Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35282) > Сторінка 532 з 589
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MC33FS4501CAER2 | NXP USA Inc. |
 Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
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MC35FS4501CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS4501CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
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MC35FS4501CAE | NXP USA Inc. |
Description: FS4500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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| MPC8535AVJANGA | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCH SOC Packaging: Bulk |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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| MPC8535BVJANGA | NXP USA Inc. |
Description: POWERQUICC, 32 BIT POWER ARCH SO Packaging: Bulk |
на замовлення 720 шт: термін постачання 21-31 дні (днів) |
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| MPC8533VTALFA | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSOR Packaging: Bulk |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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| MPC8533VTAQGA | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSOR, Packaging: Bulk |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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MKL15Z64VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 15x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, LINbus, SPI, TSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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P1022NXE2HFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI |
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P1022NXN2HFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD SATA: SATA 3Gbps (2) |
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74LVCH2T45GN,115 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 420Mbps Supplier Device Package: 8-XSON (1.2x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 5.5 V Voltage - VCCB: 1.2 V ~ 5.5 V Number of Circuits: 1 |
на замовлення 66310 шт: термін постачання 21-31 дні (днів) |
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74LVCH2T45GD,125 | NXP USA Inc. |
Description: TXRX TRANSLATING 3ST XSON8U Packaging: Bulk |
на замовлення 37005 шт: термін постачання 21-31 дні (днів) |
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NZX11D133 | NXP USA Inc. |
Description: NOW NEXPERIA NZX11D - ZENER DIOD Packaging: Bulk Tolerance: ±2% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C Voltage - Zener (Nom) (Vz): 11.35 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: ALF2 Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
на замовлення 86600 шт: термін постачання 21-31 дні (днів) |
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| PXLS83322AESR2 | NXP USA Inc. |
Description: 2 AXIS MED/MED XY Packaging: Tape & Reel (TR) |
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| SCIMX6S6AVM083CR | NXP USA Inc. |
Description: I.MX 6 SERIES 32-BIT MPU ARM COR Packaging: Tape & Reel (TR) |
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| NX20P3483AUKZ | NXP USA Inc. |
Description: NX20P3483AUK Packaging: Tape & Reel (TR) Features: 5V Regulated Output, Slew Rate Controlled Package / Case: 42-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 2 Interface: I2C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 28mOhm, 38mOhm Input Type: Non-Inverting Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Current - Output (Max): 3.4A, 5A Ratio - Input:Output: 1:1 Supplier Device Package: 42-WLCSP (2.91x2.51) Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO |
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| LPC1114FBD48/333J | NXP USA Inc. |
Description: IC MCU 32BIT 56KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 56KB (56K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 |
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MK52DN512CMD10 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Number of I/O: 96 DigiKey Programmable: Not Verified |
на замовлення 790 шт: термін постачання 21-31 дні (днів) |
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MCIMX508CVK8B | NXP USA Inc. |
Description: IC MPU I.MX50 800MHZ 416MAPBGA Packaging: Tray Package / Case: 416-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 416-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Security Features: Boot Security, Cryptography, Secure JTAG Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
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MPC8308CVMADD | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 473-MAPBGA (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI |
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MPF7100BVMA2ES | NXP USA Inc. |
Description: PF7100 PMIC I.MX8XL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: i.MX Processors Current - Supply: 10µA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MPC8377VRALGA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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MPC8377CVRALGA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) |
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MPC8377VRAGDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
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MPC8377VRAJFA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ PBGA689 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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MPC8377VRAJFA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
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MPC8379CVRALGA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (4) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
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P1013NSE2EFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) |
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P1013NSN2HFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD SATA: SATA 3Gbps (2) |
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P1013NSN2LFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD SATA: SATA 3Gbps (2) |
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P1013NXE2HFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) |
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P1022NSE2HFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.055GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.055GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI |
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MIMXRT595SFFOC | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 249FOWLP Packaging: Tray Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 1105 шт: термін постачання 21-31 дні (днів) |
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S908AB32AH3MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 51 DigiKey Programmable: Not Verified |
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| A5M36TG140-3400 | NXP USA Inc. |
Description: A5M36TG140T2 REFERENCE CIRCUIT Packaging: Box For Use With/Related Products: A5M36TG140 Frequency: 3.3GHz ~ 3.8GHz Type: Power Amplifier Supplied Contents: Board(s) |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BUK968R3-40E,118 | NXP USA Inc. |
Description: MOSFET N-CH 40V 75A D2PAK Packaging: Tape & Reel (TR) Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 6.4mOhm @ 20A, 10V Power Dissipation (Max): 96W (Tc) Vgs(th) (Max) @ Id: 2.1V @ 1mA Supplier Device Package: D2PAK Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 20.9 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V |
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74ALVT16823DL,512 | NXP USA Inc. |
Description: IC D-TYPE POS TRG DUAL 56SSOP Packaging: Bulk |
на замовлення 2485 шт: термін постачання 21-31 дні (днів) |
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BTA204-600C,127 | NXP USA Inc. |
Description: TRIAC 600V 4A TO220AB Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Triac Type: Standard Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 20 mA Current - Gate Trigger (Igt) (Max): 35 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: TO-220AB Current - On State (It (RMS)) (Max): 4 A Voltage - Off State: 600 V |
на замовлення 5050 шт: термін постачання 21-31 дні (днів) |
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74HCT259DB,112 | NXP USA Inc. |
Description: IC 8BIT ADDRESSABLE LATCH 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Standard Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type, Addressable Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Delay Time - Propagation: 20ns Supplier Device Package: 16-SSOP |
на замовлення 2169 шт: термін постачання 21-31 дні (днів) |
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MC9S08JM60CGT | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48QFN Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 37 DigiKey Programmable: Verified |
на замовлення 1597 шт: термін постачання 21-31 дні (днів) |
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MK50DN512CLQ10 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 96 DigiKey Programmable: Not Verified |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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MPC855TVR80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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BZV55-B62,115 | NXP USA Inc. |
Description: DIODE ZENER 62V 500MW LLDS Tolerance: ±2% Packaging: Bulk Package / Case: DO-213AC, MINI-MELF, SOD-80 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 62 V Impedance (Max) (Zzt): 215 Ohms Supplier Device Package: LLDS; MiniMelf Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V |
на замовлення 240205 шт: термін постачання 21-31 дні (днів) |
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MC35FS6502NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товар відсутній |
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S32G379AACK1VUCT | NXP USA Inc. |
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART |
на замовлення 419 шт: термін постачання 21-31 дні (днів) |
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LPC865M201JHI48/0E | NXP USA Inc. |
Description: IC MCU CORTEX M0+ HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 42 |
на замовлення 549 шт: термін постачання 21-31 дні (днів) |
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| SAC57D53MCVLTR | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 208LQFP Packaging: Tape & Reel (TR) Package / Case: 208-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz, 320MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-A5/M4/M0+ Data Converters: A/D 24x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) DigiKey Programmable: Not Verified |
товар відсутній |
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SAC57D54HCVLT | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 208LQFP Packaging: Bulk Package / Case: 208-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz, 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 2.3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-A5/M4/M0+ Data Converters: A/D 24x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) DigiKey Programmable: Not Verified |
товар відсутній |
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SAC57D54HCVMO | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 516MAPBGA Packaging: Tray Package / Case: 516-BGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz, 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 2.3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-A5/M4/M0+ Data Converters: A/D 24x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Supplier Device Package: 516-MAPBGA (27x27) DigiKey Programmable: Not Verified |
товар відсутній |
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SPC5604BF2MLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товар відсутній |
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SPC5604CF2MLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товар відсутній |
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SPC5606BK0MLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 149 DigiKey Programmable: Not Verified |
товар відсутній |
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MPC566MVR56 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 40x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
товар відсутній |
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S9S12GN32F0VFT | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFN Packaging: Tray Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
товар відсутній |
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| ISI-QMC-DGC02 | NXP USA Inc. |
Description: ISI-QMC-DGC02 Packaging: Bulk Function: Motor Controller/Driver Type: Interface Contents: Board(s) Utilized IC / Part: PF5020, RT1176, TJA115x |
товар відсутній |
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TEF7000HN/V2S,557 | NXP USA Inc. |
Description: TEF7000HN - DIGITAL LOW-IF CAR R Packaging: Bulk |
на замовлення 697 шт: термін постачання 21-31 дні (днів) |
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TEF7000HN/V3518 | NXP USA Inc. |
Description: TEF7000HN - TUNER FRONT-END Packaging: Bulk |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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TEF7000HN/V3557 | NXP USA Inc. |
Description: TEF7000HN - TUNER FRONT-END Packaging: Bulk |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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| MC33MR2001R2VKR2 | NXP USA Inc. |
Description: IC INTERFACE TRANSCEIVER 3.135V Packaging: Bulk |
на замовлення 15815 шт: термін постачання 21-31 дні (днів) |
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| MC33FS4501CAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
| MC35FS4501CAER2 |
|
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC33FS4501CAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
| MC35FS4501CAE |
|
Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MPC8535AVJANGA |
|
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 11845.89 грн |
| MPC8535BVJANGA |
|
на замовлення 720 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 12555.25 грн |
| MPC8533VTALFA |
|
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6175.74 грн |
| MPC8533VTAQGA |
|
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 7036.6 грн |
| MKL15Z64VFT4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| P1022NXE2HFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
товар відсутній
| P1022NXN2HFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
товар відсутній
| 74LVCH2T45GN,115 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Supplier Device Package: 8-XSON (1.2x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Supplier Device Package: 8-XSON (1.2x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Number of Circuits: 1
на замовлення 66310 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1446+ | 15.11 грн |
| 74LVCH2T45GD,125 |
|
на замовлення 37005 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1665+ | 12.59 грн |
| NZX11D133 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA NZX11D - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11.35 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: ALF2
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: NOW NEXPERIA NZX11D - ZENER DIOD
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11.35 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: ALF2
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
на замовлення 86600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 15000+ | 1.44 грн |
| PXLS83322AESR2 |
товар відсутній
| SCIMX6S6AVM083CR |
товар відсутній
| NX20P3483AUKZ |
Виробник: NXP USA Inc.
Description: NX20P3483AUK
Packaging: Tape & Reel (TR)
Features: 5V Regulated Output, Slew Rate Controlled
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 28mOhm, 38mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Current - Output (Max): 3.4A, 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 42-WLCSP (2.91x2.51)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO
Description: NX20P3483AUK
Packaging: Tape & Reel (TR)
Features: 5V Regulated Output, Slew Rate Controlled
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 28mOhm, 38mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Current - Output (Max): 3.4A, 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 42-WLCSP (2.91x2.51)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO
товар відсутній
| LPC1114FBD48/333J |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 56KB (56K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
Description: IC MCU 32BIT 56KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 56KB (56K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
товар відсутній
| MK52DN512CMD10 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 790 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1472.71 грн |
| 10+ | 1133.36 грн |
| 160+ | 957.13 грн |
| 480+ | 892.72 грн |
| MCIMX508CVK8B |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Tray
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX50 800MHZ 416MAPBGA
Packaging: Tray
Package / Case: 416-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 416-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
товар відсутній
| MPC8308CVMADD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 473-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI
товар відсутній
| MPF7100BVMA2ES |
Виробник: NXP USA Inc.
Description: PF7100 PMIC I.MX8XL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: PF7100 PMIC I.MX8XL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MPC8377VRALGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6591.82 грн |
| MPC8377CVRALGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
товар відсутній
| MPC8377VRAGDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
товар відсутній
| MPC8377VRAJFA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 5172.03 грн |
| MPC8377VRAJFA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
товар відсутній
| MPC8379CVRALGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
товар відсутній
| P1013NSE2EFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
товар відсутній
| P1013NSN2HFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
товар відсутній
| P1013NSN2LFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
товар відсутній
| P1013NXE2HFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
товар відсутній
| P1022NSE2HFB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.055GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.055GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
товар відсутній
| MIMXRT595SFFOC |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tray
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 1105 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1507.68 грн |
| 10+ | 1164.47 грн |
| 80+ | 1151.73 грн |
| S908AB32AH3MFUE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
товар відсутній
| A5M36TG140-3400 |
|
Виробник: NXP USA Inc.
Description: A5M36TG140T2 REFERENCE CIRCUIT
Packaging: Box
For Use With/Related Products: A5M36TG140
Frequency: 3.3GHz ~ 3.8GHz
Type: Power Amplifier
Supplied Contents: Board(s)
Description: A5M36TG140T2 REFERENCE CIRCUIT
Packaging: Box
For Use With/Related Products: A5M36TG140
Frequency: 3.3GHz ~ 3.8GHz
Type: Power Amplifier
Supplied Contents: Board(s)
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33635.77 грн |
| BUK968R3-40E,118 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.4mOhm @ 20A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 20.9 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.4mOhm @ 20A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 20.9 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
товар відсутній
| 74ALVT16823DL,512 |
|
на замовлення 2485 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 139+ | 153.14 грн |
| BTA204-600C,127 |
|
Виробник: NXP USA Inc.
Description: TRIAC 600V 4A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 20 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
Description: TRIAC 600V 4A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 20 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
на замовлення 5050 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1145+ | 18.19 грн |
| 74HCT259DB,112 |
|
Виробник: NXP USA Inc.
Description: IC 8BIT ADDRESSABLE LATCH 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SSOP
Description: IC 8BIT ADDRESSABLE LATCH 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SSOP
на замовлення 2169 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 767+ | 27.03 грн |
| MC9S08JM60CGT |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 37
DigiKey Programmable: Verified
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 37
DigiKey Programmable: Verified
на замовлення 1597 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 43+ | 499.13 грн |
| MK50DN512CLQ10 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1357.14 грн |
| 10+ | 1044.33 грн |
| 120+ | 882.02 грн |
| MPC855TVR80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 100+ | 10513.46 грн |
| BZV55-B62,115 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 62V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Description: DIODE ZENER 62V 500MW LLDS
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
на замовлення 240205 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13172+ | 1.4 грн |
| MC35FS6502NAE |
|
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
| S32G379AACK1VUCT |
|
Виробник: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
на замовлення 419 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10390.29 грн |
| 10+ | 8717.33 грн |
| 25+ | 8693.9 грн |
| 40+ | 7939.13 грн |
| 80+ | 7098.52 грн |
| LPC865M201JHI48/0E |
|
Виробник: NXP USA Inc.
Description: IC MCU CORTEX M0+ HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
Description: IC MCU CORTEX M0+ HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
на замовлення 549 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 217.45 грн |
| 10+ | 163.56 грн |
| 80+ | 131.46 грн |
| 520+ | 116.56 грн |
| SAC57D53MCVLTR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 208LQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
товар відсутній
| SAC57D54HCVLT |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
DigiKey Programmable: Not Verified
товар відсутній
| SAC57D54HCVMO |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 516-MAPBGA (27x27)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-A5/M4/M0+
Data Converters: A/D 24x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 516-MAPBGA (27x27)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5604BF2MLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товар відсутній
| SPC5604CF2MLL6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товар відсутній
| SPC5606BK0MLU6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
| MPC566MVR56 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| S9S12GN32F0VFT |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| ISI-QMC-DGC02 |
|
Виробник: NXP USA Inc.
Description: ISI-QMC-DGC02
Packaging: Bulk
Function: Motor Controller/Driver
Type: Interface
Contents: Board(s)
Utilized IC / Part: PF5020, RT1176, TJA115x
Description: ISI-QMC-DGC02
Packaging: Bulk
Function: Motor Controller/Driver
Type: Interface
Contents: Board(s)
Utilized IC / Part: PF5020, RT1176, TJA115x
товар відсутній
| TEF7000HN/V2S,557 |
|
на замовлення 697 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 123+ | 173.69 грн |
| TEF7000HN/V3518 |
|
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 66+ | 317.47 грн |
| TEF7000HN/V3557 |
|
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 66+ | 317.47 грн |
| MC33MR2001R2VKR2 |
на замовлення 15815 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 12+ | 1761.37 грн |