Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35272) > Сторінка 116 з 588
Фото | Назва | Виробник | Інформація |
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MPC8313E-RDB | NXP USA Inc. |
Description: MPC8313E EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: e300 Utilized IC / Part: MPC8313E |
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MC9S08GT16ACFBER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFP Packaging: Cut Tape (CT) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 1831 шт: термін постачання 21-31 дні (днів) |
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MC9S08GT60ACFDER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48QFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 39 DigiKey Programmable: Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MC9S08GT8ACFBER | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44QFP Packaging: Cut Tape (CT) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
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MC9S08QG8CFFER | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16QFN Packaging: Cut Tape (CT) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-QFN-EP (5x5) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BAP51-04W,115 | NXP USA Inc. | Description: RF DIODE PIN 50V 240MW SOT323-3 |
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BAP65-05,215 | NXP USA Inc. |
Description: RF DIODE PIN 30V 250MW TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: PIN - 1 Pair Common Cathode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz Resistance @ If, F: 350mOhm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 30V Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Current - Max: 100 mA Power Dissipation (Max): 250 mW |
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BAP70-04W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 260MW SOT323-3 Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Series Connection Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SC-70 Part Status: Obsolete Current - Max: 100 mA Power Dissipation (Max): 260 mW |
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BAP70AM,135 | NXP USA Inc. |
Description: RF DIODE PIN 50V 300MW 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Diode Type: PIN - 2 Pair Series Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: 6-TSSOP Current - Max: 100 mA Power Dissipation (Max): 300 mW |
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BB178LX,315 | NXP USA Inc. |
Description: DIODE UHF VAR CAP 32V SOD882T Packaging: Tape & Reel (TR) Package / Case: SOD-882 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD2 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 15.0 |
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BB179LX,315 | NXP USA Inc. |
Description: DIODE UHF VAR CAP 30V SOD882T Packaging: Tape & Reel (TR) Package / Case: SOD-882 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD2 Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 10.9 |
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BFG25A/X,215 | NXP USA Inc. |
Description: RF TRANS NPN 5V 5GHZ SOT143B Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 32mW Current - Collector (Ic) (Max): 6.5mA Voltage - Collector Emitter Breakdown (Max): 5V DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V Frequency - Transition: 5GHz Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz Supplier Device Package: SOT-143B |
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BFG520/XR,215 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SOT143R Packaging: Tape & Reel (TR) Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz Supplier Device Package: SOT-143R |
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BFR93AR,215 | NXP USA Inc. |
Description: RF TRANS NPN 12V 6GHZ TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 35mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V Frequency - Transition: 6GHz Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete |
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BFU725F,115 | NXP USA Inc. |
Description: RF TRANS NPN 2.8V 70GHZ 4DFP Packaging: Tape & Reel (TR) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 10dB ~ 24dB Power - Max: 136mW Current - Collector (Ic) (Max): 40mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V Frequency - Transition: 70GHz Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz Supplier Device Package: 4-DFP |
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BGW200EG/01,518 | NXP USA Inc. |
Description: IC RF TXRX+MCU WIFI 68LFLGA Packaging: Tape & Reel (TR) Package / Case: 68-LFLGA Exposed Pad Sensitivity: -91dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kb ROM, 1280kb SRAM Type: TxRx + MCU Operating Temperature: -30°C ~ 85°C Voltage - Supply: 2.7V ~ 3V Power - Output: 17.6dBm Protocol: 802.11b Current - Receiving: 93.7mA ~ 111.5mA Data Rate (Max): 11Mbps Current - Transmitting: 16mA ~ 94.2mA Supplier Device Package: 68-HLLGAR (10x15) GPIO: 11 Modulation: CCK, DSSS, QPSK RF Family/Standard: WiFi Serial Interfaces: JTAG, SDIO, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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BLF6G10LS-200,112 | NXP USA Inc. |
Description: FET RF 65V 871.5MHZ SOT502B Packaging: Tray Package / Case: SOT-502B Current Rating (Amps): 49A Mounting Type: Chassis Mount Frequency: 871.5MHz Power - Output: 40W Gain: 20.2dB Technology: LDMOS Supplier Device Package: SOT502B Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.4 A |
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BLF6G10LS-200,118 | NXP USA Inc. |
Description: FET RF 65V 871.5MHZ SOT502B Packaging: Tape & Reel (TR) Package / Case: SOT-502B Current Rating (Amps): 49A Mounting Type: Chassis Mount Frequency: 871.5MHz Power - Output: 40W Gain: 20.2dB Technology: LDMOS Supplier Device Package: SOT502B Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.4 A |
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BLT50,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 470MHZ SOT223 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 2W Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 10V DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V Frequency - Transition: 470MHz Supplier Device Package: SC-73 Part Status: Obsolete |
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CBT3857PW,118 | NXP USA Inc. |
Description: IC BUS SWITCH 10 X 1:1 24TSSOP Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: 0°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 24-TSSOP |
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CBT6820DGG,512 | NXP USA Inc. |
Description: IC BUS SWITCH 10 X 1:1 48TSSOP Packaging: Tube Package / Case: 48-TFSOP (0.240", 6.10mm Width) Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 48-TSSOP Part Status: Obsolete |
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CBT6820DGG,518 | NXP USA Inc. |
Description: IC BUS SWITCH 10 X 1:1 48TSSOP Packaging: Tape & Reel (TR) Package / Case: 48-TFSOP (0.240", 6.10mm Width) Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 48-TSSOP Part Status: Obsolete |
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CBTU4411EE,557 | NXP USA Inc. |
Description: IC BUS SWITCH 11 X 4:1 72LFBGA Packaging: Tray Package / Case: 72-LFBGA Mounting Type: Surface Mount Circuit: 11 x 4:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 72-LFBGA (7x7) Part Status: Obsolete |
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CBTU4411EE,551 | NXP USA Inc. |
Description: IC BUS SWITCH 11 X 4:1 72LFBGA Packaging: Tray Package / Case: 72-LFBGA Mounting Type: Surface Mount Circuit: 11 x 4:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 72-LFBGA (7x7) Part Status: Obsolete |
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CGD1042H,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J Packaging: Tray Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Part Status: Obsolete Number of Circuits: 1 Current - Supply: 450 mA |
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CGD1044H,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J Packaging: Bulk Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 450 mA |
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GTL2002D,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIRECTIONAL 8SO Features: Auto-Direction Sensing Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 8-SO Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 5.5 V Voltage - VCCB: 1 V ~ 5.5 V Number of Circuits: 1 |
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GTL2003PW,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 20TSSOP Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 8 Voltage - VCCA: 0.8 V ~ 5.5 V Voltage - VCCB: 0.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
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GTL2010PW,112 | NXP USA Inc. | Description: IC TRANSLATOR BIDIR 24TSSOP |
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GTL2012DC,125 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP Packaging: Tape & Reel (TR) Package / Case: 8-VFSOP (0.091", 2.30mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 8-VSSOP Channel Type: Bidirectional Output Signal: GTL Translator Type: Mixed Signal Channels per Circuit: 2 Input Signal: LVTTL Number of Circuits: 1 |
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GTL2018PW,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 24TSSOP Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-TSSOP Channel Type: Bidirectional Output Signal: GTL Translator Type: Mixed Signal Channels per Circuit: 8 Input Signal: LVTTL Grade: Automotive Part Status: Active Number of Circuits: 1 Qualification: AEC-Q100 |
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GTL2107PW,112 | NXP USA Inc. | Description: IC TRNSLTR UNIDIR 28TSSOP |
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GTL2107PW,118 | NXP USA Inc. |
Description: IC TRANSLATOR UNIDIR 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 28-TSSOP Channel Type: Unidirectional Output Signal: LVTTL Translator Type: Mixed Signal Channels per Circuit: 12 Input Signal: GTL Part Status: Obsolete Number of Circuits: 1 |
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J174,126 | NXP USA Inc. |
Description: JFET P-CH 30V TO92-3 Packaging: Tape & Box (TB) Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: 150°C (TJ) FET Type: P-Channel Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Voltage - Breakdown (V(BR)GSS): 30 V Supplier Device Package: TO-92-3 Part Status: Obsolete Drain to Source Voltage (Vdss): 30 V Power - Max: 400 mW Resistance - RDS(On): 85 Ohms Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V |
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J175,116 | NXP USA Inc. |
Description: JFET P-CH 30V TO92-3 Packaging: Tape & Box (TB) Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: 150°C (TJ) FET Type: P-Channel Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Voltage - Breakdown (V(BR)GSS): 30 V Supplier Device Package: TO-92-3 Part Status: Obsolete Drain to Source Voltage (Vdss): 30 V Power - Max: 400 mW Resistance - RDS(On): 125 Ohms Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V |
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J176,126 | NXP USA Inc. |
Description: JFET P-CH 30V TO92-3 Packaging: Tape & Box (TB) Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: 150°C (TJ) FET Type: P-Channel Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Voltage - Breakdown (V(BR)GSS): 30 V Supplier Device Package: TO-92-3 Part Status: Obsolete Drain to Source Voltage (Vdss): 30 V Power - Max: 400 mW Resistance - RDS(On): 250 Ohms Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V |
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J177,126 | NXP USA Inc. |
Description: JFET P-CH 30V TO92-3 Packaging: Tape & Box (TB) Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Operating Temperature: 150°C (TJ) FET Type: P-Channel Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Voltage - Breakdown (V(BR)GSS): 30 V Supplier Device Package: TO-92-3 Part Status: Obsolete Drain to Source Voltage (Vdss): 30 V Power - Max: 400 mW Resistance - RDS(On): 300 Ohms Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V |
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LM75AD,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C 8SO Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-SO Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Active |
на замовлення 94043 шт: термін постачання 21-31 дні (днів) |
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LPC2119FBD64/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 46 DigiKey Programmable: Not Verified |
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LPC2124FBD64/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 46 DigiKey Programmable: Not Verified |
на замовлення 320 шт: термін постачання 21-31 дні (днів) |
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LPC2129FBD64/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 46 DigiKey Programmable: Not Verified |
на замовлення 246 шт: термін постачання 21-31 дні (днів) |
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LPC2194HBD64/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 46 DigiKey Programmable: Not Verified |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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LPC2212FBD144/01,5 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLSH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 112 DigiKey Programmable: Not Verified |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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LPC2292FBD144/01,5 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLSH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 112 DigiKey Programmable: Not Verified |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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LPC2292FET144/01,5 | NXP USA Inc. |
Description: IC MCU 16/32BIT 256KB 144TFBGA Packaging: Tray Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-TFBGA (12x12) Part Status: Not For New Designs Number of I/O: 112 DigiKey Programmable: Not Verified |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
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LPC2294HBD144/01,5 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLSH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Discontinued at Digi-Key Number of I/O: 112 DigiKey Programmable: Not Verified |
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MF1MOA2S50/D3F,118 | NXP USA Inc. | Description: IC RFID TRANSP 13.56MHZ MOA4 |
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OM4068H/2,518 | NXP USA Inc. |
Description: IC DRVR 32 SEGMENT 44QFP Packaging: Tape & Reel (TR) Package / Case: 44-QFP Display Type: LCD Mounting Type: Surface Mount Interface: Serial Configuration: 32 Segment Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.5V ~ 5.5V Supplier Device Package: 44-PQFP (10x10) Current - Supply: 12 µA |
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OM6274,598 | NXP USA Inc. |
Description: DEMO BOARD I2C TO SPI SC18IS602 Packaging: Bulk Function: I2C to SPI Type: Interface Utilized IC / Part: SC18IS602, SC18IS603 Supplied Contents: Board(s), Accessories Embedded: No Part Status: Obsolete |
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OM6276,598 | NXP USA Inc. |
Description: DEMO BOARD PWM LED Packaging: Bulk Function: RGB LED Controller Type: Opto/Lighting Utilized IC / Part: PCA9633 Supplied Contents: Board(s) Part Status: Obsolete |
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P87C51X2FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 33MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, UART/USART Peripherals: POR Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 32 |
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P89LPC9107FN,112 | NXP USA Inc. |
Description: IC MCU 8BIT 1KB FLASH 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 18MHz Program Memory Size: 1KB (1K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 14-DIP Number of I/O: 12 DigiKey Programmable: Not Verified |
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P89LPC916FDH,118 | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 2KB (2K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x8b; D/A 1x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Verified |
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P89LPC920FN,112 | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 18MHz Program Memory Size: 2KB (2K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 20-DIP Part Status: Obsolete Number of I/O: 18 |
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P89LPC924FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x8b; D/A 1x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 18 DigiKey Programmable: Verified |
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P89LPC936FA,529 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28PLCC Packaging: Tube Package / Case: 28-LCC (J-Lead) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 16KB (16K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 8051 Data Converters: A/D 8x8b; D/A 2x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 28-PLCC (11.48x11.48) Part Status: Obsolete Number of I/O: 26 |
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P89LPC936FDH,518 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 18MHz Program Memory Size: 16KB (16K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 8051 Data Converters: A/D 8x8b; D/A 2x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: 28-TSSOP Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
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PBLS2001S,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 1.5W Current - Collector (Ic) (Max): 100mA, 3A Voltage - Collector Emitter Breakdown (Max): 50V, 20V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 2A, 2V Frequency - Transition: 100MHz Resistor - Base (R1): 2.2kOhms Resistor - Emitter Base (R2): 2.2kOhms Supplier Device Package: 8-SO Part Status: Obsolete |
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PBLS2002S,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 1.5W Current - Collector (Ic) (Max): 100mA, 3A Voltage - Collector Emitter Breakdown (Max): 50V, 20V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V Frequency - Transition: 100MHz Resistor - Base (R1): 4.7kOhms Resistor - Emitter Base (R2): 4.7kOhms Supplier Device Package: 8-SO Part Status: Obsolete |
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PBLS2003S,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 1.5W Current - Collector (Ic) (Max): 100mA, 3A Voltage - Collector Emitter Breakdown (Max): 50V, 20V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 2A, 2V Frequency - Transition: 100MHz Resistor - Base (R1): 10kOhms Resistor - Emitter Base (R2): 10kOhms Supplier Device Package: 8-SO Part Status: Obsolete |
товар відсутній |
MPC8313E-RDB |
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
товар відсутній
MC9S08GT16ACFBER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 1831 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 660.7 грн |
10+ | 499.91 грн |
100+ | 413.9 грн |
MC9S08GT60ACFDER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1156.42 грн |
10+ | 889.7 грн |
100+ | 751.42 грн |
500+ | 700.85 грн |
MC9S08GT8ACFBER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
товар відсутній
MC9S08QG8CFFER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 354.3 грн |
BAP65-05,215 |
Виробник: NXP USA Inc.
Description: RF DIODE PIN 30V 250MW TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
Description: RF DIODE PIN 30V 250MW TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
товар відсутній
BAP70-04W,115 |
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Description: RF DIODE PIN 50V 260MW SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
товар відсутній
BAP70AM,135 |
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Diode Type: PIN - 2 Pair Series
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: 6-TSSOP
Current - Max: 100 mA
Power Dissipation (Max): 300 mW
Description: RF DIODE PIN 50V 300MW 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Diode Type: PIN - 2 Pair Series
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: 6-TSSOP
Current - Max: 100 mA
Power Dissipation (Max): 300 mW
товар відсутній
BB178LX,315 |
Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
Description: DIODE UHF VAR CAP 32V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
товар відсутній
BB179LX,315 |
Виробник: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
Description: DIODE UHF VAR CAP 30V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
товар відсутній
BFG25A/X,215 |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 5V 5GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 32mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Supplier Device Package: SOT-143B
Description: RF TRANS NPN 5V 5GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 32mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Supplier Device Package: SOT-143B
товар відсутній
BFG520/XR,215 |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SOT-143R
Description: RF TRANS NPN 15V 9GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SOT-143R
товар відсутній
BFR93AR,215 |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Description: RF TRANS NPN 12V 6GHZ TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
товар відсутній
BFU725F,115 |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 10dB ~ 24dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Frequency - Transition: 70GHz
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 10dB ~ 24dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Frequency - Transition: 70GHz
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Supplier Device Package: 4-DFP
товар відсутній
BGW200EG/01,518 |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU WIFI 68LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 68-LFLGA Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kb ROM, 1280kb SRAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 3V
Power - Output: 17.6dBm
Protocol: 802.11b
Current - Receiving: 93.7mA ~ 111.5mA
Data Rate (Max): 11Mbps
Current - Transmitting: 16mA ~ 94.2mA
Supplier Device Package: 68-HLLGAR (10x15)
GPIO: 11
Modulation: CCK, DSSS, QPSK
RF Family/Standard: WiFi
Serial Interfaces: JTAG, SDIO, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU WIFI 68LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 68-LFLGA Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kb ROM, 1280kb SRAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.7V ~ 3V
Power - Output: 17.6dBm
Protocol: 802.11b
Current - Receiving: 93.7mA ~ 111.5mA
Data Rate (Max): 11Mbps
Current - Transmitting: 16mA ~ 94.2mA
Supplier Device Package: 68-HLLGAR (10x15)
GPIO: 11
Modulation: CCK, DSSS, QPSK
RF Family/Standard: WiFi
Serial Interfaces: JTAG, SDIO, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
BLF6G10LS-200,112 |
Виробник: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
товар відсутній
BLF6G10LS-200,118 |
Виробник: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tape & Reel (TR)
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tape & Reel (TR)
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
товар відсутній
BLT50,115 |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 470MHZ SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 470MHz
Supplier Device Package: SC-73
Part Status: Obsolete
Description: RF TRANS NPN 10V 470MHZ SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 470MHz
Supplier Device Package: SC-73
Part Status: Obsolete
товар відсутній
CBT3857PW,118 |
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
Description: IC BUS SWITCH 10 X 1:1 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
товар відсутній
CBT6820DGG,512 |
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tube
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
товар відсутній
CBT6820DGG,518 |
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
товар відсутній
CBTU4411EE,557 |
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
товар відсутній
CBTU4411EE,551 |
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Packaging: Tray
Package / Case: 72-LFBGA
Mounting Type: Surface Mount
Circuit: 11 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 72-LFBGA (7x7)
Part Status: Obsolete
товар відсутній
CGD1042H,112 |
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tray
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 450 mA
Description: IC AMP CATV SOT115J
Packaging: Tray
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 450 mA
товар відсутній
CGD1044H,112 |
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
товар відсутній
GTL2002D,118 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
товар відсутній
GTL2003PW,118 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 20TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 0.8 V ~ 5.5 V
Voltage - VCCB: 0.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
GTL2012DC,125 |
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: LVTTL
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 2
Input Signal: LVTTL
Number of Circuits: 1
товар відсутній
GTL2018PW,118 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 8
Input Signal: LVTTL
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 8
Input Signal: LVTTL
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
товар відсутній
GTL2107PW,118 |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
J174,126 |
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 85 Ohms
Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 85 Ohms
Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
товар відсутній
J175,116 |
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
товар відсутній
J176,126 |
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 250 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 250 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V
товар відсутній
J177,126 |
Виробник: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 300 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V
Description: JFET P-CH 30V TO92-3
Packaging: Tape & Box (TB)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 400 mW
Resistance - RDS(On): 300 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V
товар відсутній
LM75AD,118 |
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 94043 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 26.85 грн |
5000+ | 23.93 грн |
7500+ | 22.38 грн |
12500+ | 20.79 грн |
17500+ | 20.5 грн |
25000+ | 19.92 грн |
LPC2119FBD64/01,15 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
товар відсутній
LPC2124FBD64/01,15 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 320 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1155.66 грн |
10+ | 889.41 грн |
160+ | 811.29 грн |
LPC2129FBD64/01,15 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 246 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1712.2 грн |
10+ | 1322.62 грн |
160+ | 1129.41 грн |
LPC2194HBD64/01,15 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
на замовлення 55 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1981.35 грн |
10+ | 1530.62 грн |
LPC2212FBD144/01,5 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 35 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1674.95 грн |
10+ | 1293.7 грн |
LPC2292FBD144/01,5 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2030.77 грн |
10+ | 1568.03 грн |
LPC2292FET144/01,5 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 256KB 144TFBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 114 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2070.3 грн |
10+ | 1598.93 грн |
LPC2294HBD144/01,5 |
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 112
DigiKey Programmable: Not Verified
товар відсутній
OM4068H/2,518 |
Виробник: NXP USA Inc.
Description: IC DRVR 32 SEGMENT 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: Serial
Configuration: 32 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Supplier Device Package: 44-PQFP (10x10)
Current - Supply: 12 µA
Description: IC DRVR 32 SEGMENT 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: Serial
Configuration: 32 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.5V ~ 5.5V
Supplier Device Package: 44-PQFP (10x10)
Current - Supply: 12 µA
товар відсутній
OM6274,598 |
Виробник: NXP USA Inc.
Description: DEMO BOARD I2C TO SPI SC18IS602
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS602, SC18IS603
Supplied Contents: Board(s), Accessories
Embedded: No
Part Status: Obsolete
Description: DEMO BOARD I2C TO SPI SC18IS602
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS602, SC18IS603
Supplied Contents: Board(s), Accessories
Embedded: No
Part Status: Obsolete
товар відсутній
OM6276,598 |
Виробник: NXP USA Inc.
Description: DEMO BOARD PWM LED
Packaging: Bulk
Function: RGB LED Controller
Type: Opto/Lighting
Utilized IC / Part: PCA9633
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEMO BOARD PWM LED
Packaging: Bulk
Function: RGB LED Controller
Type: Opto/Lighting
Utilized IC / Part: PCA9633
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
P87C51X2FA,512 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
товар відсутній
P89LPC9107FN,112 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-DIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-DIP
Number of I/O: 12
DigiKey Programmable: Not Verified
товар відсутній
P89LPC916FDH,118 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Verified
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Verified
товар відсутній
P89LPC920FN,112 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
товар відсутній
P89LPC924FDH,518 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Verified
товар відсутній
P89LPC936FA,529 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Part Status: Obsolete
Number of I/O: 26
Description: IC MCU 8BIT 16KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Part Status: Obsolete
Number of I/O: 26
товар відсутній
P89LPC936FDH,518 |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
товар відсутній
PBLS2001S,115 |
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 2.2kOhms
Resistor - Emitter Base (R2): 2.2kOhms
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 2.2kOhms
Resistor - Emitter Base (R2): 2.2kOhms
Supplier Device Package: 8-SO
Part Status: Obsolete
товар відсутній
PBLS2002S,115 |
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 4.7kOhms
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 4.7kOhms
Supplier Device Package: 8-SO
Part Status: Obsolete
товар відсутній
PBLS2003S,115 |
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: TRANS NPN PREBIAS/PNP 1.5W 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: 8-SO
Part Status: Obsolete
товар відсутній