DIP300T600P26 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-26 (0.3" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 387.51 грн |
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Технічний опис DIP300T600P26 Chip Quik Inc.
Description: DIP-26 (0.3" BODY) TO DIP-26 (0., Packaging: Bulk, Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 26, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.