Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35275) > Сторінка 568 з 588
| Фото | Назва | Виробник | Інформація |
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74HCT368DB,112 | NXP USA Inc. |
 Description: IC INVERTER DL 4,2-INPUT 16SSOPPackaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SSOP |
на замовлення 4368 шт: термін постачання 21-31 дні (днів) |
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MRFE6VS25GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 512MHz Power - Output: 25W Gain: 25.4dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 10 mA |
на замовлення 435 шт: термін постачання 21-31 дні (днів) |
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MRFE6VS25GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-2 Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 512MHz Power - Output: 25W Gain: 25.4dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 10 mA |
на замовлення 435 шт: термін постачання 21-31 дні (днів) |
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MC34017A-3P | NXP USA Inc. |
Description: IC TELECOM INTERFACE 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Function: Tone Ringer Operating Temperature: -20°C ~ 60°C Voltage - Supply: 5V Current - Supply: 20mA Supplier Device Package: 8-PDIP Number of Circuits: 1 Power (Watts): 1 W |
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SPC5603BF2VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
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MRFE6VP6300HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780S-4L Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
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| MRFE6VP5600HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Bulk Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 600MHz Configuration: 2 N-Channel Power - Output: 600W Gain: 25dB Technology: LDMOS (Dual) Supplier Device Package: NI-1230-4S Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 1479 шт: термін постачання 21-31 дні (днів) |
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AFIC10275NR1 | NXP USA Inc. |
Description: IC RF AMP 978MHZ-1.09GHZ TO270 Packaging: Bulk Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 978MHz ~ 1.09GHz Voltage - Supply: 50V Gain: 32.6dB Supplier Device Package: TO-270 WB-14 |
на замовлення 175 шт: термін постачання 21-31 дні (днів) |
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| SPC5675KFAVJM2R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
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| SPC5675KFAVJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
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MPC8347ZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
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MC9S08JM32CGT | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 37 DigiKey Programmable: Not Verified |
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| NJJ29C2A7HN5/047Y | NXP USA Inc. |
Description: NJJ29C2A7HN5 Packaging: Tape & Reel (TR) |
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| BUK663R5-30C,118 | NXP USA Inc. |
Description: MOSFET N-CH 30V 100A D2PAK Packaging: Bulk |
на замовлення 8739 шт: термін постачання 21-31 дні (днів) |
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| LPC5516JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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| LPC5516JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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| LPC5516JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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MAC57D5-516DC | NXP USA Inc. |
Description: MAC57D5XX EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4 Utilized IC / Part: MAC57D5xx |
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PMEG2010EV,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 20V 1A SOT666 Packaging: Bulk |
на замовлення 80000 шт: термін постачання 21-31 дні (днів) |
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74HC253D,652 | NXP USA Inc. |
Description: IC DUAL 4-IN MUX 3-ST 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
на замовлення 31369 шт: термін постачання 21-31 дні (днів) |
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| SAF7770EL/101Z120Y | NXP USA Inc. |
Description: SAF7770EL Packaging: Tape & Reel (TR) Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
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| SAF7770EL/101Z120K | NXP USA Inc. |
Description: SAF7770EL Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (15x15) |
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| FB32K146HRT0VLLR | NXP USA Inc. |
Description: S32K146, M4F, FLASH 1M, RAM 128K Packaging: Tape & Reel (TR) |
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| FB32K146HRT0VLLT | NXP USA Inc. |
Description: S32K146, M4F, FLASH 1M, RAM 128K Packaging: Tray |
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| S32G254ASBK0VUCR | NXP USA Inc. |
Description: S32G254A ARM CORTEX-M7 AND -A53, Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (4) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
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| S9S12G64J0MLHR | NXP USA Inc. |
Description: S12 CORE 64K FLASH Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
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| S9S12G48J0MLHR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
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TEA19162HT/2J | NXP USA Inc. |
Description: IC PFC CONTROLLER SO8 Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 70 ~ 276 VAC Frequency - Switching: 134kHz Mode: Discontinuous Conduction (DCM) Supplier Device Package: 8-SO Current - Startup: 800 µA |
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TEA19162HT/2J | NXP USA Inc. |
Description: IC PFC CONTROLLER SO8 Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 70 ~ 276 VAC Frequency - Switching: 134kHz Mode: Discontinuous Conduction (DCM) Supplier Device Package: 8-SO Current - Startup: 800 µA |
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| P3T1035DUKAZ | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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MC35FS6500NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MCIMX6D6AVT08AD | NXP USA Inc. |
Description: IC MPU I.MX6D 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
на замовлення 183 шт: термін постачання 21-31 дні (днів) |
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| TEA19051BARTK/1J | NXP USA Inc. |
Description: SMARTCHARG PROTOC CONTR QC4 Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) DigiKey Programmable: Not Verified |
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| MGD3160AM338EKR2 | NXP USA Inc. |
Description: GATE DRIVER Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 40V Input Type: Non-Inverting Supplier Device Package: 32-SOIC Channel Type: Single Driven Configuration: High-Side Number of Drivers: 1 Gate Type: IGBT, SiC MOSFET Current - Peak Output (Source, Sink): 15A, 15A Grade: Automotive Qualification: AEC-Q100 |
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74ABT16374BDL,118 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 8BIT 48SSOP Packaging: Tape & Reel (TR) Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 2 mA Current - Output High, Low: 32mA, 64mA Trigger Type: Positive Edge Clock Frequency: 260 MHz Input Capacitance: 4 pF Supplier Device Package: 48-SSOP Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Number of Bits per Element: 8 |
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74ABT16373BDL,118 | NXP USA Inc. |
Description: IC 16BIT D TYPE LATCH 48SSOP Packaging: Tape & Reel (TR) Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 2ns Supplier Device Package: 48-SSOP |
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74LVC162244ADL,118 | NXP USA Inc. |
Description: IC BUFF DVR TRI-ST 16BIT 48SSOP Packaging: Bulk |
на замовлення 3700 шт: термін постачання 21-31 дні (днів) |
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74ABT16240ADL,118 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 48SSOP Packaging: Bulk |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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74ALVC16245DL,118 | NXP USA Inc. |
Description: IC TRANSCVR 3-ST 16BIT 48SSOP Packaging: Bulk |
на замовлення 4038 шт: термін постачання 21-31 дні (днів) |
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| PCA9420BSAZ | NXP USA Inc. |
Description: PCA9420BS Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Current - Supply: 4.5µA Supplier Device Package: 24-HVQFN (3x3) |
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| PCA9420BSAZ | NXP USA Inc. |
Description: PCA9420BS Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Current - Supply: 4.5µA Supplier Device Package: 24-HVQFN (3x3) |
на замовлення 2246 шт: термін постачання 21-31 дні (днів) |
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BZV49-C3V0,115 | NXP USA Inc. |
Description: DIODE ZENER 3V 1W SOT89 Packaging: Bulk |
на замовлення 59427 шт: термін постачання 21-31 дні (днів) |
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| MC33665ATF4AER2 | NXP USA Inc. |
Description: HIGH SPEED TRANSCEIVER WITH CAN Packaging: Cut Tape (CT) Package / Case: 48-LQFP Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Function: Power Management Interface: CAN, I2C Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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74LVCH245ABX,115 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 20DHXQFN Packaging: Bulk Package / Case: 20-XFQFN Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 20-DHXQFN (4.5x2.5) |
на замовлення 78786 шт: термін постачання 21-31 дні (днів) |
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74CBTLV3125DS,118 | NXP USA Inc. |
Description: NOW NEXPERIA 74CBTLV3125DS - BUS Packaging: Bulk Package / Case: 16-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.3V ~ 3.6V Independent Circuits: 4 Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
на замовлення 225269 шт: термін постачання 21-31 дні (днів) |
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| MKM35Z512VLQ7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Cut Tape (CT) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 99 |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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MC68LC302CAF20CT | NXP USA Inc. |
Description: IC MPU M683XX 20MHZ 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 20MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: M68000 Voltage - I/O: 5.0V Supplier Device Package: 100-LQFP (14x14) Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI |
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| P3S0210BQAZ | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Package / Case: 14-VFQFN Exposed Pad Mounting Type: Surface Mount Circuit: 1 x 2:1, 1 x 1:2 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.72V ~ 3.63V Independent Circuits: 1 Current - Output High, Low: 10µA, 10µA Voltage Supply Source: Single Supply Supplier Device Package: 14-DHVQFN (2.5x3) |
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S9S08LG32J0CLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 69 DigiKey Programmable: Not Verified |
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PEMI4QFN/LM,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/16PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 16pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Number of Channels: 4 |
на замовлення 36000 шт: термін постачання 21-31 дні (днів) |
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74HC30PW,112 | NXP USA Inc. |
Description: IC GATE NAND 1CH 8-INP 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 8 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 2 µA |
на замовлення 26640 шт: термін постачання 21-31 дні (днів) |
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SPC5645BK0VLT1 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 160K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Number of I/O: 177 DigiKey Programmable: Not Verified |
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PMG370XN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 960MA 6TSSOP Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 960mA (Ta) Rds On (Max) @ Id, Vgs: 440mOhm @ 200mA, 4.5V Power Dissipation (Max): 690mW (Tc) Vgs(th) (Max) @ Id: 1.5V @ 250µA Supplier Device Package: 6-TSSOP Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 0.65 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 37 pF @ 25 V |
на замовлення 111000 шт: термін постачання 21-31 дні (днів) |
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| FRDM-22XSDBEVB | NXP USA Inc. |
Description: FREEDOM PLATFORM DAUGHTER BOARD Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC22XS4200 Supplied Contents: Board(s) |
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| LFBDMPGMR | NXP USA Inc. |
Description: BDM FLASH PROGRAMMER FOR HCS08, Packaging: Bulk For Use With/Related Products: HC12, HCS08, HCS12, HCS12X Type: Programmer Contents: Board(s), Cable(s), Power Supply, Accessories |
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MPL3150A2ST1 | NXP USA Inc. |
Description: IC BAR SENSOR 150KPA HORIZON 8TS Packaging: Tape & Reel (TR) Package / Case: 8-TLGA Mounting Type: Surface Mount Supplier Device Package: 8-LGA (3x5) |
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SPC5200CVR400B | NXP USA Inc. |
Description: IC MPU MPC52XX 400MHZ 272BGA Packaging: Tray Package / Case: 272-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 272-PBGA (27x27) Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Graphics Acceleration: No Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART |
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SPC5200CVR400BR2 | NXP USA Inc. |
Description: IC MPU MPC52XX 400MHZ 272BGA Packaging: Tape & Reel (TR) Package / Case: 272-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 272-PBGA (27x27) Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Graphics Acceleration: No Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART |
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| NXH3675UK/A1Z | NXP USA Inc. |
Description: NXH3675UK Packaging: Tape & Reel (TR) |
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| NHS3100THADADKUL | NXP USA Inc. |
Description: NHS3100 THERAPY ADK Packaging: Bulk For Use With/Related Products: NHS3100 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
товар відсутній |
| 74HCT368DB,112 |
|
Виробник: NXP USA Inc.
Description: IC INVERTER DL 4,2-INPUT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Description: IC INVERTER DL 4,2-INPUT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
на замовлення 4368 шт:
термін постачання 21-31 дні (днів)| MRFE6VS25GNR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
на замовлення 435 шт:
термін постачання 21-31 дні (днів)| MRFE6VS25GNR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
на замовлення 435 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2711.24 грн |
| 10+ | 1981.25 грн |
| 25+ | 1820.17 грн |
| 100+ | 1539.72 грн |
| 250+ | 1507.47 грн |
| MC34017A-3P |
|
Виробник: NXP USA Inc.
Description: IC TELECOM INTERFACE 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Function: Tone Ringer
Operating Temperature: -20°C ~ 60°C
Voltage - Supply: 5V
Current - Supply: 20mA
Supplier Device Package: 8-PDIP
Number of Circuits: 1
Power (Watts): 1 W
Description: IC TELECOM INTERFACE 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Function: Tone Ringer
Operating Temperature: -20°C ~ 60°C
Voltage - Supply: 5V
Current - Supply: 20mA
Supplier Device Package: 8-PDIP
Number of Circuits: 1
Power (Watts): 1 W
товар відсутній
| SPC5603BF2VLH4R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
товар відсутній
| MRFE6VP6300HSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MRFE6VP5600HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 25dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Bulk
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: 2 N-Channel
Power - Output: 600W
Gain: 25dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-1230-4S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 1479 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 11870.22 грн |
| AFIC10275NR1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32.6dB
Supplier Device Package: TO-270 WB-14
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32.6dB
Supplier Device Package: TO-270 WB-14
на замовлення 175 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 18901.49 грн |
| SPC5675KFAVJM2R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товар відсутній
| SPC5675KFAVJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товар відсутній
| MPC8347ZQADDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
товар відсутній
| MC9S08JM32CGT |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
товар відсутній
| NJJ29C2A7HN5/047Y |
товар відсутній
| BUK663R5-30C,118 |
на замовлення 8739 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 701+ | 30.61 грн |
| LPC5516JBD64Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1500+ | 265.63 грн |
| LPC5516JBD64Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 372.55 грн |
| 10+ | 327.34 грн |
| 25+ | 321.06 грн |
| 50+ | 299.13 грн |
| 100+ | 268.42 грн |
| 250+ | 267.41 грн |
| 500+ | 246.51 грн |
| LPC5516JBD64K |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 372.55 грн |
| 10+ | 327.34 грн |
| 25+ | 321.06 грн |
| 40+ | 299.12 грн |
| 80+ | 268.42 грн |
| 230+ | 267.41 грн |
| 800+ | 242.55 грн |
| MAC57D5-516DC |
Виробник: NXP USA Inc.
Description: MAC57D5XX EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Utilized IC / Part: MAC57D5xx
Description: MAC57D5XX EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Utilized IC / Part: MAC57D5xx
товар відсутній
| PMEG2010EV,115 |
|
на замовлення 80000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5701+ | 3.5 грн |
| 74HC253D,652 |
|
Виробник: NXP USA Inc.
Description: IC DUAL 4-IN MUX 3-ST 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DUAL 4-IN MUX 3-ST 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
на замовлення 31369 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1555+ | 13.29 грн |
| SAF7770EL/101Z120Y |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
| SAF7770EL/101Z120K |
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
товар відсутній
| FB32K146HRT0VLLR |
товар відсутній
| FB32K146HRT0VLLT |
товар відсутній
| S32G254ASBK0VUCR |
Виробник: NXP USA Inc.
Description: S32G254A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: S32G254A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S9S12G64J0MLHR |
Виробник: NXP USA Inc.
Description: S12 CORE 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товар відсутній
| S9S12G48J0MLHR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товар відсутній
| TEA19162HT/2J |
|
Виробник: NXP USA Inc.
Description: IC PFC CONTROLLER SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Description: IC PFC CONTROLLER SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
товар відсутній
| TEA19162HT/2J |
|
Виробник: NXP USA Inc.
Description: IC PFC CONTROLLER SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Description: IC PFC CONTROLLER SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
товар відсутній
| P3T1035DUKAZ |
|
Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Description: IC
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 74.51 грн |
| 10+ | 64.21 грн |
| 25+ | 60.94 грн |
| 100+ | 46.99 грн |
| 250+ | 43.92 грн |
| 500+ | 38.82 грн |
| 1000+ | 30.14 грн |
| MC35FS6500NAE |
|
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MCIMX6D6AVT08AD |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 183 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5606.47 грн |
| 10+ | 4459.92 грн |
| 120+ | 4107.77 грн |
| TEA19051BARTK/1J |
|
Виробник: NXP USA Inc.
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
товар відсутній
| MGD3160AM338EKR2 |
|
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| 74ABT16374BDL,118 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48SSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 mA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 260 MHz
Input Capacitance: 4 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE DUAL 8BIT 48SSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 2 mA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 260 MHz
Input Capacitance: 4 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Bits per Element: 8
товар відсутній
| 74ABT16373BDL,118 |
|
Виробник: NXP USA Inc.
Description: IC 16BIT D TYPE LATCH 48SSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2ns
Supplier Device Package: 48-SSOP
Description: IC 16BIT D TYPE LATCH 48SSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2ns
Supplier Device Package: 48-SSOP
товар відсутній
| 74LVC162244ADL,118 |
|
на замовлення 3700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 683+ | 31.32 грн |
| 74ABT16240ADL,118 |
|
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 522+ | 41.29 грн |
| 74ALVC16245DL,118 |
|
на замовлення 4038 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 410+ | 51.97 грн |
| PCA9420BSAZ |
|
Виробник: NXP USA Inc.
Description: PCA9420BS
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
Description: PCA9420BS
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
товар відсутній
| PCA9420BSAZ |
|
Виробник: NXP USA Inc.
Description: PCA9420BS
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
Description: PCA9420BS
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
на замовлення 2246 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 229.61 грн |
| 10+ | 198.63 грн |
| 25+ | 195.57 грн |
| 50+ | 183.08 грн |
| 100+ | 163.58 грн |
| 250+ | 158.21 грн |
| 500+ | 155.05 грн |
| BZV49-C3V0,115 |
|
на замовлення 59427 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1674+ | 12.76 грн |
| MC33665ATF4AER2 |
|
Виробник: NXP USA Inc.
Description: HIGH SPEED TRANSCEIVER WITH CAN
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH SPEED TRANSCEIVER WITH CAN
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| 74LVCH245ABX,115 |
|
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20DHXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-DHXQFN (4.5x2.5)
Description: IC TXRX NON-INVERT 3.6V 20DHXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-DHXQFN (4.5x2.5)
на замовлення 78786 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1211+ | 17.49 грн |
| 74CBTLV3125DS,118 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74CBTLV3125DS - BUS
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: NOW NEXPERIA 74CBTLV3125DS - BUS
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
на замовлення 225269 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1106+ | 19.22 грн |
| MKM35Z512VLQ7R |
|
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 796.8 грн |
| 10+ | 710.69 грн |
| 25+ | 694.57 грн |
| 50+ | 648.32 грн |
| 100+ | 570.72 грн |
| 250+ | 542.4 грн |
| MC68LC302CAF20CT |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Description: IC MPU M683XX 20MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
товар відсутній
| P3S0210BQAZ |
|
Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
товар відсутній
| S9S08LG32J0CLK |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
товар відсутній
| PEMI4QFN/LM,132 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
на замовлення 36000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2959+ | 7.12 грн |
| 74HC30PW,112 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 1CH 8-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 8
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 1CH 8-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 8
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
на замовлення 26640 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2125+ | 9.79 грн |
| SPC5645BK0VLT1 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
товар відсутній
| PMG370XN,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 960MA 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 960mA (Ta)
Rds On (Max) @ Id, Vgs: 440mOhm @ 200mA, 4.5V
Power Dissipation (Max): 690mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-TSSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.65 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 37 pF @ 25 V
Description: MOSFET N-CH 30V 960MA 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 960mA (Ta)
Rds On (Max) @ Id, Vgs: 440mOhm @ 200mA, 4.5V
Power Dissipation (Max): 690mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-TSSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.65 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 37 pF @ 25 V
на замовлення 111000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3328+ | 6.3 грн |
| FRDM-22XSDBEVB |
Виробник: NXP USA Inc.
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
товар відсутній
| LFBDMPGMR |
Виробник: NXP USA Inc.
Description: BDM FLASH PROGRAMMER FOR HCS08,
Packaging: Bulk
For Use With/Related Products: HC12, HCS08, HCS12, HCS12X
Type: Programmer
Contents: Board(s), Cable(s), Power Supply, Accessories
Description: BDM FLASH PROGRAMMER FOR HCS08,
Packaging: Bulk
For Use With/Related Products: HC12, HCS08, HCS12, HCS12X
Type: Programmer
Contents: Board(s), Cable(s), Power Supply, Accessories
товар відсутній
| MPL3150A2ST1 |
Виробник: NXP USA Inc.
Description: IC BAR SENSOR 150KPA HORIZON 8TS
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
Description: IC BAR SENSOR 150KPA HORIZON 8TS
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
товар відсутній
| SPC5200CVR400B |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
товар відсутній
| SPC5200CVR400BR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
товар відсутній
| NXH3675UK/A1Z |
|
товар відсутній
| NHS3100THADADKUL |
Виробник: NXP USA Inc.
Description: NHS3100 THERAPY ADK
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NHS3100 THERAPY ADK
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
товар відсутній