Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35278) > Сторінка 448 з 588
| Фото | Назва | Виробник | Інформація |
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74ALVCH16601DGG118 | NXP USA Inc. |
 Description: REGISTERED BUS TRANSCEIVERPackaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Number of Circuits: 18 Mounting Type: Surface Mount Logic Type: Universal Bus Transceiver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-TSSOP |
на замовлення 1994 шт: термін постачання 21-31 дні (днів) |
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74ALVCH16601DGG512 | NXP USA Inc. |
Description: REGISTERED BUS TRANSCEIVER Packaging: Bulk Part Status: Active |
на замовлення 875 шт: термін постачання 21-31 дні (днів) |
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MK22FX512AVLH12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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74LV139D,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 2:4 16SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 12mA, 12mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
на замовлення 7819 шт: термін постачання 21-31 дні (днів) |
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| TEA19363DB1484UL | NXP USA Inc. |
Description: 60W USB PD2.0 DEMO BOARD Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA19363 Supplied Contents: Board(s) |
товар відсутній |
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SPC5746CK1AMKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
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MMG3003NT1-NXP | NXP USA Inc. |
Description: WIDE BAND MEDIUM POWER AMPLIFIER |
на замовлення 470 шт: термін постачання 21-31 дні (днів) |
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MMZ25332BT1 | NXP USA Inc. |
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN Packaging: Cut Tape (CT) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.8GHz RF Type: LTE, TDS-CDMA, W-CDMA Voltage - Supply: 3V ~ 5V Gain: 26.5dB Current - Supply: 390mA Noise Figure: 5.8dB P1dB: 33dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) |
на замовлення 1599 шт: термін постачання 21-31 дні (днів) |
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| AFSC5G37D37T2 | NXP USA Inc. |
Description: AIRFAST PWR AMP 5G 29DB HLQFN26 |
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| AFSC5G37D37T2 | NXP USA Inc. |
Description: AIRFAST PWR AMP 5G 29DB HLQFN26 |
на замовлення 1717 шт: термін постачання 21-31 дні (днів) |
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| BLA6H0912-500112 | NXP USA Inc. |
Description: BLA6H0912-500 - LDMOS AVIONICS R Packaging: Tray Package / Case: SOT634A Current Rating (Amps): 54A Frequency: 960MHz ~ 1.22GHz Power - Output: 450W Gain: 17dB Technology: LDMOS Supplier Device Package: CDFM2 Part Status: Not For New Designs Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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S912XDP512J1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 91 DigiKey Programmable: Not Verified |
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BAP51-05W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 240MW SOT323-3 |
на замовлення 20095 шт: термін постачання 21-31 дні (днів) |
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| MRF6V3090NBR5578 | NXP USA Inc. | Description: RF POWER UHF BAND N-CHANNEL FET |
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SPC5602BF2VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
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| SL2S5402FTBX | NXP USA Inc. |
Description: ICODE Packaging: Tape & Reel (TR) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: ISO 15693, ISO 18000-3 Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 15693, ISO 18000-3 Supplier Device Package: 3-XSON (1x1.45) Part Status: Active |
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S912ZVL12F0CLF | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 DigiKey Programmable: Not Verified |
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MCIMX6D5EYM12AC | NXP USA Inc. |
Description: IC MPU I.MX6D 1.2GHZ 624FCPBGA Packaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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| LS1084ASE7MQA | NXP USA Inc. |
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LVDS Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART |
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MK22FN1M0AVLK12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 80FQFP Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MC33HB2001EKR2518 | NXP USA Inc. |
Description: BRUSH DC MOTOR CONTROLLER 16A |
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MC33HB2002ES | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Packaging: Tray Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: DC Motors Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
на замовлення 520 шт: термін постачання 21-31 дні (днів) |
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| MC33HB2002ESR2 | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Packaging: Tape & Reel (TR) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: DC Motors Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
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S9S12GN48AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
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MPF5024AVNA0ESR2 | NXP USA Inc. | Description: PF5024 |
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NX3L1G3157GMZ | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 900MOHM 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 900mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 1MHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 100mOhm Switch Time (Ton, Toff) (Max): 25ns, 10ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Number of Circuits: 1 Grade: Automotive Qualification: AEC-Q100 |
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| S32G274AABK0CUCT | NXP USA Inc. |
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: MII, RGMII, RMII, SGMII USB: USB OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Security Features: HSE-H |
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IP4284CZ10-TBR,115 | NXP USA Inc. |
Description: TVS DIODE 8VC DFN2510A-10 |
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SPC5746CK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
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2PA1774QMB315 | NXP USA Inc. |
Description: NOW NEXPERIA 2PA1774QMB - SMALL Packaging: Bulk Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Frequency - Transition: 100MHz Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW Qualification: AEC-Q101 |
на замовлення 57940 шт: термін постачання 21-31 дні (днів) |
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PDTC144VMB315 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 10 kOhms Grade: Automotive Qualification: AEC-Q101 |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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LPC11E13FBD48301 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP |
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SPC5747CHK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
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SP5747CHK0AVKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
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MML09211HT1 | NXP USA Inc. |
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN Packaging: Tape & Reel (TR) Package / Case: 8-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 1.4GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 5V Gain: 21.3dB Current - Supply: 60mA Noise Figure: 0.66dB P1dB: 20dBm Test Frequency: 1.4GHz Supplier Device Package: 8-DFN (2x2) Part Status: Obsolete |
на замовлення 24000 шт: термін постачання 21-31 дні (днів) |
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NX3V1T66GM,115 | NXP USA Inc. |
Description: IC SWITCH SPST 6XSON |
на замовлення 33273 шт: термін постачання 21-31 дні (днів) |
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S912ZVC12F0VLFR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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NX3L1G53GD,125 | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 750MOHM 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 8-XSON, SOT996-2 (2x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 24ns, 8ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 |
на замовлення 13143 шт: термін постачання 21-31 дні (днів) |
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| TDA18225HN/C1 | NXP USA Inc. | Description: INTEGRATED CIRCUIT |
на замовлення 938 шт: термін постачання 21-31 дні (днів) |
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MC9S12E64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I²C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 |
на замовлення 924 шт: термін постачання 21-31 дні (днів) |
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MC9S12DJ64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 |
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LPC1112LVFHI33/103 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN |
на замовлення 3920 шт: термін постачання 21-31 дні (днів) |
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| P60D144PX34/9A0409 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
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BZX79-B6V2143 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-B6V2 - ZENER |
на замовлення 105000 шт: термін постачання 21-31 дні (днів) |
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| BAP65-05 | NXP USA Inc. | Description: PIN DIODE, 30V V(BR), SILICON, T |
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74AVC20T245DGV,118 | NXP USA Inc. |
Description: IC TRNSLTR BIDIRECTIONAL 56TSSOP |
на замовлення 14222 шт: термін постачання 21-31 дні (днів) |
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S9S12G64AVLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
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| SWAC58R-ICC01L | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
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| SWAC58R-ICC01V | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
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| SWAC58R-ICC01P | NXP USA Inc. | Description: AUTO SOFTWARE SAC58R INTER CORE |
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LD6806TD/18P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.8V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 18224 шт: термін постачання 21-31 дні (днів) |
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MPC5775B-EVB | NXP USA Inc. |
Description: MPC5775B-EVB DEV BOARD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B, MPC5775E Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| S32K14WEVB-Q064 | NXP USA Inc. |
Description: S32K144W EVAL BOARD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K144W |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| S12VR64EVB3 | NXP USA Inc. |
Description: S12VR64 EVAL BRD |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1060-EVKB | NXP USA Inc. |
Description: I.MX RT1060 EVAL BRD REVB Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: i.MX RT1060 |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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S32K3X4EVBQ257ND | NXP USA Inc. |
Description: S32K344 EVAL BOARD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: S32K344 |
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S32K116EVB2Q048 | NXP USA Inc. |
Description: EVAL BOARD S32K116 Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: S32K116 |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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S32K118EVB2Q048 | NXP USA Inc. |
Description: EVAL BOARD S32K118 GEN PURPOSE Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: S32K118 |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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| KIT33772CTPLEVB | NXP USA Inc. |
Description: EVAL BOARD MC33772C DAISY CHAIN Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Primary Attributes: 6-Channel (Hex) Embedded: Yes, MCU Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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FRDM33772CSPEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33772C SPI COMM Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Primary Attributes: 6-Channel (Hex) Embedded: Yes, MCU Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| 74ALVCH16601DGG118 |
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Виробник: NXP USA Inc.
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
на замовлення 1994 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 367+ | 57.03 грн |
| 74ALVCH16601DGG512 |
|
на замовлення 875 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 402+ | 57.02 грн |
| MK22FX512AVLH12R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1500+ | 669.05 грн |
| 74LV139D,112 |
|
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 2:4 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC DECODER/DEMUX 1 X 2:4 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
на замовлення 7819 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2049+ | 10.53 грн |
| TEA19363DB1484UL |
|
Виробник: NXP USA Inc.
Description: 60W USB PD2.0 DEMO BOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Description: 60W USB PD2.0 DEMO BOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
товар відсутній
| SPC5746CK1AMKU2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| MMG3003NT1-NXP |
|
Виробник: NXP USA Inc.
Description: WIDE BAND MEDIUM POWER AMPLIFIER
Description: WIDE BAND MEDIUM POWER AMPLIFIER
на замовлення 470 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 134+ | 159.57 грн |
| MMZ25332BT1 |
|
Виробник: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 3V ~ 5V
Gain: 26.5dB
Current - Supply: 390mA
Noise Figure: 5.8dB
P1dB: 33dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 3V ~ 5V
Gain: 26.5dB
Current - Supply: 390mA
Noise Figure: 5.8dB
P1dB: 33dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
на замовлення 1599 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 570.99 грн |
| 10+ | 503.86 грн |
| 25+ | 458.03 грн |
| 100+ | 386.85 грн |
| 250+ | 354.61 грн |
| 500+ | 322.38 грн |
| AFSC5G37D37T2 |
|
Виробник: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 29DB HLQFN26
Description: AIRFAST PWR AMP 5G 29DB HLQFN26
на замовлення 1717 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2789.55 грн |
| 10+ | 2506.12 грн |
| 25+ | 2491.16 грн |
| BLA6H0912-500112 |
|
Виробник: NXP USA Inc.
Description: BLA6H0912-500 - LDMOS AVIONICS R
Packaging: Tray
Package / Case: SOT634A
Current Rating (Amps): 54A
Frequency: 960MHz ~ 1.22GHz
Power - Output: 450W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM2
Part Status: Not For New Designs
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: BLA6H0912-500 - LDMOS AVIONICS R
Packaging: Tray
Package / Case: SOT634A
Current Rating (Amps): 54A
Frequency: 960MHz ~ 1.22GHz
Power - Output: 450W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM2
Part Status: Not For New Designs
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 74 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 46851.34 грн |
| S912XDP512J1VAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| BAP51-05W,115 |
|
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SOT323-3
Description: RF DIODE PIN 50V 240MW SOT323-3
на замовлення 20095 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2935+ | 7.33 грн |
| SPC5602BF2VLH4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
товар відсутній
| SL2S5402FTBX |
Виробник: NXP USA Inc.
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693, ISO 18000-3
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693, ISO 18000-3
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
товар відсутній
| S912ZVL12F0CLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
товар відсутній
| MCIMX6D5EYM12AC |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.2GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 1.2GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товар відсутній
| LS1084ASE7MQA |
Виробник: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
товар відсутній
| MK22FN1M0AVLK12R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MC33HB2002ES |
|
Виробник: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
на замовлення 520 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 273.71 грн |
| 10+ | 237.21 грн |
| 25+ | 224.21 грн |
| 80+ | 182.36 грн |
| 230+ | 173.01 грн |
| 490+ | 155.24 грн |
| MC33HB2002ESR2 |
Виробник: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
товар відсутній
| S9S12GN48AMLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| NX3L1G3157GMZ |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
| S32G274AABK0CUCT |
|
Виробник: NXP USA Inc.
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
товар відсутній
| SPC5746CK1MMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| 2PA1774QMB315 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
на замовлення 57940 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6935+ | 2.77 грн |
| PDTC144VMB315 |
|
Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 11225+ | 2.08 грн |
| SPC5747CHK0AVKU6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| SP5747CHK0AVKU6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| MML09211HT1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
Part Status: Obsolete
Description: IC RF AMP GSM 400MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 21.3dB
Current - Supply: 60mA
Noise Figure: 0.66dB
P1dB: 20dBm
Test Frequency: 1.4GHz
Supplier Device Package: 8-DFN (2x2)
Part Status: Obsolete
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 69+ | 558.06 грн |
| NX3V1T66GM,115 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPST 6XSON
Description: IC SWITCH SPST 6XSON
на замовлення 33273 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3606+ | 6.11 грн |
| S912ZVC12F0VLFR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 341.84 грн |
| NX3L1G53GD,125 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
на замовлення 13143 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 888+ | 25.85 грн |
| TDA18225HN/C1 |
Виробник: NXP USA Inc.
Description: INTEGRATED CIRCUIT
Description: INTEGRATED CIRCUIT
на замовлення 938 шт:
термін постачання 21-31 дні (днів)| MC9S12E64MFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
на замовлення 924 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 15+ | 1576.11 грн |
| MC9S12DJ64MFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
товар відсутній
| LPC1112LVFHI33/103 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
на замовлення 3920 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 89+ | 253.44 грн |
| BZX79-B6V2143 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
Description: NOW NEXPERIA BZX79-B6V2 - ZENER
на замовлення 105000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 15000+ | 1.39 грн |
| 74AVC20T245DGV,118 |
|
Виробник: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 56TSSOP
Description: IC TRNSLTR BIDIRECTIONAL 56TSSOP
на замовлення 14222 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 332+ | 69.07 грн |
| S9S12G64AVLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
| LD6806TD/18P,125 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 18224 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2959+ | 7.02 грн |
| MPC5775B-EVB |
|
Виробник: NXP USA Inc.
Description: MPC5775B-EVB DEV BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Description: MPC5775B-EVB DEV BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21017.03 грн |
| S32K14WEVB-Q064 |
|
Виробник: NXP USA Inc.
Description: S32K144W EVAL BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144W
Description: S32K144W EVAL BOARD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144W
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12478.08 грн |
| S12VR64EVB3 |
|
Виробник: NXP USA Inc.
Description: S12VR64 EVAL BRD
Description: S12VR64 EVAL BRD
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 41611.34 грн |
| MIMXRT1060-EVKB |
|
Виробник: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
Description: I.MX RT1060 EVAL BRD REVB
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8576.21 грн |
| S32K3X4EVBQ257ND |
Виробник: NXP USA Inc.
Description: S32K344 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Description: S32K344 EVAL BOARD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
товар відсутній
| S32K116EVB2Q048 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD S32K116
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K116
Description: EVAL BOARD S32K116
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K116
на замовлення 58 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7830.35 грн |
| S32K118EVB2Q048 |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD S32K118 GEN PURPOSE
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Description: EVAL BOARD S32K118 GEN PURPOSE
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7831.87 грн |
| KIT33772CTPLEVB |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD MC33772C DAISY CHAIN
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD MC33772C DAISY CHAIN
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 17496.07 грн |
| FRDM33772CSPEVB |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C SPI COMM
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD FOR MC33772C SPI COMM
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15707.84 грн |