Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35440) > Сторінка 169 з 591
Фото | Назва | Виробник | Інформація |
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TWR-K60N512-KIT | NXP USA Inc. | Description: TOWER SYSTEM K60 EVAL BRD |
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TWR-MCF51MM | NXP USA Inc. | Description: TOWER SYSTEM MCF51MM EVAL BRD |
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I74F86D,602 | NXP USA Inc. |
Description: IC GATE XOR 4CH 2-INP 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
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I74F00D,602 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
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MRFE6VP6300HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 150 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MRFE6VP6300HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 151 шт: термін постачання 21-31 дні (днів) |
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MRFE6VP61K25HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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PK60N256VLQ100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 144LQFP |
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PK60N256VLL100 | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
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LPC1111FHN33/102,5 | NXP USA Inc. | Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
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LPC1111FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 8KB (8K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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LPC1112FHN33/102,5 | NXP USA Inc. | Description: IC MCU 32BIT 16KB FLASH 32HVQFN |
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LPC1112FHN33/202,5 | NXP USA Inc. | Description: IC MCU 32BIT 16KB FLASH 32HVQFN |
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LPC1113FBD48/302,1 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
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LPC1113FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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LPC1113FHN33/302,5 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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LPC1114FBD48/302,1 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Discontinued at Digi-Key Number of I/O: 42 DigiKey Programmable: Not Verified |
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LPC1114FHN33/202,5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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LPC1114FHN33/302:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Discontinued at Digi-Key Number of I/O: 28 DigiKey Programmable: Not Verified |
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1323XNSK-BDM | NXP USA Inc. |
Description: 1323X_NETWORK_BDM Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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1323XNSK-SFTW | NXP USA Inc. |
Description: 1323X_NETWORK_PLUS Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Part Status: Active |
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D3172MMA7361LC | NXP USA Inc. |
Description: BOARD XYZ-AXIS DIGITAL ACCEL D Packaging: Box Sensitivity: 800, 206 mV/g Interface: Analog Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7361LC Supplied Contents: Board(s) Sensing Range: ±1.5g, 6g |
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DEMO9S08SC4 | NXP USA Inc. |
Description: MC9S08SC4 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SC4 Part Status: Active |
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DEMOFLEXISJMSD | NXP USA Inc. |
Description: CARD READER M9S08JM60 Packaging: Box Function: SD/MMC Type: Memory Utilized IC / Part: MC9S08JM60 Supplied Contents: Board(s) Primary Attributes: SPI to SD/MMC Memory Card Interface Embedded: Yes, MCU, 8-Bit Part Status: Obsolete Secondary Attributes: On-Board LEDs |
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DSPB56725CAF | NXP USA Inc. |
Description: IC DSP 24BIT 80LQFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Interface: Host Interface, I²C, SAI, SPI Type: Audio Processor Operating Temperature: -40°C ~ 85°C (TA) Non-Volatile Memory: External On-Chip RAM: 112kB Voltage - I/O: 3.30V Voltage - Core: 1.00V Clock Rate: 200MHz Supplier Device Package: 80-LQFP (14x14) Part Status: Not For New Designs |
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JMBADGE2008-B | NXP USA Inc. | Description: MCF51JM128 EVAL BRD |
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KIT3376MMA7331LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 308mV/g, 83.6mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7331LC Supplied Contents: Board(s) Sensing Range: ±4g, 9g Part Status: Obsolete |
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KIT3376MMA7341LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 440, 117.8 mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7341LC Supplied Contents: Board(s) Sensing Range: ±3g, 9g Part Status: Obsolete |
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KIT3376MMA7361LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 800, 206 mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7361LC Supplied Contents: Board(s) Sensing Range: ±1.5g, 6g Part Status: Obsolete |
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KIT3376MMA7368LC | NXP USA Inc. |
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR Packaging: Box Sensitivity: 800mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7368LC Supplied Contents: Board(s) Sensing Range: ±1.5g Part Status: Obsolete |
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KIT33905D5EKEVBE | NXP USA Inc. |
Description: KIT EVALUATION FOR MC33905 Packaging: Box Function: CANbus and LINbus Type: Interface Utilized IC / Part: MC33905 Supplied Contents: Board(s), Cable(s) |
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KITSTBLITE2EVM | NXP USA Inc. |
Description: SENSOR TOOLBX MB Packaging: Box Sensor Type: Accelerometer, Capacitive Touch, Pressure Utilized IC / Part: Sensor Toolbox Supplied Contents: Board(s) |
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KMC8113TMP3600V | NXP USA Inc. |
Description: IC DSP 300/400MHZ 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I²C, TDM, UART Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 300MHz Supplier Device Package: 431-FCPBGA (20x20) Part Status: Obsolete |
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LFM34INTPQA | NXP USA Inc. |
Description: MCU 1MB 64KB FLASH 80MHZ 208BGA Packaging: Box For Use With/Related Products: MPC5534 Module/Board Type: Socket Adapter |
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LFSTBEB845X | NXP USA Inc. |
Description: EVAL BOARD FOR MMA845XQ Packaging: Box Interface: I2C Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8451, MMA8452, MMA8453 Supplied Contents: Board(s), Cable(s) Sensing Range: ±2g, 4g, 8g |
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LFVBBM34U1A | NXP USA Inc. |
Description: MPC5534 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5534 Part Status: Obsolete |
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LFVBBM53QA | NXP USA Inc. | Description: MPC5553 EVAL BRD |
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LFVBBM53WA | NXP USA Inc. |
Description: MPC5553 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5553 Part Status: Obsolete |
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LFVBBM54WA | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
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LFVBBM65U1A | NXP USA Inc. |
Description: MPC5565 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5565 |
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LFVBBM66WA | NXP USA Inc. |
Description: MPC5566 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5566 Part Status: Active |
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LFVBBM67U1A | NXP USA Inc. |
Description: MPC5567 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5567 Part Status: Active |
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LFVBBM67WA | NXP USA Inc. |
Description: MPC5567 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5567 |
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M5253DEMO | NXP USA Inc. |
Description: MCF5253 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: Coldfire V2 Utilized IC / Part: MCF5253 |
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M5282LITESLK | NXP USA Inc. |
Description: MCF5280/MCF5281/MCF5282 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: Coldfire V2 Board Type: Evaluation Platform Utilized IC / Part: MCF5280, MCF5281, MCF5282 Part Status: Obsolete |
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M54451EVB | NXP USA Inc. | Description: MCF54451 EVAL BRD |
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MC10XS3535PNA | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:6 24PQFN |
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MC10XS3535PNAR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:6 24PQFN |
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MC13892JVL | NXP USA Inc. | Description: IC PMU I.MX51/37/35/27 186MAPBGA |
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MC13892JVLR2 | NXP USA Inc. | Description: IC PMU I.MX51/37/35/27 186MAPBGA |
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MC13892VKR2 | NXP USA Inc. | Description: IC PMU I.MX51/37/35/27 139MAPBGA |
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MC34844AEP | NXP USA Inc. |
Description: IC LED DRVR RGLTR PWM 80MA 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Voltage - Output: 8V ~ 60V Mounting Type: Surface Mount Number of Outputs: 10 Type: DC DC Regulator Operating Temperature: -40°C ~ 105°C (TA) Applications: Backlight Current - Output / Channel: 80mA Internal Switch(s): Yes Topology: Step-Up (Boost) Supplier Device Package: 32-QFN-EP (5x5) Dimming: Analog, PWM Voltage - Supply (Min): 7V Voltage - Supply (Max): 28V Part Status: Active |
на замовлення 2450 шт: термін постачання 21-31 дні (днів) |
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MC34844AEPR2 | NXP USA Inc. |
Description: IC LED DRVR RGLTR PWM 80MA 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Voltage - Output: 8V ~ 60V Mounting Type: Surface Mount Number of Outputs: 10 Type: DC DC Regulator Operating Temperature: -40°C ~ 105°C (TA) Applications: Backlight Current - Output / Channel: 80mA Internal Switch(s): Yes Topology: Step-Up (Boost) Supplier Device Package: 32-QFN-EP (5x5) Dimming: Analog, PWM Voltage - Supply (Min): 7V Voltage - Supply (Max): 28V Part Status: Active |
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MC34845AEP | NXP USA Inc. | Description: IC LED DRVR RGLTR DIM 2.3A 24QFN |
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MC34845AEPR2 | NXP USA Inc. | Description: IC LED DRVR RGLTR DIM 2.3A 24QFN |
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MC34845CEP | NXP USA Inc. | Description: IC LED DRVR RGLTR DIM 2.3A 24QFN |
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MC34845CEPR2 | NXP USA Inc. | Description: IC LED DRVR RGLTR DIM 2.3A 24QFN |
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MC34845DEPR2 | NXP USA Inc. | Description: IC LED DRVR RGLTR DIM 2.6A 24QFN |
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MC34933EPR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.5V 16UQFN Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1A Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 5.5V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 2V ~ 7V Supplier Device Package: 16-UQFN-EP (3x3) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
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I74F86D,602 |
Виробник: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE XOR 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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I74F00D,602 |
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
товар відсутній
MRFE6VP6300HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 150 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
50+ | 8047.1 грн |
MRFE6VP61K25HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
MRFE6VP6300HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 151 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10054.93 грн |
10+ | 7954.55 грн |
25+ | 7749.05 грн |
MRFE6VP61K25HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 15568.72 грн |
10+ | 12662.96 грн |
LPC1111FHN33/102,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
товар відсутній
LPC1111FHN33/202,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
LPC1112FHN33/102,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
товар відсутній
LPC1112FHN33/202,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
товар відсутній
LPC1113FBD48/302,1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
товар відсутній
LPC1113FHN33/202,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
LPC1113FHN33/302,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
LPC1114FBD48/302,1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 42
DigiKey Programmable: Not Verified
товар відсутній
LPC1114FHN33/202,5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 58 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 312.03 грн |
10+ | 234.23 грн |
LPC1114FHN33/302:5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
1323XNSK-BDM |
Виробник: NXP USA Inc.
Description: 1323X_NETWORK_BDM
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Description: 1323X_NETWORK_BDM
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 48284.21 грн |
1323XNSK-SFTW |
Виробник: NXP USA Inc.
Description: 1323X_NETWORK_PLUS
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
Description: 1323X_NETWORK_PLUS
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
товар відсутній
D3172MMA7361LC |
Виробник: NXP USA Inc.
Description: BOARD XYZ-AXIS DIGITAL ACCEL D
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Description: BOARD XYZ-AXIS DIGITAL ACCEL D
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
товар відсутній
DEMO9S08SC4 |
Виробник: NXP USA Inc.
Description: MC9S08SC4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SC4
Part Status: Active
Description: MC9S08SC4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SC4
Part Status: Active
товар відсутній
DEMOFLEXISJMSD |
Виробник: NXP USA Inc.
Description: CARD READER M9S08JM60
Packaging: Box
Function: SD/MMC
Type: Memory
Utilized IC / Part: MC9S08JM60
Supplied Contents: Board(s)
Primary Attributes: SPI to SD/MMC Memory Card Interface
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Secondary Attributes: On-Board LEDs
Description: CARD READER M9S08JM60
Packaging: Box
Function: SD/MMC
Type: Memory
Utilized IC / Part: MC9S08JM60
Supplied Contents: Board(s)
Primary Attributes: SPI to SD/MMC Memory Card Interface
Embedded: Yes, MCU, 8-Bit
Part Status: Obsolete
Secondary Attributes: On-Board LEDs
товар відсутній
DSPB56725CAF |
Виробник: NXP USA Inc.
Description: IC DSP 24BIT 80LQFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Interface: Host Interface, I²C, SAI, SPI
Type: Audio Processor
Operating Temperature: -40°C ~ 85°C (TA)
Non-Volatile Memory: External
On-Chip RAM: 112kB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 200MHz
Supplier Device Package: 80-LQFP (14x14)
Part Status: Not For New Designs
Description: IC DSP 24BIT 80LQFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Interface: Host Interface, I²C, SAI, SPI
Type: Audio Processor
Operating Temperature: -40°C ~ 85°C (TA)
Non-Volatile Memory: External
On-Chip RAM: 112kB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Clock Rate: 200MHz
Supplier Device Package: 80-LQFP (14x14)
Part Status: Not For New Designs
товар відсутній
KIT3376MMA7331LC |
Виробник: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 308mV/g, 83.6mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7331LC
Supplied Contents: Board(s)
Sensing Range: ±4g, 9g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 308mV/g, 83.6mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7331LC
Supplied Contents: Board(s)
Sensing Range: ±4g, 9g
Part Status: Obsolete
товар відсутній
KIT3376MMA7341LC |
Виробник: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 440, 117.8 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7341LC
Supplied Contents: Board(s)
Sensing Range: ±3g, 9g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 440, 117.8 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7341LC
Supplied Contents: Board(s)
Sensing Range: ±3g, 9g
Part Status: Obsolete
товар відсутній
KIT3376MMA7361LC |
Виробник: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800, 206 mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g, 6g
Part Status: Obsolete
товар відсутній
KIT3376MMA7368LC |
Виробник: NXP USA Inc.
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7368LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g
Part Status: Obsolete
Description: KIT EVAL 3AXIS ANLG ACCELEROMETR
Packaging: Box
Sensitivity: 800mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7368LC
Supplied Contents: Board(s)
Sensing Range: ±1.5g
Part Status: Obsolete
товар відсутній
KIT33905D5EKEVBE |
Виробник: NXP USA Inc.
Description: KIT EVALUATION FOR MC33905
Packaging: Box
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33905
Supplied Contents: Board(s), Cable(s)
Description: KIT EVALUATION FOR MC33905
Packaging: Box
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33905
Supplied Contents: Board(s), Cable(s)
товар відсутній
KITSTBLITE2EVM |
Виробник: NXP USA Inc.
Description: SENSOR TOOLBX MB
Packaging: Box
Sensor Type: Accelerometer, Capacitive Touch, Pressure
Utilized IC / Part: Sensor Toolbox
Supplied Contents: Board(s)
Description: SENSOR TOOLBX MB
Packaging: Box
Sensor Type: Accelerometer, Capacitive Touch, Pressure
Utilized IC / Part: Sensor Toolbox
Supplied Contents: Board(s)
товар відсутній
KMC8113TMP3600V |
Виробник: NXP USA Inc.
Description: IC DSP 300/400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Description: IC DSP 300/400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
товар відсутній
LFM34INTPQA |
Виробник: NXP USA Inc.
Description: MCU 1MB 64KB FLASH 80MHZ 208BGA
Packaging: Box
For Use With/Related Products: MPC5534
Module/Board Type: Socket Adapter
Description: MCU 1MB 64KB FLASH 80MHZ 208BGA
Packaging: Box
For Use With/Related Products: MPC5534
Module/Board Type: Socket Adapter
товар відсутній
LFSTBEB845X |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MMA845XQ
Packaging: Box
Interface: I2C
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Description: EVAL BOARD FOR MMA845XQ
Packaging: Box
Interface: I2C
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
товар відсутній
LFVBBM34U1A |
Виробник: NXP USA Inc.
Description: MPC5534 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5534
Part Status: Obsolete
Description: MPC5534 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5534
Part Status: Obsolete
товар відсутній
LFVBBM53WA |
Виробник: NXP USA Inc.
Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5553
Part Status: Obsolete
Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5553
Part Status: Obsolete
товар відсутній
LFVBBM54WA |
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
товар відсутній
LFVBBM65U1A |
Виробник: NXP USA Inc.
Description: MPC5565 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5565
Description: MPC5565 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5565
товар відсутній
LFVBBM66WA |
Виробник: NXP USA Inc.
Description: MPC5566 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
Description: MPC5566 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
товар відсутній
LFVBBM67U1A |
Виробник: NXP USA Inc.
Description: MPC5567 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5567
Part Status: Active
Description: MPC5567 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5567
Part Status: Active
товар відсутній
LFVBBM67WA |
Виробник: NXP USA Inc.
Description: MPC5567 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5567
Description: MPC5567 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5567
товар відсутній
M5253DEMO |
Виробник: NXP USA Inc.
Description: MCF5253 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5253
Description: MCF5253 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5253
товар відсутній
M5282LITESLK |
Виробник: NXP USA Inc.
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
товар відсутній
MC34844AEP |
Виробник: NXP USA Inc.
Description: IC LED DRVR RGLTR PWM 80MA 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 8V ~ 60V
Mounting Type: Surface Mount
Number of Outputs: 10
Type: DC DC Regulator
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 80mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 32-QFN-EP (5x5)
Dimming: Analog, PWM
Voltage - Supply (Min): 7V
Voltage - Supply (Max): 28V
Part Status: Active
Description: IC LED DRVR RGLTR PWM 80MA 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 8V ~ 60V
Mounting Type: Surface Mount
Number of Outputs: 10
Type: DC DC Regulator
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 80mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 32-QFN-EP (5x5)
Dimming: Analog, PWM
Voltage - Supply (Min): 7V
Voltage - Supply (Max): 28V
Part Status: Active
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 519.01 грн |
10+ | 451.01 грн |
25+ | 430.01 грн |
80+ | 350.39 грн |
230+ | 334.65 грн |
440+ | 305.12 грн |
945+ | 261.39 грн |
2450+ | 251.71 грн |
MC34844AEPR2 |
Виробник: NXP USA Inc.
Description: IC LED DRVR RGLTR PWM 80MA 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 8V ~ 60V
Mounting Type: Surface Mount
Number of Outputs: 10
Type: DC DC Regulator
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 80mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 32-QFN-EP (5x5)
Dimming: Analog, PWM
Voltage - Supply (Min): 7V
Voltage - Supply (Max): 28V
Part Status: Active
Description: IC LED DRVR RGLTR PWM 80MA 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 8V ~ 60V
Mounting Type: Surface Mount
Number of Outputs: 10
Type: DC DC Regulator
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Backlight
Current - Output / Channel: 80mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 32-QFN-EP (5x5)
Dimming: Analog, PWM
Voltage - Supply (Min): 7V
Voltage - Supply (Max): 28V
Part Status: Active
товар відсутній
MC34933EPR2 |
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.5V 16UQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 2V ~ 7V
Supplier Device Package: 16-UQFN-EP (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-5.5V 16UQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 2V ~ 7V
Supplier Device Package: 16-UQFN-EP (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
товар відсутній