Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2477) > Сторінка 5 з 42
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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DIP300-SOIC-08N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to SMD Package Accepted: DIP |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-08W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to SMD Package Accepted: DIP |
на замовлення 87 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-10N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-10W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-12N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-12W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-14N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-14W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-16N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to SMD Package Accepted: DIP |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-16W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to SMD Package Accepted: DIP |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-18N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-18W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-20N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-20W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-22N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.100" L x 0.400" W (27.94mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-22W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.100" L x 0.400" W (27.94mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-24N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-24W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-26N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.300" L x 0.400" W (33.02mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 26 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-26W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.300" L x 0.400" W (33.02mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 26 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-28N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-28W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P04 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P06 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P08 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P10 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P12 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 104 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P14 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P16 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P18 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P20 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P22 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
товар відсутній |
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DIP300T600P24 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P26 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 26 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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DIP300T600P28 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-08N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-08W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-12N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
товар відсутній |
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DIP600-SOIC-12W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
товар відсутній |
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DIP600-SOIC-14N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-14W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-16N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm) Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-16W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm) Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-18N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm) Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-18W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm) Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-20N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-20W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-24N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm) Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-24W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm) Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-28N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-28W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P04 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 272 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P06 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 253 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P08 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P10 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P12 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P14 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P16 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P18 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
товар відсутній |
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DIP600T300P20 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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DIP300-SOIC-08N |
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Виробник: Chip Quik Inc.
Description: ADAPTER BOARD DIP TO SMD
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
Description: ADAPTER BOARD DIP TO SMD
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
на замовлення 51 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 546.66 грн |
10+ | 498.37 грн |
DIP300-SOIC-08W |
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Виробник: Chip Quik Inc.
Description: ADAPTER BOARD DIP TO SMD
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
Description: ADAPTER BOARD DIP TO SMD
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
на замовлення 87 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 562.62 грн |
10+ | 513.09 грн |
DIP300-SOIC-10N |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-10 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 580.11 грн |
5+ | 544.42 грн |
10+ | 529.63 грн |
25+ | 483.22 грн |
DIP300-SOIC-10W |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-10 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 596.84 грн |
5+ | 559.5 грн |
10+ | 544.35 грн |
25+ | 496.68 грн |
50+ | 468.29 грн |
DIP300-SOIC-12N |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-12 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 618.89 грн |
5+ | 580.44 грн |
10+ | 564.78 грн |
25+ | 515.26 грн |
50+ | 485.83 грн |
DIP300-SOIC-12W |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-12 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 635.61 грн |
5+ | 595.67 грн |
10+ | 579.64 грн |
25+ | 528.87 грн |
50+ | 498.63 грн |
DIP300-SOIC-14N |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 642.46 грн |
5+ | 602.85 грн |
10+ | 586.52 грн |
25+ | 535.19 грн |
DIP300-SOIC-14W |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 659.18 грн |
5+ | 617.93 грн |
10+ | 601.24 грн |
25+ | 548.57 грн |
50+ | 517.24 грн |
DIP300-SOIC-16N |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 657.66 грн |
5+ | 615.88 грн |
10+ | 598.89 грн |
25+ | 529.88 грн |
DIP300-SOIC-16W |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
Description: DIP-16 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.30mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to SMD
Package Accepted: DIP
на замовлення 46 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 672.87 грн |
5+ | 630.67 грн |
10+ | 613.17 грн |
25+ | 542.52 грн |
DIP300-SOIC-18N |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-18 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 48 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 688.83 грн |
5+ | 645.31 грн |
10+ | 627.45 грн |
25+ | 555.17 грн |
DIP300-SOIC-18W |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-18 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 48 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 704.04 грн |
5+ | 660.1 грн |
10+ | 641.72 грн |
25+ | 567.81 грн |
DIP300-SOIC-20N |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-20 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 720.77 грн |
5+ | 674.74 грн |
10+ | 656 грн |
25+ | 580.45 грн |
50+ | 562.85 грн |
DIP300-SOIC-20W |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-20 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 735.97 грн |
5+ | 689.53 грн |
10+ | 670.28 грн |
25+ | 593.09 грн |
DIP300-SOIC-22N |
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Виробник: Chip Quik Inc.
Description: DIP-22 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.100" L x 0.400" W (27.94mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-22 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.100" L x 0.400" W (27.94mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 754.22 грн |
5+ | 706.66 грн |
10+ | 686.9 грн |
25+ | 607.83 грн |
50+ | 589.41 грн |
DIP300-SOIC-22W |
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Виробник: Chip Quik Inc.
Description: DIP-22 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.100" L x 0.400" W (27.94mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-22 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.100" L x 0.400" W (27.94mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 770.19 грн |
5+ | 721.31 грн |
10+ | 701.25 грн |
25+ | 620.52 грн |
50+ | 601.71 грн |
DIP300-SOIC-24N |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-24 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 782.35 грн |
5+ | 733.46 грн |
10+ | 713.11 грн |
25+ | 631.02 грн |
50+ | 611.88 грн |
DIP300-SOIC-24W |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-24 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 799.08 грн |
5+ | 748.25 грн |
10+ | 727.38 грн |
25+ | 643.66 грн |
DIP300-SOIC-26N |
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Виробник: Chip Quik Inc.
Description: DIP-26 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.300" L x 0.400" W (33.02mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-26 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.300" L x 0.400" W (33.02mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 817.32 грн |
5+ | 765.53 грн |
10+ | 744.3 грн |
25+ | 658.59 грн |
50+ | 638.61 грн |
DIP300-SOIC-26W |
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Виробник: Chip Quik Inc.
Description: DIP-26 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.300" L x 0.400" W (33.02mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-26 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.300" L x 0.400" W (33.02mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 832.53 грн |
5+ | 780.32 грн |
10+ | 758.65 грн |
25+ | 671.26 грн |
50+ | 650.92 грн |
DIP300-SOIC-28N |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 49 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 845.46 грн |
5+ | 792.32 грн |
10+ | 770.29 грн |
25+ | 681.59 грн |
DIP300-SOIC-28W |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 861.42 грн |
5+ | 806.97 грн |
10+ | 784.56 грн |
25+ | 694.23 грн |
50+ | 673.17 грн |
DIP300T600P04 |
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Виробник: Chip Quik Inc.
Description: DIP-4 (0.3" BODY) TO DIP-4 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-4 (0.3" BODY) TO DIP-4 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 69.19 грн |
DIP300T600P06 |
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Виробник: Chip Quik Inc.
Description: DIP-6 (0.3" BODY) TO DIP-6 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-6 (0.3" BODY) TO DIP-6 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 90.48 грн |
DIP300T600P08 |
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Виробник: Chip Quik Inc.
Description: DIP-8 (0.3" BODY) TO DIP-8 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-8 (0.3" BODY) TO DIP-8 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 118.61 грн |
DIP300T600P10 |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.3" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-10 (0.3" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 146.74 грн |
DIP300T600P12 |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.3" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-12 (0.3" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 176.39 грн |
DIP300T600P14 |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.3" BODY) TO DIP-14 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-14 (0.3" BODY) TO DIP-14 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 203 грн |
DIP300T600P16 |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.3" BODY) TO DIP-16 (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-16 (0.3" BODY) TO DIP-16 (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 233.41 грн |
DIP300T600P18 |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.3" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-18 (0.3" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 257.74 грн |
DIP300T600P20 |
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Виробник: Chip Quik Inc.
Description: DIP TO DIP 20PIN UNASSEMBLED
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP TO DIP 20PIN UNASSEMBLED
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 287.39 грн |
DIP300T600P22 |
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Виробник: Chip Quik Inc.
Description: DIP-22 (0.3" BODY) TO DIP-22 (0.
Packaging: Bulk
Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-22 (0.3" BODY) TO DIP-22 (0.
Packaging: Bulk
Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
товар відсутній
DIP300T600P24 |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.3" BODY) TO DIP-24 (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-24 (0.3" BODY) TO DIP-24 (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 350.5 грн |
DIP300T600P26 |
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Виробник: Chip Quik Inc.
Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 378.63 грн |
DIP300T600P28 |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 405.24 грн |
DIP600-SOIC-08N |
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Виробник: Chip Quik Inc.
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 626.49 грн |
5+ | 587.76 грн |
10+ | 571.88 грн |
DIP600-SOIC-08W |
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Виробник: Chip Quik Inc.
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 642.46 грн |
5+ | 602.85 грн |
10+ | 586.52 грн |
DIP600-SOIC-12N |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товар відсутній
DIP600-SOIC-12W |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товар відсутній
DIP600-SOIC-14N |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 704.04 грн |
5+ | 660.1 грн |
10+ | 641.72 грн |
DIP600-SOIC-14W |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 720.77 грн |
5+ | 674.74 грн |
10+ | 656 грн |
DIP600-SOIC-16N |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 735.97 грн |
5+ | 689.53 грн |
10+ | 670.28 грн |
DIP600-SOIC-16W |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 751.18 грн |
5+ | 704.18 грн |
10+ | 684.55 грн |
DIP600-SOIC-18N |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 767.14 грн |
5+ | 718.82 грн |
10+ | 698.83 грн |
DIP600-SOIC-18W |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 782.35 грн |
5+ | 733.46 грн |
10+ | 713.11 грн |
DIP600-SOIC-20N |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 799.08 грн |
5+ | 748.25 грн |
10+ | 727.38 грн |
DIP600-SOIC-20W |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 814.28 грн |
5+ | 762.89 грн |
10+ | 741.73 грн |
DIP600-SOIC-24N |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 861.42 грн |
5+ | 806.97 грн |
10+ | 784.56 грн |
DIP600-SOIC-24W |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 877.39 грн |
5+ | 821.61 грн |
10+ | 798.84 грн |
DIP600-SOIC-28N |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 923.77 грн |
5+ | 865.83 грн |
10+ | 841.67 грн |
DIP600-SOIC-28W |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 939.73 грн |
5+ | 880.48 грн |
10+ | 855.95 грн |
DIP600T300P04 |
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Виробник: Chip Quik Inc.
Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 272 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 69.19 грн |
DIP600T300P06 |
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Виробник: Chip Quik Inc.
Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 253 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 90.48 грн |
DIP600T300P08 |
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Виробник: Chip Quik Inc.
Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 117.09 грн |
DIP600T300P10 |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 145.98 грн |
DIP600T300P12 |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 174.11 грн |
DIP600T300P14 |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 219.73 грн |
DIP600T300P16 |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 233.41 грн |
DIP600T300P18 |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
товар відсутній
DIP600T300P20 |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 285.87 грн |