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DIP300T600P20 Chip Quik Inc.
![DIP300T600P20.pdf](/images/adobe-acrobat.png)
Description: DIP TO DIP 20PIN UNASSEMBLED
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 287.39 грн |
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Технічний опис DIP300T600P20 Chip Quik Inc.
Description: DIP TO DIP 20PIN UNASSEMBLED, Packaging: Bulk, Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.