPS10C-20G HPS10C-20G Chip Quik Inc. HPS10C-20G.pdf Description: HIGH PERFORMANCE SILICONE 100% R
Features: Clear, 20g
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Silicone
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+325.06 грн
HVPB6 HVPB6 Chip Quik Inc. HVPB6.pdf Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Bulk
Accessory Type: Vacuum Tool with Tips
на замовлення 153 шт:
термін постачання 21-31 дні (днів)
1+1397.9 грн
ICB-MAX3232 ICB-MAX3232 Chip Quik Inc. ICB-MAX3232.pdf Description: BREAKOUT BOARD FOR MAX3232
Packaging: Bulk
Function: Transceiver, RS-232
Type: Interface
Utilized IC / Part: MAX3232E
Supplied Contents: Board(s)
Embedded: No
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
1+482.24 грн
10+ 440.28 грн
IPC0001 IPC0001 Chip Quik Inc. IPC0001.pdf Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0001-S IPC0001-S Chip Quik Inc. IPC0001-S.pdf Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товар відсутній
IPC0002 IPC0002 Chip Quik Inc. IPC0002.pdf Description: QFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0002-S IPC0002-S Chip Quik Inc. IPC0002-S.pdf Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm)
Number of Positions: 8
товар відсутній
IPC0003 IPC0003 Chip Quik Inc. IPC0003.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
1+485.3 грн
IPC0003-S IPC0003-S Chip Quik Inc. IPC0003-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товар відсутній
IPC0004 IPC0004 Chip Quik Inc. IPC0004.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0004-S IPC0004-S Chip Quik Inc. IPC0004-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm)
Number of Positions: 12
товар відсутній
IPC0005 IPC0005 Chip Quik Inc. IPC0005.pdf Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0005-S IPC0005-S Chip Quik Inc. IPC0005-S.pdf Description: QFN-14 STENCIL
товар відсутній
IPC0006 IPC0006 Chip Quik Inc. IPC0006.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 67 шт:
термін постачання 21-31 дні (днів)
1+555.5 грн
IPC0006C IPC0006C Chip Quik Inc. IPC0006C.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+766.86 грн
IPC0006-S IPC0006-S Chip Quik Inc. IPC0006-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions: 16
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+816.46 грн
IPC0007 IPC0007 Chip Quik Inc. IPC0007.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+555.5 грн
IPC0007-S IPC0007-S Chip Quik Inc. IPC0007-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 16
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+816.46 грн
IPC0008 IPC0008 Chip Quik Inc. IPC0008.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0008-S IPC0008-S Chip Quik Inc. IPC0008-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 16
товар відсутній
IPC0009 IPC0009 Chip Quik Inc. IPC0009.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0009-S IPC0009-S Chip Quik Inc. IPC0009-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm)
Number of Positions: 16
товар відсутній
IPC0010 IPC0010 Chip Quik Inc. IPC0010.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0010-S IPC0010-S Chip Quik Inc. IPC0010-S.pdf Description: QFN-20 STENCIL
товар відсутній
IPC0011 IPC0011 Chip Quik Inc. IPC0011.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0011-S IPC0011-S Chip Quik Inc. IPC0011-S.pdf Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 20
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+816.46 грн
IPC0012 IPC0012 Chip Quik Inc. IPC0012.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
1+591.36 грн
IPC0012C IPC0012C Chip Quik Inc. IPC0012C.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
1+802.72 грн
IPC0012-S IPC0012-S Chip Quik Inc. IPC0012-S.pdf Description: QFN-20 STENCIL
товар відсутній
IPC0013 IPC0013 Chip Quik Inc. IPC0013.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0013-S IPC0013-S Chip Quik Inc. IPC0013-S.pdf Description: QFN-20 STENCIL
товар відсутній
IPC0014 IPC0014 Chip Quik Inc. IPC0014.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)
1+639.43 грн
IPC0014C IPC0014C Chip Quik Inc. IPC0014C.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
1+853.08 грн
HDR100MET40F-G-V-TH HDR100MET40F-G-V-TH.pdf
HDR100MET40F-G-V-TH
Виробник: Chip Quik Inc.
Description: 1.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.079" (2.00mm)
Number of Rows: 1
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+156.42 грн
Мінімальне замовлення: 2
HDR100MET40M-G-RA-TH HDR100MET40M-G-RA-TH.pdf
HDR100MET40M-G-RA-TH
Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.050" (1.27mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.071" (1.80mm)
товар відсутній
HDR100MET40M-G-V-TH HDR100MET40M-G-V-TH.pdf
HDR100MET40M-G-V-TH
Виробник: Chip Quik Inc.
Description: 1.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.039" (1.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.197" (5.00mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.079" (2.00mm)
на замовлення 79 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+128.19 грн
Мінімальне замовлення: 3
HDR100MET80F-G-V-SM
Виробник: Chip Quik Inc.
Description: 1.00 MM 80 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Insulation Height: 0.089" (2.26mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
товар відсутній
HDR100MET80M-G-V-SM
Виробник: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.039" (1.00mm)
Contact Length - Mating: 0.075" (1.90mm)
товар відсутній
HDR127MET10F-G-V-SM-DR HDR127MET10F-G-V-SM-DR.pdf
Виробник: Chip Quik Inc.
Description: CONN HDR 10POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товар відсутній
HDR127MET20F-G-V-SM-DR HDR127MET20F-G-V-SM-DR.pdf
Виробник: Chip Quik Inc.
Description: CONN HDR 20POS 0.05 GOLD SMD
товар відсутній
HDR127MET40F-G-RA-TH HDR127MET40F-G-RA-TH.pdf
HDR127MET40F-G-RA-TH
Виробник: Chip Quik Inc.
Description: CONN HDR 40POS 0.05 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.094" (2.40mm)
Insulation Height: 0.071" (1.80mm)
Number of Rows: 1
на замовлення 131 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+110.64 грн
Мінімальне замовлення: 3
HDR127MET40F-G-V-SM-DR HDR127MET40F-G-V-SM-DR.pdf
Виробник: Chip Quik Inc.
Description: CONN HDR 40POS 0.05 GOLD SMD
товар відсутній
HDR127MET40F-G-V-TH
Виробник: Chip Quik Inc.
Description: 1.27 MM 40 PIN VERTICAL FEMALE H
товар відсутній
HDR127MET40M-G-RA-TH HDR127MET40M-G-RA-TH.pdf
HDR127MET40M-G-RA-TH
Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.083" (2.10mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+103.77 грн
Мінімальне замовлення: 3
HDR127MET40M-G-V-TH
Виробник: Chip Quik Inc.
Description: 1.27 MM 40 PIN VERTICAL MALE HEA
товар відсутній
HDR127MET80F-G-V-SM HDR127MET80F-G-V-SM.pdf
HDR127MET80F-G-V-SM
Виробник: Chip Quik Inc.
Description: CONN HDR 80POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 109 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+159.48 грн
Мінімальне замовлення: 2
HDR127MET80F-G-V-TH
Виробник: Chip Quik Inc.
Description: 1.27 MM 80 PIN VERTICAL FEMALE H
товар відсутній
HDR127MET80M-G-V-SM HDR127MET80M-G-V-SM.pdf
HDR127MET80M-G-V-SM
Виробник: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
на замовлення 198 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+145.74 грн
Мінімальне замовлення: 3
HDR127MET80M-G-V-TH
Виробник: Chip Quik Inc.
Description: CONN HEADER VERT 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.268" (6.80mm)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+145.74 грн
Мінімальне замовлення: 3
HDR200MET10F-G-V-SM-DR HDR200MET10F-G-V-SM-DR.pdf
Виробник: Chip Quik Inc.
Description: CONN HDR 10POS 0.079 GOLD SMD
товар відсутній
HDR200MET20F-G-V-SM-DR HDR200MET20F-G-V-SM-DR.pdf
Виробник: Chip Quik Inc.
Description: CONN HDR 20POS 0.079 GOLD SMD
товар відсутній
HDR200MET40F-G-RA-TH HDR200MET40F-G-RA-TH.pdf
HDR200MET40F-G-RA-TH
Виробник: Chip Quik Inc.
Description: CONN HDR 40P 0.079 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.108" (2.75mm)
Number of Rows: 1
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+98.43 грн
Мінімальне замовлення: 4
HDR200MET40F-G-V-SM-DR HDR200MET40F-G-V-SM-DR.pdf
Виробник: Chip Quik Inc.
Description: CONN HDR 40POS 0.079 GOLD SMD
товар відсутній
HDR200MET40F-G-V-TH HDR200MET40F-G-V-TH.pdf
HDR200MET40F-G-V-TH
Виробник: Chip Quik Inc.
Description: 2.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.169" (4.30mm)
Number of Rows: 1
на замовлення 530 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+132.77 грн
Мінімальне замовлення: 3
HDR200MET40M-G-RA-TH HDR200MET40M-G-RA-TH.pdf
HDR200MET40M-G-RA-TH
Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+106.06 грн
Мінімальне замовлення: 3
HDR200MET40M-G-V-TH HDR200MET40M-G-V-TH.pdf
HDR200MET40M-G-V-TH
Виробник: Chip Quik Inc.
Description: 2.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.110" (2.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.343" (8.70mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.154" (3.90mm)
на замовлення 177 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+83.93 грн
Мінімальне замовлення: 4
HDR200MET80F-G-V-SM
Виробник: Chip Quik Inc.
Description: 2.00 MM 80 PIN VERTICAL FEMALE H
товар відсутній
HDR200MET80M-G-V-SM HDR200MET80M-G-V-SM.pdf
HDR200MET80M-G-V-SM
Виробник: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 133 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+174.74 грн
Мінімальне замовлення: 2
HDR-ETD HDR-ETD.pdf
HDR-ETD
Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40, 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 41 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+121.32 грн
Мінімальне замовлення: 3
HDR-SOICN-80 HDR-SOICN-80.pdf
HDR-SOICN-80
Виробник: Chip Quik Inc.
Description: SMT TO SOIC-NARROW HEADER (1.27M
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+400.6 грн
5+ 375.47 грн
10+ 365.33 грн
25+ 333.34 грн
50+ 314.32 грн
100+ 304.78 грн
HPS10C-20G HPS10C-20G.pdf
HPS10C-20G
Виробник: Chip Quik Inc.
Description: HIGH PERFORMANCE SILICONE 100% R
Features: Clear, 20g
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Silicone
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+325.06 грн
HVPB6 HVPB6.pdf
HVPB6
Виробник: Chip Quik Inc.
Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Bulk
Accessory Type: Vacuum Tool with Tips
на замовлення 153 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1397.9 грн
ICB-MAX3232 ICB-MAX3232.pdf
ICB-MAX3232
Виробник: Chip Quik Inc.
Description: BREAKOUT BOARD FOR MAX3232
Packaging: Bulk
Function: Transceiver, RS-232
Type: Interface
Utilized IC / Part: MAX3232E
Supplied Contents: Board(s)
Embedded: No
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+482.24 грн
10+ 440.28 грн
IPC0001 IPC0001.pdf
IPC0001
Виробник: Chip Quik Inc.
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0001-S IPC0001-S.pdf
IPC0001-S
Виробник: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товар відсутній
IPC0002 IPC0002.pdf
IPC0002
Виробник: Chip Quik Inc.
Description: QFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0002-S IPC0002-S.pdf
IPC0002-S
Виробник: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm)
Number of Positions: 8
товар відсутній
IPC0003 IPC0003.pdf
IPC0003
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+485.3 грн
IPC0003-S IPC0003-S.pdf
IPC0003-S
Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товар відсутній
IPC0004 IPC0004.pdf
IPC0004
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0004-S IPC0004-S.pdf
IPC0004-S
Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm)
Number of Positions: 12
товар відсутній
IPC0005 IPC0005.pdf
IPC0005
Виробник: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0005-S IPC0005-S.pdf
IPC0005-S
Виробник: Chip Quik Inc.
Description: QFN-14 STENCIL
товар відсутній
IPC0006 IPC0006.pdf
IPC0006
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 67 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+555.5 грн
IPC0006C IPC0006C.pdf
IPC0006C
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+766.86 грн
IPC0006-S IPC0006-S.pdf
IPC0006-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions: 16
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+816.46 грн
IPC0007 IPC0007.pdf
IPC0007
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+555.5 грн
IPC0007-S IPC0007-S.pdf
IPC0007-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 16
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+816.46 грн
IPC0008 IPC0008.pdf
IPC0008
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0008-S IPC0008-S.pdf
IPC0008-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 16
товар відсутній
IPC0009 IPC0009.pdf
IPC0009
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0009-S IPC0009-S.pdf
IPC0009-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm)
Number of Positions: 16
товар відсутній
IPC0010 IPC0010.pdf
IPC0010
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0010-S IPC0010-S.pdf
IPC0010-S
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
товар відсутній
IPC0011 IPC0011.pdf
IPC0011
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0011-S IPC0011-S.pdf
IPC0011-S
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 20
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+816.46 грн
IPC0012 IPC0012.pdf
IPC0012
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+591.36 грн
IPC0012C IPC0012C.pdf
IPC0012C
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+802.72 грн
IPC0012-S IPC0012-S.pdf
IPC0012-S
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
товар відсутній
IPC0013 IPC0013.pdf
IPC0013
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0013-S IPC0013-S.pdf
IPC0013-S
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
товар відсутній
IPC0014 IPC0014.pdf
IPC0014
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+639.43 грн
IPC0014C IPC0014C.pdf
IPC0014C
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+853.08 грн
Обрати Сторінку:   [  << Попередня Сторінка ]  1 4 8 9 10 11 12 13 14 15 16 17 18 20 24 28 32 36 40 42  [ Наступна Сторінка >> ]