Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35276) > Сторінка 465 з 588
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||
|---|---|---|---|---|---|---|---|---|---|
 |
LPC1115JET48/303151 | NXP USA Inc. |
 Description: IC MCU 32BIT 64KB FLASH 48LQFP |
товар відсутній |
|||||
| UJA1162A-EVB | NXP USA Inc. |
Description: UJA1162A EVAL BOARD Packaging: Bulk Function: CAN Transceiver Type: Interface Utilized IC / Part: UJA1162A Supplied Contents: Board(s) Embedded: Yes, MCU Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
|||||
 |
SP5747GTK0AMKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
SP5747GK0AMMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
|
|
SPC5747GK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 4MB (4M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
|
|
SPC5747GTK0AMKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
NCF2984AHN/T0BEY | NXP USA Inc. | Description: MANTRA F |
товар відсутній |
|||||
 |
PMEG3010ESB314 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY Packaging: Bulk Part Status: Active |
на замовлення 477000 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
LS1026AXN8P1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
товар відсутній |
|||||
 |
MC17XSF500EK-NXP | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 18V, PENTA 17M |
товар відсутній |
|||||
 |
MC40XS6500CEK | NXP USA Inc. |
Description: HIGH-SIDE SWITCH 12V PENTA 40MOH |
товар відсутній |
|||||
| PCAL6408AHK115 | NXP USA Inc. |
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I |
товар відсутній |
||||||
 |
LPC1113FBD48/301151 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 |
товар відсутній |
|||||
 |
NCF2951BTT/T0E080J | NXP USA Inc. | Description: IC ACTIC 4G 3D 38TSSOP |
товар відсутній |
|||||
 |
FXPS7115DI4T1 | NXP USA Inc. |
Description: 40-115 KPA BAP DIG I2C |
товар відсутній |
|||||
| FXTH870902DT1528 | NXP USA Inc. |
Description: TPMS 7X7 900KPA Z AXIS Packaging: Bulk |
товар відсутній |
||||||
 |
MWCT1001AVLHR528 | NXP USA Inc. |
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR |
товар відсутній |
|||||
 |
MWCT1001AVLH557 | NXP USA Inc. |
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR |
товар відсутній |
|||||
 |
MPL3150A2T1 | NXP USA Inc. |
Description: PRESS SENSOR 2.5V 50/110KPA TSON |
товар відсутній |
|||||
|
|
MPL3150A2 | NXP USA Inc. |
Description: PRESS SENSOR 2.5V 50/110KPA TSON |
товар відсутній |
|||||
| MC33FS8510B6ESR2 | NXP USA Inc. |
Description: FS8500 Packaging: Tape & Reel (TR) |
товар відсутній |
||||||
| MC33FS8510B6ES | NXP USA Inc. |
Description: FS8500 Packaging: Tray |
товар відсутній |
||||||
| LPC11E13FBD48/301 | NXP USA Inc. | Description: IC MCU ARM CORTEX-M0 32BIT FLASH |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
|
|||||
 |
S912XET512BVAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
S912XET512BVALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
74ABT162245ADGG512 | NXP USA Inc. |
Description: BUS TRANSCEIVER, ABT SERIES |
на замовлення 975 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
SPC5604CF2VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
MKL28Z512VLL7R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 27x16b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 90 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
MFS8603BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
товар відсутній |
|||||
 |
S912ZVC64F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
|
|
S912ZVC64F0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
товар відсутній |
|||||
 |
S9S12GN16F1CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER 16-BIT, HCS12 C |
товар відсутній |
|||||
|
|
S9S12GN32F1CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
товар відсутній |
|||||
| S9S12G48BCLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
товар відсутній |
||||||
|
|
S9S12GN48F1CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
товар відсутній |
|||||
|
|
MC9S08DZ16ACLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
товар відсутній |
|||||
 |
BZB784-C2V7,115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C2V7 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-323 Part Status: Active Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V |
на замовлення 168000 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
BZB784-C8V2,115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C8V2 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 8.2 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 700 nA @ 5 V |
на замовлення 129290 шт: термін постачання 21-31 дні (днів) |
|
||||
| BZB84-C75215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C75 - ZENER D |
товар відсутній |
||||||
 |
BZB84-C11215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C10 - ZENER D |
товар відсутній |
|||||
 |
BZX84-C2V7/LF1R | NXP USA Inc. |
Description: DIODE ZENER 2.7V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Grade: Automotive Qualification: AEC-Q101 |
товар відсутній |
|||||
|
|
BZX84-C2V7/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 2.7V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Grade: Automotive Qualification: AEC-Q101 |
товар відсутній |
|||||
 |
BUK7640-100A118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7640-100A - POWE |
на замовлення 4269 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
MCIMX250DJM4A | NXP USA Inc. | Description: IC MPU I.MX25 400MAPBGA |
товар відсутній |
|||||
|
|
MCIMX250CJM4A | NXP USA Inc. |
Description: IC MPU IMX25 IND 400MAPBGA |
товар відсутній |
|||||
 |
MPC8260AZUPJDB-NXP | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSOR, |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
TDF8599TH/N2,512 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 85W 36HSOP Packaging: Tube Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
на замовлення 700 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
TDF8531HH/N3K | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
товар відсутній |
|||||
|
|
TDF8534HH/N3K | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
товар відсутній |
|||||
 |
TDF8531HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 3-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
товар відсутній |
|||||
|
|
TDF8534HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
товар відсутній |
|||||
|
|
TDF8532HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
товар відсутній |
|||||
|
|
TDF8532HH/N3K | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
товар відсутній |
|||||
 |
P1021NXN2DFB | NXP USA Inc. |
Description: IC MPU Q OR IQ 800MHZ 689TEBGA |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
|
||||
 |
MCIMX6L2EVN10ACR | NXP USA Inc. |
Description: I.MX 6SL ROM PERF ENHAN |
товар відсутній |
|||||
 |
LD6806F/18P,115 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 6XSON |
на замовлення 6669 шт: термін постачання 21-31 дні (днів) |
|
||||
| FRDMSTBI-B3115 | NXP USA Inc. |
Description: SENSOR TOOLBOX DEVELOPMENT PLATF Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Sensing Range: 20 ~ 110 kPa Part Status: Active |
товар відсутній |
||||||
| BRKTSTBI-B3115 | NXP USA Inc. |
Description: SENSOR BREAKOUT BOARD FOR FXPQ31 Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 2.5V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Part Status: Active |
товар відсутній |
||||||
 |
FXPQ3115BV | NXP USA Inc. |
Description: PRESS SENSOR 2.5V 20/110KPA TSON |
товар відсутній |
|||||
 |
MPC8544VJALFA | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
|
| LPC1115JET48/303151 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
товар відсутній
| UJA1162A-EVB |
|
Виробник: NXP USA Inc.
Description: UJA1162A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1162A
Supplied Contents: Board(s)
Embedded: Yes, MCU
Part Status: Active
Description: UJA1162A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1162A
Supplied Contents: Board(s)
Embedded: Yes, MCU
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6182.02 грн |
| SP5747GTK0AMKU6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| SP5747GK0AMMJ6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| SPC5747GK0AMMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| SPC5747GTK0AMKU6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| PMEG3010ESB314 |
|
на замовлення 477000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6662+ | 3.5 грн |
| LS1026AXN8P1A |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товар відсутній
| MC17XSF500EK-NXP |
|
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 18V, PENTA 17M
Description: HIGH-SIDE SWITCH, 18V, PENTA 17M
товар відсутній
| LPC1113FBD48/301151 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
товар відсутній
| FXTH870902DT1528 |
товар відсутній
| MWCT1001AVLHR528 |
|
Виробник: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
товар відсутній
| MC33FS8510B6ESR2 |
товар відсутній
| LPC11E13FBD48/301 |
Виробник: NXP USA Inc.
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 49+ | 411.25 грн |
| S912XET512BVAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| S912XET512BVALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| 74ABT162245ADGG512 |
|
Виробник: NXP USA Inc.
Description: BUS TRANSCEIVER, ABT SERIES
Description: BUS TRANSCEIVER, ABT SERIES
на замовлення 975 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 704+ | 32.05 грн |
| SPC5604CF2VLL6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
товар відсутній
| MKL28Z512VLL7R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
товар відсутній
| MFS8603BMDA0ES |
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S912ZVC64F0MLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
| S912ZVC64F0MLFR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
| S9S12GN16F1CLC557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Description: MICROCONTROLLER 16-BIT, HCS12 C
товар відсутній
| S9S12GN32F1CLC557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
товар відсутній
| S9S12GN48F1CLC557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
товар відсутній
| MC9S08DZ16ACLC557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
товар відсутній
| BZB784-C2V7,115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
на замовлення 168000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10452+ | 2.08 грн |
| BZB784-C8V2,115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
на замовлення 129290 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10452+ | 2.28 грн |
| BZX84-C2V7/LF1R |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
| BZX84-C2V7/LF1VL |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
| BUK7640-100A118 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK7640-100A - POWE
Description: NOW NEXPERIA BUK7640-100A - POWE
на замовлення 4269 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 478+ | 46.96 грн |
| MPC8260AZUPJDB-NXP |
|
Виробник: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR,
Description: POWERQUICC RISC MICROPROCESSOR,
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 20118.74 грн |
| TDF8599TH/N2,512 |
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 85W 36HSOP
Packaging: Tube
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 85W 36HSOP
Packaging: Tube
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
на замовлення 700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 24+ | 989.15 грн |
| TDF8531HH/N3Y |
|
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
товар відсутній
| TDF8532HH/N3K |
|
Виробник: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
товар відсутній
| P1021NXN2DFB |
|
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6408.97 грн |
| LD6806F/18P,115 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Description: IC REG LINEAR 1.8V 200MA 6XSON
на замовлення 6669 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2404+ | 8.94 грн |
| FRDMSTBI-B3115 |
|
Виробник: NXP USA Inc.
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
товар відсутній
| BRKTSTBI-B3115 |
|
Виробник: NXP USA Inc.
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| MPC8544VJALFA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10819.86 грн |
| 10+ | 8631.45 грн |