Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35276) > Сторінка 468 з 588
| Фото | Назва | Виробник | Інформація |
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BZX84-C13/LF1VL | NXP USA Inc. |
 Description: DIODE ZENER 13V 250MW TO236ABPackaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
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BZX84-C13/LF1R | NXP USA Inc. |
Description: DIODE ZENER 13V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
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MC33772BTA2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
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MC33PF8100CEESR2 | NXP USA Inc. | Description: PF8100 |
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S32K312NHT0MPBST | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 172QFP Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
на замовлення 116 шт: термін постачання 21-31 дні (днів) |
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| S32K344EHT1VPBST | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 172QFP Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 218 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
на замовлення 420 шт: термін постачання 21-31 дні (днів) |
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| S32K344EHT1VMMST | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 257LFBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active Number of I/O: 218 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1135 шт: термін постачання 21-31 дні (днів) |
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| S32K3-T-BOX | NXP USA Inc. |
Description: S32K3-T-BOX REF DESIGN BOARD Packaging: Box Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: S32K3 Part Status: Active |
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74LVC162244ADGG118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC162244ADGG - B Packaging: Bulk Part Status: Active |
на замовлення 4971 шт: термін постачання 21-31 дні (днів) |
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74ALVCH16843DGG118 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Circuit: 9:9 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Independent Circuits: 2 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 2.2ns Supplier Device Package: 56-TSSOP |
на замовлення 1218 шт: термін постачання 21-31 дні (днів) |
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74LVCH16244ADGG118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 48-TSSOP |
на замовлення 5499 шт: термін постачання 21-31 дні (днів) |
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MC9S08QE4CWL | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28SOIC |
на замовлення 196 шт: термін постачання 21-31 дні (днів) |
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MC9RS08KB8CSG | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-SOIC Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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MPC8349EVVAJFB | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCH SOC |
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| MPC8347EVVALFB | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCH SOC |
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74LV259BQ,115 | NXP USA Inc. |
Description: IC 8BIT ADDRESS LATCH 16-DHVQFN Packaging: Bulk Package / Case: 16-VFQFN Exposed Pad Output Type: Standard Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type, Addressable Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Delay Time - Propagation: 36ns Supplier Device Package: 16-DHVQFN (2.5x3.5) Part Status: Obsolete |
на замовлення 2725 шт: термін постачання 21-31 дні (днів) |
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NCX2220GF115 | NXP USA Inc. |
Description: IC COMPARATOR DUAL LV 8XSON Packaging: Bulk Part Status: Active |
на замовлення 9145 шт: термін постачання 21-31 дні (днів) |
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NCX2220GT115 | NXP USA Inc. |
Description: SINGLE COMPARATOR Packaging: Bulk Part Status: Active |
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PEMI6QFN/RG,132 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHM/11PF SMD Packaging: Cut Tape (CT) Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 15dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
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FS32K148UAT0VLLT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100LQFP |
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| MIMX8MN6DVTJZDA | NXP USA Inc. | Description: I.MX 8M NANO QUAD FCBGA486M |
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TJA1152AT/0Z | NXP USA Inc. |
Description: IC HS-CAN TXRX W/ STANDBY & VIO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 150°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 40kbps Protocol: CANbus Supplier Device Package: 8-SO Part Status: Active |
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TJA1152AT/0Z | NXP USA Inc. |
Description: IC HS-CAN TXRX W/ STANDBY & VIO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 150°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 40kbps Protocol: CANbus Supplier Device Package: 8-SO Part Status: Active |
на замовлення 1970 шт: термін постачання 21-31 дні (днів) |
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| TDA18250AHN/C1,551 | NXP USA Inc. | Description: IC VIDEO SILICON TUNER |
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74HCT3G04DP-Q100125 | NXP USA Inc. |
Description: IC INVERTER 3CH 3-INP 8TSSOP |
на замовлення 2521 шт: термін постачання 21-31 дні (днів) |
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BGA3023Y | NXP USA Inc. |
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO |
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BGA3023Y | NXP USA Inc. |
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO |
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PZM5.6NB2,115 | NXP USA Inc. |
Description: DIODE ZENER 5.6V 300MW SMT3 Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SMT3; MPAK Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V |
на замовлення 501990 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G2CVM05ABR | NXP USA Inc. |
Description: IC MPU I.MX6G 528MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
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BUK6E2R0-30C127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V Power Dissipation (Max): 306W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V Grade: Automotive Qualification: AEC-Q101 |
на замовлення 4728 шт: термін постачання 21-31 дні (днів) |
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BZX84-C24/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 70 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V |
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MC35FS6500NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MC9S08JS16LCFK557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
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| LS1027ASN7KQA | NXP USA Inc. | Description: LS1027A-1000 ST NO SEC |
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LS1027ASE7NQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.3GHZ 448FBGA Packaging: Tray Package / Case: 448-BFBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 448-FBGA (17x17) Ethernet: 1Gbps (1), 2.5Gbps (5) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM SATA: SATA 6Gbps (1) Part Status: Active Additional Interfaces: CANbus, I2C, SPI, UART |
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| LS1017AXN7HNA | NXP USA Inc. | Description: LS1017A-800 XT NO SEC |
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| LS1017AXN7NQA | NXP USA Inc. | Description: LS1017A-1300 XT NO SEC |
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74AVC16T245DGG,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 48TSSOP |
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SSTU32865ET/G,518 | NXP USA Inc. |
Description: IC REG BUFFER 28BIT 160-TFBGA Packaging: Bulk Package / Case: 160-TFBGA Mounting Type: Surface Mount Number of Bits: 28 Logic Type: 1:2 Registered Buffer with Parity Operating Temperature: 0°C ~ 70°C Supply Voltage: 1.7V ~ 1.9V Supplier Device Package: 160-TFBGA (13x9) Part Status: Obsolete |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74LVTH244ADB,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SSOP |
на замовлення 2921 шт: термін постачання 21-31 дні (днів) |
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74LVTH244AD,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SO |
на замовлення 17890 шт: термін постачання 21-31 дні (днів) |
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| BLF2425M7LS140,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V SOT502B Packaging: Tube Package / Case: SOT-502B Frequency: 2.45GHz Power - Output: 140W Gain: 18.5dB Technology: LDMOS Supplier Device Package: SOT502B Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.3 A |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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| NXH3670ADK | NXP USA Inc. |
Description: NXH3670ADK Packaging: Bulk Part Status: Active |
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S9S08SL16F1MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
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MC15XS3400DHFK557 | NXP USA Inc. |
Description: BUFFER/INVERTER BASED PERIPHERAL |
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NX3L4053HR,115 | NXP USA Inc. |
Description: IC ANALOG SWITCH SPDT HXQFN16U Packaging: Bulk Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 800mOhm -3db Bandwidth: 60MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 120mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Discontinued at Digi-Key Number of Circuits: 3 |
на замовлення 31106 шт: термін постачання 21-31 дні (днів) |
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BUK9609-55A,118 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A D2PAK |
на замовлення 1600 шт: термін постачання 21-31 дні (днів) |
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| BUK9614-60E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9614-60E - POWER |
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S912XEQ512BMALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
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| ASL5115EVBMST | NXP USA Inc. |
Description: ASL5115EVBMST Packaging: Bulk Features: Dimmable Voltage - Input: 4.5V ~ 5.5V Current - Output / Channel: 1.5A Utilized IC / Part: ASL5115 Supplied Contents: Board(s) Outputs and Type: 12, Non-Isolated Part Status: Active |
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| MK21FX512AVMD12 | NXP USA Inc. |
Description: KINETIS K21: 120MHZ CORTEX-M4F M |
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S9S12G240F0VLH | NXP USA Inc. |
Description: IC MCU 16BIT 240KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 240KB (240K x 8) RAM Size: 11K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
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MKL33Z32VLK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
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| SEN-GEN6-SKT | NXP USA Inc. | Description: SOCKET EVALUATION BOARD FOR FXLS |
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N74F157AN,602 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Supplier Device Package: 16-DIP Part Status: Obsolete |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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| MM912J637AM2EPR2564 | NXP USA Inc. |
Description: MM912 - MAGNIV S12 RELAY DRIVER, |
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SPC5673KAVMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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SPC5673KAVMM1R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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74LVT241PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
на замовлення 12500 шт: термін постачання 21-31 дні (днів) |
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74LVT240PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
на замовлення 4800 шт: термін постачання 21-31 дні (днів) |
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| BZX84-C13/LF1VL |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 13V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 13V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
| BZX84-C13/LF1R |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 13V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 13V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
товар відсутній
| MC33772BTA2AER2 |
|
Виробник: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
товар відсутній
| S32K312NHT0MPBST |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 116 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 938.21 грн |
| 10+ | 721.97 грн |
| 80+ | 609.78 грн |
| S32K344EHT1VPBST |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 420 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1823.96 грн |
| 10+ | 1408.64 грн |
| 80+ | 1202.88 грн |
| S32K344EHT1VMMST |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Number of I/O: 218
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINBus, SPI, QSPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Number of I/O: 218
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1135 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1861.98 грн |
| 10+ | 1437.86 грн |
| 80+ | 1227.82 грн |
| S32K3-T-BOX |
|
Виробник: NXP USA Inc.
Description: S32K3-T-BOX REF DESIGN BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: S32K3
Part Status: Active
Description: S32K3-T-BOX REF DESIGN BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: S32K3
Part Status: Active
товар відсутній
| 74LVC162244ADGG118 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC162244ADGG - B
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVC162244ADGG - B
Packaging: Bulk
Part Status: Active
на замовлення 4971 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 893+ | 23.65 грн |
| 74ALVCH16843DGG118 |
|
Виробник: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 9:9
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.2ns
Supplier Device Package: 56-TSSOP
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 9:9
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.2ns
Supplier Device Package: 56-TSSOP
на замовлення 1218 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 404+ | 51.47 грн |
| 74LVCH16244ADGG118 |
|
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-TSSOP
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-TSSOP
на замовлення 5499 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 522+ | 41.74 грн |
| MC9S08QE4CWL |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Description: IC MCU 8BIT 4KB FLASH 28SOIC
на замовлення 196 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 118+ | 195.7 грн |
| MC9RS08KB8CSG |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 64 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 267.63 грн |
| 10+ | 201.12 грн |
| 74LV259BQ,115 |
|
Виробник: NXP USA Inc.
Description: IC 8BIT ADDRESS LATCH 16-DHVQFN
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 36ns
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
Description: IC 8BIT ADDRESS LATCH 16-DHVQFN
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 36ns
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
на замовлення 2725 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 720+ | 31.93 грн |
| NCX2220GF115 |
|
на замовлення 9145 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1025+ | 20.31 грн |
| PEMI6QFN/RG,132 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 100 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
товар відсутній
| TJA1152AT/0Z |
|
Виробник: NXP USA Inc.
Description: IC HS-CAN TXRX W/ STANDBY & VIO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 40kbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
Description: IC HS-CAN TXRX W/ STANDBY & VIO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 40kbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
товар відсутній
| TJA1152AT/0Z |
|
Виробник: NXP USA Inc.
Description: IC HS-CAN TXRX W/ STANDBY & VIO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 40kbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
Description: IC HS-CAN TXRX W/ STANDBY & VIO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 40kbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
на замовлення 1970 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 300.32 грн |
| 10+ | 259.76 грн |
| 25+ | 245.59 грн |
| 100+ | 199.76 грн |
| 250+ | 189.51 грн |
| 500+ | 170.05 грн |
| 1000+ | 141.06 грн |
| 74HCT3G04DP-Q100125 |
|
Виробник: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8TSSOP
Description: IC INVERTER 3CH 3-INP 8TSSOP
на замовлення 2521 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1656+ | 13.66 грн |
| PZM5.6NB2,115 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 5.6V 300MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
Description: DIODE ZENER 5.6V 300MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2.5 V
на замовлення 501990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8876+ | 2.13 грн |
| MCIMX6G2CVM05ABR |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6G 528MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
| BUK6E2R0-30C127 |
|
Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
на замовлення 4728 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 329+ | 63.08 грн |
| BZX84-C24/LF1VL |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 24V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Description: DIODE ZENER 24V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
товар відсутній
| MC35FS6500NAER2 |
|
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| MC9S08JS16LCFK557 |
|
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
товар відсутній
| LS1027ASE7NQA |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, I2C, SPI, UART
товар відсутній
| SSTU32865ET/G,518 |
|
Виробник: NXP USA Inc.
Description: IC REG BUFFER 28BIT 160-TFBGA
Packaging: Bulk
Package / Case: 160-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 1.9V
Supplier Device Package: 160-TFBGA (13x9)
Part Status: Obsolete
Description: IC REG BUFFER 28BIT 160-TFBGA
Packaging: Bulk
Package / Case: 160-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 1.9V
Supplier Device Package: 160-TFBGA (13x9)
Part Status: Obsolete
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 96+ | 219.7 грн |
| 74LVTH244ADB,118 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
на замовлення 2921 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1104+ | 20.13 грн |
| 74LVTH244AD,118 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Description: IC BUFFER NON-INVERT 3.6V 20SO
на замовлення 17890 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1303+ | 17.14 грн |
| BLF2425M7LS140,112 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Frequency: 2.45GHz
Power - Output: 140W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.3 A
Description: RF MOSFET LDMOS 28V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Frequency: 2.45GHz
Power - Output: 140W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.3 A
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 8937.35 грн |
| NXH3670ADK |
|
товар відсутній
| MC15XS3400DHFK557 |
|
Виробник: NXP USA Inc.
Description: BUFFER/INVERTER BASED PERIPHERAL
Description: BUFFER/INVERTER BASED PERIPHERAL
товар відсутній
| NX3L4053HR,115 |
|
Виробник: NXP USA Inc.
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
на замовлення 31106 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 540+ | 39.83 грн |
| BUK9609-55A,118 |
|
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Description: MOSFET N-CH 55V 75A D2PAK
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 444+ | 47.26 грн |
| S912XEQ512BMALR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| ASL5115EVBMST |
Виробник: NXP USA Inc.
Description: ASL5115EVBMST
Packaging: Bulk
Features: Dimmable
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
Description: ASL5115EVBMST
Packaging: Bulk
Features: Dimmable
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
товар відсутній
| S9S12G240F0VLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 240KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
| MKL33Z32VLK4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
товар відсутній
| N74F157AN,602 |
|
Виробник: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
Description: IC MULTIPLEXER 4 X 2:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2219+ | 9.96 грн |
| MM912J637AM2EPR2564 |
|
Виробник: NXP USA Inc.
Description: MM912 - MAGNIV S12 RELAY DRIVER,
Description: MM912 - MAGNIV S12 RELAY DRIVER,
товар відсутній
| SPC5673KAVMM1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| SPC5673KAVMM1R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| 74LVT241PW/AU118 |
|
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
на замовлення 12500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1312+ | 17.14 грн |
| 74LVT240PW/AU118 |
|
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
на замовлення 4800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1312+ | 17.14 грн |