Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35281) > Сторінка 538 з 589
Фото | Назва | Виробник | Інформація |
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PCF7952XTT/C2BC21J | NXP USA Inc. |
Description: RF TRANSMITTER UHF 24TSSOP Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Modulation or Protocol: UHF Applications: Remote Keyless Entry Supplier Device Package: 24-TSSOP DigiKey Programmable: Not Verified |
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MCIMX353CVM5B | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
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MCIMX351AVM4B | NXP USA Inc. |
Description: IC MPU I.MX35 400MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
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MCIMX357CVM5B | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART |
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MCIMX355AJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
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MCIMX355AVM4B | NXP USA Inc. |
Description: IC MPU I.MX35 400MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
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MCIMX356AJQ5C | NXP USA Inc. |
Description: IC MPU I.MX35 532MHZ 400LFBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Security Features: Secure Fusebox, Secure JTAG Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART |
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74AUP1G17GM,132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON (1.45x1) |
на замовлення 2756741 шт: термін постачання 21-31 дні (днів) |
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74AUP1G17GF132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON (1x1) |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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74AUP1G175GF,132 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 0.8 pF Supplier Device Package: 6-XSON (1x1) Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF Number of Bits per Element: 1 |
на замовлення 72263 шт: термін постачання 21-31 дні (днів) |
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74AUP1G175GM,132 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 0.8 pF Supplier Device Package: 6-XSON (1.45x1) Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF Number of Bits per Element: 1 |
на замовлення 75000 шт: термін постачання 21-31 дні (днів) |
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MC33FS8520A0KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8520A0ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
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MC33FS8510D3KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8510A2KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8510A0ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8510A0KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC32BC3770CSR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 25WLCSP Packaging: Tape & Reel (TR) Package / Case: 25-WFBGA, WLCSP Number of Cells: 1 Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 25-WLCSP (2.27x2.17) Charge Current - Max: 2A Programmable Features: Current Voltage - Supply (Max): 6.2V Battery Pack Voltage: 4.475V (Max) Current - Charging: Constant - Programmable |
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MC68HC11E0CFNE3R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44PLCC Packaging: Tape & Reel (TR) Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 38 DigiKey Programmable: Not Verified |
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PTN38007EWY | NXP USA Inc. |
Description: IC USB4 / MULTIPRO REDRIVER Packaging: Tape & Reel (TR) Package / Case: 36-WFLGA Exposed Pad Delay Time: 70ps Number of Channels: 4 Mounting Type: Surface Mount Output: Differential Type: ReDriver Input: Differential Operating Temperature: -20°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Applications: DisplayPort, USB Type C Current - Supply: 250mA Data Rate (Max): 20Gbps Supplier Device Package: 36-HWFLGA (2.1x6) Signal Conditioning: Input Equalization, Output Pre-Emphasis Capacitance - Input: 10 pF |
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PTN38007EWY | NXP USA Inc. |
Description: IC USB4 / MULTIPRO REDRIVER Packaging: Cut Tape (CT) Package / Case: 36-WFLGA Exposed Pad Delay Time: 70ps Number of Channels: 4 Mounting Type: Surface Mount Output: Differential Type: ReDriver Input: Differential Operating Temperature: -20°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Applications: DisplayPort, USB Type C Current - Supply: 250mA Data Rate (Max): 20Gbps Supplier Device Package: 36-HWFLGA (2.1x6) Signal Conditioning: Input Equalization, Output Pre-Emphasis Capacitance - Input: 10 pF |
на замовлення 6421 шт: термін постачання 21-31 дні (днів) |
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IP4338CX24/LF/P135 | NXP USA Inc. |
Description: DATA LINE FILTER Packaging: Bulk |
на замовлення 13399 шт: термін постачання 21-31 дні (днів) |
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88W8987-A2-NYEA/AK | NXP USA Inc. |
Description: IC RF TXRX BLE 68HVQFN Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Sensitivity: -99dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V, 1.8V, 2.2V Power - Output: 22dBm Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Current - Receiving: 38mA ~ 82mA Data Rate (Max): 433Mbps Current - Transmitting: 79mA ~ 145mA Supplier Device Package: 68-HVQFN (8x8) GPIO: 21 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART |
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IP4359CX4/LF-H500315 | NXP USA Inc. |
Description: DATA LINE FILTER Packaging: Bulk Package / Case: 4-UFBGA, WLCSP Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -35°C ~ 85°C (TA) Applications: DVI, HDMI, USB Capacitance @ Frequency: 1.3pF @ 1MHz Voltage - Reverse Standoff (Typ): 5.5V (Max) Supplier Device Package: 4-WLCSP (0.76x0.76) Unidirectional Channels: 2 Voltage - Breakdown (Min): 6V Power Line Protection: Yes |
на замовлення 758500 шт: термін постачання 21-31 дні (днів) |
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88W8964-B0-BTWC/AK | NXP USA Inc. |
Description: 4X4 802.11AC WAVE2 WIFI WITH BF Packaging: Tray Frequency: 20MHz ~ 160MHz Type: TxRx Only Protocol: 802.11ac Data Rate (Max): 2.6Gbps Modulation: 256-QAM RF Family/Standard: WiFi |
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NPIC6C596D,118 | NXP USA Inc. |
Description: NOW NEXPERIA NPIC6C596D - SERIAL Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
на замовлення 6130 шт: термін постачання 21-31 дні (днів) |
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ASL5115SHV/0Y | NXP USA Inc. |
Description: IC LED DRV CTRL PWM 1.5A 48HLQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 48-HLQFP (7x7) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Grade: Automotive |
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MCIMX6D7CZK08AE | NXP USA Inc. |
Description: IC MPU I.MX6D 800MHZ 569MAPBGA Packaging: Tray Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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MRF21030LR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400 Mounting Type: Chassis Mount Frequency: 2.14GHz Power - Output: 30W Gain: 13dB Technology: LDMOS Supplier Device Package: NI-400 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 250 mA |
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MC33897CTEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
на замовлення 32500 шт: термін постачання 21-31 дні (днів) |
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MC33897CTEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
на замовлення 33872 шт: термін постачання 21-31 дні (днів) |
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S32K324EHT1MMMSR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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74LVC1G79GX,125 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 5X2SON Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 500 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 500 MHz Input Capacitance: 5 pF Supplier Device Package: 5-X2SON (0.80x0.80) Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF Number of Bits per Element: 1 |
на замовлення 300000 шт: термін постачання 21-31 дні (днів) |
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74LVC1G79GM,132 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 500 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 500 MHz Input Capacitance: 5 pF Supplier Device Package: 6-XSON (1.45x1) Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF Number of Bits per Element: 1 |
на замовлення 215000 шт: термін постачання 21-31 дні (днів) |
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74AHC2G241GD,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-XSON (2x3) |
на замовлення 5770 шт: термін постачання 21-31 дні (днів) |
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74AHC2G241DP-Q100125 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES Packaging: Bulk |
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MC908QT2AMDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SO Packaging: Tube Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
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GTL2005PW,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 14-TSSOP Channel Type: Bidirectional Output Signal: LVTTL, TTL Translator Type: Mixed Signal Channels per Circuit: 4 Input Signal: GTL Number of Circuits: 1 |
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GTL2005PW,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 14-TSSOP Channel Type: Bidirectional Output Signal: LVTTL, TTL Translator Type: Mixed Signal Channels per Circuit: 4 Input Signal: GTL Number of Circuits: 1 |
на замовлення 6347 шт: термін постачання 21-31 дні (днів) |
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GTL2014PW,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 14-TSSOP Channel Type: Bidirectional Output Signal: GTL Translator Type: Mixed Signal Channels per Circuit: 4 Input Signal: LVTTL Number of Circuits: 1 |
товар відсутній |
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N74F257AD,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
на замовлення 28942 шт: термін постачання 21-31 дні (днів) |
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N74F157AD,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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PCAL9714HNMP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 14-BIT S Packaging: Tape & Reel (TR) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 14 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Grade: Automotive Qualification: AEC-Q100 |
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PCAL9714HNMP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 14-BIT S Packaging: Cut Tape (CT) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 14 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Grade: Automotive Qualification: AEC-Q100 |
на замовлення 5791 шт: термін постачання 21-31 дні (днів) |
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PCAL9714HN/Q900MP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 14-BIT S Packaging: Tape & Reel (TR) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 14 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Grade: Automotive Qualification: AEC-Q100 |
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PCAL9714HN/Q900MP | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING 14-BIT S Packaging: Cut Tape (CT) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: SPI Number of I/O: 14 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V Clock Frequency: 5 MHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Grade: Automotive Qualification: AEC-Q100 |
на замовлення 5830 шт: термін постачання 21-31 дні (днів) |
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74HC10N,652 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
на замовлення 17715 шт: термін постачання 21-31 дні (днів) |
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74HCT10N,652 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
на замовлення 5066 шт: термін постачання 21-31 дні (днів) |
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74HC4316N,652 | NXP USA Inc. |
Description: IC SWITCH SPST-NOX4 135OHM 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 135Ohm -3db Bandwidth: 160MHz Supplier Device Package: 16-DIP Voltage - Supply, Single (V+): 2V ~ 10V Voltage - Supply, Dual (V±): ±1V ~ 5V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 6Ohm Switch Time (Ton, Toff) (Max): 16ns, 16ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 100nA Number of Circuits: 4 |
на замовлення 1002 шт: термін постачання 21-31 дні (днів) |
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74HC4016N,652 | NXP USA Inc. |
Description: IC SWITCH SPST-NOX4 120OHM 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 120Ohm -3db Bandwidth: 160MHz Supplier Device Package: 14-DIP Voltage - Supply, Single (V+): 2V ~ 10V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 9Ohm Switch Time (Ton, Toff) (Max): 28ns, 22ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Number of Circuits: 4 |
на замовлення 5403 шт: термін постачання 21-31 дні (днів) |
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N74F11N,602 | NXP USA Inc. |
Description: IC GATE AND 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: AND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF Number of Circuits: 3 |
на замовлення 3360 шт: термін постачання 21-31 дні (днів) |
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PCA9554ADB,112 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP Features: POR Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-SSOP Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
на замовлення 2629 шт: термін постачання 21-31 дні (днів) |
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74HCT125N,652 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 14-DIP |
на замовлення 27563 шт: термін постачання 21-31 дні (днів) |
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74HC125N,652 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 14-DIP |
на замовлення 10432 шт: термін постачання 21-31 дні (днів) |
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74HC4538N,652 | NXP USA Inc. |
Description: IC MULTIVIBRATOR 25NS 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 25 ns Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Schmitt Trigger Input: No Supplier Device Package: 16-DIP Voltage - Supply: 2 V ~ 6 V |
на замовлення 2489 шт: термін постачання 21-31 дні (днів) |
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BT137X-800,127 | NXP USA Inc. |
Description: TRIAC 800V 8A SOT186A Packaging: Bulk |
на замовлення 1858 шт: термін постачання 21-31 дні (днів) |
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S9S08RN16W2VTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
товар відсутній |
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S9S08RN16W2VTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
товар відсутній |
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HEF40174BP,652 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 6BIT 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Non-Inverted Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 15V Current - Quiescent (Iq): 80 µA Current - Output High, Low: 3mA, 3mA Trigger Type: Positive Edge Clock Frequency: 45 MHz Input Capacitance: 7.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 45ns @ 15V, 50pF Number of Bits per Element: 6 |
на замовлення 4593 шт: термін постачання 21-31 дні (днів) |
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BZX884-C43,315 | NXP USA Inc. |
Description: DIODE ZENER 43V 250MW SOD882 Packaging: Bulk |
на замовлення 59863 шт: термін постачання 21-31 дні (днів) |
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PCF7952XTT/C2BC21J |
Виробник: NXP USA Inc.
Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
Description: RF TRANSMITTER UHF 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
товар відсутній
MCIMX353CVM5B |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
товар відсутній
MCIMX351AVM4B |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
товар відсутній
MCIMX357CVM5B |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
товар відсутній
MCIMX355AJQ5C |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
товар відсутній
MCIMX355AVM4B |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
товар відсутній
MCIMX356AJQ5C |
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
товар відсутній
74AUP1G17GM,132 |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
на замовлення 2756741 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3974+ | 5.56 грн |
74AUP1G17GF132 |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1x1)
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (1x1)
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2338+ | 9.04 грн |
74AUP1G175GF,132 |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (1x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (1x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Number of Bits per Element: 1
на замовлення 72263 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1629+ | 12.52 грн |
74AUP1G175GM,132 |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 5.7ns @ 3.3V, 30pF
Number of Bits per Element: 1
на замовлення 75000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1543+ | 13.21 грн |
MC33FS8520A0KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8520A0ESR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
MC33FS8510D3KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8510A2KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8510A0ESR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8510A0KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC32BC3770CSR2 |
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-WFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 25-WLCSP (2.27x2.17)
Charge Current - Max: 2A
Programmable Features: Current
Voltage - Supply (Max): 6.2V
Battery Pack Voltage: 4.475V (Max)
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-WFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 25-WLCSP (2.27x2.17)
Charge Current - Max: 2A
Programmable Features: Current
Voltage - Supply (Max): 6.2V
Battery Pack Voltage: 4.475V (Max)
Current - Charging: Constant - Programmable
товар відсутній
MC68HC11E0CFNE3R |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 38
DigiKey Programmable: Not Verified
товар відсутній
PTN38007EWY |
Виробник: NXP USA Inc.
Description: IC USB4 / MULTIPRO REDRIVER
Packaging: Tape & Reel (TR)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort, USB Type C
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization, Output Pre-Emphasis
Capacitance - Input: 10 pF
Description: IC USB4 / MULTIPRO REDRIVER
Packaging: Tape & Reel (TR)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort, USB Type C
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization, Output Pre-Emphasis
Capacitance - Input: 10 pF
товар відсутній
PTN38007EWY |
Виробник: NXP USA Inc.
Description: IC USB4 / MULTIPRO REDRIVER
Packaging: Cut Tape (CT)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort, USB Type C
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization, Output Pre-Emphasis
Capacitance - Input: 10 pF
Description: IC USB4 / MULTIPRO REDRIVER
Packaging: Cut Tape (CT)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort, USB Type C
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization, Output Pre-Emphasis
Capacitance - Input: 10 pF
на замовлення 6421 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 534.49 грн |
10+ | 351.79 грн |
25+ | 309.7 грн |
100+ | 246.4 грн |
250+ | 224.93 грн |
500+ | 211.86 грн |
1000+ | 197.7 грн |
2500+ | 188.08 грн |
IP4338CX24/LF/P135 |
на замовлення 13399 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1664+ | 12.52 грн |
88W8987-A2-NYEA/AK |
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
IP4359CX4/LF-H500315 |
Виробник: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: DVI, HDMI, USB
Capacitance @ Frequency: 1.3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 4-WLCSP (0.76x0.76)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Description: DATA LINE FILTER
Packaging: Bulk
Package / Case: 4-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: DVI, HDMI, USB
Capacitance @ Frequency: 1.3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: 4-WLCSP (0.76x0.76)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
на замовлення 758500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2049+ | 10.43 грн |
88W8964-B0-BTWC/AK |
Виробник: NXP USA Inc.
Description: 4X4 802.11AC WAVE2 WIFI WITH BF
Packaging: Tray
Frequency: 20MHz ~ 160MHz
Type: TxRx Only
Protocol: 802.11ac
Data Rate (Max): 2.6Gbps
Modulation: 256-QAM
RF Family/Standard: WiFi
Description: 4X4 802.11AC WAVE2 WIFI WITH BF
Packaging: Tray
Frequency: 20MHz ~ 160MHz
Type: TxRx Only
Protocol: 802.11ac
Data Rate (Max): 2.6Gbps
Modulation: 256-QAM
RF Family/Standard: WiFi
товар відсутній
NPIC6C596D,118 |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA NPIC6C596D - SERIAL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: NOW NEXPERIA NPIC6C596D - SERIAL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
на замовлення 6130 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1078+ | 19.66 грн |
ASL5115SHV/0Y |
Виробник: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 48HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 48-HLQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Description: IC LED DRV CTRL PWM 1.5A 48HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 48-HLQFP (7x7)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
товар відсутній
MCIMX6D7CZK08AE |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товар відсутній
MRF21030LR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 250 mA
Description: RF MOSFET LDMOS 28V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400
Mounting Type: Chassis Mount
Frequency: 2.14GHz
Power - Output: 30W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: NI-400
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 250 mA
товар відсутній
MC33897CTEFR2 |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
на замовлення 32500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 120.69 грн |
5000+ | 111.86 грн |
MC33897CTEFR2 |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
на замовлення 33872 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 240.26 грн |
10+ | 207.93 грн |
25+ | 196.62 грн |
100+ | 159.91 грн |
250+ | 151.72 грн |
500+ | 136.14 грн |
1000+ | 112.93 грн |
S32K324EHT1MMMSR |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
74LVC1G79GX,125 |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Bits per Element: 1
на замовлення 300000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5017+ | 4.21 грн |
74LVC1G79GM,132 |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 500 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 500 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Bits per Element: 1
на замовлення 215000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4661+ | 4.21 грн |
74AHC2G241GD,125 |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
на замовлення 5770 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2049+ | 10.53 грн |
74AHC2G241DP-Q100125 |
товар відсутній
MC908QT2AMDWE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
товар відсутній
GTL2005PW,112 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: GTL
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: GTL
Number of Circuits: 1
товар відсутній
GTL2005PW,112 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: GTL
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: GTL
Number of Circuits: 1
на замовлення 6347 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
634+ | 33.32 грн |
GTL2014PW,112 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
товар відсутній
N74F257AD,623 |
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
на замовлення 28942 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2219+ | 9.79 грн |
N74F157AD,623 |
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2420+ | 8.39 грн |
PCAL9714HNMP |
Виробник: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
PCAL9714HNMP |
Виробник: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5791 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 104.92 грн |
10+ | 90.27 грн |
25+ | 85.69 грн |
100+ | 66.05 грн |
250+ | 61.75 грн |
500+ | 54.57 грн |
1000+ | 42.37 грн |
2500+ | 39.55 грн |
PCAL9714HN/Q900MP |
Виробник: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
PCAL9714HN/Q900MP |
Виробник: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
Description: LOW-VOLTAGE TRANSLATING 14-BIT S
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 14
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.1V ~ 5.5V, 1.65V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5830 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 111 грн |
10+ | 95.98 грн |
25+ | 90.55 грн |
100+ | 72.42 грн |
250+ | 67.99 грн |
500+ | 59.49 грн |
1000+ | 48.49 грн |
2500+ | 45.14 грн |
74HC10N,652 |
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
на замовлення 17715 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
987+ | 20.98 грн |
74HCT10N,652 |
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
на замовлення 5066 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
987+ | 20.98 грн |
74HC4316N,652 |
Виробник: NXP USA Inc.
Description: IC SWITCH SPST-NOX4 135OHM 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 135Ohm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-DIP
Voltage - Supply, Single (V+): 2V ~ 10V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 6Ohm
Switch Time (Ton, Toff) (Max): 16ns, 16ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 4
Description: IC SWITCH SPST-NOX4 135OHM 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 135Ohm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-DIP
Voltage - Supply, Single (V+): 2V ~ 10V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 6Ohm
Switch Time (Ton, Toff) (Max): 16ns, 16ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 4
на замовлення 1002 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
392+ | 53.86 грн |
74HC4016N,652 |
Виробник: NXP USA Inc.
Description: IC SWITCH SPST-NOX4 120OHM 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 160MHz
Supplier Device Package: 14-DIP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 9Ohm
Switch Time (Ton, Toff) (Max): 28ns, 22ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Description: IC SWITCH SPST-NOX4 120OHM 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 160MHz
Supplier Device Package: 14-DIP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 9Ohm
Switch Time (Ton, Toff) (Max): 28ns, 22ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
на замовлення 5403 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
392+ | 53.86 грн |
N74F11N,602 |
Виробник: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 3
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 3
на замовлення 3360 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
784+ | 26.58 грн |
PCA9554ADB,112 |
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2629 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
404+ | 52.68 грн |
74HCT125N,652 |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
Description: IC BUFFER NON-INVERT 5.5V 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
на замовлення 27563 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
833+ | 25.18 грн |
74HC125N,652 |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-DIP
Description: IC BUFFER NON-INVERT 6V 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-DIP
на замовлення 10432 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
833+ | 25.18 грн |
74HC4538N,652 |
Виробник: NXP USA Inc.
Description: IC MULTIVIBRATOR 25NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Description: IC MULTIVIBRATOR 25NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 25 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
на замовлення 2489 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
544+ | 38.47 грн |
BT137X-800,127 |
на замовлення 1858 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1049+ | 20.28 грн |
S9S08RN16W2VTJR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
S9S08RN16W2VTJ |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
HEF40174BP,652 |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 6BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 3mA, 3mA
Trigger Type: Positive Edge
Clock Frequency: 45 MHz
Input Capacitance: 7.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 45ns @ 15V, 50pF
Number of Bits per Element: 6
Description: IC FF D-TYPE SNGL 6BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 15V
Current - Quiescent (Iq): 80 µA
Current - Output High, Low: 3mA, 3mA
Trigger Type: Positive Edge
Clock Frequency: 45 MHz
Input Capacitance: 7.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 45ns @ 15V, 50pF
Number of Bits per Element: 6
на замовлення 4593 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
544+ | 38.99 грн |
BZX884-C43,315 |
на замовлення 59863 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
15000+ | 1.39 грн |