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IPC0038 IPC0038 Chip Quik Inc. IPC0038.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0038-S IPC0038-S Chip Quik Inc. IPC0038-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.055" L x 0.055" W (1.40mm x 1.40mm)
Number of Positions: 12
товар відсутній
IPC0039 IPC0039 Chip Quik Inc. IPC0039.pdf Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+559.58 грн
IPC0039-S IPC0039-S Chip Quik Inc. IPC0039-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.102" L x 0.071" W (2.60mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
IPC0040 IPC0040 Chip Quik Inc. IPC0040.pdf Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0040-S IPC0040-S Chip Quik Inc. IPC0040-S.pdf Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.126" L x 0.071" W (3.20mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
IPC0041 IPC0041 Chip Quik Inc. IPC0041.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0041C IPC0041C Chip Quik Inc. IPC0041C.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
1+838.61 грн
IPC0041-S IPC0041-S Chip Quik Inc. IPC0041-S.pdf Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.144" L x 0.104" W (3.65mm x 2.65mm)
Number of Positions: 24
товар відсутній
IPC0042 IPC0042 Chip Quik Inc. IPC0042.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
1+663.74 грн
IPC0042-S IPC0042-S Chip Quik Inc. IPC0042-S.pdf Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
товар відсутній
IPC0043 IPC0043 Chip Quik Inc. IPC0043.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0043-S IPC0043-S Chip Quik Inc. IPC0043-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.138" L x 0.098" W (3.50mm x 2.50mm)
Number of Positions: 32
товар відсутній
IPC0044 IPC0044 Chip Quik Inc. IPC0044.pdf Description: QFN-40 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+880.43 грн
IPC0044-S IPC0044-S Chip Quik Inc. IPC0044-S.pdf Description: QFN-40 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Number of Positions: 40
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+810.48 грн
IPC0045 IPC0045 Chip Quik Inc. IPC0045.pdf Description: QFN-46 TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 46
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0045-S IPC0045-S Chip Quik Inc. IPC0045-S.pdf Description: QFN-46 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.217" L x 0.098" W (5.50mm x 2.50mm)
Number of Positions: 46
товар відсутній
IPC0046 IPC0046 Chip Quik Inc. IPC0046.pdf Description: QFN-68 TO DIP-72 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.600" (25.40mm x 91.44mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0046-S IPC0046-S Chip Quik Inc. IPC0046-S.pdf Description: QFN-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.193" L x 0.193" W (4.90mm x 4.90mm)
Number of Positions: 68
товар відсутній
IPC0047 IPC0047 Chip Quik Inc. IPC0047.pdf Description: POWERSOIC-36/PSOP-36/HSOP-36
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
товар відсутній
IPC0047-S IPC0047-S Chip Quik Inc. IPC0047-S.pdf Description: POWERSOIC-36/PSOP-36/HSOP-36 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSOIC
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.244" W (16.00mm x 6.20mm)
Number of Positions: 36
товар відсутній
IPC0048 IPC0048 Chip Quik Inc. IPC0048.pdf Description: POWERSOIC-24/PSOP-24/HSOP-24
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+628.77 грн
IPC0048C IPC0048C Chip Quik Inc. IPC0048C.pdf Description: POWERSOIC-24 TO DIP-28 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.039" (1.00mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
1+838.61 грн
IPC0048-S IPC0048-S Chip Quik Inc. IPC0048-S.pdf Description: POWERSOIC-24/PSOP-24/HSOP-24 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: PowerSOIC
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.244" W (16.00mm x 6.20mm)
Number of Positions: 24
товар відсутній
IPC0049 IPC0049 Chip Quik Inc. IPC0049.pdf Description: POWERSOIC-20/PSOP-20/HSOP-20
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
1+551.98 грн
IPC0049C IPC0049C Chip Quik Inc. IPC0049C.pdf Description: POWERSOIC-20 TO DIP-24 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
1+761.82 грн
IPC0049-S IPC0049-S Chip Quik Inc. IPC0049-S.pdf Description: POWERSOIC-20/PSOP-20/HSOP-20 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.630" L x 0.244" W (16.00mm x 6.20mm)
Number of Positions: 20
товар відсутній
IPC0050 IPC0050 Chip Quik Inc. IPC0050.pdf Description: POWERSOIC-10/PSOP-10/HSOP-10
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
товар відсутній
IPC0050-S IPC0050-S Chip Quik Inc. IPC0050-S.pdf Description: POWERSOIC-10/PSOP-10/HSOP-10 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm)
Number of Positions: 10
товар відсутній
IPC0051 IPC0051 Chip Quik Inc. IPC0051.pdf Description: POWERSOIC-8/PSOP-8/HSOP-8 TO DIP
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
1+370.27 грн
IPC0051C IPC0051C Chip Quik Inc. IPC0051C.pdf Description: POWERSOIC-8 TO DIP-12 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+580.11 грн
IPC0051-S IPC0051-S Chip Quik Inc. IPC0051-S.pdf Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm)
Number of Positions: 8
товар відсутній
IPC0052 IPC0052 Chip Quik Inc. IPC0052.pdf Description: DFN-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0052-S IPC0052-S Chip Quik Inc. IPC0052-S.pdf Description: DFN-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.059" L x 0.051" W (1.50mm x 1.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
товар відсутній
IPC0053 IPC0053 Chip Quik Inc. IPC0053.pdf Description: DFN-5 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0053-S IPC0053-S Chip Quik Inc. IPC0053-S.pdf Description: DFN-5 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 5
товар відсутній
IPC0054 IPC0054 Chip Quik Inc. IPC0054.pdf Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0054-S IPC0054-S Chip Quik Inc. IPC0054-S.pdf Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.047" L x 0.039" W (1.20mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
IPC0055 IPC0055 Chip Quik Inc. IPC0055.pdf Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0055-S IPC0055-S Chip Quik Inc. IPC0055-S.pdf Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.039" L x 0.018" W (1.00mm x 0.45mm)
Number of Positions: 6
товар відсутній
IPC0056 IPC0056 Chip Quik Inc. IPC0056.pdf Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0056-S IPC0056-S Chip Quik Inc. IPC0056-S.pdf Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
IPC0057 IPC0057 Chip Quik Inc. IPC0057.pdf Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
1+336.05 грн
IPC0057-S IPC0057-S Chip Quik Inc. IPC0057-S.pdf Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 6
товар відсутній
IPC0058 IPC0058 Chip Quik Inc. IPC0058.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0058-S IPC0058-S Chip Quik Inc. IPC0058-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.059" L x 0.030" W (1.50mm x 0.75mm)
Number of Positions: 8
товар відсутній
IPC0059 IPC0059 Chip Quik Inc. IPC0059.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0059-S IPC0059-S Chip Quik Inc. IPC0059-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm)
Number of Positions: 8
товар відсутній
IPC0060 IPC0060 Chip Quik Inc. IPC0060.pdf Description: DFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
1+335.29 грн
IPC0060C IPC0060C Chip Quik Inc. IPC0060C.pdf Description: DFN-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
1+545.14 грн
IPC0060-S IPC0060-S Chip Quik Inc. IPC0060-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
IPC0061 IPC0061 Chip Quik Inc. IPC0061.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
1+374.83 грн
IPC0061C IPC0061C Chip Quik Inc. IPC0061C.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
1+587.71 грн
IPC0061-S IPC0061-S Chip Quik Inc. IPC0061-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm)
Number of Positions: 8
товар відсутній
IPC0062 IPC0062 Chip Quik Inc. IPC0062.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
1+374.83 грн
IPC0062-S IPC0062-S Chip Quik Inc. IPC0062-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.053" L x 0.057" W (1.35mm x 1.45mm)
Number of Positions: 8
товар відсутній
IPC0063 IPC0063 Chip Quik Inc. IPC0063.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
1+374.83 грн
IPC0063-S IPC0063-S Chip Quik Inc. IPC0063-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm)
Number of Positions: 8
товар відсутній
IPC0064 IPC0064 Chip Quik Inc. IPC0064.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0064-S IPC0064-S Chip Quik Inc. IPC0064-S.pdf Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.069" L x 0.057" W (1.75mm x 1.45mm)
Number of Positions: 8
товар відсутній
IPC0038 IPC0038.pdf
IPC0038
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0038-S IPC0038-S.pdf
IPC0038-S
Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.055" L x 0.055" W (1.40mm x 1.40mm)
Number of Positions: 12
товар відсутній
IPC0039 IPC0039.pdf
IPC0039
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+559.58 грн
IPC0039-S IPC0039-S.pdf
IPC0039-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.102" L x 0.071" W (2.60mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
IPC0040 IPC0040.pdf
IPC0040
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0040-S IPC0040-S.pdf
IPC0040-S
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.126" L x 0.071" W (3.20mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
IPC0041 IPC0041.pdf
IPC0041
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0041C IPC0041C.pdf
IPC0041C
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+838.61 грн
IPC0041-S IPC0041-S.pdf
IPC0041-S
Виробник: Chip Quik Inc.
Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.144" L x 0.104" W (3.65mm x 2.65mm)
Number of Positions: 24
товар відсутній
IPC0042 IPC0042.pdf
IPC0042
Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+663.74 грн
IPC0042-S IPC0042-S.pdf
IPC0042-S
Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
товар відсутній
IPC0043 IPC0043.pdf
IPC0043
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0043-S IPC0043-S.pdf
IPC0043-S
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.138" L x 0.098" W (3.50mm x 2.50mm)
Number of Positions: 32
товар відсутній
IPC0044 IPC0044.pdf
IPC0044
Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+880.43 грн
IPC0044-S IPC0044-S.pdf
IPC0044-S
Виробник: Chip Quik Inc.
Description: QFN-40 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Number of Positions: 40
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+810.48 грн
IPC0045 IPC0045.pdf
IPC0045
Виробник: Chip Quik Inc.
Description: QFN-46 TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 46
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0045-S IPC0045-S.pdf
IPC0045-S
Виробник: Chip Quik Inc.
Description: QFN-46 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.217" L x 0.098" W (5.50mm x 2.50mm)
Number of Positions: 46
товар відсутній
IPC0046 IPC0046.pdf
IPC0046
Виробник: Chip Quik Inc.
Description: QFN-68 TO DIP-72 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.600" (25.40mm x 91.44mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0046-S IPC0046-S.pdf
IPC0046-S
Виробник: Chip Quik Inc.
Description: QFN-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.193" L x 0.193" W (4.90mm x 4.90mm)
Number of Positions: 68
товар відсутній
IPC0047 IPC0047.pdf
IPC0047
Виробник: Chip Quik Inc.
Description: POWERSOIC-36/PSOP-36/HSOP-36
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
товар відсутній
IPC0047-S IPC0047-S.pdf
IPC0047-S
Виробник: Chip Quik Inc.
Description: POWERSOIC-36/PSOP-36/HSOP-36 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSOIC
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.244" W (16.00mm x 6.20mm)
Number of Positions: 36
товар відсутній
IPC0048 IPC0048.pdf
IPC0048
Виробник: Chip Quik Inc.
Description: POWERSOIC-24/PSOP-24/HSOP-24
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+628.77 грн
IPC0048C IPC0048C.pdf
IPC0048C
Виробник: Chip Quik Inc.
Description: POWERSOIC-24 TO DIP-28 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.039" (1.00mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+838.61 грн
IPC0048-S IPC0048-S.pdf
IPC0048-S
Виробник: Chip Quik Inc.
Description: POWERSOIC-24/PSOP-24/HSOP-24 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: PowerSOIC
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.244" W (16.00mm x 6.20mm)
Number of Positions: 24
товар відсутній
IPC0049 IPC0049.pdf
IPC0049
Виробник: Chip Quik Inc.
Description: POWERSOIC-20/PSOP-20/HSOP-20
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+551.98 грн
IPC0049C IPC0049C.pdf
IPC0049C
Виробник: Chip Quik Inc.
Description: POWERSOIC-20 TO DIP-24 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+761.82 грн
IPC0049-S IPC0049-S.pdf
IPC0049-S
Виробник: Chip Quik Inc.
Description: POWERSOIC-20/PSOP-20/HSOP-20 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.630" L x 0.244" W (16.00mm x 6.20mm)
Number of Positions: 20
товар відсутній
IPC0050 IPC0050.pdf
IPC0050
Виробник: Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
товар відсутній
IPC0050-S IPC0050-S.pdf
IPC0050-S
Виробник: Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm)
Number of Positions: 10
товар відсутній
IPC0051 IPC0051.pdf
IPC0051
Виробник: Chip Quik Inc.
Description: POWERSOIC-8/PSOP-8/HSOP-8 TO DIP
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+370.27 грн
IPC0051C IPC0051C.pdf
IPC0051C
Виробник: Chip Quik Inc.
Description: POWERSOIC-8 TO DIP-12 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+580.11 грн
IPC0051-S IPC0051-S.pdf
IPC0051-S
Виробник: Chip Quik Inc.
Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm)
Number of Positions: 8
товар відсутній
IPC0052 IPC0052.pdf
IPC0052
Виробник: Chip Quik Inc.
Description: DFN-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0052-S IPC0052-S.pdf
IPC0052-S
Виробник: Chip Quik Inc.
Description: DFN-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.059" L x 0.051" W (1.50mm x 1.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
товар відсутній
IPC0053 IPC0053.pdf
IPC0053
Виробник: Chip Quik Inc.
Description: DFN-5 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0053-S IPC0053-S.pdf
IPC0053-S
Виробник: Chip Quik Inc.
Description: DFN-5 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 5
товар відсутній
IPC0054 IPC0054.pdf
IPC0054
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0054-S IPC0054-S.pdf
IPC0054-S
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.047" L x 0.039" W (1.20mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
IPC0055 IPC0055.pdf
IPC0055
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0055-S IPC0055-S.pdf
IPC0055-S
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.039" L x 0.018" W (1.00mm x 0.45mm)
Number of Positions: 6
товар відсутній
IPC0056 IPC0056.pdf
IPC0056
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0056-S IPC0056-S.pdf
IPC0056-S
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
IPC0057 IPC0057.pdf
IPC0057
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+336.05 грн
IPC0057-S IPC0057-S.pdf
IPC0057-S
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 6
товар відсутній
IPC0058 IPC0058.pdf
IPC0058
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0058-S IPC0058-S.pdf
IPC0058-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.059" L x 0.030" W (1.50mm x 0.75mm)
Number of Positions: 8
товар відсутній
IPC0059 IPC0059.pdf
IPC0059
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0059-S IPC0059-S.pdf
IPC0059-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm)
Number of Positions: 8
товар відсутній
IPC0060 IPC0060.pdf
IPC0060
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+335.29 грн
IPC0060C IPC0060C.pdf
IPC0060C
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+545.14 грн
IPC0060-S IPC0060-S.pdf
IPC0060-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
IPC0061 IPC0061.pdf
IPC0061
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+374.83 грн
IPC0061C IPC0061C.pdf
IPC0061C
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+587.71 грн
IPC0061-S IPC0061-S.pdf
IPC0061-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm)
Number of Positions: 8
товар відсутній
IPC0062 IPC0062.pdf
IPC0062
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+374.83 грн
IPC0062-S IPC0062-S.pdf
IPC0062-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.053" L x 0.057" W (1.35mm x 1.45mm)
Number of Positions: 8
товар відсутній
IPC0063 IPC0063.pdf
IPC0063
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+374.83 грн
IPC0063-S IPC0063-S.pdf
IPC0063-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm)
Number of Positions: 8
товар відсутній
IPC0064 IPC0064.pdf
IPC0064
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
IPC0064-S IPC0064-S.pdf
IPC0064-S
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.069" L x 0.057" W (1.75mm x 1.45mm)
Number of Positions: 8
товар відсутній
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