Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35280) > Сторінка 517 з 588
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
S32K322NHT0VPBST | NXP USA Inc. |
 Description: IC MCU 32BIT 2MB FLASH 172QFPPackaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 Grade: Automotive Qualification: AEC-Q100 |
на замовлення 418 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
S32K322EHT0MPAST | NXP USA Inc. |
Description: S32K322, 2MB FLASH, 256K SRAM Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 479 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
|
S32K341EHT0MPAST | NXP USA Inc. |
Description: S32K341, 1MB FLASH, LOCKSTEP COR Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 456 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
S32K344-WB | NXP USA Inc. |
Description: S32K344-WB Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: S32K344 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
S32K311NHT0MLFST | NXP USA Inc. |
Description: S32K311, CES, 48 LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1176 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| S32K311NHT0VLFSR | NXP USA Inc. |
Description: IC MCU 48LQFP Packaging: Tape & Reel (TR) |
товар відсутній |
||||||||||||||||||
| S32K311NHT0VLFST | NXP USA Inc. |
Description: IC MCU 48LQFP Packaging: Tray |
товар відсутній |
||||||||||||||||||
| S32K311NHT0VPAST | NXP USA Inc. |
Description: S32K311, CES, 100 MAXQFP Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 100-MaxQFP (10x10) |
товар відсутній |
||||||||||||||||||
|
|
S32K311NHT0MPAST | NXP USA Inc. |
Description: S32K311, CES, 100 MAXQFP Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 2050 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| S32K312NHT0MPAST | NXP USA Inc. |
Description: S32K312 ARM CORTEX-M7, 120 MHZ, Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 100-MaxQFP (10x10) |
товар відсутній |
||||||||||||||||||
| S32K312NHT0VPBSR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 172QFP Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART Peripherals: DMA, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 |
товар відсутній |
||||||||||||||||||
| S32K312NHT0MPAIT | NXP USA Inc. |
Description: S32K312, 2MB FLASH, ISELED Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 100-MaxQFP (10x10) |
товар відсутній |
||||||||||||||||||
| S32K312NVT0MPBST | NXP USA Inc. |
Description: S32K312, 2MB FLASH, SINGLECORE Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART Peripherals: DMA, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 |
товар відсутній |
||||||||||||||||||
|
|
S32K341NHT0VPASR | NXP USA Inc. |
Description: S32K341, 1MB FLASH, 256KB RAM, A Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||||||
|
|
S32K341NHT0VPAST | NXP USA Inc. |
Description: S32K341, 1MB FLASH, 256KB RAM, A Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||||||
| S32K341NHT0MPAST | NXP USA Inc. |
Description: S32K341,1MB FLASH, 256KB RAM, AS Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 100-MaxQFP (10x10) |
товар відсутній |
||||||||||||||||||
| S32K341NHT0MPASR | NXP USA Inc. |
Description: S32K341, 1MB FLASH, 256KB RAM, A Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 100-MaxQFP (10x10) |
товар відсутній |
||||||||||||||||||
| S32K322NHT0MPBST | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 172QFP Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 |
товар відсутній |
||||||||||||||||||
| S32K322EHT0VPBST | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 172QFP Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
| S32K341NHT0VPBST | NXP USA Inc. |
Description: S32K341, 1MB FLASH, 256KB RAM Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 |
товар відсутній |
||||||||||||||||||
| S32K342NHT0MPBST | NXP USA Inc. |
Description: S32K342, 2MB FLASH, LOCKSTEP COR Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 |
товар відсутній |
||||||||||||||||||
| S32K322NHT0MPASR | NXP USA Inc. |
Description: S32K322, 2MB FLASH, 256KB RAM Packaging: Tape & Reel (TR) |
товар відсутній |
||||||||||||||||||
| S32K322NHT0MPAST | NXP USA Inc. |
Description: S32K322, 2MB FLASH, 256KB RAM Packaging: Tray |
товар відсутній |
||||||||||||||||||
| S32K342NHT0VPBST | NXP USA Inc. |
Description: S32K342, 2MB FLASH, 256KB RAM Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 |
товар відсутній |
||||||||||||||||||
| S32K342NHT0VPAST | NXP USA Inc. |
Description: S32K342, 2MB FLASH, ARM M7 Packaging: Tray |
товар відсутній |
||||||||||||||||||
| S32K342NHT0VPASR | NXP USA Inc. |
Description: S32K342, 2MB FLASH, ARM M7 Packaging: Tape & Reel (TR) |
товар відсутній |
||||||||||||||||||
| S32K322EHT0MPBIR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 172QFP Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
| S32K322EHT0MPBIT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 172QFP Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
| S32K314NHT1VPBST | NXP USA Inc. |
Description: S32K314 ARM CORTEX-M7, 160 MHZ, Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I²S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 |
товар відсутній |
||||||||||||||||||
| S32K314NHT1MPBST | NXP USA Inc. |
Description: S32K344 PHANTOM, 172 MAXQFP Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I²S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 |
товар відсутній |
||||||||||||||||||
| S32K314NHT1VMMST | NXP USA Inc. |
Description: S32K314 ARM CORTEX-M7, 160 MHZ, Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I²S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 218 |
товар відсутній |
||||||||||||||||||
| S32K342NHT0MPAST | NXP USA Inc. |
Description: S32K342, 2MB FLASH, ARM M7 Packaging: Tray |
товар відсутній |
||||||||||||||||||
| GTL2014PWZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 14-TSSOP Channel Type: Bidirectional Output Signal: GTL Translator Type: Mixed Signal Channels per Circuit: 4 Input Signal: LVTTL Number of Circuits: 1 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
| GTL2014PWZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 14-TSSOP Channel Type: Bidirectional Output Signal: GTL Translator Type: Mixed Signal Channels per Circuit: 4 Input Signal: LVTTL Number of Circuits: 1 |
на замовлення 4005 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
| GTL2034PWZ | NXP USA Inc. |
Description: IC BUS BUFFER 3.6V 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Bus Buffer Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: -, 40mA Supplier Device Package: 14-TSSOP |
товар відсутній |
||||||||||||||||||
 |
GTL2010PW,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 24TSSOP Packaging: Bulk Features: Auto-Direction Sensing Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-TSSOP Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 10 Voltage - VCCA: 1 V ~ 5.5 V Voltage - VCCB: 1 V ~ 5.5 V Number of Circuits: 1 |
на замовлення 314 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
S9S12G64AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 1250 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
FRDM-MC-LVBLDC | NXP USA Inc. |
Description: FREESCALE FREEDOM DEVELOPMENT BO Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: FAN7888 Supplied Contents: Board(s) Primary Attributes: Motors (BLDC) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
S912XDG128F2CAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||||
| P2040NSN1MMB | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA Packaging: Tray Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) |
товар відсутній |
||||||||||||||||||
 |
MC9S08AC128MFUE | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||||
 |
TDA6111Q/N4,112 | NXP USA Inc. |
Description: IC AMP GENERAL PURPOSE DBS9MPF Packaging: Tube Package / Case: 9-SIP Exposed Tab, Formed Leads Mounting Type: Through Hole Applications: General Purpose Slew Rate: 3000V/µs Supplier Device Package: DBS9MPF Number of Circuits: 1 Current - Supply: 9 mA Current - Output / Channel: 10 A -3db Bandwidth: 16 MHz |
товар відсутній |
|||||||||||||||||
| KW45Z41052AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
 |
KW45Z41052AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 48-HVQFN (7x7) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||||||
| KW45Z41053AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
| KW45Z41082AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 1MB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
|
|
KW45Z41053AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 48-HVQFN (7x7) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||||||
| KW45B41Z52AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
|
|
KW45Z41082AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 1MB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 48-HVQFN (7x7) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||||||
| KW45Z41083AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 1MB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
| KW45B41Z53AFPBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 512kB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
||||||||||||||||||
|
|
KW45Z41083AFTBR | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 1MB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 4.1mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 4.6mA ~ 22.4mA Supplier Device Package: 48-HVQFN (7x7) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, I2C, PWM, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||||||||||||||
| MVR5510AMMALESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
товар відсутній |
||||||||||||||||||
| MVR5510AMBALESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
товар відсутній |
||||||||||||||||||
| MVR5510AMDALESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
товар відсутній |
||||||||||||||||||
 |
MC33PF8200CLESR2 | NXP USA Inc. |
Description: PF8200 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
товар відсутній |
|||||||||||||||||
 |
MRFX1K80NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V OM1230-4 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L Mounting Type: Surface Mount Frequency: 1.8MHz ~ 470MHz Power - Output: 1800W Gain: 24dB Technology: LDMOS Supplier Device Package: OM-1230-4L Voltage - Test: 65 V |
товар відсутній |
|||||||||||||||||
|
|
MRFX1K80NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V OM1230-4 Packaging: Cut Tape (CT) Package / Case: OM-1230-4L Mounting Type: Surface Mount Frequency: 1.8MHz ~ 470MHz Power - Output: 1800W Gain: 24dB Technology: LDMOS Supplier Device Package: OM-1230-4L Voltage - Test: 65 V |
товар відсутній |
|||||||||||||||||
 |
PSMN1R7-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 100A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V Power Dissipation (Max): 164W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V |
товар відсутній |
|||||||||||||||||
 |
RPI-CAM-MIPI | NXP USA Inc. |
Description: ACCESSORY BOARD:MIPI CAMERA CARD Packaging: Box For Use With/Related Products: AP1302, AR0144 Accessory Type: Adapter Board |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
| S32K322NHT0VPBST |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
на замовлення 418 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1065.18 грн |
| 10+ | 949.59 грн |
| 25+ | 936.73 грн |
| 40+ | 868.03 грн |
| 80+ | 760.71 грн |
| S32K322EHT0MPAST |
|
Виробник: NXP USA Inc.
Description: S32K322, 2MB FLASH, 256K SRAM
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K322, 2MB FLASH, 256K SRAM
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 479 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1122.97 грн |
| 10+ | 1000.77 грн |
| 25+ | 987.19 грн |
| 40+ | 914.79 грн |
| 80+ | 801.69 грн |
| 230+ | 767.32 грн |
| S32K341EHT0MPAST |
|
Виробник: NXP USA Inc.
Description: S32K341, 1MB FLASH, LOCKSTEP COR
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K341, 1MB FLASH, LOCKSTEP COR
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 456 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1138.93 грн |
| 10+ | 1015.12 грн |
| 25+ | 1001.31 грн |
| 40+ | 927.86 грн |
| 80+ | 813.14 грн |
| 230+ | 778.28 грн |
| S32K344-WB |
|
Виробник: NXP USA Inc.
Description: S32K344-WB
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Description: S32K344-WB
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 59632.02 грн |
| S32K311NHT0MLFST |
|
Виробник: NXP USA Inc.
Description: S32K311, CES, 48 LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K311, CES, 48 LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1176 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 550.46 грн |
| 10+ | 487.83 грн |
| 25+ | 477.68 грн |
| 40+ | 446.73 грн |
| 80+ | 400.85 грн |
| 230+ | 388.73 грн |
| 440+ | 363.59 грн |
| S32K311NHT0VLFSR |
|
товар відсутній
| S32K311NHT0VPAST |
Виробник: NXP USA Inc.
Description: S32K311, CES, 100 MAXQFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Description: S32K311, CES, 100 MAXQFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
товар відсутній
| S32K311NHT0MPAST |
|
Виробник: NXP USA Inc.
Description: S32K311, CES, 100 MAXQFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K311, CES, 100 MAXQFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2050 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 669.07 грн |
| 10+ | 592.3 грн |
| 25+ | 580.03 грн |
| 40+ | 542.46 грн |
| 80+ | 486.74 грн |
| 230+ | 472.03 грн |
| 480+ | 441.5 грн |
| 960+ | 426.11 грн |
| S32K312NHT0MPAST |
Виробник: NXP USA Inc.
Description: S32K312 ARM CORTEX-M7, 120 MHZ,
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Description: S32K312 ARM CORTEX-M7, 120 MHZ,
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
товар відсутній
| S32K312NHT0VPBSR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
товар відсутній
| S32K312NHT0MPAIT |
Виробник: NXP USA Inc.
Description: S32K312, 2MB FLASH, ISELED
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Description: S32K312, 2MB FLASH, ISELED
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
товар відсутній
| S32K312NVT0MPBST |
Виробник: NXP USA Inc.
Description: S32K312, 2MB FLASH, SINGLECORE
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Description: S32K312, 2MB FLASH, SINGLECORE
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
товар відсутній
| S32K341NHT0VPASR |
|
Виробник: NXP USA Inc.
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32K341NHT0VPAST |
|
Виробник: NXP USA Inc.
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32K341NHT0MPAST |
Виробник: NXP USA Inc.
Description: S32K341,1MB FLASH, 256KB RAM, AS
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Description: S32K341,1MB FLASH, 256KB RAM, AS
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
товар відсутній
| S32K341NHT0MPASR |
Виробник: NXP USA Inc.
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Description: S32K341, 1MB FLASH, 256KB RAM, A
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
товар відсутній
| S32K322NHT0MPBST |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
товар відсутній
| S32K322EHT0VPBST |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32K341NHT0VPBST |
Виробник: NXP USA Inc.
Description: S32K341, 1MB FLASH, 256KB RAM
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Description: S32K341, 1MB FLASH, 256KB RAM
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
товар відсутній
| S32K342NHT0MPBST |
Виробник: NXP USA Inc.
Description: S32K342, 2MB FLASH, LOCKSTEP COR
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Description: S32K342, 2MB FLASH, LOCKSTEP COR
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
товар відсутній
| S32K322NHT0MPASR |
товар відсутній
| S32K322NHT0MPAST |
товар відсутній
| S32K342NHT0VPBST |
Виробник: NXP USA Inc.
Description: S32K342, 2MB FLASH, 256KB RAM
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Description: S32K342, 2MB FLASH, 256KB RAM
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, I³C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
товар відсутній
| S32K342NHT0VPAST |
товар відсутній
| S32K342NHT0VPASR |
товар відсутній
| S32K322EHT0MPBIR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32K322EHT0MPBIT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32K314NHT1VPBST |
Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
товар відсутній
| S32K314NHT1MPBST |
Виробник: NXP USA Inc.
Description: S32K344 PHANTOM, 172 MAXQFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Description: S32K344 PHANTOM, 172 MAXQFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
товар відсутній
| S32K314NHT1VMMST |
Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
товар відсутній
| S32K342NHT0MPAST |
товар відсутній
| GTL2014PWZ |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 35.15 грн |
| GTL2014PWZ |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Output Signal: GTL
Translator Type: Mixed Signal
Channels per Circuit: 4
Input Signal: LVTTL
Number of Circuits: 1
на замовлення 4005 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 82.87 грн |
| 10+ | 71.31 грн |
| 25+ | 67.71 грн |
| 100+ | 52.18 грн |
| 250+ | 48.78 грн |
| 500+ | 43.11 грн |
| 1000+ | 33.47 грн |
| GTL2034PWZ |
Виробник: NXP USA Inc.
Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
товар відсутній
| GTL2010PW,118 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Bulk
Features: Auto-Direction Sensing
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
на замовлення 314 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 314+ | 68.06 грн |
| S9S12G64AMLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 503.32 грн |
| 10+ | 381.01 грн |
| 80+ | 315.44 грн |
| 1250+ | 258.2 грн |
| FRDM-MC-LVBLDC |
|
Виробник: NXP USA Inc.
Description: FREESCALE FREEDOM DEVELOPMENT BO
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: FAN7888
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Description: FREESCALE FREEDOM DEVELOPMENT BO
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: FAN7888
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3519.44 грн |
| S912XDG128F2CAA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
| P2040NSN1MMB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
товар відсутній
| MC9S08AC128MFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
| TDA6111Q/N4,112 |
|
Виробник: NXP USA Inc.
Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: General Purpose
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz
Description: IC AMP GENERAL PURPOSE DBS9MPF
Packaging: Tube
Package / Case: 9-SIP Exposed Tab, Formed Leads
Mounting Type: Through Hole
Applications: General Purpose
Slew Rate: 3000V/µs
Supplier Device Package: DBS9MPF
Number of Circuits: 1
Current - Supply: 9 mA
Current - Output / Channel: 10 A
-3db Bandwidth: 16 MHz
товар відсутній
| KW45Z41052AFPBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41052AFTBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41053AFPBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41082AFPBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41053AFTBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45B41Z52AFPBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41082AFTBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41083AFPBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45B41Z53AFPBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| KW45Z41083AFTBR |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MVR5510AMMALESR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
| MVR5510AMBALESR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
| MVR5510AMDALESR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
| MC33PF8200CLESR2 |
Виробник: NXP USA Inc.
Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
| MRFX1K80NR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
товар відсутній
| MRFX1K80NR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
товар відсутній
| PSMN1R7-25YLC,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
товар відсутній
| RPI-CAM-MIPI |
|
Виробник: NXP USA Inc.
Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8738.15 грн |