Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35281) > Сторінка 541 з 589

Обрати Сторінку:   [  << Попередня Сторінка ]  1 58 116 174 232 290 348 406 464 522 536 537 538 539 540 541 542 543 544 545 546 580 589  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
FS32V232CKN2VUBR NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234BLN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CMN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234BJN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CKN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V232BMN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234BMN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CON2VUBR NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CKN2VUBR NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CTN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V232CTN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
MC68HC908QY4MDTE MC68HC908QY4MDTE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
товар відсутній
S9S12G128AVLH S9S12G128AVLH NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
1+616.61 грн
10+ 466.45 грн
160+ 386.18 грн
74HCT32DB,118 74HCT32DB,118 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14-SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
на замовлення 22000 шт:
термін постачання 21-31 дні (днів)
1972+10.63 грн
Мінімальне замовлення: 1972
JN5168/001,515 JN5168/001,515 NXP USA Inc. JN516X.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
1000+203.54 грн
2000+ 186.2 грн
Мінімальне замовлення: 1000
JN5168/001,515 JN5168/001,515 NXP USA Inc. JN516X.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
1+406.76 грн
10+ 350.04 грн
25+ 315 грн
100+ 269.34 грн
250+ 243.06 грн
500+ 218.1 грн
S9S08AW16AE0MFT S9S08AW16AE0MFT NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
товар відсутній
N74F126D,623 N74F126D,623 NXP USA Inc. 74F12%285%2C6%29.pdf Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
на замовлення 27498 шт:
термін постачання 21-31 дні (днів)
2664+7.72 грн
Мінімальне замовлення: 2664
N74F126D,602 N74F126D,602 NXP USA Inc. 74F12%285%2C6%29.pdf Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
на замовлення 8007 шт:
термін постачання 21-31 дні (днів)
2664+7.83 грн
Мінімальне замовлення: 2664
FRDM-MCXN947 FRDM-MCXN947 NXP USA Inc. FRDM-MCXN947-QSG.pdf Description: FRDM DEVELOPMENT BOARD FOR MCX
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
на замовлення 319 шт:
термін постачання 21-31 дні (днів)
1+1768.46 грн
74LV4094DB,112 74LV4094DB,112 NXP USA Inc. 74LV4094.pdf Description: IC 8ST SHIFT/STORE BUS 16-SSOP
Packaging: Tube
на замовлення 1436 шт:
термін постачання 21-31 дні (днів)
408+52.46 грн
Мінімальне замовлення: 408
74LV4094PW,118 74LV4094PW,118 NXP USA Inc. 74LV4094.pdf Description: IC 8BIT SHIFT/STORE BUS 16TSSOP
Packaging: Bulk
на замовлення 31425 шт:
термін постачання 21-31 дні (днів)
2388+9.13 грн
Мінімальне замовлення: 2388
74LV4094D112 74LV4094D112 NXP USA Inc. 74LV4094.pdf Description: NOW NEXPERIA 74LV4094D - SERIAL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
товар відсутній
74HCT365N,652 74HCT365N,652 NXP USA Inc. 74HC_HCT365.pdf Description: IC BUFFER NON-INVERT 5.5V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-DIP
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
523+39.87 грн
Мінімальне замовлення: 523
74HC365N,652 74HC365N,652 NXP USA Inc. 74HC%28T%29365_Rev3.pdf Description: IC BUFFER NON-INVERT 6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 6
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-DIP
на замовлення 11874 шт:
термін постачання 21-31 дні (днів)
523+40.41 грн
Мінімальне замовлення: 523
SPC5604PEF1MLL4 SPC5604PEF1MLL4 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
товар відсутній
DSPA56721AF NXP USA Inc. Description: IC MCU
Packaging: Bulk
товар відсутній
LPC1112LVFHN24/003 LPC1112LVFHN24/003 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
товар відсутній
TFF1012HN/N1,115 TFF1012HN/N1,115 NXP USA Inc. TFF1012HN.pdf Description: IC DOWNCONVERTER 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 5V
Gain: 30dB
Current - Supply: 52mA
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
товар відсутній
CBT3306GM,125 CBT3306GM,125 NXP USA Inc. PHGLS24512-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA CBT3306GM - BUS DRI
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-XQFN (1.6x1.6)
на замовлення 107517 шт:
термін постачання 21-31 дні (днів)
2714+7.83 грн
Мінімальне замовлення: 2714
NT4H2421TTDUD/02Z NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
NT4H2421TTDUF/02Z NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
NT4H2421TTDUD/02V NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
NT4H2421TTDUF/02V NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
MK22FN128CAH12R MK22FN128CAH12R NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.35x3.32)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
SPC5602DF1VLL4 SPC5602DF1VLL4 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товар відсутній
MC9S08QG8CFQE MC9S08QG8CFQE NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
товар відсутній
MKL05Z16VFM4 MKL05Z16VFM4 NXP USA Inc. KL05P48M48SF1.pdf Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
MC9S08GT16AMFCE MC9S08GT16AMFCE NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
товар відсутній
FS32K146HFT0MLHT FS32K146HFT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
1N4729A,113 1N4729A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 3.6V 1W DO41
Packaging: Bulk
на замовлення 115000 шт:
термін постачання 21-31 дні (днів)
9072+2.1 грн
Мінімальне замовлення: 9072
74LV04N,112 74LV04N,112 NXP USA Inc. 74LV04_Rev3.pdf Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
на замовлення 3848 шт:
термін постачання 21-31 дні (днів)
620+34.03 грн
Мінімальне замовлення: 620
74LVC1G384GXH 74LVC1G384GXH NXP USA Inc. 74LVC1G384.pdf Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 5-X2SON (0.80x0.80)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
на замовлення 833288 шт:
термін постачання 21-31 дні (днів)
3602+5.62 грн
Мінімальне замовлення: 3602
74AUP1G80GX,125 74AUP1G80GX,125 NXP USA Inc. PHGL-S-A0000296409-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 1.5 pF
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Number of Bits per Element: 1
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)
3831+5.56 грн
Мінімальне замовлення: 3831
PCA9554AD,112 PCA9554AD,112 NXP USA Inc. PCA9554%28A%29.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Packaging: Tube
Features: POR
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 5217 шт:
термін постачання 21-31 дні (днів)
404+52.68 грн
Мінімальне замовлення: 404
PMF780SN,115 PMF780SN,115 NXP USA Inc. PMF780SN.pdf Description: MOSFET N-CH 60V 570MA SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 570mA (Ta)
Rds On (Max) @ Id, Vgs: 920mOhm @ 300mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 1.05 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 23 pF @ 30 V
на замовлення 91124 шт:
термін постачання 21-31 дні (днів)
5323+4.17 грн
Мінімальне замовлення: 5323
MW7IC2425GNR1 NXP USA Inc. MW7IC2425.pdf Description: IC RF AMP ISM 2.45GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.45GHz
RF Type: ISM
Voltage - Supply: 28V
Gain: 27.7dB
Current - Supply: 195mA
Test Frequency: 2.45GHz
Supplier Device Package: TO-270 WBL-16 GULL
товар відсутній
MC9S08AC96MFGE MC9S08AC96MFGE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
товар відсутній
SPC5602BF2MLQ4R SPC5602BF2MLQ4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
товар відсутній
74AUP1G386GM,115 74AUP1G386GM,115 NXP USA Inc. 74AUP1G386.pdf Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 4900 шт:
термін постачання 21-31 дні (днів)
1800+11.89 грн
Мінімальне замовлення: 1800
74HCT194N,652 74HCT194N,652 NXP USA Inc. 74HC_T194.pdf Description: IC 4BIT BI UNIV SHIFT REG 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 4
на замовлення 6305 шт:
термін постачання 21-31 дні (днів)
523+39.87 грн
Мінімальне замовлення: 523
MC9S12D64MFUE MC9S12D64MFUE NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
LS1023ASN7KQB NXP USA Inc. Description: QORIQ, 2XCPU 64-BIT ARM ARCH, 1.
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
на замовлення 343 шт:
термін постачання 21-31 дні (днів)
5+4368.24 грн
Мінімальне замовлення: 5
BC857QASX BC857QASX NXP USA Inc. Description: TRANS PNP 45V 0.1A 6DFN
Packaging: Tape & Reel (TR)
товар відсутній
74AHCT2G126DC,125 74AHCT2G126DC,125 NXP USA Inc. 74AHC_AHCT2G126.pdf Description: IC BUFF DVR TRI-ST DL 8VSSOP
Packaging: Bulk
на замовлення 21883 шт:
термін постачання 21-31 дні (днів)
1948+10.53 грн
Мінімальне замовлення: 1948
74AHC2G126GD,125 74AHC2G126GD,125 NXP USA Inc. 74AHC_AHCT2G126.pdf Description: IC BUFFER/LINEDVR DUAL XSON8U
Packaging: Bulk
на замовлення 90914 шт:
термін постачання 21-31 дні (днів)
2049+10.53 грн
Мінімальне замовлення: 2049
74LVC2G00GD,125 74LVC2G00GD,125 NXP USA Inc. 74LVC2G00.pdf Description: IC GATE NAND 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
на замовлення 37590 шт:
термін постачання 21-31 дні (днів)
2049+10.53 грн
Мінімальне замовлення: 2049
FS32K144HAT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
товар відсутній
SPC5742PK1AMLQ9 SPC5742PK1AMLQ9 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
SPC5742PK1AMLQ9R SPC5742PK1AMLQ9R NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
FS32V232CKN2VUBR S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234BLN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CMN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234BJN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CKN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V232BMN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234BMN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CON2VUBR S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CKN2VUBR S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V234CTN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
FS32V232CTN2VUB S32V234.pdf
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
товар відсутній
MC68HC908QY4MDTE MC68HC908QY4.pdf
MC68HC908QY4MDTE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
товар відсутній
S9S12G128AVLH MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+616.61 грн
10+ 466.45 грн
160+ 386.18 грн
74HCT32DB,118 74HC_HCT32.pdf
74HCT32DB,118
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
на замовлення 22000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1972+10.63 грн
Мінімальне замовлення: 1972
JN5168/001,515 JN516X.pdf
JN5168/001,515
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1000+203.54 грн
2000+ 186.2 грн
Мінімальне замовлення: 1000
JN5168/001,515 JN516X.pdf
JN5168/001,515
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+406.76 грн
10+ 350.04 грн
25+ 315 грн
100+ 269.34 грн
250+ 243.06 грн
500+ 218.1 грн
S9S08AW16AE0MFT MC9S08AW60.pdf
S9S08AW16AE0MFT
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
товар відсутній
N74F126D,623 74F12%285%2C6%29.pdf
N74F126D,623
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
на замовлення 27498 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2664+7.72 грн
Мінімальне замовлення: 2664
N74F126D,602 74F12%285%2C6%29.pdf
N74F126D,602
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
на замовлення 8007 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2664+7.83 грн
Мінімальне замовлення: 2664
FRDM-MCXN947 FRDM-MCXN947-QSG.pdf
FRDM-MCXN947
Виробник: NXP USA Inc.
Description: FRDM DEVELOPMENT BOARD FOR MCX
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
на замовлення 319 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1768.46 грн
74LV4094DB,112 74LV4094.pdf
74LV4094DB,112
Виробник: NXP USA Inc.
Description: IC 8ST SHIFT/STORE BUS 16-SSOP
Packaging: Tube
на замовлення 1436 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
408+52.46 грн
Мінімальне замовлення: 408
74LV4094PW,118 74LV4094.pdf
74LV4094PW,118
Виробник: NXP USA Inc.
Description: IC 8BIT SHIFT/STORE BUS 16TSSOP
Packaging: Bulk
на замовлення 31425 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2388+9.13 грн
Мінімальне замовлення: 2388
74LV4094D112 74LV4094.pdf
74LV4094D112
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LV4094D - SERIAL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
товар відсутній
74HCT365N,652 74HC_HCT365.pdf
74HCT365N,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-DIP
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
523+39.87 грн
Мінімальне замовлення: 523
74HC365N,652 74HC%28T%29365_Rev3.pdf
74HC365N,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 6
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-DIP
на замовлення 11874 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
523+40.41 грн
Мінімальне замовлення: 523
SPC5604PEF1MLL4
SPC5604PEF1MLL4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
товар відсутній
DSPA56721AF
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
товар відсутній
LPC1112LVFHN24/003 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHN24/003
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
товар відсутній
TFF1012HN/N1,115 TFF1012HN.pdf
TFF1012HN/N1,115
Виробник: NXP USA Inc.
Description: IC DOWNCONVERTER 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 5V
Gain: 30dB
Current - Supply: 52mA
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
товар відсутній
CBT3306GM,125 PHGLS24512-1.pdf?t.download=true&u=5oefqw
CBT3306GM,125
Виробник: NXP USA Inc.
Description: NOW NEXPERIA CBT3306GM - BUS DRI
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 8-XQFN (1.6x1.6)
на замовлення 107517 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2714+7.83 грн
Мінімальне замовлення: 2714
NT4H2421TTDUD/02Z
Виробник: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
NT4H2421TTDUF/02Z
Виробник: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
NT4H2421TTDUD/02V
Виробник: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
NT4H2421TTDUF/02V
Виробник: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
товар відсутній
MK22FN128CAH12R
MK22FN128CAH12R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.35x3.32)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
SPC5602DF1VLL4 MPC5602D.pdf
SPC5602DF1VLL4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товар відсутній
MC9S08QG8CFQE MC9S08QG8.pdf
MC9S08QG8CFQE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
товар відсутній
MKL05Z16VFM4 KL05P48M48SF1.pdf
MKL05Z16VFM4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
MC9S08GT16AMFCE MC9S08GT16A.pdf
MC9S08GT16AMFCE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
товар відсутній
FS32K146HFT0MLHT S32K1xx.pdf
FS32K146HFT0MLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
1N4729A,113 1N4728A_SER.pdf
1N4729A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.6V 1W DO41
Packaging: Bulk
на замовлення 115000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
9072+2.1 грн
Мінімальне замовлення: 9072
74LV04N,112 74LV04_Rev3.pdf
74LV04N,112
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
на замовлення 3848 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
620+34.03 грн
Мінімальне замовлення: 620
74LVC1G384GXH 74LVC1G384.pdf
74LVC1G384GXH
Виробник: NXP USA Inc.
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 5-X2SON (0.80x0.80)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Channel Capacitance (CS(off), CD(off)): 5pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 1
на замовлення 833288 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3602+5.62 грн
Мінімальне замовлення: 3602
74AUP1G80GX,125 PHGL-S-A0000296409-1.pdf?t.download=true&u=5oefqw
74AUP1G80GX,125
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 1.5 pF
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Number of Bits per Element: 1
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3831+5.56 грн
Мінімальне замовлення: 3831
PCA9554AD,112 PCA9554%28A%29.pdf
PCA9554AD,112
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Packaging: Tube
Features: POR
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 5217 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
404+52.68 грн
Мінімальне замовлення: 404
PMF780SN,115 PMF780SN.pdf
PMF780SN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 60V 570MA SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 570mA (Ta)
Rds On (Max) @ Id, Vgs: 920mOhm @ 300mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 1.05 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 23 pF @ 30 V
на замовлення 91124 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5323+4.17 грн
Мінімальне замовлення: 5323
MW7IC2425GNR1 MW7IC2425.pdf
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 2.45GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.45GHz
RF Type: ISM
Voltage - Supply: 28V
Gain: 27.7dB
Current - Supply: 195mA
Test Frequency: 2.45GHz
Supplier Device Package: TO-270 WBL-16 GULL
товар відсутній
MC9S08AC96MFGE MC9S08AC128.pdf
MC9S08AC96MFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
товар відсутній
SPC5602BF2MLQ4R
SPC5602BF2MLQ4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
товар відсутній
74AUP1G386GM,115 74AUP1G386.pdf
74AUP1G386GM,115
Виробник: NXP USA Inc.
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 4900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1800+11.89 грн
Мінімальне замовлення: 1800
74HCT194N,652 74HC_T194.pdf
74HCT194N,652
Виробник: NXP USA Inc.
Description: IC 4BIT BI UNIV SHIFT REG 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 4
на замовлення 6305 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
523+39.87 грн
Мінімальне замовлення: 523
MC9S12D64MFUE MC9S12DJ64%20Guide.pdf
MC9S12D64MFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
LS1023ASN7KQB
Виробник: NXP USA Inc.
Description: QORIQ, 2XCPU 64-BIT ARM ARCH, 1.
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
на замовлення 343 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+4368.24 грн
Мінімальне замовлення: 5
BC857QASX
BC857QASX
Виробник: NXP USA Inc.
Description: TRANS PNP 45V 0.1A 6DFN
Packaging: Tape & Reel (TR)
товар відсутній
74AHCT2G126DC,125 74AHC_AHCT2G126.pdf
74AHCT2G126DC,125
Виробник: NXP USA Inc.
Description: IC BUFF DVR TRI-ST DL 8VSSOP
Packaging: Bulk
на замовлення 21883 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1948+10.53 грн
Мінімальне замовлення: 1948
74AHC2G126GD,125 74AHC_AHCT2G126.pdf
74AHC2G126GD,125
Виробник: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Packaging: Bulk
на замовлення 90914 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2049+10.53 грн
Мінімальне замовлення: 2049
74LVC2G00GD,125 74LVC2G00.pdf
74LVC2G00GD,125
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
на замовлення 37590 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2049+10.53 грн
Мінімальне замовлення: 2049
FS32K144HAT0VLFT S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
товар відсутній
SPC5742PK1AMLQ9 MPC574xPFS.pdf
SPC5742PK1AMLQ9
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
SPC5742PK1AMLQ9R MPC574xPFS.pdf
SPC5742PK1AMLQ9R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
Обрати Сторінку:   [  << Попередня Сторінка ]  1 58 116 174 232 290 348 406 464 522 536 537 538 539 540 541 542 543 544 545 546 580 589  [ Наступна Сторінка >> ]