Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35267) > Сторінка 575 з 588
| Фото | Назва | Виробник | Інформація |
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BZV85-C15,113 | NXP USA Inc. |
 Description: DIODE ZENER 15V 1.3W DO41Packaging: Bulk |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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MC34119D | NXP USA Inc. |
Description: IC AMP CLASS AB MONO 400MW 8SOIC Packaging: Tube Features: Shutdown Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -20°C ~ 70°C (TA) Voltage - Supply: 2V ~ 16V, ±1V ~ 8V Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm Supplier Device Package: 8-SOIC |
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2PA1774Q,115 | NXP USA Inc. |
Description: TRANS PNP 50V 0.15A SC75 Packaging: Bulk Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Frequency - Transition: 100MHz Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 150 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 150 mW |
на замовлення 21655 шт: термін постачання 21-31 дні (днів) |
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| MGD3162AM550EKR2 | NXP USA Inc. |
Description: GATE DRIVER Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Technology: Magnetic Coupling Voltage - Isolation: 8000Vrms Approval Agency: UL, VDE Supplier Device Package: 32-SOIC Common Mode Transient Immunity (Min): 100V/ns Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 12V ~ 25V Qualification: AEC-Q100 |
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| MGD3162AM550EKR2 | NXP USA Inc. |
Description: GATE DRIVER Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Technology: Magnetic Coupling Voltage - Isolation: 8000Vrms Approval Agency: UL, VDE Supplier Device Package: 32-SOIC Common Mode Transient Immunity (Min): 100V/ns Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 12V ~ 25V Qualification: AEC-Q100 |
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MGD3162AM550EKT | NXP USA Inc. |
Description: GATE DRIVER Packaging: Tray Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Technology: Magnetic Coupling Approval Agency: VDE Supplier Device Package: 32-SOIC Common Mode Transient Immunity (Min): 100V/ns Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 0.3V ~ 25V Qualification: AEC-Q100 |
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| P3T1108UK-ARD | NXP USA Inc. |
Description: P3T1108UK-ARD Packaging: Bulk |
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| FRDM-STBA-A8961 | NXP USA Inc. |
Description: IC Packaging: Bulk |
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S912ZVC19AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
на замовлення 1250 шт: термін постачання 21-31 дні (днів) |
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74HC193D,653 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC193D - BINARY C Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up, Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 49 MHz Number of Bits per Element: 4 |
на замовлення 9151 шт: термін постачання 21-31 дні (днів) |
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| KITFS24SKTFDMEVM | NXP USA Inc. |
Description: Programming Socket Board Packaging: Tray Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS2400 Supplied Contents: Board(s), Cable(s), Accessories Primary Attributes: 40V Supply Embedded: Yes, MCU |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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74HCT280D,653 | NXP USA Inc. |
Description: IC PARITY GEN/CHKER 9BIT 14SOIC Packaging: Bulk |
на замовлення 1779 шт: термін постачання 21-31 дні (днів) |
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MCIMX6D4AVT10AC | NXP USA Inc. |
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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MMA8451QT | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Packaging: Bulk Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g) |
на замовлення 6375 шт: термін постачання 21-31 дні (днів) |
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LPC1345FHN33,551 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 32KB (32K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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MCF51QM64VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 2x16b, 12x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 35 DigiKey Programmable: Not Verified |
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LPC4330FBD144Y | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 |
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| A3G26H502W17SR3 | NXP USA Inc. |
Description: RF MOSFET GAN 48V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4S2S Mounting Type: Chassis Mount Frequency: 2.496GHz ~ 2.69GHz Configuration: 2 N-Channel Power - Output: 80W Gain: 13.1dB Technology: GaN Supplier Device Package: NI-780-4S2S Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 370 mA |
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MPC860DTCZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
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| C9KEAZ128AMLHR | NXP USA Inc. |
Description: IC Packaging: Bulk |
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TEA2376AT/1J | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 22V Frequency - Switching: 25kHz ~ 300kHz Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM) Supplier Device Package: 10-SO |
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MX8-DSI-OLED1 | NXP USA Inc. |
Description: MIPI-DSI 1080P OLED DISPLAY Packaging: Box Function: OLED Type: Display Contents: Board(s) Utilized IC / Part: i.MX 8M Mini |
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S912ZVML12F3WKHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 DigiKey Programmable: Not Verified |
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| 88MW322-A0-NXUE/AZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 88HVQFN Packaging: Tape & Reel (TR) Package / Case: 88-VFQFN Exposed Pad Sensitivity: -96.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB RAM, 128kB ROM Type: TxRx + MCU Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 4.4V ~ 5.25V Power - Output: 26dBm Protocol: 802.11n/g/b, Bluetooth Current - Receiving: 29.3mA ~ 45.2mA Data Rate (Max): 72.2Mbps Current - Transmitting: 27.6mA ~ 183.3mA Supplier Device Package: 88-HVQFN (10x10) GPIO: 50 Modulation: DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART |
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| MC33FS6516CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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| MC33FS6516CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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S9S12G48BMLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
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S9S12G48BMLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
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S9S12G96ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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S9S12G96AVLFR | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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S9S12G96AVLF | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 3K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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| IW624HN/A0ZMCSMP | NXP USA Inc. |
Description: IC Packaging: Bulk |
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BF1100R,215 | NXP USA Inc. |
Description: RF MOSFET 9V SOT143R Packaging: Bulk Package / Case: SOT-143R Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: SOT-143R Voltage - Rated: 14 V Voltage - Test: 9 V Current - Test: 10 mA |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| LFVBSK77CZZA | NXP USA Inc. |
Description: QORIVVA MPC5777C 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5777C Accessory Type: Base Board |
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S9S12GN48AMLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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S9S12G64ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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S912ZVCA19F1WKH | NXP USA Inc. |
Description: S12Z, 64LQFP-EP, 192K FLASH Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 16x12b SAR; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 42 |
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| S9S12G48J0CLH | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
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| LFVBSK77CZZ1A | NXP USA Inc. |
Description: QORIVVA MPC5777C 522 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5777C Accessory Type: Base Board |
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| LFBGARBY2AO | NXP USA Inc. |
Description: SURFACE MOUNT PGA SOCKET FOR 437 Packaging: Bulk Module/Board Type: Socket Module - PGA |
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| C9KEAZ128AMLH | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 71 |
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| NCF2951MTT/T0E08AJ | NXP USA Inc. |
Description: IC PASS ENTRY 125KHZ Packaging: Tape & Reel (TR) Frequency: 125kHz Interface: SPI Type: Passive Entry/Start |
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74AUP2G38GM,125 | NXP USA Inc. |
Description: IC GATE NAND 2CH 2-INP 8-XQFN Packaging: Bulk Features: Open Drain Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: -, 4mA Number of Inputs: 2 Supplier Device Package: 8-XQFN (1.6x1.6) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 12.7ns @ 3.3V, 30pF Number of Circuits: 2 Current - Quiescent (Max): 500 nA |
на замовлення 47280 шт: термін постачання 21-31 дні (днів) |
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K32W041AY | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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K32W041AMY | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| S912ZVMAL1F0WLFR | NXP USA Inc. |
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S12Z Data Converters: A/D 7x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
товар відсутній |
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| SPC5603BAMLH6R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0 Data Converters: A/D 36x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, FlexRay, LINbus, SCI, SPI Peripherals: POR, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 |
товар відсутній |
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| SPC5603BAMLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0 Data Converters: A/D 36x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, FlexRay, LINbus, SCI, SPI Peripherals: POR, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 |
товар відсутній |
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TJA1028TK/5V0/20AZ | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 825 шт: термін постачання 21-31 дні (днів) |
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BYW29E-100,127 | NXP USA Inc. |
Description: DIODE FAST REC 100V 8A TO220AC Packaging: Bulk |
на замовлення 5691 шт: термін постачання 21-31 дні (днів) |
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MRF6VP11KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230S-4 GW Mounting Type: Chassis Mount Frequency: 130MHz Configuration: Dual Power - Output: 1000W Gain: 26dB Technology: LDMOS Supplier Device Package: NI-1230S-4 GULL Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
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MRF6VP11KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: NI-1230S-4 GW Mounting Type: Chassis Mount Frequency: 130MHz Configuration: Dual Power - Output: 1000W Gain: 26dB Technology: LDMOS Supplier Device Package: NI-1230S-4 GULL Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 150 mA |
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MK22FX512VMC12R | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 121MAPBGA Packaging: Tape & Reel (TR) Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 64 DigiKey Programmable: Not Verified |
товар відсутній |
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MK22FX512VMC12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 64 DigiKey Programmable: Not Verified |
товар відсутній |
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74HCT1G04GV,125 | NXP USA Inc. |
Description: IC INVERTER 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 2mA, 2mA Number of Inputs: 1 Supplier Device Package: 5-TSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 10ns @ 4.5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 20 µA |
на замовлення 342156 шт: термін постачання 21-31 дні (днів) |
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BZX79-C6V2,143 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-C6V2 - ZENER Packaging: Bulk Tolerance: ±5% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 6.2 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: ALF2 Power - Max: 400 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 4 V |
на замовлення 220000 шт: термін постачання 21-31 дні (днів) |
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| BLF871S,112 | NXP USA Inc. |
Description: TRANSISTOR RF PWR LDMOS SOT467B Packaging: Tube |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| BLS6G2731S-120,112 | NXP USA Inc. |
Description: FET RF 60V 3.1GHZ SOT502B Packaging: Tube |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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| TEA1999DB1546 | NXP USA Inc. |
Description: TEA1999DB1546 Packaging: Box DigiKey Programmable: Not Verified |
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| S32G234MSBK0VUCT | NXP USA Inc. |
Description: S32G234M ARM CORTEX-M7, HSE W/PR Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-M7 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (4) Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Graphics Acceleration: No Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
| BZV85-C15,113 |
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на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9072+ | 2.1 грн |
| MC34119D |
|
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB MONO 400MW 8SOIC
Packaging: Tube
Features: Shutdown
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
Description: IC AMP CLASS AB MONO 400MW 8SOIC
Packaging: Tube
Features: Shutdown
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-SOIC
товар відсутній
| 2PA1774Q,115 |
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Виробник: NXP USA Inc.
Description: TRANS PNP 50V 0.15A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Description: TRANS PNP 50V 0.15A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
на замовлення 21655 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13172+ | 1.4 грн |
| MGD3162AM550EKR2 |
|
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
товар відсутній
| MGD3162AM550EKR2 |
|
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
Description: GATE DRIVER
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
товар відсутній
| MGD3162AM550EKT |
|
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
Description: GATE DRIVER
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
товар відсутній
| S912ZVC19AMLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 371.79 грн |
| 10+ | 318.04 грн |
| 25+ | 311.78 грн |
| 74HC193D,653 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HC193D - BINARY C
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
Description: NOW NEXPERIA 74HC193D - BINARY C
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 49 MHz
Number of Bits per Element: 4
на замовлення 9151 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1159+ | 18.19 грн |
| KITFS24SKTFDMEVM |
|
Виробник: NXP USA Inc.
Description: Programming Socket Board
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Embedded: Yes, MCU
Description: Programming Socket Board
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Embedded: Yes, MCU
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33626.65 грн |
| 74HCT280D,653 |
|
на замовлення 1779 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1115+ | 18.95 грн |
| MCIMX6D4AVT10AC |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товар відсутній
| MMA8451QT |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Bulk
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Bulk
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
на замовлення 6375 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 199+ | 105.62 грн |
| LPC1345FHN33,551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 558.06 грн |
| 10+ | 422.01 грн |
| MCF51QM64VLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 2x16b, 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 2x16b, 12x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
товар відсутній
| LPC4330FBD144Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
товар відсутній
| A3G26H502W17SR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S2S
Mounting Type: Chassis Mount
Frequency: 2.496GHz ~ 2.69GHz
Configuration: 2 N-Channel
Power - Output: 80W
Gain: 13.1dB
Technology: GaN
Supplier Device Package: NI-780-4S2S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 370 mA
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S2S
Mounting Type: Chassis Mount
Frequency: 2.496GHz ~ 2.69GHz
Configuration: 2 N-Channel
Power - Output: 80W
Gain: 13.1dB
Technology: GaN
Supplier Device Package: NI-780-4S2S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 370 mA
товар відсутній
| MPC860DTCZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товар відсутній
| TEA2376AT/1J |
|
Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
товар відсутній
| MX8-DSI-OLED1 |
|
Виробник: NXP USA Inc.
Description: MIPI-DSI 1080P OLED DISPLAY
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
Description: MIPI-DSI 1080P OLED DISPLAY
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
товар відсутній
| S912ZVML12F3WKHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
товар відсутній
| 88MW322-A0-NXUE/AZ |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
товар відсутній
| MC33FS6516CAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC33FS6516CAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S9S12G48BMLCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
товар відсутній
| S9S12G48BMLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
товар відсутній
| S9S12G96ACLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| S9S12G96AVLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| S9S12G96AVLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| BF1100R,215 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1567+ | 13.47 грн |
| LFVBSK77CZZA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Description: QORIVVA MPC5777C 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
товар відсутній
| S9S12GN48AMLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| S9S12G64ACLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| S912ZVCA19F1WKH |
Виробник: NXP USA Inc.
Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
товар відсутній
| S9S12G48J0CLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товар відсутній
| LFVBSK77CZZ1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Description: QORIVVA MPC5777C 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
товар відсутній
| LFBGARBY2AO |
Виробник: NXP USA Inc.
Description: SURFACE MOUNT PGA SOCKET FOR 437
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Description: SURFACE MOUNT PGA SOCKET FOR 437
Packaging: Bulk
Module/Board Type: Socket Module - PGA
товар відсутній
| C9KEAZ128AMLH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
Description: IC
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
товар відсутній
| NCF2951MTT/T0E08AJ |
|
Виробник: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Packaging: Tape & Reel (TR)
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Description: IC PASS ENTRY 125KHZ
Packaging: Tape & Reel (TR)
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
товар відсутній
| 74AUP2G38GM,125 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XQFN
Packaging: Bulk
Features: Open Drain
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 12.7ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
Description: IC GATE NAND 2CH 2-INP 8-XQFN
Packaging: Bulk
Features: Open Drain
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 12.7ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
на замовлення 47280 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2036+ | 10.53 грн |
| K32W041AY |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 405.24 грн |
| 10+ | 348.06 грн |
| 25+ | 313.21 грн |
| 100+ | 267.82 грн |
| 250+ | 241.69 грн |
| 500+ | 216.87 грн |
| 1000+ | 179.9 грн |
| K32W041AMY |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 470.63 грн |
| 10+ | 404.66 грн |
| 25+ | 364.2 грн |
| 100+ | 311.42 грн |
| 250+ | 281.04 грн |
| 500+ | 252.18 грн |
| 1000+ | 209.19 грн |
| S912ZVMAL1F0WLFR |
Виробник: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
товар відсутній
| SPC5603BAMLH6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
товар відсутній
| SPC5603BAMLH6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
товар відсутній
| TJA1028TK/5V0/20AZ |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 825 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 384+ | 55.3 грн |
| BYW29E-100,127 |
|
на замовлення 5691 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 787+ | 26.67 грн |
| MRF6VP11KHR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 130MHz
Configuration: Dual
Power - Output: 1000W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 130MHz
Configuration: Dual
Power - Output: 1000W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
товар відсутній
| MRF6VP11KHR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 130MHz
Configuration: Dual
Power - Output: 1000W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 130MHz
Configuration: Dual
Power - Output: 1000W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
товар відсутній
| MK22FX512VMC12R |
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| MK22FX512VMC12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| 74HCT1G04GV,125 |
|
Виробник: NXP USA Inc.
Description: IC INVERTER 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 10ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Description: IC INVERTER 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 2mA, 2mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 10ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
на замовлення 342156 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8149+ | 2.81 грн |
| BZX79-C6V2,143 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C6V2 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 4 V
Description: NOW NEXPERIA BZX79-C6V2 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 4 V
на замовлення 220000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13172+ | 1.4 грн |
| BLF871S,112 |
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 9321.3 грн |
| BLS6G2731S-120,112 |
|
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 15147.5 грн |
| TEA1999DB1546 |
|
товар відсутній
| S32G234MSBK0VUCT |
Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній