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SAC57D54HCVMO NXP Semiconductors
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MCU 32-bit ARM Cortex A5/ARM Cortex M4/ARM Cortex M0+ RISC 4MB Flash 3.3V/5V Automotive 516-Pin MAP-BGA Tray
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Технічний опис SAC57D54HCVMO NXP Semiconductors
Description: IC MCU 32BIT 4MB FLASH 516MAPBGA, Packaging: Tray, Package / Case: 516-BGA, Mounting Type: Surface Mount, Speed: 80MHz, 160MHz, 320MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 2.3M x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-A5/M4/M0+, Data Converters: A/D 24x12b, Core Size: 32-Bit Tri-Core, Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT, Supplier Device Package: 516-MAPBGA (27x27), DigiKey Programmable: Not Verified.
Інші пропозиції SAC57D54HCVMO
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SAC57D54HCVMO | Виробник : NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 516MAPBGA Packaging: Tray Package / Case: 516-BGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz, 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 2.3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-A5/M4/M0+ Data Converters: A/D 24x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Supplier Device Package: 516-MAPBGA (27x27) DigiKey Programmable: Not Verified |
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SAC57D54HCVMO | Виробник : NXP Semiconductors |
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