Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35279) > Сторінка 514 з 588
| Фото | Назва | Виробник | Інформація |
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| BUK7E3R1-40E,127-NXP | NXP USA Inc. |
Description: PFET, 100A I(D), 40V, 0.0031OHM, Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V Power Dissipation (Max): 234W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V |
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ON5233,118 | NXP USA Inc. |
Description: RF MOSFET SOT428 DPAK Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Supplier Device Package: DPAK |
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P1010NSN5HFB | NXP USA Inc. |
 Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGAPackaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
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| BZX585-C36115 | NXP USA Inc. |
Description: NOW NEXPERIA BZX585-C36 ZENER DI Packaging: Bulk Tolerance: ±5% Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 36 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOD-523 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V |
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74HC85D,652 | NXP USA Inc. |
Description: IC COMPARATOR MAG 4BIT 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Output: Active High Type: Magnitude Comparator Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: 16-SO Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF Output Function: A Number of Bits: 4 |
на замовлення 14717 шт: термін постачання 21-31 дні (днів) |
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| 74ALVCH16843DGG653 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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| 74ALVCH16843DGG518 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk |
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MC908JK3EMDWE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 DigiKey Programmable: Not Verified |
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| TDF8541JV/N3ZU | NXP USA Inc. |
Description: TDF8541JV Packaging: Tube Package / Case: 27-SIP, Formed Leads Supplier Device Package: DBS27P Mounting Type: Through Hole |
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TJA1103AHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 36HVQFN Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Type: Transceiver Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: IEEE 802.3 Supplier Device Package: 36-HVQFN (6x6) Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
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TJA1103AHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 36HVQFN Packaging: Cut Tape (CT) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Type: Transceiver Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: IEEE 802.3 Supplier Device Package: 36-HVQFN (6x6) Duplex: Full Grade: Automotive Qualification: AEC-Q100 |
на замовлення 2355 шт: термін постачання 21-31 дні (днів) |
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| OM13053UL | NXP USA Inc. |
Description: LPC812-LPCXPRESSO BOARD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: LPC812 Platform: LPCXpresso™ |
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NCK2910AHN/10203Y | NXP USA Inc. |
Description: NCK2910AHN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
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NCK2910AHN/10203Y | NXP USA Inc. |
Description: NCK2910AHN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
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| FRDM-XS2410EVB | NXP USA Inc. |
Description: FRDM EXP BOARD XS2410 Packaging: Bulk Function: Voltage Reference Type: Power Management Utilized IC / Part: XS2410EVB Supplied Contents: Board(s) |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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MC34PF8100EREPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PR Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
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MC68332AVEH20 | NXP USA Inc. |
Description: MC68332 - MICROCONTROLLER, 32-BI Packaging: Bulk DigiKey Programmable: Not Verified |
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MC68332GCAG16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 16MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 15 DigiKey Programmable: Not Verified |
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MC68332GVAG25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 25MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 15 DigiKey Programmable: Not Verified |
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MC68332AMEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
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MC68332AVEH20 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 20MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
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MC68332GVEH25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 25MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
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MC33797BPEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 32-SOIC |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MC33797BPEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 32-SOIC |
на замовлення 1185 шт: термін постачання 21-31 дні (днів) |
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MC33797BPEW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 32-SOIC |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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| PN7642EV/C100Y | NXP USA Inc. |
Description: SINGLE-CHIP SOLUTION WITH HIGH-P Packaging: Tape & Reel (TR) Package / Case: 64-VFBGA Mounting Type: Surface Mount Interface: I²C, SPI, UART, USB Type: RFID Reader Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.5V Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092 Supplier Device Package: 64-VFBGA (4.5x4.5) |
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| PN7642EV/C100K | NXP USA Inc. |
Description: SINGLE-CHIP SOLUTION WITH HIGH-P Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Interface: I²C, SPI, UART, USB Type: RFID Reader Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V ~ 3.5V Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092 Supplier Device Package: 64-VFBGA (4.5x4.5) |
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| OM27642DB | NXP USA Inc. |
Description: DEVELOPMENT BOARD Packaging: Bulk For Use With/Related Products: PN7642 Type: Near Field Communication (NFC) Supplied Contents: Board(s), Accessories |
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| OM27642EVK | NXP USA Inc. |
Description: DEVELOPMENT KIT Packaging: Bulk For Use With/Related Products: PN7642 Type: Near Field Communication (NFC) Supplied Contents: Board(s), Cable(s) |
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PN7462AUEV/C300Y | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 64VFBGA Packaging: Tape & Reel (TR) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C, SPI, UART, USB Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
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| ISI-QMC-DB02 | NXP USA Inc. |
Description: INTERFACE DEVELOPMENT TOOLS ISI- Packaging: Bulk Function: Expansion Board Type: Interface Contents: Board(s) Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x |
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XC7SH86GV,125 | NXP USA Inc. |
Description: NOW NEXPERIA XC7SH86GV - XOR GAT Packaging: Bulk Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 5-TSOP Input Logic Level - High: 1.5V ~ 3.85V Input Logic Level - Low: 0.5V ~ 1.65V Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 1 µA |
на замовлення 147000 шт: термін постачання 21-31 дні (днів) |
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FRDMDUAL33664EVB | NXP USA Inc. |
Description: FRDMDUAL33664EVB Packaging: Bulk Function: Transceiver Type: Interface Utilized IC / Part: MC33664 Supplied Contents: Board(s) Primary Attributes: Isolated Embedded: Yes, MCU |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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PBLS1503V,115 | NXP USA Inc. |
Description: NEXPERIA PBLS1503V - SMALL SIGNA Packaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 300mW Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 15V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V Frequency - Transition: 280MHz Resistor - Base (R1): 10kOhms Resistor - Emitter Base (R2): 10kOhms Supplier Device Package: SOT-666 |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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PBLS1502V,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP SOT666 Packaging: Cut Tape (CT) Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 300mW Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 15V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 100mA, 2V Frequency - Transition: 280MHz Resistor - Base (R1): 4.7kOhms Resistor - Emitter Base (R2): 4.7kOhms Supplier Device Package: SOT-666 |
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MC32PF4210A3ESR2 | NXP USA Inc. |
Description: PF4210 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
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S9S08DV16F2MLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
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MKE16F512VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 450 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Y1CVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: CAN, I2C, SPI, UART |
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| MIMXRT595SFAWCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 141WLCSP Packaging: Tape & Reel (TR) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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SPC5744PK1AMMM9 | NXP USA Inc. |
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
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SPC5746CHK0AMMH6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Packaging: Bulk Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) DigiKey Programmable: Not Verified |
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SPC5746CHK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
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| T1022NSE7WQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
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| T4161NSN7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART |
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MCIMX6G1AVM07AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 696MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
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MKV31F512VLL12P | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 70 DigiKey Programmable: Not Verified |
товар відсутній |
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LS1043AXN7QQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
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| MRF377HR3 | NXP USA Inc. |
Description: FET RF 65V 860MHZ NI-860C Packaging: Tape & Reel (TR) Package / Case: NI-860C3 Current Rating (Amps): 17A Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 45W Gain: 18.2dB Technology: LDMOS Supplier Device Package: NI-860C3 Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 2 A |
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| MCIMX6G1AVM07AA557 | NXP USA Inc. |
Description: CORTEX A7 RISC MPU 32 BIT Packaging: Bulk |
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| MCIMX6Y1DVM05AA557 | NXP USA Inc. |
Description: I.MX 32 BIT MPU, ARM CORTEX A7 C Packaging: Bulk |
товар відсутній |
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MCIMX6G2DVK05AA557-NXP | NXP USA Inc. |
Description: I.MX 32 BIT MPU, ARM CORTEX A7 C Packaging: Bulk |
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| MCIMX6G0DVM05AA557 | NXP USA Inc. |
Description: CORTEX A7 RISC MICROPROCESSOR 32 Packaging: Bulk |
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UBA2024T/N1,518 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 900mA Current - Supply: 5 mA |
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UBA2024T/N1,518 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 900mA Current - Supply: 5 mA |
на замовлення 4413 шт: термін постачання 21-31 дні (днів) |
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UBA2024AP/N1,112 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 1.35A Current - Supply: 5 mA |
на замовлення 1875 шт: термін постачання 21-31 дні (днів) |
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UBA2024AP/N1,112 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 1.35A Current - Supply: 5 mA |
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UBA2024AT/N1,518 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 1.2A Current - Supply: 5 mA |
товар відсутній |
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UBA2024BP/N1,112 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 2.5A Current - Supply: 5 mA |
на замовлення 400 шт: термін постачання 21-31 дні (днів) |
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UBA2024BP/N1,112 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 2.5A Current - Supply: 5 mA |
товар відсутній |
| BUK7E3R1-40E,127-NXP |
Виробник: NXP USA Inc.
Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
Description: PFET, 100A I(D), 40V, 0.0031OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 234W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 79 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6200 pF @ 25 V
товар відсутній
| ON5233,118 |
Виробник: NXP USA Inc.
Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Description: RF MOSFET SOT428 DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Supplier Device Package: DPAK
товар відсутній
| P1010NSN5HFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
товар відсутній
| BZX585-C36115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX585-C36 ZENER DI
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Description: NOW NEXPERIA BZX585-C36 ZENER DI
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOD-523
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
товар відсутній
| 74HC85D,652 |
|
Виробник: NXP USA Inc.
Description: IC COMPARATOR MAG 4BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Description: IC COMPARATOR MAG 4BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: A
Number of Bits: 4
на замовлення 14717 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1268+ | 16.85 грн |
| 74ALVCH16843DGG653 |
|
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 423+ | 53.98 грн |
| 74ALVCH16843DGG518 |
|
товар відсутній
| MC908JK3EMDWE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
товар відсутній
| TDF8541JV/N3ZU |
Виробник: NXP USA Inc.
Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Supplier Device Package: DBS27P
Mounting Type: Through Hole
Description: TDF8541JV
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Supplier Device Package: DBS27P
Mounting Type: Through Hole
товар відсутній
| TJA1103AHN/0Z |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| TJA1103AHN/0Z |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2355 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 225.81 грн |
| 10+ | 195.63 грн |
| 25+ | 184.94 грн |
| 100+ | 150.41 грн |
| 250+ | 142.7 грн |
| 500+ | 128.05 грн |
| 1000+ | 106.22 грн |
| OM13053UL |
Виробник: NXP USA Inc.
Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
Description: LPC812-LPCXPRESSO BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC812
Platform: LPCXpresso™
товар відсутній
| NCK2910AHN/10203Y |
Виробник: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6000+ | 206.18 грн |
| NCK2910AHN/10203Y |
Виробник: NXP USA Inc.
Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
Description: NCK2910AHN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 320.85 грн |
| 10+ | 280.34 грн |
| 25+ | 274.23 грн |
| 50+ | 255.95 грн |
| 100+ | 229.49 грн |
| 250+ | 228.66 грн |
| 500+ | 216.69 грн |
| 1000+ | 206.01 грн |
| FRDM-XS2410EVB |
|
Виробник: NXP USA Inc.
Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
Description: FRDM EXP BOARD XS2410
Packaging: Bulk
Function: Voltage Reference
Type: Power Management
Utilized IC / Part: XS2410EVB
Supplied Contents: Board(s)
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7020.63 грн |
| MC34PF8100EREPR2 |
|
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товар відсутній
| MC68332AVEH20 |
|
Виробник: NXP USA Inc.
Description: MC68332 - MICROCONTROLLER, 32-BI
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MC68332 - MICROCONTROLLER, 32-BI
Packaging: Bulk
DigiKey Programmable: Not Verified
товар відсутній
| MC68332GCAG16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
товар відсутній
| MC68332GVAG25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
товар відсутній
| MC68332AMEH16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
товар відсутній
| MC68332AVEH20 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
товар відсутній
| MC68332GVEH25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
товар відсутній
| MC33797BPEWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 495.37 грн |
| MC33797BPEWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
на замовлення 1185 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 781.59 грн |
| 10+ | 692.17 грн |
| 25+ | 663.53 грн |
| 100+ | 548.64 грн |
| 250+ | 521.72 грн |
| 500+ | 488.06 грн |
| MC33797BPEW |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 32-SOIC
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 793 грн |
| 10+ | 702.05 грн |
| PN7642EV/C100Y |
Виробник: NXP USA Inc.
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
товар відсутній
| PN7642EV/C100K |
Виробник: NXP USA Inc.
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: SINGLE-CHIP SOLUTION WITH HIGH-P
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.5V
Standards: FeliCa, ISO 14443, ISO 14443-A, ISO 15693-B, ISO 18092
Supplier Device Package: 64-VFBGA (4.5x4.5)
товар відсутній
| OM27642DB |
Виробник: NXP USA Inc.
Description: DEVELOPMENT BOARD
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Accessories
Description: DEVELOPMENT BOARD
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Accessories
товар відсутній
| OM27642EVK |
Виробник: NXP USA Inc.
Description: DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Cable(s)
Description: DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: PN7642
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Cable(s)
товар відсутній
| PN7462AUEV/C300Y |
|
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 64VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: IC RFID READER 13.56MHZ 64VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART, USB
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
товар відсутній
| ISI-QMC-DB02 |
|
Виробник: NXP USA Inc.
Description: INTERFACE DEVELOPMENT TOOLS ISI-
Packaging: Bulk
Function: Expansion Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
Description: INTERFACE DEVELOPMENT TOOLS ISI-
Packaging: Bulk
Function: Expansion Board
Type: Interface
Contents: Board(s)
Utilized IC / Part: NAFE13388, PCT2075, PN7462, SE05x, TJA146x
товар відсутній
| XC7SH86GV,125 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Description: NOW NEXPERIA XC7SH86GV - XOR GAT
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 8.8ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
на замовлення 147000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1679+ | 13.69 грн |
| FRDMDUAL33664EVB |
|
Виробник: NXP USA Inc.
Description: FRDMDUAL33664EVB
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: Yes, MCU
Description: FRDMDUAL33664EVB
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: Yes, MCU
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25567.44 грн |
| PBLS1503V,115 |
|
Виробник: NXP USA Inc.
Description: NEXPERIA PBLS1503V - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
Description: NEXPERIA PBLS1503V - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3806+ | 5.56 грн |
| PBLS1502V,115 |
|
Виробник: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP SOT666
Packaging: Cut Tape (CT)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 4.7kOhms
Supplier Device Package: SOT-666
Description: TRANS NPN PREBIAS/PNP SOT666
Packaging: Cut Tape (CT)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 4.7kOhms
Supplier Device Package: SOT-666
товар відсутній
| MC32PF4210A3ESR2 |
|
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
товар відсутній
| S9S08DV16F2MLF |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
| MKE16F512VLL16 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 843.94 грн |
| 10+ | 638.36 грн |
| 90+ | 528.48 грн |
| MCIMX6Y1CVK05AA |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: CAN, I2C, SPI, UART
товар відсутній
| MIMXRT595SFAWCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6000+ | 1125.21 грн |
| SPC5744PK1AMMM9 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5746CHK0AMMH6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Bulk
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5746CHK0AMMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| T1022NSE7WQB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.5GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
товар відсутній
| T4161NSN7PQB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
товар відсутній
| MCIMX6G1AVM07AA |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 696MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 696MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
| MKV31F512VLL12P |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
товар відсутній
| LS1043AXN7QQA |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товар відсутній
| MRF377HR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 860MHZ NI-860C
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
Description: FET RF 65V 860MHZ NI-860C
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Current Rating (Amps): 17A
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 45W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 2 A
товар відсутній
| MCIMX6G1AVM07AA557 |
|
товар відсутній
| MCIMX6Y1DVM05AA557 |
|
товар відсутній
| MCIMX6G0DVM05AA557 |
|
товар відсутній
| UBA2024T/N1,518 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
товар відсутній
| UBA2024T/N1,518 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Current - Supply: 5 mA
на замовлення 4413 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 376+ | 56.17 грн |
| UBA2024AP/N1,112 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
на замовлення 1875 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 290+ | 74.84 грн |
| UBA2024AP/N1,112 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 1.35A
Current - Supply: 5 mA
товар відсутній
| UBA2024AT/N1,518 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.2A
Current - Supply: 5 mA
товар відсутній
| UBA2024BP/N1,112 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
на замовлення 400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 290+ | 74.84 грн |
| UBA2024BP/N1,112 |
|
Виробник: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
товар відсутній