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SPC5743PFK1AMLQ9 SPC5743PFK1AMLQ9 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
SPC5745BBK1AMMH2 SPC5745BBK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
товар відсутній
FRDM-17510EVB NXP USA Inc. KTFRDM17510EVBUG.pdf Description: FRDM-17510EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17510
Supplied Contents: Board(s)
товар відсутній
FRDM-17531AEPEVB NXP USA Inc. Description: FRDM-17531AEPE
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
товар відсутній
MKW20Z160VHT4 MKW20Z160VHT4 NXP USA Inc. MKW40Z160.pdf Description: IC RF TXRX+MCU 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
товар відсутній
88W8997-A1-CBQE/AZ 88W8997-A1-CBQE/AZ NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: 2X2 WAVE2 WIFI + BT
Packaging: Cut Tape (CT)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1+1055.3 грн
10+ 940.36 грн
25+ 927.6 грн
50+ 859.57 грн
100+ 753.3 грн
250+ 721 грн
500+ 704.57 грн
88W8777-A0-CBK/BZ NXP USA Inc. Description: 11N 1X1 + BT 4.1 LE + FMRX + SDI
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz
Type: TxRx Only
Protocol: 802.11b/g/n, Bluetooth v4.0
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, SDIO, UART
товар відсутній
88W8977-A1-EADE/AZ NXP USA Inc. 88W8977_SDS.pdf?pspll=1 Description: 1X1 11N DUAL BAND + BT IN T&R (E
Packaging: Tape & Reel (TR)
Package / Case: 74-WFBGA, WLBGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 74-eWLP (3.46x4.68)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8787-A1-BKBE/CZ NXP USA Inc. Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
товар відсутній
88W8787-A16CBJ/AZ NXP USA Inc. Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
товар відсутній
88W8787-A16CBJ/BZ NXP USA Inc. Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
товар відсутній
88W8787-A1-BKBE/AZ NXP USA Inc. Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
товар відсутній
88W8977-A1-NMVE/AZ NXP USA Inc. 88W8977_SDS.pdf?pspll=1 Description: 1X1 11N DUAL BAND + BT IN T&R (E
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-EAHE/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE
Packaging: Tape & Reel (TR)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-NYEE/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: IC RF TXRX BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8787-A1-BRDA/AZ NXP USA Inc. Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
товар відсутній
88W8987-A2-NYEE/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-NYEA/BZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
товар відсутній
88W8987-A2-NYEI/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A1-NYEI/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-NYEI/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
MCF51JE128CLK MCF51JE128CLK NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
товар відсутній
74LVT245DB,112 74LVT245DB,112 NXP USA Inc. 74LVT245.pdf Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
на замовлення 6255 шт:
термін постачання 21-31 дні (днів)
885+24.2 грн
Мінімальне замовлення: 885
MC9S12E32VFUE16R MC9S12E32VFUE16R NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
товар відсутній
74HCT4852BQ,115 74HCT4852BQ,115 NXP USA Inc. PHGLS15782-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74HCT4852BQ - DIFFE
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 210Ohm
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 2Ohm
Switch Time (Ton, Toff) (Max): 25ns, 80ns
Channel Capacitance (CS(off), CD(off)): 10pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 2
на замовлення 3092 шт:
термін постачання 21-31 дні (днів)
1104+19.22 грн
Мінімальне замовлення: 1104
HVP-KE18F HVP-KE18F NXP USA Inc. KE1XF512PB.pdf Description: EVAL BOARD FOR KE1XF
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: KE1xF
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+7641.8 грн
74HC366N,652 74HC366N,652 NXP USA Inc. 74HC_HCT366.pdf Description: IC BUFFER INVERT 6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 6
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-DIP
на замовлення 1055 шт:
термін постачання 21-31 дні (днів)
620+33.57 грн
Мінімальне замовлення: 620
MC9S08GT60ACFBER MC9S08GT60ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
товар відсутній
MC9S08GT60ACFBER MC9S08GT60ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
товар відсутній
74HC670N,652 74HC670N,652 NXP USA Inc. 74HC%28T%29670.pdf Description: IC 4X4 REGISTER FILE 3ST 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
на замовлення 1916 шт:
термін постачання 21-31 дні (днів)
270+78.7 грн
Мінімальне замовлення: 270
74HCT670N,652 74HCT670N,652 NXP USA Inc. 74HC%28T%29670.pdf Description: IC 4X4 REGISTER FILE 3ST 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
на замовлення 1026 шт:
термін постачання 21-31 дні (днів)
270+78.7 грн
Мінімальне замовлення: 270
PMDPB70EN,115 PMDPB70EN,115 NXP USA Inc. PHGLS24505-1.pdf?t.download=true&u=5oefqw Description: MOSFET 2N-CH 30V 3.5A 6HUSON
Packaging: Bulk
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.5A
Input Capacitance (Ciss) (Max) @ Vds: 130pF @ 15V
Rds On (Max) @ Id, Vgs: 57mOhm @ 3.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 4.5nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
на замовлення 39355 шт:
термін постачання 21-31 дні (днів)
1480+13.9 грн
Мінімальне замовлення: 1480
PMXB65ENE,147 PMXB65ENE,147 NXP USA Inc. PMXB65ENE.pdf Description: NOW NEXPERIA PMXB65ENE - SMALL S
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 67mOhm @ 3.2A, 10V
Power Dissipation (Max): 400mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 295 pF @ 15 V
на замовлення 2082 шт:
термін постачання 21-31 дні (днів)
1402+14.89 грн
Мінімальне замовлення: 1402
PSMN2R9-30MLC,115 PSMN2R9-30MLC,115 NXP USA Inc. PSMN2R9-30MLC.pdf Description: 30 V, 2.95 MILLI OHM LOGIC LEVEL
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 25A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 36.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2419 pF @ 15 V
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
960+21.54 грн
Мінімальне замовлення: 960
74LVC2G125GD,125 74LVC2G125GD,125 NXP USA Inc. PHGLS27070-1.pdf?t.download=true&u=5oefqw Description: IC BUS BUFF DVR TRI-ST DL 8XSON
Packaging: Bulk
на замовлення 513100 шт:
термін постачання 21-31 дні (днів)
2049+10.42 грн
Мінімальне замовлення: 2049
74HCT02PW,112 74HCT02PW,112 NXP USA Inc. 74HC_HCT02.pdf Description: IC GATE NOR 4CH 2-INP 14-TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
на замовлення 26684 шт:
термін постачання 21-31 дні (днів)
2518+8.39 грн
Мінімальне замовлення: 2518
BCX71H,235 BCX71H,235 NXP USA Inc. PHGLS19403-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BCX71H - SMALL SIGN
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 550mV @ 1.25mA, 50mA
Current - Collector Cutoff (Max): 20nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-23
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
на замовлення 80000 шт:
термін постачання 21-31 дні (днів)
13172+1.4 грн
Мінімальне замовлення: 13172
MC68302AG16VC MC68302AG16VC NXP USA Inc. M68302FADS.pdf Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
товар відсутній
PCA9554PW/DG,118 PCA9554PW/DG,118 NXP USA Inc. PCA9554%28A%29.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 860 шт:
термін постачання 21-31 дні (днів)
370+57.43 грн
Мінімальне замовлення: 370
74HCT4053PW,112 74HCT4053PW,112 NXP USA Inc. NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX TRIPLE 2X1 16TSSOP
Packaging: Bulk
на замовлення 22687 шт:
термін постачання 21-31 дні (днів)
1723+12.1 грн
Мінімальне замовлення: 1723
PCA9451AHNY NXP USA Inc. PCA9451.pdf Description: PMIC SUPPORTING I.MX 93
Packaging: Tape & Reel (TR)
на замовлення 1690 шт:
термін постачання 21-31 дні (днів)
PCA9451AHNY NXP USA Inc. PCA9451.pdf Description: PMIC SUPPORTING I.MX 93
Packaging: Cut Tape (CT)
на замовлення 1690 шт:
термін постачання 21-31 дні (днів)
1+324.65 грн
10+ 283.85 грн
25+ 277.69 грн
50+ 259.17 грн
100+ 232.38 грн
250+ 231.53 грн
500+ 219.42 грн
1000+ 208.6 грн
MMRF1050HR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 850MHz ~ 950MHz
Configuration: 2 N-Channel
Power - Output: 1050W
Gain: 21.3dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
LPC1225FBD48/321,1 LPC1225FBD48/321,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 80KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
1+534.49 грн
10+ 402.24 грн
80+ 329.56 грн
500+ 302.77 грн
1000+ 255.35 грн
2500+ 242.58 грн
PDTC114YE,135 PDTC114YE,135 NXP USA Inc. PHGLS24123-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)
13172+1.42 грн
Мінімальне замовлення: 13172
PDTC114EK,115 PDTC114EK,115 NXP USA Inc. PDTC114E_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
товар відсутній
PDTC114EK,115 PDTC114EK,115 NXP USA Inc. PDTC114E_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SMT3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
на замовлення 273000 шт:
термін постачання 21-31 дні (днів)
8876+2.1 грн
Мінімальне замовлення: 8876
MMRF1317HR5 MMRF1317HR5 NXP USA Inc. MMRF1317H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1300W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
MPXHZ6400AC6T1 MPXHZ6400AC6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 0.13" 4.8V SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 232.06PSI (1600kPa)
на замовлення 600 шт:
термін постачання 21-31 дні (днів)
300+804.29 грн
600+ 748.68 грн
Мінімальне замовлення: 300
MPXHZ6400AC6T1 MPXHZ6400AC6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 0.13" 4.8V SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 232.06PSI (1600kPa)
на замовлення 883 шт:
термін постачання 21-31 дні (днів)
1+1287.19 грн
10+ 981.07 грн
25+ 929.38 грн
100+ 751.07 грн
BUK7514-55A,127 BUK7514-55A,127 NXP USA Inc. BUK7514-55A.pdf Description: MOSFET N-CH 55V 73A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
на замовлення 7599 шт:
термін постачання 21-31 дні (днів)
523+39.61 грн
Мінімальне замовлення: 523
MCIMX31LDVKN5D MCIMX31LDVKN5D NXP USA Inc. FSCLS05432-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX31 532MHZ 457LFBGA
Packaging: Bulk
Package / Case: 457-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 457-LFBGA (14x14)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
на замовлення 2133 шт:
термін постачання 21-31 дні (днів)
11+2071.13 грн
Мінімальне замовлення: 11
MCIMX351AVM4B MCIMX351AVM4B NXP USA Inc. FSCLS07025-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX35 400MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
14+1524.84 грн
Мінімальне замовлення: 14
MCIMX353CVM5B MCIMX353CVM5B NXP USA Inc. PHGL-S-A0001741977-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
14+1521.36 грн
Мінімальне замовлення: 14
MCIMX351AVM4B MCIMX351AVM4B NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
на замовлення 77 шт:
термін постачання 21-31 дні (днів)
14+1524.84 грн
Мінімальне замовлення: 14
88W8801-B0-NMDC/AK NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: 802.11 B/G/N 1X1 SINGLE-CHIP MAC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
товар відсутній
88W8801-B0-NMDE/AK NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: 802.11 B/G/N 1X1 SINGLE-CHIP MAC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
товар відсутній
88W8801-B0-NMDE/AZ NXP USA Inc. 88W8801_SDS.pdf?pspll=1 Description: 802.11 B/G/N 1X1 SINGLE-CHIP MAC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
товар відсутній
88MW320-A0-NAPC/AK NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
товар відсутній
88MW320-A0-NAPC/AZ NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
товар відсутній
SPC5743PFK1AMLQ9 MPC574xPFS.pdf
SPC5743PFK1AMLQ9
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
SPC5745BBK1AMMH2 MPC5746C.pdf
SPC5745BBK1AMMH2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
товар відсутній
FRDM-17510EVB KTFRDM17510EVBUG.pdf
Виробник: NXP USA Inc.
Description: FRDM-17510EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17510
Supplied Contents: Board(s)
товар відсутній
FRDM-17531AEPEVB
Виробник: NXP USA Inc.
Description: FRDM-17531AEPE
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
товар відсутній
MKW20Z160VHT4 MKW40Z160.pdf
MKW20Z160VHT4
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48VFQFN
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
товар відсутній
88W8997-A1-CBQE/AZ 88W8997-FACT-SHEET.pdf
88W8997-A1-CBQE/AZ
Виробник: NXP USA Inc.
Description: 2X2 WAVE2 WIFI + BT
Packaging: Cut Tape (CT)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1055.3 грн
10+ 940.36 грн
25+ 927.6 грн
50+ 859.57 грн
100+ 753.3 грн
250+ 721 грн
500+ 704.57 грн
88W8777-A0-CBK/BZ
Виробник: NXP USA Inc.
Description: 11N 1X1 + BT 4.1 LE + FMRX + SDI
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz
Type: TxRx Only
Protocol: 802.11b/g/n, Bluetooth v4.0
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, SDIO, UART
товар відсутній
88W8977-A1-EADE/AZ 88W8977_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11N DUAL BAND + BT IN T&R (E
Packaging: Tape & Reel (TR)
Package / Case: 74-WFBGA, WLBGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 74-eWLP (3.46x4.68)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8787-A1-BKBE/CZ
Виробник: NXP USA Inc.
Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
товар відсутній
88W8787-A16CBJ/AZ
Виробник: NXP USA Inc.
Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
товар відсутній
88W8787-A16CBJ/BZ
Виробник: NXP USA Inc.
Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
товар відсутній
88W8787-A1-BKBE/AZ
Виробник: NXP USA Inc.
Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
товар відсутній
88W8977-A1-NMVE/AZ 88W8977_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11N DUAL BAND + BT IN T&R (E
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-EAHE/AZ 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE
Packaging: Tape & Reel (TR)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-NYEE/AZ 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8787-A1-BRDA/AZ
Виробник: NXP USA Inc.
Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
товар відсутній
88W8987-A2-NYEE/AK 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-NYEA/BZ 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
товар відсутній
88W8987-A2-NYEI/AK 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A1-NYEI/AZ 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
88W8987-A2-NYEI/AZ 88W8987_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
товар відсутній
MCF51JE128CLK MCF51JE256.pdf
MCF51JE128CLK
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
товар відсутній
74LVT245DB,112 74LVT245.pdf
74LVT245DB,112
Виробник: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
на замовлення 6255 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
885+24.2 грн
Мінімальне замовлення: 885
MC9S12E32VFUE16R MC9S12E128V1.pdf
MC9S12E32VFUE16R
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
товар відсутній
74HCT4852BQ,115 PHGLS15782-1.pdf?t.download=true&u=5oefqw
74HCT4852BQ,115
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4852BQ - DIFFE
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 210Ohm
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 2Ohm
Switch Time (Ton, Toff) (Max): 25ns, 80ns
Channel Capacitance (CS(off), CD(off)): 10pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 2
на замовлення 3092 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1104+19.22 грн
Мінімальне замовлення: 1104
HVP-KE18F KE1XF512PB.pdf
HVP-KE18F
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR KE1XF
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: KE1xF
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+7641.8 грн
74HC366N,652 74HC_HCT366.pdf
74HC366N,652
Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 6
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-DIP
на замовлення 1055 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
620+33.57 грн
Мінімальне замовлення: 620
MC9S08GT60ACFBER MC9S08GB60A.pdf
MC9S08GT60ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
товар відсутній
MC9S08GT60ACFBER MC9S08GB60A.pdf
MC9S08GT60ACFBER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
товар відсутній
74HC670N,652 74HC%28T%29670.pdf
74HC670N,652
Виробник: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
на замовлення 1916 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
270+78.7 грн
Мінімальне замовлення: 270
74HCT670N,652 74HC%28T%29670.pdf
74HCT670N,652
Виробник: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
на замовлення 1026 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
270+78.7 грн
Мінімальне замовлення: 270
PMDPB70EN,115 PHGLS24505-1.pdf?t.download=true&u=5oefqw
PMDPB70EN,115
Виробник: NXP USA Inc.
Description: MOSFET 2N-CH 30V 3.5A 6HUSON
Packaging: Bulk
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.5A
Input Capacitance (Ciss) (Max) @ Vds: 130pF @ 15V
Rds On (Max) @ Id, Vgs: 57mOhm @ 3.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 4.5nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
на замовлення 39355 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1480+13.9 грн
Мінімальне замовлення: 1480
PMXB65ENE,147 PMXB65ENE.pdf
PMXB65ENE,147
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PMXB65ENE - SMALL S
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 67mOhm @ 3.2A, 10V
Power Dissipation (Max): 400mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 295 pF @ 15 V
на замовлення 2082 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1402+14.89 грн
Мінімальне замовлення: 1402
PSMN2R9-30MLC,115 PSMN2R9-30MLC.pdf
PSMN2R9-30MLC,115
Виробник: NXP USA Inc.
Description: 30 V, 2.95 MILLI OHM LOGIC LEVEL
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 25A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 36.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2419 pF @ 15 V
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
960+21.54 грн
Мінімальне замовлення: 960
74LVC2G125GD,125 PHGLS27070-1.pdf?t.download=true&u=5oefqw
74LVC2G125GD,125
Виробник: NXP USA Inc.
Description: IC BUS BUFF DVR TRI-ST DL 8XSON
Packaging: Bulk
на замовлення 513100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2049+10.42 грн
Мінімальне замовлення: 2049
74HCT02PW,112 74HC_HCT02.pdf
74HCT02PW,112
Виробник: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14-TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
на замовлення 26684 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2518+8.39 грн
Мінімальне замовлення: 2518
BCX71H,235 PHGLS19403-1.pdf?t.download=true&u=5oefqw
BCX71H,235
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BCX71H - SMALL SIGN
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 550mV @ 1.25mA, 50mA
Current - Collector Cutoff (Max): 20nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-23
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
на замовлення 80000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
13172+1.4 грн
Мінімальне замовлення: 13172
MC68302AG16VC M68302FADS.pdf
MC68302AG16VC
Виробник: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
товар відсутній
PCA9554PW/DG,118 PCA9554%28A%29.pdf
PCA9554PW/DG,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 860 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
370+57.43 грн
Мінімальне замовлення: 370
74HCT4053PW,112 NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw
74HCT4053PW,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16TSSOP
Packaging: Bulk
на замовлення 22687 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1723+12.1 грн
Мінімальне замовлення: 1723
PCA9451AHNY PCA9451.pdf
Виробник: NXP USA Inc.
Description: PMIC SUPPORTING I.MX 93
Packaging: Tape & Reel (TR)
на замовлення 1690 шт:
термін постачання 21-31 дні (днів)
PCA9451AHNY PCA9451.pdf
Виробник: NXP USA Inc.
Description: PMIC SUPPORTING I.MX 93
Packaging: Cut Tape (CT)
на замовлення 1690 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+324.65 грн
10+ 283.85 грн
25+ 277.69 грн
50+ 259.17 грн
100+ 232.38 грн
250+ 231.53 грн
500+ 219.42 грн
1000+ 208.6 грн
MMRF1050HR6
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 850MHz ~ 950MHz
Configuration: 2 N-Channel
Power - Output: 1050W
Gain: 21.3dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
LPC1225FBD48/321,1 LPC122X.pdf
LPC1225FBD48/321,1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+534.49 грн
10+ 402.24 грн
80+ 329.56 грн
500+ 302.77 грн
1000+ 255.35 грн
2500+ 242.58 грн
PDTC114YE,135 PHGLS24123-1.pdf?t.download=true&u=5oefqw
PDTC114YE,135
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
13172+1.42 грн
Мінімальне замовлення: 13172
PDTC114EK,115 PDTC114E_SER.pdf
PDTC114EK,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
товар відсутній
PDTC114EK,115 PDTC114E_SER.pdf
PDTC114EK,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SMT3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
на замовлення 273000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
8876+2.1 грн
Мінімальне замовлення: 8876
MMRF1317HR5 MMRF1317H.pdf
MMRF1317HR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1300W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
MPXHZ6400AC6T1 MPXH6400A.pdf
MPXHZ6400AC6T1
Виробник: NXP USA Inc.
Description: SENSOR 58.02PSIA 0.13" 4.8V SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 232.06PSI (1600kPa)
на замовлення 600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
300+804.29 грн
600+ 748.68 грн
Мінімальне замовлення: 300
MPXHZ6400AC6T1 MPXH6400A.pdf
MPXHZ6400AC6T1
Виробник: NXP USA Inc.
Description: SENSOR 58.02PSIA 0.13" 4.8V SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 232.06PSI (1600kPa)
на замовлення 883 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1287.19 грн
10+ 981.07 грн
25+ 929.38 грн
100+ 751.07 грн
BUK7514-55A,127 BUK7514-55A.pdf
BUK7514-55A,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 73A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
на замовлення 7599 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
523+39.61 грн
Мінімальне замовлення: 523
MCIMX31LDVKN5D FSCLS05432-1.pdf?t.download=true&u=5oefqw
MCIMX31LDVKN5D
Виробник: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457LFBGA
Packaging: Bulk
Package / Case: 457-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 457-LFBGA (14x14)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
на замовлення 2133 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
11+2071.13 грн
Мінімальне замовлення: 11
MCIMX351AVM4B FSCLS07025-1.pdf?t.download=true&u=5oefqw
MCIMX351AVM4B
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
14+1524.84 грн
Мінімальне замовлення: 14
MCIMX353CVM5B PHGL-S-A0001741977-1.pdf?t.download=true&u=5oefqw
MCIMX353CVM5B
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
14+1521.36 грн
Мінімальне замовлення: 14
MCIMX351AVM4B MCIMX35SR2AEC.pdf
MCIMX351AVM4B
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
на замовлення 77 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
14+1524.84 грн
Мінімальне замовлення: 14
88W8801-B0-NMDC/AK 88W8801_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 802.11 B/G/N 1X1 SINGLE-CHIP MAC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
товар відсутній
88W8801-B0-NMDE/AK 88W8801_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 802.11 B/G/N 1X1 SINGLE-CHIP MAC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
товар відсутній
88W8801-B0-NMDE/AZ 88W8801_SDS.pdf?pspll=1
Виробник: NXP USA Inc.
Description: 802.11 B/G/N 1X1 SINGLE-CHIP MAC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 26dBm
Protocol: 802.11n/g/b
Current - Receiving: 68mA ~ 82mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 285mA ~ 359mA
Supplier Device Package: 48-HVQFN (6x6)
Modulation: DSSS, OFDM
RF Family/Standard: WiFi
Serial Interfaces: GPIO, SDIO, UART, USB
товар відсутній
88MW320-A0-NAPC/AK 88MW320-88W322.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
товар відсутній
88MW320-A0-NAPC/AZ 88MW320-88W322.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
товар відсутній
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