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MCIMX515CJM6C MCIMX515CJM6C NXP USA Inc. IMX51CONINDFS.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
товар відсутній
SLN-SVUI-IOT SLN-SVUI-IOT NXP USA Inc. SLN-SVUI-IOT-UG.pdf Description: VOICE COMMAND EVAL BOARD
Packaging: Bulk
Function: Voice Recognition
Type: Audio/Voice
Supplied Contents: Board(s), Cable(s), Accessories
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+15379.39 грн
10+ 14585.17 грн
MC33812EKR2 MC33812EKR2 NXP USA Inc. Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
товар відсутній
MC33812EK MC33812EK NXP USA Inc. Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
товар відсутній
MPC859PCVR100A MPC859PCVR100A NXP USA Inc. MPC866EC.pdf Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товар відсутній
K32W061-DK006 NXP USA Inc. K32W061.pdf Description: K32W061-DK006
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
товар відсутній
MK51DX256ZCLL10 MK51DX256ZCLL10 NXP USA Inc. KNTSK50FMLYFS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
SPC5566MVR144R NXP USA Inc. MPC5566.pdf Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
товар відсутній
MCIMX6G1CVM05ABR MCIMX6G1CVM05ABR NXP USA Inc. IMX6ULTRALITEFS.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G1AVM07ABR NXP USA Inc. Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G2AVM05ABR NXP USA Inc. Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G2DVK05AB MCIMX6G2DVK05AB NXP USA Inc. IMX6ULCEC.pdf Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G1AVM07AB MCIMX6G1AVM07AB NXP USA Inc. IMX6ULTRALITEFS.pdf Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MPC8548VJATGD NXP USA Inc. FSCLS11828-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
2+18303.13 грн
Мінімальне замовлення: 2
KMPC8548EVUAUJ KMPC8548EVUAUJ NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
MPC8548EPXAUJB MPC8548EPXAUJB NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
MPC8548EPXAVHB MPC8548EPXAVHB NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.5GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
MPC8548PXAUJC MPC8548PXAUJC NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
товар відсутній
MPC8548PXATGD MPC8548PXATGD NXP USA Inc. MPC8548EEC.pdf Description: IC MPU MPC85XX 1.2GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
товар відсутній
BSC9132NXN7KNKB NXP USA Inc. BSC9132.pdf Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
товар відсутній
PTN3365BSMP PTN3365BSMP NXP USA Inc. PTN3365.pdf Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
товар відсутній
PTN3365BSMP PTN3365BSMP NXP USA Inc. PTN3365.pdf Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
товар відсутній
SC26C92C1A,529 SC26C92C1A,529 NXP USA Inc. SC26C92.pdf Description: IC DUART 1MBPS 44PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
FIFO's: 8 Byte
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC (16.59x16.59)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
товар відсутній
74LVT32PW,118 74LVT32PW,118 NXP USA Inc. 74LVT32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
Number of Circuits: 4
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+27.35 грн
Мінімальне замовлення: 1000
SP05127-05UL NXP USA Inc. Description: SP05127-05 DEMOBOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
товар відсутній
SP05145-01UL NXP USA Inc. Description: SP05145-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
товар відсутній
S9S12VR32F0CLCR S9S12VR32F0CLCR NXP USA Inc. S12VRFS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
S9S12VR32F0CLC S9S12VR32F0CLC NXP USA Inc. S12VRFS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
MPF5200AMMG3ES MPF5200AMMG3ES NXP USA Inc. R_MPF5200AMMG3ES.pdf Description: IC REG BUCK 1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
товар відсутній
MPF5200AMMG2ES MPF5200AMMG2ES NXP USA Inc. R_MPF5200AMMG2ES.pdf Description: IC REG BUCK 1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+517.77 грн
10+ 450.34 грн
25+ 429.39 грн
80+ 349.89 грн
230+ 334.16 грн
490+ 304.67 грн
MPF5200AMMG2ESR2 NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
товар відсутній
MPF5200AMMG3ESR2 NXP USA Inc. Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
товар відсутній
MPF5200AMMG0ESR2 MPF5200AMMG0ESR2 NXP USA Inc. Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
товар відсутній
MPF5200AMMG0ES MPF5200AMMG0ES NXP USA Inc. Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Automotive
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
товар відсутній
SPC5668EAMMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
товар відсутній
SPC5668EF1AMMG NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
товар відсутній
MIMXRT1170-EVKB MIMXRT1170-EVKB NXP USA Inc. IMXRT1170CEC.pdf Description: I.MX RT1170 EVAL KIT REV.B
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Utilized IC / Part: RT1170
товар відсутній
MCIMX6D4AVT08AC-NXP NXP USA Inc. PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
5+5003.55 грн
Мінімальне замовлення: 5
MC33FS8430G1ESR2 NXP USA Inc. Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
товар відсутній
74HC40105PW,118 74HC40105PW,118 NXP USA Inc. PHGLS29751-1.pdf?t.download=true&u=5oefqw Description: IC FIFO ASYNC 16X4 34NS 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Asynchronous
Memory Size: 64 (16 x 4)
Operating Temperature: -40°C ~ 125°C
Data Rate: 36MHz
Access Time: 34ns
Supplier Device Package: 16-TSSOP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
на замовлення 1058 шт:
термін постачання 21-31 дні (днів)
485+43.08 грн
Мінімальне замовлення: 485
P1012NSN2HFB P1012NSN2HFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
товар відсутній
MPC8280VVQLDA MPC8280VVQLDA NXP USA Inc. FSCLS05948-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
1+26171.12 грн
BUK7611-55A,118 BUK7611-55A,118 NXP USA Inc. PHGLS20941-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BUK7611-55A - 75A,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 3093 pF @ 25 V
Qualification: AEC-Q101
на замовлення 6400 шт:
термін постачання 21-31 дні (днів)
523+41.02 грн
Мінімальне замовлення: 523
MC13201FCR2 MC13201FCR2 NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
товар відсутній
MC56F8006VWL MC56F8006VWL NXP USA Inc. MC56F8006.pdf Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
товар відсутній
PTN3360DBS518 PTN3360DBS518 NXP USA Inc. PTN3360D.pdf Description: ENHANCED PERFORMANCE HDMI/DVI LE
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: DVI, HDMI
Voltage - Supply: 3V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 230413 шт:
термін постачання 21-31 дні (днів)
290+72.09 грн
Мінімальне замовлення: 290
S9S08QD2J1CSCR S9S08QD2J1CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2350 шт:
термін постачання 21-31 дні (днів)
2+223.53 грн
10+ 168.61 грн
100+ 138.12 грн
500+ 126.89 грн
1000+ 107.02 грн
Мінімальне замовлення: 2
BZX79-B10,143 BZX79-B10,143 NXP USA Inc. PHGLS19463-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 10V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
на замовлення 175000 шт:
термін постачання 21-31 дні (днів)
13172+1.4 грн
Мінімальне замовлення: 13172
OM-SE050ARD-E NXP USA Inc. Description: SE050E ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
товар відсутній
OMA1006UK-SKT NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: OMA1006UK-SKT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006UK
Supplied Contents: Board(s)
товар відсутній
OM67201ULUL NXP USA Inc. Description: A1007 DEMONSTRATION BOARD
Packaging: Box
товар відсутній
OMPCA9957LEDEV NXP USA Inc. UM11196.pdf Description: EVAL BOARD FOR PCA9957
Packaging: Bulk
Features: Dimmable
Voltage - Output: 5.5V
Voltage - Input: 2.7V ~ 5.5V
Current - Output / Channel: 32mA
Utilized IC / Part: PCA9957
Supplied Contents: Board(s)
Outputs and Type: 24, Non-Isolated
товар відсутній
OM-SE050ARD-F NXP USA Inc. SE050-DATASHEET.pdf?pspll=1 Description: SE050F ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
товар відсутній
OM13582UL NXP USA Inc. Description: TYPE-C DOCK BOARD
Packaging: Bulk
товар відсутній
OM13581UL NXP USA Inc. Description: TYPE-C HOST BOARD
Packaging: Bulk
товар відсутній
OM13580JP NXP USA Inc. Description: COMPLETE TYE-C DEMONSTRATION KIT
Packaging: Bulk
товар відсутній
PTVS13VP1UP/WD115 PTVS13VP1UP/WD115 NXP USA Inc. PHGLS23376-1.pdf?t.download=true&u=5oefqw Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Current - Peak Pulse (10/1000µs): 27.9A
Voltage - Reverse Standoff (Typ): 13V (Max)
Supplier Device Package: CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
AFT05MS031GNR1 AFT05MS031GNR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+707.75 грн
Мінімальне замовлення: 500
AFT05MS031GNR1 AFT05MS031GNR1 NXP USA Inc. AFT05MS031N.pdf Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 689 шт:
термін постачання 21-31 дні (днів)
1+1202.04 грн
10+ 833.11 грн
25+ 749.71 грн
100+ 616.2 грн
250+ 573.92 грн
BSP41,115 NXP USA Inc. BSP41_43.pdf Description: TRANS NPN 60V 1A SC73
Packaging: Bulk
на замовлення 113000 шт:
термін постачання 21-31 дні (днів)
1989+10.53 грн
Мінімальне замовлення: 1989
MCIMX515CJM6C IMX51CONINDFS.pdf
MCIMX515CJM6C
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Packaging: Tray
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 95°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
товар відсутній
SLN-SVUI-IOT SLN-SVUI-IOT-UG.pdf
SLN-SVUI-IOT
Виробник: NXP USA Inc.
Description: VOICE COMMAND EVAL BOARD
Packaging: Bulk
Function: Voice Recognition
Type: Audio/Voice
Supplied Contents: Board(s), Cable(s), Accessories
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+15379.39 грн
10+ 14585.17 грн
MC33812EKR2
MC33812EKR2
Виробник: NXP USA Inc.
Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
товар відсутній
MC33812EK
MC33812EK
Виробник: NXP USA Inc.
Description: IC DVR IGNITION/INJECTOR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
товар відсутній
MPC859PCVR100A MPC866EC.pdf
MPC859PCVR100A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товар відсутній
K32W061-DK006 K32W061.pdf
Виробник: NXP USA Inc.
Description: K32W061-DK006
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
товар відсутній
MK51DX256ZCLL10 KNTSK50FMLYFS.pdf
MK51DX256ZCLL10
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
SPC5566MVR144R MPC5566.pdf
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
товар відсутній
MCIMX6G1CVM05ABR IMX6ULTRALITEFS.pdf
MCIMX6G1CVM05ABR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G1AVM07ABR
Виробник: NXP USA Inc.
Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G2AVM05ABR
Виробник: NXP USA Inc.
Description: I.MX 32-BIT MPU, ARM CORTEX-A7 C
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G2DVK05AB IMX6ULCEC.pdf
MCIMX6G2DVK05AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MCIMX6G1AVM07AB IMX6ULTRALITEFS.pdf
MCIMX6G1AVM07AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
MPC8548VJATGD FSCLS11828-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR,
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+18303.13 грн
Мінімальне замовлення: 2
KMPC8548EVUAUJ MPC8548EEC.pdf
KMPC8548EVUAUJ
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
MPC8548EPXAUJB MPC8548EEC.pdf
MPC8548EPXAUJB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
MPC8548EPXAVHB MPC8548EEC.pdf
MPC8548EPXAVHB
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
товар відсутній
MPC8548PXAUJC MPC8548EEC.pdf
MPC8548PXAUJC
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
товар відсутній
MPC8548PXATGD MPC8548EEC.pdf
MPC8548PXATGD
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
товар відсутній
BSC9132NXN7KNKB BSC9132.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
товар відсутній
PTN3365BSMP PTN3365.pdf
PTN3365BSMP
Виробник: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
товар відсутній
PTN3365BSMP PTN3365.pdf
PTN3365BSMP
Виробник: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
товар відсутній
SC26C92C1A,529 SC26C92.pdf
SC26C92C1A,529
Виробник: NXP USA Inc.
Description: IC DUART 1MBPS 44PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
FIFO's: 8 Byte
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC (16.59x16.59)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
товар відсутній
74LVT32PW,118 74LVT32.pdf
74LVT32PW,118
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
Number of Circuits: 4
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1000+27.35 грн
Мінімальне замовлення: 1000
SP05127-05UL
Виробник: NXP USA Inc.
Description: SP05127-05 DEMOBOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
товар відсутній
SP05145-01UL
Виробник: NXP USA Inc.
Description: SP05145-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
товар відсутній
S9S12VR32F0CLCR S12VRFS.pdf
S9S12VR32F0CLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
S9S12VR32F0CLC S12VRFS.pdf
S9S12VR32F0CLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
MPF5200AMMG3ES R_MPF5200AMMG3ES.pdf
MPF5200AMMG3ES
Виробник: NXP USA Inc.
Description: IC REG BUCK 1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
товар відсутній
MPF5200AMMG2ES R_MPF5200AMMG2ES.pdf
MPF5200AMMG2ES
Виробник: NXP USA Inc.
Description: IC REG BUCK 1.2V DL 32HWQFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Output Type: Fixed
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 2
Function: Step-Down
Output Configuration: Positive
Frequency - Switching: 2MHz
Topology: Buck
Supplier Device Package: 32-HWQFN (5x5)
Synchronous Rectifier: No
Voltage - Output (Min/Fixed): 1.2V, 1.2V
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+517.77 грн
10+ 450.34 грн
25+ 429.39 грн
80+ 349.89 грн
230+ 334.16 грн
490+ 304.67 грн
MPF5200AMMG2ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
товар відсутній
MPF5200AMMG3ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED - P
Packaging: Tape & Reel (TR)
товар відсутній
MPF5200AMMG0ESR2
MPF5200AMMG0ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
товар відсутній
MPF5200AMMG0ES
MPF5200AMMG0ES
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Automotive
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
товар відсутній
SPC5668EAMMG
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
товар відсутній
SPC5668EF1AMMG
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208BGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 64x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
товар відсутній
MIMXRT1170-EVKB IMXRT1170CEC.pdf
MIMXRT1170-EVKB
Виробник: NXP USA Inc.
Description: I.MX RT1170 EVAL KIT REV.B
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Utilized IC / Part: RT1170
товар відсутній
MCIMX6D4AVT08AC-NXP PHGL-S-A0006627490-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, DUAL A
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+5003.55 грн
Мінімальне замовлення: 5
MC33FS8430G1ESR2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Packaging: Tape & Reel (TR)
товар відсутній
74HC40105PW,118 PHGLS29751-1.pdf?t.download=true&u=5oefqw
74HC40105PW,118
Виробник: NXP USA Inc.
Description: IC FIFO ASYNC 16X4 34NS 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Asynchronous
Memory Size: 64 (16 x 4)
Operating Temperature: -40°C ~ 125°C
Data Rate: 36MHz
Access Time: 34ns
Supplier Device Package: 16-TSSOP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
на замовлення 1058 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
485+43.08 грн
Мінімальне замовлення: 485
P1012NSN2HFB QP1021FS.pdf
P1012NSN2HFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
товар відсутній
MPC8280VVQLDA FSCLS05948-1.pdf?t.download=true&u=5oefqw
MPC8280VVQLDA
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+26171.12 грн
BUK7611-55A,118 PHGLS20941-1.pdf?t.download=true&u=5oefqw
BUK7611-55A,118
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK7611-55A - 75A,
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 3093 pF @ 25 V
Qualification: AEC-Q101
на замовлення 6400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
523+41.02 грн
Мінімальне замовлення: 523
MC13201FCR2 MC13201.pdf
MC13201FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
товар відсутній
MC56F8006VWL MC56F8006.pdf
MC56F8006VWL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 15x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
товар відсутній
PTN3360DBS518 PTN3360D.pdf
PTN3360DBS518
Виробник: NXP USA Inc.
Description: ENHANCED PERFORMANCE HDMI/DVI LE
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: DVI, HDMI
Voltage - Supply: 3V ~ 3.6V
Applications: DisplayPort to HDMI, DVI Adapters
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 230413 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
290+72.09 грн
Мінімальне замовлення: 290
S9S08QD2J1CSCR MC9S08QD4.pdf
S9S08QD2J1CSCR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+223.53 грн
10+ 168.61 грн
100+ 138.12 грн
500+ 126.89 грн
1000+ 107.02 грн
Мінімальне замовлення: 2
BZX79-B10,143 PHGLS19463-1.pdf?t.download=true&u=5oefqw
BZX79-B10,143
Виробник: NXP USA Inc.
Description: DIODE ZENER 10V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
на замовлення 175000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
13172+1.4 грн
Мінімальне замовлення: 13172
OM-SE050ARD-E
Виробник: NXP USA Inc.
Description: SE050E ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
товар відсутній
OMA1006UK-SKT A1006_Demo-Dev_Kit.pdf
Виробник: NXP USA Inc.
Description: OMA1006UK-SKT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006UK
Supplied Contents: Board(s)
товар відсутній
OM67201ULUL
Виробник: NXP USA Inc.
Description: A1007 DEMONSTRATION BOARD
Packaging: Box
товар відсутній
OMPCA9957LEDEV UM11196.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9957
Packaging: Bulk
Features: Dimmable
Voltage - Output: 5.5V
Voltage - Input: 2.7V ~ 5.5V
Current - Output / Channel: 32mA
Utilized IC / Part: PCA9957
Supplied Contents: Board(s)
Outputs and Type: 24, Non-Isolated
товар відсутній
OM-SE050ARD-F SE050-DATASHEET.pdf?pspll=1
Виробник: NXP USA Inc.
Description: SE050F ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SE050
Platform: Arduino
товар відсутній
OM13582UL
Виробник: NXP USA Inc.
Description: TYPE-C DOCK BOARD
Packaging: Bulk
товар відсутній
OM13581UL
Виробник: NXP USA Inc.
Description: TYPE-C HOST BOARD
Packaging: Bulk
товар відсутній
OM13580JP
Виробник: NXP USA Inc.
Description: COMPLETE TYE-C DEMONSTRATION KIT
Packaging: Bulk
товар відсутній
PTVS13VP1UP/WD115 PHGLS23376-1.pdf?t.download=true&u=5oefqw
PTVS13VP1UP/WD115
Виробник: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Current - Peak Pulse (10/1000µs): 27.9A
Voltage - Reverse Standoff (Typ): 13V (Max)
Supplier Device Package: CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 14.4V
Voltage - Clamping (Max) @ Ipp: 21.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
AFT05MS031GNR1 AFT05MS031N.pdf
AFT05MS031GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
500+707.75 грн
Мінімальне замовлення: 500
AFT05MS031GNR1 AFT05MS031N.pdf
AFT05MS031GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
на замовлення 689 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1202.04 грн
10+ 833.11 грн
25+ 749.71 грн
100+ 616.2 грн
250+ 573.92 грн
BSP41,115 BSP41_43.pdf
Виробник: NXP USA Inc.
Description: TRANS NPN 60V 1A SC73
Packaging: Bulk
на замовлення 113000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1989+10.53 грн
Мінімальне замовлення: 1989
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