Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35280) > Сторінка 516 з 588
Фото | Назва | Виробник | Інформація |
Доступність |
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AFSC5G35E38T2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 24V ~ 31V Gain: 30.5dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
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AFSC5G40E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 4GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28.8dB Test Frequency: 4GHz Supplier Device Package: 26-HLQFN (10x6) |
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AFSC5G23E39T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 26-HLQFN (10x6) |
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AFSC5G26E39T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28dB Current - Supply: 65mA Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
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A3M35TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28.8dBm Test Frequency: 3.4GHz Supplier Device Package: 26-HLQFN (10x6) |
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A3M39TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.6dB Test Frequency: 3.98GHz Supplier Device Package: 26-HLQFN (10x6) |
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A3M37TL039T2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.1dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
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A3M34TL139T2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.58GHz RF Type: LTE Voltage - Supply: 24V ~ 30V Gain: 27.3dB Test Frequency: 3.3GHz Supplier Device Package: 26-HLQFN (10x6) |
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A3M36SL039SAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: Wireless LAN Voltage - Supply: 29V Gain: 29.8dB Test Frequency: 3.4GHz ~ 3.8GHz Supplier Device Package: 38-PLGA (10x8) |
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A3M36SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: LTE Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V Gain: 28.2dB Test Frequency: 3.4GHz Supplier Device Package: 38-PLGA (10x8) |
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A3M34SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 29.6dB Current - Supply: 11mA Test Frequency: 3.3GHz ~ 3.7GHz Supplier Device Package: 38-PLGA (10x8) |
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A3M38SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 29.6dB Current - Supply: 11mA Test Frequency: 3.3GHz ~ 3.7GHz Supplier Device Package: 38-PLGA (10x8) |
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A3M39SL039IAAT2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE W Packaging: Tape & Reel (TR) Package / Case: 38-PowerLFLGA Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE, TDD Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V Gain: 28.3dB Test Frequency: 3.7GHz ~ 3.98GHz Supplier Device Package: 38-PLGA (10x8) |
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A5M39TG140T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 32.7dB Current - Supply: 40mA Test Frequency: 3.7GHz ~ 3.98GHz Supplier Device Package: 26-HLQFN (10x6) |
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A5M36TG140T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.8GHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 31.8dB Test Frequency: 3.3GHz ~ 3.8GHz Supplier Device Package: 26-HLQFN (10x6) |
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74AUP1G885GN115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Schmitt Trigger Input: No Supplier Device Package: 8-XSON (1.2x1) Number of Circuits: 1 |
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PCF85103C-2T/00:11 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 2Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 6.0V Technology: EEPROM Clock Frequency: 100 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I²C Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
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MC68030CRC25C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68030CRC33C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 33MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68030FE16C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 132-BCQFP Mounting Type: Surface Mount Speed: 166MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 132-CQFP (24x24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68030FE20C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 132-BCQFP Mounting Type: Surface Mount Speed: 20MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 132-CQFP (24x24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68030RC16C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 166MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68030RC25C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68030RC50C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 128-BPGA Mounting Type: Through Hole Speed: 50MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68030 Voltage - I/O: 5.0V Supplier Device Package: 128-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC68040RC25V | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 182-BEPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 182-PGA (47.24x47.24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MC33FS8500A0KSR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8500A0ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
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BUK7230-55A,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 38A (Tc) Rds On (Max) @ Id, Vgs: 30mOhm @ 25A, 10V Power Dissipation (Max): 88W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: DPAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 1152 pF @ 25 V Grade: Automotive Qualification: AEC-Q101 |
на замовлення 6270 шт: термін постачання 21-31 дні (днів) |
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MFS8600BMBA0ESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MFS8600BMDA0ESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MFS8600BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MFS8600BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
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PTN3393BS/F1Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) |
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PTN3393BS/F1Y | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 3895 шт: термін постачання 21-31 дні (днів) |
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MC33FS6511CAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
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MC33FS6511CAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
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SPC5741PK1AKLQ8R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 135°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
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T1014NXE7KQA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) |
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S912XEQ512J3VAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
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LPC2290FBD144/01,5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 76 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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BGA2802,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 31dB Current - Supply: 12.5mA Noise Figure: 5.1dB P1dB: 7dbm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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BGA2802,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 31dB Current - Supply: 12.5mA Noise Figure: 5.1dB P1dB: 7dbm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
на замовлення 19003 шт: термін постачання 21-31 дні (днів) |
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BGA2800,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 20.2dB Current - Supply: 10.5mA Noise Figure: 3.7dB P1dB: -2dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
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BGA2800,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 20.2dB Current - Supply: 10.5mA Noise Figure: 3.7dB P1dB: -2dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
на замовлення 2389 шт: термін постачання 21-31 дні (днів) |
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BGA2874,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 750MHz RF Type: General Purpose Voltage - Supply: 2.3V ~ 2.7V Gain: 31dB Current - Supply: 16.5mA Noise Figure: 3.1dB P1dB: 5dBm Test Frequency: 500MHz Supplier Device Package: 6-TSSOP |
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MCTPTX1AK324 | NXP USA Inc. |
![]() Packaging: Box Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: S32K324 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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S32K324NHT1VMMST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324EHT1VMMSR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324NHT1VPBST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324NHT1VPBSR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324EHT1VMMST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324NHT1MMMST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324NHT1MPBST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324EHT1VPBST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324EHT1MMMST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324EHT1MPBSR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324NHT1MMMSR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товар відсутній |
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S32K324NHT1MPBIT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 Grade: Automotive Qualification: AEC-Q100 |
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S32K324NHT1MPBIR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 Grade: Automotive Qualification: AEC-Q100 |
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MCSPTE1AK344 | NXP USA Inc. |
Description: S32K344 BRUSHLESS MOTOR DEV KIT Packaging: Box Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: S32K344 Supplied Contents: Board(s) Primary Attributes: Motors (BLDC) Embedded: Yes, MCU |
товар відсутній |
AFSC5G35E38T2 |
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Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
AFSC5G40E38T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
AFSC5G23E39T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
AFSC5G26E39T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
A3M35TL039T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
A3M39TL039T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
A3M37TL039T2 |
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Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
A3M34TL139T2 |
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Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.58GHz
RF Type: LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.3GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
A3M36SL039SAAT2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Wireless LAN
Voltage - Supply: 29V
Gain: 29.8dB
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: 38-PLGA (10x8)
товар відсутній
A3M36SL039IAAT2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: LTE
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.2dB
Test Frequency: 3.4GHz
Supplier Device Package: 38-PLGA (10x8)
товар відсутній
A3M34SL039IAAT2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
товар відсутній
A3M38SL039IAAT2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 29.6dB
Current - Supply: 11mA
Test Frequency: 3.3GHz ~ 3.7GHz
Supplier Device Package: 38-PLGA (10x8)
товар відсутній
A3M39SL039IAAT2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
Description: AIRFAST POWER AMPLIFIER MODULE W
Packaging: Tape & Reel (TR)
Package / Case: 38-PowerLFLGA
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 1.65V ~ 1.95V, 4.75V ~ 5.25V, 24V ~ 30V
Gain: 28.3dB
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 38-PLGA (10x8)
товар відсутній
A5M39TG140T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 32.7dB
Current - Supply: 40mA
Test Frequency: 3.7GHz ~ 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
A5M36TG140T2 |
Виробник: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.8dB
Test Frequency: 3.3GHz ~ 3.8GHz
Supplier Device Package: 26-HLQFN (10x6)
товар відсутній
74AUP1G885GN115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
Description: NOW NEXPERIA 74AUP1G885GN - XOR
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (1.2x1)
Number of Circuits: 1
товар відсутній
PCF85103C-2T/00:11 |
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Виробник: NXP USA Inc.
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I²C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6.0V
Technology: EEPROM
Clock Frequency: 100 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I²C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
товар відсутній
MC68030CRC25C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68030CRC33C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 33MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68030FE16C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 166MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68030FE20C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 20MHZ 132CQFP
Packaging: Tray
Package / Case: 132-BCQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 132-CQFP (24x24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68030RC16C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 166MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 166MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68030RC25C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68030RC50C |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 50MHZ 128PGA
Packaging: Tray
Package / Case: 128-BPGA
Mounting Type: Through Hole
Speed: 50MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68030
Voltage - I/O: 5.0V
Supplier Device Package: 128-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC68040RC25V |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 182PGA
Packaging: Tray
Package / Case: 182-BEPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 182-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
MC33FS8500A0KSR2 |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8500A0ESR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
BUK7230-55A,118 |
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Виробник: NXP USA Inc.
Description: PFET, 38A I(D), 55V, 0.03OHM, 1-
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 38A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 25A, 10V
Power Dissipation (Max): 88W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1152 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Description: PFET, 38A I(D), 55V, 0.03OHM, 1-
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 38A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 25A, 10V
Power Dissipation (Max): 88W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1152 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
на замовлення 6270 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
673+ | 31.59 грн |
MFS8600BMBA0ESR2 |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MFS8600BMDA0ESR2 |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MFS8600BMBA0ES |
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MFS8600BMDA0ES |
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
PTN3393BS/F1Y |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
товар відсутній
PTN3393BS/F1Y |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 3895 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 229.61 грн |
10+ | 198.41 грн |
25+ | 187.6 грн |
100+ | 152.57 грн |
250+ | 144.75 грн |
500+ | 129.88 грн |
1000+ | 107.75 грн |
MC33FS6511CAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
MC33FS6511CAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
SPC5741PK1AKLQ8R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 135°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
товар відсутній
T1014NXE7KQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
товар відсутній
S912XEQ512J3VAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
LPC2290FBD144/01,5 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1117.64 грн |
10+ | 859.9 грн |
BGA2802,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3000+ | 8.83 грн |
6000+ | 8.08 грн |
15000+ | 7.75 грн |
BGA2802,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 31dB
Current - Supply: 12.5mA
Noise Figure: 5.1dB
P1dB: 7dbm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 19003 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
14+ | 22.05 грн |
16+ | 18.89 грн |
25+ | 17.02 грн |
100+ | 13.97 грн |
250+ | 12.26 грн |
500+ | 10.83 грн |
1000+ | 8.41 грн |
BGA2800,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
товар відсутній
BGA2800,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 20.2dB
Current - Supply: 10.5mA
Noise Figure: 3.7dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 2389 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
20+ | 15.97 грн |
22+ | 13.69 грн |
25+ | 12.42 грн |
100+ | 10.2 грн |
250+ | 8.95 грн |
500+ | 7.91 грн |
1000+ | 6.14 грн |
BGA2874,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-750MHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 750MHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 2.7V
Gain: 31dB
Current - Supply: 16.5mA
Noise Figure: 3.1dB
P1dB: 5dBm
Test Frequency: 500MHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-750MHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 750MHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 2.7V
Gain: 31dB
Current - Supply: 16.5mA
Noise Figure: 3.1dB
P1dB: 5dBm
Test Frequency: 500MHz
Supplier Device Package: 6-TSSOP
товар відсутній
MCTPTX1AK324 |
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Виробник: NXP USA Inc.
Description: S32K324 MOTOR CTRL REF DESING BO
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K324
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Description: S32K324 MOTOR CTRL REF DESING BO
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K324
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 35439.21 грн |
S32K324NHT1VMMST |
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Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324EHT1VMMSR |
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Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324NHT1VPBST |
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Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324NHT1VPBSR |
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Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324EHT1VMMST |
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Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324NHT1MMMST |
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Виробник: NXP USA Inc.
Description: S32K324, 4MB FLASH, ARM M7 MULTI
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324, 4MB FLASH, ARM M7 MULTI
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324NHT1MPBST |
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Виробник: NXP USA Inc.
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K324 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324EHT1VPBST |
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Виробник: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324EHT1MMMST |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324EHT1MPBSR |
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Виробник: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324NHT1MMMSR |
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товар відсутній
S32K324NHT1MPBIT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
S32K324NHT1MPBIR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MCSPTE1AK344 |
Виробник: NXP USA Inc.
Description: S32K344 BRUSHLESS MOTOR DEV KIT
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, MCU
Description: S32K344 BRUSHLESS MOTOR DEV KIT
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, MCU
товар відсутній