Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35282) > Сторінка 534 з 589
Фото | Назва | Виробник | Інформація |
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NX3P190UK,012 | NXP USA Inc. |
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на замовлення 610218 шт: термін постачання 21-31 дні (днів) |
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NX3P191UK,012 | NXP USA Inc. |
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на замовлення 5492 шт: термін постачання 21-31 дні (днів) |
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LPC55S36-EVK | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M33 Utilized IC / Part: LPC55S36 Platform: LPCXpresso™ |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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LPC5502JHI48J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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LPC5502JHI48EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 7x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 30 |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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MCZ33905CS3EK | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
на замовлення 205 шт: термін постачання 21-31 дні (днів) |
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KMI25/2Z | NXP USA Inc. |
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на замовлення 2489 шт: термін постачання 21-31 дні (днів) |
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KMI23/4Z | NXP USA Inc. |
Description: HIGH PERFORMANCE ROTATIONAL SPEE Packaging: Bulk |
на замовлення 11156 шт: термін постачання 21-31 дні (днів) |
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MC908GT16CBE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 42-SDIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 42-PDIP Number of I/O: 36 DigiKey Programmable: Not Verified |
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MC908GT8CBE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 42-SDIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 42-PDIP Number of I/O: 34 DigiKey Programmable: Not Verified |
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FS32K148HET0MLQR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: I²S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
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MCIMX8DXL-WEVK | NXP USA Inc. |
Description: MCIMX8DXL-WEVK Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-A35, Cortex®-M4F Utilized IC / Part: i.MX 8XLite |
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S9S08AW32E5MFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
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FXLS93433AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
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FXLS93333AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
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FXLS90433AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
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FXLS90733AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I²C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
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FXLS90333AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
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MC07XS6517DEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP Packaging: Tape & Reel (TR) Features: Internal PWM Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 7mOhm, 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 2:3 Supplier Device Package: 54-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
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MC07XS6517DEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP Packaging: Tube Features: Internal PWM Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 7mOhm, 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 2:3 Supplier Device Package: 54-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
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AFT26HW050SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4S4 Mounting Type: Chassis Mount Frequency: 2.69GHz Configuration: Dual Power - Output: 9W Gain: 14.2dB Technology: LDMOS Supplier Device Package: NI-780-4S4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 100 mA |
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74HC2G02GD,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 8-XSON (2x3) Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 20 µA |
на замовлення 53574 шт: термін постачання 21-31 дні (днів) |
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MCIMX6S4AVM08ADR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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OL2385AHN/001A2Y | NXP USA Inc. |
Description: OL2385AHN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -123dBm Mounting Type: Surface Mount Frequency: 158MHz ~ 960MHz Memory Size: 7kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Protocol: Sigfox, Wireless M-Bus, Zigbee® Current - Receiving: 600nA ~ 11mA Data Rate (Max): 400kbps Current - Transmitting: 500µA ~ 33mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK RF Family/Standard: 802.15.4 Serial Interfaces: GPIO, SPI, UART, USART |
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PCA9634PW,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 8 Frequency: 25MHz Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 20-TSSOP Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
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BZB84-B62,215 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 62 V Impedance (Max) (Zzt): 215 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V |
на замовлення 35900 шт: термін постачання 21-31 дні (днів) |
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BZB84-C20,215 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 55 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 14 V |
на замовлення 29870 шт: термін постачання 21-31 дні (днів) |
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BZB84-B39,215 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 39 V Impedance (Max) (Zzt): 130 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V |
на замовлення 22609 шт: термін постачання 21-31 дні (днів) |
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BZB84-B56,215 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 56 V Impedance (Max) (Zzt): 200 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V |
на замовлення 18942 шт: термін постачання 21-31 дні (днів) |
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BZB84-B43,215 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 43 V Impedance (Max) (Zzt): 150 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 30.1 V |
на замовлення 12810 шт: термін постачання 21-31 дні (днів) |
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SSL5251T/1118 | NXP USA Inc. |
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на замовлення 6754 шт: термін постачання 21-31 дні (днів) |
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SSL5237TE/1518 | NXP USA Inc. |
Description: 10 OHM/700 VOLT MAINS DIMMABLE B Packaging: Bulk |
на замовлення 2429 шт: термін постачання 21-31 дні (днів) |
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MC33PT2001HAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
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MC33PT2001HMAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
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MC33PT2001AER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
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MC33PT2001HAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
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MC33PT2001HMAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0V ~ 72V Applications: Solenoid Controller Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
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IP4365CX11/P135 | NXP USA Inc. |
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на замовлення 122437 шт: термін постачання 21-31 дні (днів) |
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MF4SAM3HN/9BA6AUZ | NXP USA Inc. |
Description: MF4SAM3HN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 850kHz ~ 11.5MHz Interface: I2C, UART Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: 32-HVQFN (5x5) |
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MF4SAM3HN/9BA6AUZ | NXP USA Inc. |
Description: MF4SAM3HN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 850kHz ~ 11.5MHz Interface: I2C, UART Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V Standards: Mifare, ISO 14443, ISO 7816-4 Supplier Device Package: 32-HVQFN (5x5) |
на замовлення 4932 шт: термін постачання 21-31 дні (днів) |
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TEA19363T/1J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 25.5kHz ~ 128kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 0V ~ 120V Supplier Device Package: 10-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V |
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TEA19363T/1J | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 25.5kHz ~ 128kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 0V ~ 120V Supplier Device Package: 10-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V |
на замовлення 2499 шт: термін постачання 21-31 дні (днів) |
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74HCU04DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 1 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.4V ~ 3.4V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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TDA8034HN/C2J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Supplier Device Package: 24-HVQFN (4x4) |
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TDA8034HN/C2EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Supplier Device Package: 24-HVQFN (4x4) |
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TDA8034HN/C2QL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Supplier Device Package: 24-HVQFN (4x4) |
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TDA8026ET/C3K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I²C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) |
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TDA8026ET/C3Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I²C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) |
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TDA8026ET/C3E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I²C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) |
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LPC3131FET180,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 192K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) DigiKey Programmable: Not Verified |
на замовлення 189 шт: термін постачання 21-31 дні (днів) |
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IP4285CZ9-TBB,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 9-XFDFN Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: HDMI Current - Peak Pulse (10/1000µs): 4A (8/20µs) Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: DFN2110-9 Unidirectional Channels: 4 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 3.9V (Typ) Power Line Protection: Yes |
на замовлення 346487 шт: термін постачання 21-31 дні (днів) |
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74ALVC32PW,112 | NXP USA Inc. |
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на замовлення 4800 шт: термін постачання 21-31 дні (днів) |
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PCA9421BSZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Applications: Microcontroller, MCU Current - Supply: 5.5µA Supplier Device Package: 24-HVQFN (3x3) |
на замовлення 1400 шт: термін постачання 21-31 дні (днів) |
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PCA9421BSZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Applications: Microcontroller, MCU Current - Supply: 5.5µA Supplier Device Package: 24-HVQFN (3x3) |
на замовлення 1400 шт: термін постачання 21-31 дні (днів) |
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SAF7772EL/200Z13AY | NXP USA Inc. |
Description: SAF7772EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товар відсутній |
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SAF7771EL/200Z13AY | NXP USA Inc. |
Description: SAF7771EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товар відсутній |
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SAF7772EL/200Z13AK | NXP USA Inc. |
Description: SAF7772EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товар відсутній |
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SAF7771EL/200Z13AK | NXP USA Inc. |
Description: SAF7771EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товар відсутній |
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SAF7770EL/200Z13AY | NXP USA Inc. |
Description: SAF7770EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товар відсутній |
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SAF7770EL/101Z13AY | NXP USA Inc. |
Description: SAF7770EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
товар відсутній |
NX3P190UK,012 |
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на замовлення 610218 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1402+ | 14.74 грн |
NX3P191UK,012 |
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на замовлення 5492 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1332+ | 16.15 грн |
LPC55S36-EVK |
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Виробник: NXP USA Inc.
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5239.24 грн |
LPC5502JHI48J |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2000+ | 166.52 грн |
LPC5502JHI48EL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 232.65 грн |
10+ | 203.54 грн |
25+ | 199.14 грн |
40+ | 185.87 грн |
80+ | 166.66 грн |
230+ | 166.05 грн |
440+ | 157.36 грн |
1300+ | 149.61 грн |
MCZ33905CS3EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
на замовлення 205 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 784.63 грн |
10+ | 682.94 грн |
25+ | 651.17 грн |
100+ | 530.62 грн |
KMI25/2Z |
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на замовлення 2489 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
179+ | 116.45 грн |
KMI23/4Z |
на замовлення 11156 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
177+ | 117.84 грн |
MC908GT16CBE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
товар відсутній
MC908GT8CBE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
товар відсутній
FS32K148HET0MLQR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
товар відсутній
MCIMX8DXL-WEVK |
Виробник: NXP USA Inc.
Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
товар відсутній
S9S08AW32E5MFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
FXLS93433AESR2 |
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Виробник: NXP USA Inc.
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
товар відсутній
FXLS93333AESR2 |
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Виробник: NXP USA Inc.
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
товар відсутній
FXLS90433AESR2 |
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Виробник: NXP USA Inc.
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
товар відсутній
FXLS90733AESR2 |
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Виробник: NXP USA Inc.
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I²C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I²C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
товар відсутній
FXLS90333AESR2 |
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Виробник: NXP USA Inc.
Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
товар відсутній
MC07XS6517DEKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
товар відсутній
MC07XS6517DEK |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
товар відсутній
AFT26HW050SR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
товар відсутній
74HC2G02GD,125 |
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Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
на замовлення 53574 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2049+ | 10.4 грн |
MCIMX6S4AVM08ADR |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товар відсутній
OL2385AHN/001A2Y |
Виробник: NXP USA Inc.
Description: OL2385AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Description: OL2385AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
товар відсутній
PCA9634PW,112 |
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Виробник: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
товар відсутній
BZB84-B62,215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B62 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Description: NOW NEXPERIA BZB84-B62 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
на замовлення 35900 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10303+ | 2.08 грн |
BZB84-C20,215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C20 - ZENER D
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
Description: NOW NEXPERIA BZB84-C20 - ZENER D
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
на замовлення 29870 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
11632+ | 2.08 грн |
BZB84-B39,215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B39 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Description: NOW NEXPERIA BZB84-B39 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 39 V
Impedance (Max) (Zzt): 130 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
на замовлення 22609 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10303+ | 2.08 грн |
BZB84-B56,215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B56 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Description: NOW NEXPERIA BZB84-B56 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
на замовлення 18942 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10303+ | 2.08 грн |
BZB84-B43,215 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B43 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 43 V
Impedance (Max) (Zzt): 150 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 30.1 V
Description: NOW NEXPERIA BZB84-B43 - ZENER D
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 43 V
Impedance (Max) (Zzt): 150 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 30.1 V
на замовлення 12810 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
12810+ | 2.08 грн |
SSL5251T/1118 |
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на замовлення 6754 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
683+ | 30.5 грн |
SSL5237TE/1518 |
на замовлення 2429 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
579+ | 36.04 грн |
MC33PT2001HAER2 |
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Виробник: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33PT2001HMAER2 |
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Виробник: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33PT2001AER2 |
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Виробник: NXP USA Inc.
Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33PT2001HAE |
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Виробник: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33PT2001HMAE |
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Виробник: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
IP4365CX11/P135 |
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на замовлення 122437 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2219+ | 9.7 грн |
MF4SAM3HN/9BA6AUZ |
Виробник: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
товар відсутній
MF4SAM3HN/9BA6AUZ |
Виробник: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
на замовлення 4932 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 789.95 грн |
10+ | 704.47 грн |
25+ | 688.48 грн |
50+ | 642.66 грн |
100+ | 565.73 грн |
250+ | 537.66 грн |
500+ | 523.55 грн |
1000+ | 506.14 грн |
TEA19363T/1J |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
товар відсутній
TEA19363T/1J |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
на замовлення 2499 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 109.48 грн |
10+ | 94.37 грн |
25+ | 89.56 грн |
100+ | 69.02 грн |
250+ | 64.52 грн |
500+ | 57.02 грн |
1000+ | 44.28 грн |
74HCU04DB,118 |
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Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.4V ~ 3.4V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC INVERTER 6CH 1-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.4V ~ 3.4V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2001+ | 10.64 грн |
TDA8034HN/C2J |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
товар відсутній
TDA8034HN/C2EL |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
товар відсутній
TDA8034HN/C2QL |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
товар відсутній
TDA8026ET/C3K |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I²C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I²C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
товар відсутній
TDA8026ET/C3Y |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I²C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I²C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
товар відсутній
TDA8026ET/C3E |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I²C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I²C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
товар відсутній
LPC3131FET180,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
на замовлення 189 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
189+ | 767.44 грн |
IP4285CZ9-TBB,115 |
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Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM 3.9VC DFN2110-9
Packaging: Bulk
Package / Case: 9-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Current - Peak Pulse (10/1000µs): 4A (8/20µs)
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: DFN2110-9
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 3.9V (Typ)
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 3.9VC DFN2110-9
Packaging: Bulk
Package / Case: 9-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Current - Peak Pulse (10/1000µs): 4A (8/20µs)
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: DFN2110-9
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 3.9V (Typ)
Power Line Protection: Yes
на замовлення 346487 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1902+ | 11.13 грн |
74ALVC32PW,112 |
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на замовлення 4800 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2664+ | 7.63 грн |
PCA9421BSZ |
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Виробник: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
на замовлення 1400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1400+ | 109.5 грн |
PCA9421BSZ |
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Виробник: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
на замовлення 1400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 206.8 грн |
10+ | 179.23 грн |
25+ | 169.48 грн |
100+ | 137.83 грн |
250+ | 130.76 грн |
500+ | 117.33 грн |
SAF7772EL/200Z13AY |
Виробник: NXP USA Inc.
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
SAF7771EL/200Z13AY |
Виробник: NXP USA Inc.
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
SAF7772EL/200Z13AK |
Виробник: NXP USA Inc.
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
SAF7771EL/200Z13AK |
Виробник: NXP USA Inc.
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
SAF7770EL/200Z13AY |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
SAF7770EL/101Z13AY |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній