Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35281) > Сторінка 171 з 589
Фото | Назва | Виробник | Інформація |
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SPC5517GAMMG66 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 144 DigiKey Programmable: Not Verified |
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SPC5534MVM80 | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 208MAPBGA |
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TWR-S08JE128 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08JE EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08JE Platform: Tower System Part Status: Active |
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TWR-S08JE128-KIT | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Utilized IC / Part: MC9S08JE Platform: Tower System |
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TWR-WIFI-G1011MI | NXP USA Inc. | Description: TOWER WIFI MOD- GAINSPAN |
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LPC1114FHN33/302,5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
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PK40X256VMD100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144BGA |
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PK40X256VLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144LQFP |
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PK60N256VMD100 | NXP USA Inc. | Description: IC MCU 32B 256KB FLASH 144MAPBGA |
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SPC5634MF1MLQ80 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 32x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 80 DigiKey Programmable: Not Verified |
на замовлення 290 шт: термін постачання 21-31 дні (днів) |
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SPC5634MF1MMG80 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 34x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 80 DigiKey Programmable: Not Verified |
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S9S08SG16E1MTJR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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S9S08SG4E2VTGR | NXP USA Inc. |
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MC9S08QB8CTGR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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MRF8S23120HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.3GHz Power - Output: 28W Gain: 16dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
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MRF8S23120HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.3GHz Power - Output: 28W Gain: 16dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 800 mA |
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MRF8S23120HSR3 | NXP USA Inc. | Description: FET RF 65V 2.3GHZ NI-780S |
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MRFE6VP61K25HR6 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 150 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HSR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HSR6 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-1230S Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230S Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MPXV2050GP | NXP USA Inc. |
![]() Features: Temperature Compensated Packaging: Tray Package / Case: 8-SMD, Gull Wing, Side Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: ±0.3% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 29.01PSI (200kPa) Part Status: Active |
на замовлення 121 шт: термін постачання 21-31 дні (днів) |
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MPVZ5150GC7U | NXP USA Inc. |
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MPVZ7025DP | NXP USA Inc. |
![]() Packaging: Tray Features: Temperature Compensated Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.7 V Operating Pressure: ±3.63PSI (±25kPa) Pressure Type: Differential Accuracy: ±5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.3mm) Tube, Dual Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: ±29.01PSI (±200kPa) |
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TWR-ADCDAC-LTC | NXP USA Inc. |
Description: MOD ADC DAC TOWER LINEAR TECH Packaging: Box Function: ADC, DAC Type: Data Acquisition Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471 Supplied Contents: Board(s), Cable(s) Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters Embedded: No Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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TRK-MPC5604B | NXP USA Inc. |
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LPC1224FBD48/121,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 6085 шт: термін постачання 21-31 дні (днів) |
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LPC1224FBD64/101,1 | NXP USA Inc. |
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LPC1225FBD48/301,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
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LPC1225FBD64/301,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 1280 шт: термін постачання 21-31 дні (днів) |
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LPC1225FBD64/321,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 80KB (80K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 55 DigiKey Programmable: Not Verified |
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LPC1226FBD48/301,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 460 шт: термін постачання 21-31 дні (днів) |
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LPC1226FBD64/301,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 55 DigiKey Programmable: Not Verified |
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LPC1227FBD48/301,1 | NXP USA Inc. |
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на замовлення 116 шт: термін постачання 21-31 дні (днів) |
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LPC1227FBD64/301,1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
на замовлення 320 шт: термін постачання 21-31 дні (днів) |
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JN5139/001,531 | NXP USA Inc. |
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JN5139/001,518 | NXP USA Inc. |
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JN5139/Z01,531 | NXP USA Inc. |
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JN5148/001,515 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Sensitivity: -96.5dBm Frequency: 2.4GHz Memory Size: 128kB ROM, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.75dBm Protocol: Zigbee® Current - Receiving: 17.5mA Data Rate (Max): 667kbps Current - Transmitting: 15mA GPIO: 21 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I²C, JTAG, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5148/001,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Sensitivity: -96.5dBm Frequency: 2.4GHz Memory Size: 128kB ROM, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.75dBm Protocol: Zigbee® Current - Receiving: 17.5mA Data Rate (Max): 667kbps Current - Transmitting: 15mA GPIO: 21 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I²C, JTAG, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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NTB0102GT,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
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NX3DV2567GU,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: Networking On-State Resistance (Max): 700mOhm -3db Bandwidth: 160MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Switch Circuit: 4PDT Number of Channels: 1 |
на замовлення 3161 шт: термін постачання 21-31 дні (днів) |
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NX3DV3899GU,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 3.3Ohm -3db Bandwidth: 200MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 4pC Crosstalk: -90dB @ 1MHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:2 Channel-to-Channel Matching (ΔRon): 700mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 8pF Current - Leakage (IS(off)) (Max): 5nA Part Status: Active Number of Circuits: 2 |
на замовлення 3916 шт: термін постачання 21-31 дні (днів) |
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NTB0104GU12,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 12-XFQFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 12-XQFN (2x1.7) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 52000 шт: термін постачання 21-31 дні (днів) |
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NTS0102GT,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 6550 шт: термін постачання 21-31 дні (днів) |
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NX3DV2567GU,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: Networking On-State Resistance (Max): 700mOhm -3db Bandwidth: 160MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Switch Circuit: 4PDT Number of Channels: 1 |
на замовлення 990 шт: термін постачання 21-31 дні (днів) |
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NX3DV3899GU,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 3.3Ohm -3db Bandwidth: 200MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 4pC Crosstalk: -90dB @ 1MHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:2 Channel-to-Channel Matching (ΔRon): 700mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 8pF Current - Leakage (IS(off)) (Max): 5nA Part Status: Active Number of Circuits: 2 |
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NX3L2467GU,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 70mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Active Number of Circuits: 2 |
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NX5DV715HF,118 | NXP USA Inc. |
![]() Features: Buffers, RGB Packaging: Tape & Reel (TR) Package / Case: 32-WFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 4Ohm (Typ) -3db Bandwidth: 600MHz Supplier Device Package: 32-HWQFN (3x6) Voltage - Supply, Single (V+): 2V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
товар відсутній |
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NTB0102GT,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 3479 шт: термін постачання 21-31 дні (днів) |
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NTB0104GU12,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 12-XFQFN Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 100Mbps Supplier Device Package: 12-XQFN (2x1.7) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.65 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
на замовлення 54061 шт: термін постачання 21-31 дні (днів) |
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NTS0102GT,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 8-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Not For New Designs Number of Circuits: 1 |
на замовлення 7675 шт: термін постачання 21-31 дні (днів) |
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NX3L2467GU,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 70mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Active Number of Circuits: 2 |
на замовлення 292 шт: термін постачання 21-31 дні (днів) |
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NX5DV715HF,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Features: Buffers, RGB Package / Case: 32-WFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 4Ohm (Typ) -3db Bandwidth: 600MHz Supplier Device Package: 32-HWQFN (3x6) Voltage - Supply, Single (V+): 2V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Active Number of Channels: 2 |
на замовлення 4616 шт: термін постачання 21-31 дні (днів) |
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PBSS3515E,135 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V Frequency - Transition: 280MHz Supplier Device Package: SC-75 Part Status: Obsolete Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 15 V Power - Max: 250 mW |
товар відсутній |
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BGX885N,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOT-115D Mounting Type: Chassis Mount Frequency: 40MHz ~ 860MHz RF Type: General Purpose Voltage - Supply: 26V Gain: 17.3dB Current - Supply: 240mA Noise Figure: 8dB Test Frequency: 750MHz Supplier Device Package: SFM9 Part Status: Obsolete |
товар відсутній |
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EM773FHN33,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Obsolete Number of I/O: 25 DigiKey Programmable: Not Verified |
товар відсутній |
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LPC1342FBD48,151 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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LPC1768FET100,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
на замовлення 3955 шт: термін постачання 21-31 дні (днів) |
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LPC2420FET208,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 72MHz RAM Size: 82K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Not For New Designs Number of I/O: 160 DigiKey Programmable: Not Verified |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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MPT612FBD48,151 | NXP USA Inc. |
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товар відсутній |
SPC5517GAMMG66 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 144
DigiKey Programmable: Not Verified
товар відсутній
TWR-S08JE128 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JE
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JE
Platform: Tower System
Part Status: Active
товар відсутній
TWR-S08JE128-KIT |
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Виробник: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
товар відсутній
LPC1114FHN33/302,5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
SPC5634MF1MLQ80 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 290 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2168.38 грн |
10+ | 1674.19 грн |
80+ | 1429.63 грн |
SPC5634MF1MMG80 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 80
DigiKey Programmable: Not Verified
товар відсутній
S9S08SG16E1MTJR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 149.51 грн |
MC9S08QB8CTGR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5000+ | 127.6 грн |
MRF8S23120HR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
товар відсутній
MRF8S23120HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.3GHz
Power - Output: 28W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
товар відсутній
MRFE6VP61K25HR6 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 150 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
150+ | 13717.61 грн |
MRFE6VP61K25HSR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
50+ | 14221.09 грн |
MRFE6VP61K25HSR6 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
MPXV2050GP |
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Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.3%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±0.3%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
на замовлення 121 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1398.96 грн |
10+ | 1066.29 грн |
25+ | 1010.15 грн |
MPVZ7025DP |
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Виробник: NXP USA Inc.
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: ±3.63PSI (±25kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±29.01PSI (±200kPa)
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: ±3.63PSI (±25kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±29.01PSI (±200kPa)
товар відсутній
TWR-ADCDAC-LTC |
Виробник: NXP USA Inc.
Description: MOD ADC DAC TOWER LINEAR TECH
Packaging: Box
Function: ADC, DAC
Type: Data Acquisition
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Embedded: No
Part Status: Active
Description: MOD ADC DAC TOWER LINEAR TECH
Packaging: Box
Function: ADC, DAC
Type: Data Acquisition
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Embedded: No
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8605.86 грн |
LPC1224FBD48/121,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 6085 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 489.63 грн |
10+ | 368.34 грн |
80+ | 301.77 грн |
500+ | 277.25 грн |
1000+ | 233.82 грн |
2500+ | 222.13 грн |
LPC1224FBD64/101,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Description: IC MCU 32BIT 32KB FLASH 64LQFP
товар відсутній
LPC1225FBD48/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
LPC1225FBD64/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 1280 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 526.13 грн |
10+ | 395.72 грн |
160+ | 324.22 грн |
480+ | 297.87 грн |
960+ | 251.22 грн |
LPC1225FBD64/321,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 80KB (80K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
товар відсутній
LPC1226FBD48/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 460 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 532.21 грн |
10+ | 402.82 грн |
80+ | 333.51 грн |
LPC1226FBD64/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
товар відсутній
LPC1227FBD48/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Description: IC MCU 32BIT 128KB FLASH 48LQFP
на замовлення 116 шт:
термін постачання 21-31 дні (днів)LPC1227FBD64/301,1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
на замовлення 320 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 604.44 грн |
10+ | 457.66 грн |
160+ | 378.85 грн |
JN5148/001,515 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
JN5148/001,518 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -96.5dBm
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
NTB0102GT,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
товар відсутній
NX3DV2567GU,115 |
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Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
на замовлення 3161 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 109.48 грн |
10+ | 66.19 грн |
25+ | 55.99 грн |
100+ | 41.71 грн |
250+ | 36.41 грн |
500+ | 33.17 грн |
1000+ | 29.97 грн |
NX3DV3899GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
на замовлення 3916 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 84.39 грн |
10+ | 73.14 грн |
25+ | 69.41 грн |
100+ | 53.51 грн |
250+ | 50.02 грн |
500+ | 44.2 грн |
1000+ | 34.33 грн |
NTB0104GU12,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 52000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4000+ | 37.78 грн |
8000+ | 34.56 грн |
12000+ | 33.26 грн |
NTS0102GT,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 6550 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5000+ | 15.89 грн |
NX3DV2567GU,115 |
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Виробник: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
на замовлення 990 шт:
термін постачання 21-31 дні (днів)NX3DV3899GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
товар відсутній
NX3L2467GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
товар відсутній
NX5DV715HF,118 |
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Виробник: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Tape & Reel (TR)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Tape & Reel (TR)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
товар відсутній
NTB0102GT,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 3479 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 58.54 грн |
10+ | 49.93 грн |
25+ | 46.86 грн |
100+ | 35.89 грн |
250+ | 33.34 грн |
500+ | 28.37 грн |
1000+ | 22.33 грн |
2500+ | 20.23 грн |
NTB0104GU12,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 54061 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 88.96 грн |
10+ | 76.66 грн |
25+ | 72.78 грн |
100+ | 56.09 грн |
250+ | 52.44 грн |
500+ | 46.34 грн |
1000+ | 35.98 грн |
NTS0102GT,115 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
на замовлення 7675 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
7+ | 44.1 грн |
10+ | 37.41 грн |
25+ | 35.14 грн |
100+ | 26.91 грн |
250+ | 25 грн |
500+ | 21.27 грн |
1000+ | 16.74 грн |
2500+ | 15.17 грн |
NX3L2467GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
на замовлення 292 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
6+ | 58.54 грн |
10+ | 50.37 грн |
25+ | 47.82 грн |
100+ | 36.85 грн |
250+ | 34.44 грн |
NX5DV715HF,118 |
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Виробник: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Cut Tape (CT)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Description: IC VGA SWITCH 32HWQFN
Packaging: Cut Tape (CT)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
на замовлення 4616 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 94.28 грн |
10+ | 81.12 грн |
25+ | 77.02 грн |
100+ | 59.36 грн |
250+ | 55.49 грн |
500+ | 49.03 грн |
1000+ | 38.08 грн |
2500+ | 35.54 грн |
PBSS3515E,135 |
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Виробник: NXP USA Inc.
Description: TRANS PNP 15V 0.5A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
Description: TRANS PNP 15V 0.5A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
товар відсутній
BGX885N,112 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 860MHz
RF Type: General Purpose
Voltage - Supply: 26V
Gain: 17.3dB
Current - Supply: 240mA
Noise Figure: 8dB
Test Frequency: 750MHz
Supplier Device Package: SFM9
Part Status: Obsolete
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Packaging: Bulk
Package / Case: SOT-115D
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 860MHz
RF Type: General Purpose
Voltage - Supply: 26V
Gain: 17.3dB
Current - Supply: 240mA
Noise Figure: 8dB
Test Frequency: 750MHz
Supplier Device Package: SFM9
Part Status: Obsolete
товар відсутній
EM773FHN33,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
товар відсутній
LPC1342FBD48,151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 507.12 грн |
10+ | 381.37 грн |
80+ | 312.45 грн |
LPC1768FET100,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 3955 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 790.71 грн |
10+ | 609 грн |
80+ | 555.56 грн |
LPC2420FET208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 126 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1195.2 грн |
10+ | 919.94 грн |
126+ | 776.88 грн |