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IPC0014-S IPC0014-S Chip Quik Inc. IPC0014-S.pdf Description: STENCIL 4X4MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 24
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+816.46 грн
IPC0015 IPC0015 Chip Quik Inc. IPC0015.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0015-S IPC0015-S Chip Quik Inc. IPC0015-S.pdf Description: QFN-24 STENCIL
товар відсутній
IPC0016 IPC0016 Chip Quik Inc. IPC0016.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0016-S IPC0016-S Chip Quik Inc. IPC0016-S.pdf Description: QFN-28 STENCIL
товар відсутній
IPC0017 IPC0017 Chip Quik Inc. IPC0017.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0017-S IPC0017-S Chip Quik Inc. IPC0017-S.pdf Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 28
товар відсутній
IPC0018 IPC0018 Chip Quik Inc. IPC0018.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0018-S IPC0018-S Chip Quik Inc. IPC0018-S.pdf Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 28
товар відсутній
IPC0019 IPC0019 Chip Quik Inc. IPC0019.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
товар відсутній
IPC0019-S IPC0019-S Chip Quik Inc. IPC0019-S.pdf Description: QFN-32 STENCIL
товар відсутній
IPC0020 IPC0020 Chip Quik Inc. IPC0020.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
1+738.63 грн
IPC0020C IPC0020C Chip Quik Inc. IPC0020C.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
1+949.99 грн
IPC0020-S IPC0020-S Chip Quik Inc. IPC0020-S.pdf Description: STENCIL 5X5 MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 32
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+827.9 грн
IPC0021 IPC0021 Chip Quik Inc. IPC0021.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0021-S IPC0021-S Chip Quik Inc. IPC0021-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.134" L x 0.098" W (3.40mm x 2.50mm)
Number of Positions: 32
товар відсутній
IPC0022 IPC0022 Chip Quik Inc. IPC0022.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0022-S IPC0022-S Chip Quik Inc. IPC0022-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm)
Number of Positions: 32
товар відсутній
IPC0023 IPC0023 Chip Quik Inc. IPC0023.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0023-S IPC0023-S Chip Quik Inc. IPC0023-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.228" L x 0.228" W (5.80mm x 5.80mm)
Number of Positions: 32
товар відсутній
IPC0024 IPC0024 Chip Quik Inc. IPC0024.pdf Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0024-S IPC0024-S Chip Quik Inc. IPC0024-S.pdf Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 36
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+827.9 грн
IPC0025 IPC0025 Chip Quik Inc. IPC0025.pdf Description: QFN-38 TO DIP-42 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0025-S IPC0025-S Chip Quik Inc. IPC0025-S.pdf Description: QFN-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.217" L x 0.138" W (5.50mm x 3.50mm)
Number of Positions: 38
товар відсутній
IPC0026 IPC0026 Chip Quik Inc. IPC0026.pdf Description: QFN-40 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+899.63 грн
IPC0026-S IPC0026-S Chip Quik Inc. IPC0026-S.pdf Description: QFN-40 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 40
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+827.9 грн
IPC0027 IPC0027 Chip Quik Inc. IPC0027.pdf Description: QFN-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0027-S IPC0027-S Chip Quik Inc. IPC0027-S.pdf Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Number of Positions: 44
товар відсутній
IPC0028 IPC0028 Chip Quik Inc. IPC0028.pdf Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+1049.18 грн
IPC0028-S IPC0028-S Chip Quik Inc. IPC0028-S.pdf Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.173" L x 0.173" W (4.40mm x 4.40mm)
Number of Positions: 48
товар відсутній
IPC0029 IPC0029 Chip Quik Inc. IPC0029.pdf Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0029-S IPC0029-S Chip Quik Inc. IPC0029-S.pdf Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+827.9 грн
IPC0030 IPC0030 Chip Quik Inc. IPC0030.pdf Description: QFN-50 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0030-S IPC0030-S Chip Quik Inc. IPC0030-S.pdf Description: QFN-50 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.197" W (10.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.319" L x 0.130" W (8.10mm x 3.30mm)
Number of Positions: 50
товар відсутній
IPC0031 IPC0031 Chip Quik Inc. IPC0031.pdf Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0031-S IPC0031-S Chip Quik Inc. IPC0031-S.pdf Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.240" L x 0.240" W (6.10mm x 6.10mm)
Number of Positions: 56
товар відсутній
IPC0032 IPC0032 Chip Quik Inc. IPC0032.pdf Description: QFN-64 TO DIP-68 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.400" (25.40mm x 86.36mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+1147.62 грн
IPC0032-S IPC0032-S Chip Quik Inc. IPC0032-S.pdf Description: QFN-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.150" L x 0.150" W (3.80mm x 3.80mm)
Number of Positions: 64
товар відсутній
IPC0033 IPC0033 Chip Quik Inc. IPC0033.pdf Description: QFN-68 TO DIP-72 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.600" (25.40mm x 91.44mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0033-S IPC0033-S Chip Quik Inc. IPC0033-S.pdf Description: QFN-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.303" L x 0.303" W (7.70mm x 7.70mm)
Number of Positions: 68
товар відсутній
IPC0034 IPC0034 Chip Quik Inc. IPC0034.pdf Description: QFN-72 TO DIP-76 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.800" (25.40mm x 96.52mm)
Material: FR4 Epoxy Glass
Number of Positions: 72
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+1224.68 грн
IPC0034-S IPC0034-S Chip Quik Inc. IPC0034-S.pdf Description: QFN-72 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm)
Number of Positions: 72
товар відсутній
IPC0035 IPC0035 Chip Quik Inc. IPC0035.pdf Description: QFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0035-S IPC0035-S Chip Quik Inc. IPC0035-S.pdf Description: QFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.071" L x 0.055" W (1.80mm x 1.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
товар відсутній
IPC0036 IPC0036 Chip Quik Inc. IPC0036.pdf Description: QFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+408.23 грн
IPC0036C IPC0036C Chip Quik Inc. IPC0036C.pdf Description: QFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
1+619.59 грн
IPC0036-S IPC0036-S Chip Quik Inc. IPC0036-S.pdf Description: QFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.083" L x 0.063" W (2.10mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
товар відсутній
IPC0037 IPC0037 Chip Quik Inc. IPC0037.pdf Description: QFN-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0037-S IPC0037-S Chip Quik Inc. IPC0037-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.087" L x 0.055" W (2.20mm x 1.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
товар відсутній
IPC0038 IPC0038 Chip Quik Inc. IPC0038.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0038-S IPC0038-S Chip Quik Inc. IPC0038-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.055" L x 0.055" W (1.40mm x 1.40mm)
Number of Positions: 12
товар відсутній
IPC0039 IPC0039 Chip Quik Inc. IPC0039.pdf Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
1+555.5 грн
IPC0039-S IPC0039-S Chip Quik Inc. IPC0039-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.102" L x 0.071" W (2.60mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
IPC0040 IPC0040 Chip Quik Inc. IPC0040.pdf Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0040-S IPC0040-S Chip Quik Inc. IPC0040-S.pdf Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.126" L x 0.071" W (3.20mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
IPC0041 IPC0041 Chip Quik Inc. IPC0041.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0041C IPC0041C Chip Quik Inc. IPC0041C.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
1+853.08 грн
IPC0041-S IPC0041-S Chip Quik Inc. IPC0041-S.pdf Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.144" L x 0.104" W (3.65mm x 2.65mm)
Number of Positions: 24
товар відсутній
IPC0042 IPC0042 Chip Quik Inc. IPC0042.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
1+668.43 грн
IPC0042-S IPC0042-S Chip Quik Inc. IPC0042-S.pdf Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
товар відсутній
IPC0014-S IPC0014-S.pdf
IPC0014-S
Виробник: Chip Quik Inc.
Description: STENCIL 4X4MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 24
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+816.46 грн
IPC0015 IPC0015.pdf
IPC0015
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0015-S IPC0015-S.pdf
IPC0015-S
Виробник: Chip Quik Inc.
Description: QFN-24 STENCIL
товар відсутній
IPC0016 IPC0016.pdf
IPC0016
Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0016-S IPC0016-S.pdf
IPC0016-S
Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
товар відсутній
IPC0017 IPC0017.pdf
IPC0017
Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0017-S IPC0017-S.pdf
IPC0017-S
Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 28
товар відсутній
IPC0018 IPC0018.pdf
IPC0018
Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0018-S IPC0018-S.pdf
IPC0018-S
Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 28
товар відсутній
IPC0019 IPC0019.pdf
IPC0019
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
товар відсутній
IPC0019-S IPC0019-S.pdf
IPC0019-S
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
товар відсутній
IPC0020 IPC0020.pdf
IPC0020
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+738.63 грн
IPC0020C IPC0020C.pdf
IPC0020C
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+949.99 грн
IPC0020-S IPC0020-S.pdf
IPC0020-S
Виробник: Chip Quik Inc.
Description: STENCIL 5X5 MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 32
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+827.9 грн
IPC0021 IPC0021.pdf
IPC0021
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0021-S IPC0021-S.pdf
IPC0021-S
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.134" L x 0.098" W (3.40mm x 2.50mm)
Number of Positions: 32
товар відсутній
IPC0022 IPC0022.pdf
IPC0022
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0022-S IPC0022-S.pdf
IPC0022-S
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm)
Number of Positions: 32
товар відсутній
IPC0023 IPC0023.pdf
IPC0023
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0023-S IPC0023-S.pdf
IPC0023-S
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.228" L x 0.228" W (5.80mm x 5.80mm)
Number of Positions: 32
товар відсутній
IPC0024 IPC0024.pdf
IPC0024
Виробник: Chip Quik Inc.
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0024-S IPC0024-S.pdf
IPC0024-S
Виробник: Chip Quik Inc.
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 36
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+827.9 грн
IPC0025 IPC0025.pdf
IPC0025
Виробник: Chip Quik Inc.
Description: QFN-38 TO DIP-42 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0025-S IPC0025-S.pdf
IPC0025-S
Виробник: Chip Quik Inc.
Description: QFN-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.217" L x 0.138" W (5.50mm x 3.50mm)
Number of Positions: 38
товар відсутній
IPC0026 IPC0026.pdf
IPC0026
Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+899.63 грн
IPC0026-S IPC0026-S.pdf
IPC0026-S
Виробник: Chip Quik Inc.
Description: QFN-40 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 40
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+827.9 грн
IPC0027 IPC0027.pdf
IPC0027
Виробник: Chip Quik Inc.
Description: QFN-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0027-S IPC0027-S.pdf
IPC0027-S
Виробник: Chip Quik Inc.
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Number of Positions: 44
товар відсутній
IPC0028 IPC0028.pdf
IPC0028
Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1049.18 грн
IPC0028-S IPC0028-S.pdf
IPC0028-S
Виробник: Chip Quik Inc.
Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.173" L x 0.173" W (4.40mm x 4.40mm)
Number of Positions: 48
товар відсутній
IPC0029 IPC0029.pdf
IPC0029
Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0029-S IPC0029-S.pdf
IPC0029-S
Виробник: Chip Quik Inc.
Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+827.9 грн
IPC0030 IPC0030.pdf
IPC0030
Виробник: Chip Quik Inc.
Description: QFN-50 TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0030-S IPC0030-S.pdf
IPC0030-S
Виробник: Chip Quik Inc.
Description: QFN-50 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.197" W (10.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.319" L x 0.130" W (8.10mm x 3.30mm)
Number of Positions: 50
товар відсутній
IPC0031 IPC0031.pdf
IPC0031
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0031-S IPC0031-S.pdf
IPC0031-S
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.240" L x 0.240" W (6.10mm x 6.10mm)
Number of Positions: 56
товар відсутній
IPC0032 IPC0032.pdf
IPC0032
Виробник: Chip Quik Inc.
Description: QFN-64 TO DIP-68 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.400" (25.40mm x 86.36mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1147.62 грн
IPC0032-S IPC0032-S.pdf
IPC0032-S
Виробник: Chip Quik Inc.
Description: QFN-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.150" L x 0.150" W (3.80mm x 3.80mm)
Number of Positions: 64
товар відсутній
IPC0033 IPC0033.pdf
IPC0033
Виробник: Chip Quik Inc.
Description: QFN-68 TO DIP-72 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.600" (25.40mm x 91.44mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0033-S IPC0033-S.pdf
IPC0033-S
Виробник: Chip Quik Inc.
Description: QFN-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.303" L x 0.303" W (7.70mm x 7.70mm)
Number of Positions: 68
товар відсутній
IPC0034 IPC0034.pdf
IPC0034
Виробник: Chip Quik Inc.
Description: QFN-72 TO DIP-76 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.800" (25.40mm x 96.52mm)
Material: FR4 Epoxy Glass
Number of Positions: 72
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1224.68 грн
IPC0034-S IPC0034-S.pdf
IPC0034-S
Виробник: Chip Quik Inc.
Description: QFN-72 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm)
Number of Positions: 72
товар відсутній
IPC0035 IPC0035.pdf
IPC0035
Виробник: Chip Quik Inc.
Description: QFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0035-S IPC0035-S.pdf
IPC0035-S
Виробник: Chip Quik Inc.
Description: QFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.071" L x 0.055" W (1.80mm x 1.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
товар відсутній
IPC0036 IPC0036.pdf
IPC0036
Виробник: Chip Quik Inc.
Description: QFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+408.23 грн
IPC0036C IPC0036C.pdf
IPC0036C
Виробник: Chip Quik Inc.
Description: QFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+619.59 грн
IPC0036-S IPC0036-S.pdf
IPC0036-S
Виробник: Chip Quik Inc.
Description: QFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.083" L x 0.063" W (2.10mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
товар відсутній
IPC0037 IPC0037.pdf
IPC0037
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0037-S IPC0037-S.pdf
IPC0037-S
Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.087" L x 0.055" W (2.20mm x 1.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
товар відсутній
IPC0038 IPC0038.pdf
IPC0038
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0038-S IPC0038-S.pdf
IPC0038-S
Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.055" L x 0.055" W (1.40mm x 1.40mm)
Number of Positions: 12
товар відсутній
IPC0039 IPC0039.pdf
IPC0039
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+555.5 грн
IPC0039-S IPC0039-S.pdf
IPC0039-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.102" L x 0.071" W (2.60mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товар відсутній
IPC0040 IPC0040.pdf
IPC0040
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0040-S IPC0040-S.pdf
IPC0040-S
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.126" L x 0.071" W (3.20mm x 1.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
IPC0041 IPC0041.pdf
IPC0041
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0041C IPC0041C.pdf
IPC0041C
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+853.08 грн
IPC0041-S IPC0041-S.pdf
IPC0041-S
Виробник: Chip Quik Inc.
Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.144" L x 0.104" W (3.65mm x 2.65mm)
Number of Positions: 24
товар відсутній
IPC0042 IPC0042.pdf
IPC0042
Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+668.43 грн
IPC0042-S IPC0042-S.pdf
IPC0042-S
Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
товар відсутній
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