Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35275) > Сторінка 567 з 588
| Фото | Назва | Виробник | Інформація |
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| S9S12ZVL16F0MLFR | NXP USA Inc. |
Description: S12Z CPU, 16K FLASH Packaging: Tape & Reel (TR) |
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| S9S12G64J0WLFR | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
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| MC33FS6506NAER2 | NXP USA Inc. |
 Description: SYSTEM BASIS CHIP, DCDC 0.8A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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PMP5501G,115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR, Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Transistor Type: 2 PNP (Dual) Matched Pair, Common Emitter Operating Temperature: 150°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V Frequency - Transition: 175MHz Supplier Device Package: SOT-353 |
на замовлення 331269 шт: термін постачання 21-31 дні (днів) |
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QN9080CHNY | NXP USA Inc. |
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 3.5mA Current - Transmitting: 3.5mA Supplier Device Package: 48-HVQFN (6x6) GPIO: 35 RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB DigiKey Programmable: Not Verified |
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QN9080CHNY | NXP USA Inc. |
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 3.5mA Current - Transmitting: 3.5mA Supplier Device Package: 48-HVQFN (6x6) GPIO: 35 RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB DigiKey Programmable: Not Verified |
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| MGD3160AM318EKR2 | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 40V Input Type: Non-Inverting Supplier Device Package: 32-SOIC Channel Type: Single Driven Configuration: High-Side Number of Drivers: 1 Gate Type: IGBT, SiC MOSFET Current - Peak Output (Source, Sink): 15A, 15A Grade: Automotive Qualification: AEC-Q100 |
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| MC35FS6506CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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| MC35FS6506CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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A1006UK/TA1NXZ | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 4WLCSP Packaging: Tape & Reel (TR) Package / Case: 4-XFBGA, WLCSP Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 4-WLCSP DigiKey Programmable: Not Verified |
на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
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A1006UK/TA1NXZ | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 4WLCSP Packaging: Cut Tape (CT) Package / Case: 4-XFBGA, WLCSP Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 4-WLCSP DigiKey Programmable: Not Verified |
на замовлення 15979 шт: термін постачання 21-31 дні (днів) |
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| TEF5200EL/V1K | NXP USA Inc. |
Description: IC Packaging: Tray |
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| TEF5200EL/V1Y | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
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| MF3D8300DA8/00J | NXP USA Inc. |
Description: MF3D8300DA8 Packaging: Tape & Reel (TR) Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
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FRDMGD3162HBIEVM | NXP USA Inc. |
Description: EVAL BOARD FOR GD3162 Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3162 Supplied Contents: Board(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU |
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| DC6M601X6/18S,135 | NXP USA Inc. |
Description: IC REG BUCK 1.8V 650MA 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 650mA Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 6MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 6-WLCSP (1.36x0.96) Synchronous Rectifier: Yes Voltage - Input (Min): 2.3V Voltage - Output (Min/Fixed): 1.8V |
на замовлення 12300 шт: термін постачання 21-31 дні (днів) |
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BZX79-B8V2,133 | NXP USA Inc. |
Description: DIODE ZENER 8.2V 400MW ALF2 Packaging: Bulk Tolerance: ±2% Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 8.2 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: ALF2 Power - Max: 400 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 700 nA @ 5 V |
на замовлення 176010 шт: термін постачання 21-31 дні (днів) |
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| OM6748J | NXP USA Inc. |
Description: DUMMY MODULE Packaging: Bulk |
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| OM6722,118 | NXP USA Inc. |
Description: 08 BIT SMX Packaging: Bulk |
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| OM7770/ZKRSMXDBF | NXP USA Inc. |
Description: OM7770/ZKRSMXDBF Packaging: Bulk |
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| OM6737/NXD61P-HB1J | NXP USA Inc. |
Description: 6-PIN DIF MODULE NXD6.2 Packaging: Bulk |
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| PCA9958HN/Q900Y | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
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| PCA9468UKZ | NXP USA Inc. |
Description: IC BATT CHG 2:1 SWITCHED CAP Packaging: Bulk |
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MPR083Q | NXP USA Inc. |
 Description: IC CTLR TOUCH SENSOR PROX 16-QFNPackaging: Tray Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-QFN-EP (5x5) Proximity Detection: Yes DigiKey Programmable: Not Verified |
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MPR084EJ | NXP USA Inc. |
  Description: IC CTLR TOUCH SENSR PROX 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I2C Type: Buttons, Slider, Wheel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Current - Supply: 1.62mA Number of Inputs: 8 Supplier Device Package: 16-TSSOP Proximity Detection: Yes DigiKey Programmable: Not Verified |
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| BYC20-600,127 | NXP USA Inc. |
Description: DIODE RECT 600V 20A TO-220AC Packaging: Bulk |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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BZV55-B4V7,135 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 500MW LLDS Packaging: Bulk Tolerance: ±2% Package / Case: DO-213AC, MINI-MELF, SOD-80 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 4.7 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: LLDS; MiniMelf Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 2 V |
на замовлення 40000 шт: термін постачання 21-31 дні (днів) |
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MC33FS6600M2KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
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MC33FS6600M1KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
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MC33FS6600M0KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
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MC33FS6600M2KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
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MC33FS6600M1KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
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MC33FS6600M0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
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| S912ZVL96AMLFR | NXP USA Inc. |
Description: S12Z CPU, 96K FLASH Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 |
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MC8641VJ1500KE | NXP USA Inc. |
Description: 32-BIT POWER ARCHITECTURE SOC, 1 Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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MC8641DVU1500KE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA Packaging: Tray Package / Case: 1023-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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MC8641DVU1500KE | NXP USA Inc. |
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA Packaging: Tray Package / Case: 1023-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO |
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| MC33FS6517NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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| MC33FS6517NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MC33912G5ACR2 | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) |
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| K32W2ARD-ITPS | NXP USA Inc. |
Description: K32W2ARD-ITPS Packaging: Bulk |
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| XFRDM-STBA-A8961 | NXP USA Inc. |
Description: DEV KIT Packaging: Bulk |
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| C9KEAZ128Q80EVB | NXP USA Inc. |
Description: IC Packaging: Bulk |
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| RD33774PC3EVB | NXP USA Inc. |
Description: IC Packaging: Box |
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PTN38007-EVM | NXP USA Inc. |
Description: PTN38007 EVALUATION BOARD Packaging: Bulk Function: Re-Driver Type: Interface Utilized IC / Part: PTN38007 Supplied Contents: Board(s) Embedded: No |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| FRDMGD3160CSLEVM | NXP USA Inc. |
Description: FRDMGD3160CSLEVM Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160 Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU |
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MC9328MXLCVP15 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 150MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM920T Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 225-MAPBGA (13x13) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART |
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PDTA144EM,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 250MW SOT883 Packaging: Bulk |
на замовлення 78670 шт: термін постачання 21-31 дні (днів) |
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74HCT4046ADB,118 | NXP USA Inc. |
Description: IC PLL W/VCO 16SSOP Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 5843 шт: термін постачання 21-31 дні (днів) |
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| BCW60B,215 | NXP USA Inc. |
Description: TRANSISTOR NPN 32V 100MA SOT23 Packaging: Bulk |
на замовлення 36914 шт: термін постачання 21-31 дні (днів) |
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MCIMX7D3DVK10SC | NXP USA Inc. |
Description: IC MPU I.MX7D 1.0GHZ 488TFBGA Packaging: Tray Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-TFBGA (12x12) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
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P2020NSN2KHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, SPI |
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74AHCT373D,118 | NXP USA Inc. |
Description: IC OCT D TRANSP LATCH 3ST 20SOIC Packaging: Bulk |
на замовлення 5551 шт: термін постачання 21-31 дні (днів) |
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74AUP1G57GF,132 | NXP USA Inc. |
Description: IC CONFIG MULTI-FUNC GATE 6-XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Schmitt Trigger Input: No Supplier Device Package: 6-XSON, SOT891 (1x1) Number of Circuits: 1 |
на замовлення 107624 шт: термін постачання 21-31 дні (днів) |
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| NCF29AEXHN4/0100IY | NXP USA Inc. |
Description: NCF29AEXHN4 Packaging: Tape & Reel (TR) |
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| MFS2613AMDA3ADR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
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TDA18218HN/C1,551 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.13V ~ 3.47V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Control Interface: I2C |
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TDA8787AHL/C3,151 | NXP USA Inc. |
Description: IC CCD 10BIT 18M 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Type: CCD (Charged Coupled Device) Data Interface: Serial Operating Temperature: -20°C ~ 75°C Voltage - Supply: 2.7V ~ 3.6V Sampling Rate (Per Second): 18m Resolution (Bits): 10 b Voltage Supply Source: Analog and Digital Supplier Device Package: 48-LQFP (7x7) Number of Channels: 1 |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
|
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 |
74AUP1G332GM,132 | NXP USA Inc. |
Description: IC GATE OR 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 6-XSON (1.45x1) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 30pF Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
на замовлення 75000 шт: термін постачання 21-31 дні (днів) |
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74AUP1G332GN,132 | NXP USA Inc. |
Description: IC GATE OR 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 6-XSON (0.9x1) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 30pF Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
на замовлення 100000 шт: термін постачання 21-31 дні (днів) |
| S9S12ZVL16F0MLFR |
товар відсутній
| S9S12G64J0WLFR |
Виробник: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
товар відсутній
| MC33FS6506NAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| PMP5501G,115 |
|
Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual) Matched Pair, Common Emitter
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 175MHz
Supplier Device Package: SOT-353
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual) Matched Pair, Common Emitter
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 175MHz
Supplier Device Package: SOT-353
на замовлення 331269 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4438+ | 4.91 грн |
| QN9080CHNY |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
товар відсутній
| QN9080CHNY |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLUETOOTH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 35
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
товар відсутній
| MGD3160AM318EKR2 |
|
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC35FS6506CAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC35FS6506CAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| A1006UK/TA1NXZ |
Виробник: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4000+ | 53.22 грн |
| 8000+ | 50.68 грн |
| 12000+ | 49.02 грн |
| A1006UK/TA1NXZ |
Виробник: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Cut Tape (CT)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
Description: IC SECURE AUTHENTICATOR 4WLCSP
Packaging: Cut Tape (CT)
Package / Case: 4-XFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 4-WLCSP
DigiKey Programmable: Not Verified
на замовлення 15979 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 76.79 грн |
| 10+ | 67.28 грн |
| 25+ | 66.48 грн |
| 50+ | 61.99 грн |
| 100+ | 55.43 грн |
| 250+ | 54.97 грн |
| 500+ | 53.27 грн |
| 1000+ | 51.36 грн |
| MF3D8300DA8/00J |
|
Виробник: NXP USA Inc.
Description: MF3D8300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D8300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
товар відсутній
| FRDMGD3162HBIEVM |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3162
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3162
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
товар відсутній
| DC6M601X6/18S,135 |
|
Виробник: NXP USA Inc.
Description: IC REG BUCK 1.8V 650MA 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.8V
Description: IC REG BUCK 1.8V 650MA 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.8V
на замовлення 12300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 807+ | 26.34 грн |
| BZX79-B8V2,133 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 8.2V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
Description: DIODE ZENER 8.2V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
на замовлення 176010 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13172+ | 1.42 грн |
| OM6737/NXD61P-HB1J |
товар відсутній
| PCA9468UKZ |
товар відсутній
| MPR083Q |
|
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tray
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Packaging: Tray
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-QFN-EP (5x5)
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній
| MPR084EJ | |
|
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Buttons, Slider, Wheel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Current - Supply: 1.62mA
Number of Inputs: 8
Supplier Device Package: 16-TSSOP
Proximity Detection: Yes
DigiKey Programmable: Not Verified
товар відсутній
| BYC20-600,127 |
|
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 364+ | 58.85 грн |
| BZV55-B4V7,135 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 4.7V 500MW LLDS
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
Description: DIODE ZENER 4.7V 500MW LLDS
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 2 V
на замовлення 40000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13172+ | 1.42 грн |
| MC33FS6600M2KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
товар відсутній
| MC33FS6600M1KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
товар відсутній
| MC33FS6600M0KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
товар відсутній
| MC33FS6600M2KS |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
товар відсутній
| MC33FS6600M1KS |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
товар відсутній
| MC33FS6600M0KS |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
товар відсутній
| S912ZVL96AMLFR |
Виробник: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
товар відсутній
| MC8641VJ1500KE |
|
Виробник: NXP USA Inc.
Description: 32-BIT POWER ARCHITECTURE SOC, 1
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: 32-BIT POWER ARCHITECTURE SOC, 1
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 57098.7 грн |
| MC8641DVU1500KE |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 45352.79 грн |
| MC8641DVU1500KE |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
товар відсутній
| MC33FS6517NAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC33FS6517NAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC33912G5ACR2 |
|
Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
товар відсутній
| PTN38007-EVM |
|
Виробник: NXP USA Inc.
Description: PTN38007 EVALUATION BOARD
Packaging: Bulk
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN38007
Supplied Contents: Board(s)
Embedded: No
Description: PTN38007 EVALUATION BOARD
Packaging: Bulk
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN38007
Supplied Contents: Board(s)
Embedded: No
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28189.72 грн |
| FRDMGD3160CSLEVM |
|
Виробник: NXP USA Inc.
Description: FRDMGD3160CSLEVM
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Description: FRDMGD3160CSLEVM
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
товар відсутній
| MC9328MXLCVP15 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
товар відсутній
| PDTA144EM,315 |
|
на замовлення 78670 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 11871+ | 2.13 грн |
| 74HCT4046ADB,118 |
|
Виробник: NXP USA Inc.
Description: IC PLL W/VCO 16SSOP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC PLL W/VCO 16SSOP
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 5843 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 577+ | 36.37 грн |
| BCW60B,215 |
|
на замовлення 36914 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13053+ | 1.42 грн |
| MCIMX7D3DVK10SC |
Виробник: NXP USA Inc.
Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU I.MX7D 1.0GHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
товар відсутній
| P2020NSN2KHC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
товар відсутній
| 74AHCT373D,118 |
|
на замовлення 5551 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1776+ | 12.1 грн |
| 74AUP1G57GF,132 |
|
Виробник: NXP USA Inc.
Description: IC CONFIG MULTI-FUNC GATE 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 6-XSON, SOT891 (1x1)
Number of Circuits: 1
Description: IC CONFIG MULTI-FUNC GATE 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 6-XSON, SOT891 (1x1)
Number of Circuits: 1
на замовлення 107624 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1972+ | 10.63 грн |
| NCF29AEXHN4/0100IY |
товар відсутній
| MFS2613AMDA3ADR2 |
|
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
товар відсутній
| TDA18218HN/C1,551 |
|
Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.13V ~ 3.47V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Description: IC VIDEO SILICON TUNER 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.13V ~ 3.47V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
товар відсутній
| TDA8787AHL/C3,151 |
|
Виробник: NXP USA Inc.
Description: IC CCD 10BIT 18M 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: CCD (Charged Coupled Device)
Data Interface: Serial
Operating Temperature: -20°C ~ 75°C
Voltage - Supply: 2.7V ~ 3.6V
Sampling Rate (Per Second): 18m
Resolution (Bits): 10 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 48-LQFP (7x7)
Number of Channels: 1
Description: IC CCD 10BIT 18M 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: CCD (Charged Coupled Device)
Data Interface: Serial
Operating Temperature: -20°C ~ 75°C
Voltage - Supply: 2.7V ~ 3.6V
Sampling Rate (Per Second): 18m
Resolution (Bits): 10 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 48-LQFP (7x7)
Number of Channels: 1
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 51+ | 417.58 грн |
| 74AUP1G332GM,132 |
|
Виробник: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 75000 шт:
термін постачання 21-31 дні (днів)| 74AUP1G332GN,132 |
|
Виробник: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 100000 шт:
термін постачання 21-31 дні (днів)