Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35278) > Сторінка 451 з 588
| Фото | Назва | Виробник | Інформація |
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K32L2B21VFT0A | NXP USA Inc. |
 Description: IC MCU 32BIT 128KB FLASH 48QFNPackaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.2V Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 48-QFN (7x7) Part Status: Active DigiKey Programmable: Not Verified |
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| MC33FS8510C4ES | NXP USA Inc. | Description: FS8510 |
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A3G26D055N-2400 | NXP USA Inc. |
Description: RF GAN AMPLIFIER 48V 6DFN Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
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A3G26D055NT4 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFN Packaging: Tape & Reel (TR) Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
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A3G26D055NT4 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFN Packaging: Cut Tape (CT) Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
на замовлення 2193 шт: термін постачання 21-31 дні (днів) |
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A3G26D055N-2515 | NXP USA Inc. |
Description: RF REFERENCE CIRCUIT 55W 2515MHZ |
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A3G26D055N-1805 | NXP USA Inc. |
Description: RF REFERENCE CIRCUIT 25W 1805-18 Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| BYV10X-600P127 | NXP USA Inc. |
Description: DIODE GEN PURP 600V 10A TO220F Packaging: Bulk Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Current - Average Rectified (Io): 10A Supplier Device Package: TO-220F Operating Temperature - Junction: 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A Current - Reverse Leakage @ Vr: 10 µA @ 600 V |
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74AHCT139D,112 | NXP USA Inc. |
Description: DECODER/DRIVER, AHCT/VHCT SERIES Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 8mA, 8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
на замовлення 8950 шт: термін постачання 21-31 дні (днів) |
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AFIC10275NR5 | NXP USA Inc. |
Description: IC RF AMP 978MHZ-1.09GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 978MHz ~ 1.09GHz Voltage - Supply: 50V Gain: 32dB Supplier Device Package: TO-270 WB-14 |
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MC9328MXLCVM15,557 | NXP USA Inc. |
Description: DRAGONBALL CORSICA |
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CLF1G0060S-10 | NXP USA Inc. |
Description: RF PFET, 1-ELEMENT, C BAND, GALL |
на замовлення 384 шт: термін постачання 21-31 дні (днів) |
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MC34VR500VAES | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TO 4 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Supplier Device Package: 56-QFN-EP (8x8) |
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MC34VR500VAESR2 | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TO 4 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Supplier Device Package: 56-QFN-EP (8x8) |
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74LV365DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 6 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 16-SSOP |
на замовлення 1092 шт: термін постачання 21-31 дні (днів) |
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| JN5178/001K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40VFQFN |
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TL431MFDT | NXP USA Inc. |
Description: TL431 - ADJUSTABLE PRECISION SHU Packaging: Bulk Part Status: Active |
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MPF5020AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 293 шт: термін постачання 21-31 дні (днів) |
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MPF5023AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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TDA18275AHN/C1518 | NXP USA Inc. |
Description: TDA18275AHN - HYBRID SILICON TUN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Professional Video Supplier Device Package: 32-HVQFN (5x5) Control Interface: I²C |
на замовлення 833034 шт: термін постачання 21-31 дні (днів) |
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TDA18273HN/C1/S3518 | NXP USA Inc. |
Description: TDA18273 - IC SILICON TUNER HYBR Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Professional Video Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Control Interface: I²C DigiKey Programmable: Not Verified |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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TDA18212HN/M/C1/S3518 | NXP USA Inc. | Description: SILICON TUNER FOR TERRESTRIAL AN |
на замовлення 5026 шт: термін постачання 21-31 дні (днів) |
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TDA18211HD/C2/S2551 | NXP USA Inc. |
Description: SILICON TUNER FOR TERRESTRIAL AN |
на замовлення 46110 шт: термін постачання 21-31 дні (днів) |
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SC18IS606-EVB | NXP USA Inc. |
Description: SC18IS606 I2C/SPI BRIDGE EVAL BR Packaging: Bulk Function: I2C to SPI Type: Interface Utilized IC / Part: SC18IS606 Supplied Contents: Board(s) Primary Attributes: 1.71V ~ 3.6V Operating Range Embedded: No Part Status: Active |
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SC18IS604-EVB | NXP USA Inc. |
Description: SC18IS604 SPI/I2C BRIDGE EVAL BR Packaging: Bulk Function: I2C to SPI Type: Interface Utilized IC / Part: SC18IS604 Supplied Contents: Board(s) Primary Attributes: 1.71V ~ 3.6V Operating Range Embedded: No Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PEMI2QFN/WM,115 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/16PF SMD |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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LPC4317JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP |
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LPC2210FBD144/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 76 |
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| MC56F82748VLH557 | NXP USA Inc. |
Description: MICROCONTROLLER 32-BIT FLASH |
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OM67200JP | NXP USA Inc. |
Description: A1006 DEVELOPER KIT Packaging: Bulk Function: Anti Tamper and Security Type: Interface Utilized IC / Part: A1006 Supplied Contents: Board(s) Part Status: Active |
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PHN203,518-NX | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
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LD6805K/22P,115 | NXP USA Inc. |
Description: IC REG LIN 2.2V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.2V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
на замовлення 60000 шт: термін постачання 21-31 дні (днів) |
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LD6805K/25H,115 | NXP USA Inc. |
Description: IC REG LIN 2.5V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.5V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
на замовлення 54231 шт: термін постачання 21-31 дні (днів) |
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LD6806F/18H,115 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Output (Min/Fixed): 1.8V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 7746 шт: термін постачання 21-31 дні (днів) |
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PZU602DB2115 | NXP USA Inc. |
Description: DIODE ZENER |
на замовлення 5987 шт: термін постачання 21-31 дні (днів) |
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CBT16212DGG,112 | NXP USA Inc. |
Description: IC BUS FET EXC SW 12X2:2 56TSSOP Packaging: Tube Package / Case: 56-TFSOP (0.240", 6.10mm Width) Mounting Type: Surface Mount Circuit: 12 x 2:2 Type: Bus FET Exchange Switch Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 56-TSSOP |
на замовлення 875 шт: термін постачання 21-31 дні (днів) |
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8MPLUSLPD4-PEVK | NXP USA Inc. |
Description: I.MX 8M PLUS EVAL KIT Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply Core Processor: ARM® Cortex®-A53, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX 8 Operating System: Android, FreeRTOS, Linux Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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74LVC16374ADL,112-NXP | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2- Packaging: Tube Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 20 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 48-SSOP Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Part Status: Active Number of Bits per Element: 8 |
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74LVC16374ADGG-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
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| 74LVC163D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC163D - BINARY |
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| S32K148EVB-Q144 | NXP USA Inc. |
Description: S32K148 EVAL BRD |
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| MCIMX286CVM4CR2 | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
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| MCIMX286DVM4CR | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
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MCIMX286CVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
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| MCIMX285AVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
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MC9S12DJ256CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
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| CBT3306PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
на замовлення 2729 шт: термін постачання 21-31 дні (днів) |
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CBT3306D-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
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BZX84-C3V3/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 95 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V |
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| MC908KX2CDWE-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 2KB (2K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 4263 шт: термін постачання 21-31 дні (днів) |
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N74F280BN,602 | NXP USA Inc. |
Description: IC PARITY GEN/CHKER 9-BIT 14DIP |
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| PSMN9RO-25YLC115 | NXP USA Inc. | Description: N-CHANNEL POWER MOSFET |
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74ABT821DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 10BIT 24SSOP |
на замовлення 708 шт: термін постачання 21-31 дні (днів) |
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N74F5074D,602 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO |
на замовлення 495 шт: термін постачання 21-31 дні (днів) |
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N74F273AN,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: Non-Inverted Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 38 mA Current - Output High, Low: 1mA, 20mA Trigger Type: Positive Edge Clock Frequency: 170 MHz Supplier Device Package: 20-DIP Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
на замовлення 1852 шт: термін постачання 21-31 дні (днів) |
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PCA9516AD,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 5CH 400KHZ 16SO |
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BZX84-C3V3/LF1R | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 95 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V Qualification: AEC-Q101 |
товар відсутній |
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| 74LVC14AWP112 | NXP USA Inc. |
Description: INVERTER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
товар відсутній |
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 |
MC9S08DN32AMLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
|
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 |
K32W041AK | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 2450 шт: термін постачання 21-31 дні (днів) |
|
| K32L2B21VFT0A |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| A3G26D055N-2400 |
|
Виробник: NXP USA Inc.
Description: RF GAN AMPLIFIER 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF GAN AMPLIFIER 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
товар відсутній
| A3G26D055NT4 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
товар відсутній
| A3G26D055NT4 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Cut Tape (CT)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Cut Tape (CT)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
на замовлення 2193 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1474.23 грн |
| 10+ | 1309.22 грн |
| 25+ | 1294.87 грн |
| A3G26D055N-1805 |
|
Виробник: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 25W 1805-18
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF REFERENCE CIRCUIT 25W 1805-18
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 51320.4 грн |
| BYV10X-600P127 |
|
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 600V 10A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Description: DIODE GEN PURP 600V 10A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
товар відсутній
| 74AHCT139D,112 |
|
Виробник: NXP USA Inc.
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
на замовлення 8950 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2664+ | 7.69 грн |
| AFIC10275NR5 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32dB
Supplier Device Package: TO-270 WB-14
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32dB
Supplier Device Package: TO-270 WB-14
товар відсутній
| CLF1G0060S-10 |
|
Виробник: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, C BAND, GALL
Description: RF PFET, 1-ELEMENT, C BAND, GALL
на замовлення 384 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5957.35 грн |
| MC34VR500VAES |
|
Виробник: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
товар відсутній
| MC34VR500VAESR2 |
|
Виробник: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
товар відсутній
| 74LV365DB,112 |
|
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SSOP
Description: IC BUF NON-INVERT 3.6V 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SSOP
на замовлення 1092 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 784+ | 26.58 грн |
| TL431MFDT |
|
Виробник: NXP USA Inc.
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
товар відсутній
| MPF5020AMMA0ES |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 293 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 461.5 грн |
| 10+ | 398.72 грн |
| 25+ | 377 грн |
| 80+ | 306.61 грн |
| 230+ | 290.89 грн |
| MPF5023AMMA0ES |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 418.93 грн |
| 10+ | 364.24 грн |
| 25+ | 347.27 грн |
| 80+ | 282.97 грн |
| 230+ | 270.26 грн |
| 490+ | 246.41 грн |
| TDA18275AHN/C1518 |
|
Виробник: NXP USA Inc.
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
на замовлення 833034 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 446+ | 46.44 грн |
| TDA18273HN/C1/S3518 |
|
Виробник: NXP USA Inc.
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Control Interface: I²C
DigiKey Programmable: Not Verified
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Control Interface: I²C
DigiKey Programmable: Not Verified
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 96+ | 225.24 грн |
| TDA18212HN/M/C1/S3518 |
Виробник: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
Description: SILICON TUNER FOR TERRESTRIAL AN
на замовлення 5026 шт:
термін постачання 21-31 дні (днів)| TDA18211HD/C2/S2551 |
|
Виробник: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
Description: SILICON TUNER FOR TERRESTRIAL AN
на замовлення 46110 шт:
термін постачання 21-31 дні (днів)| SC18IS606-EVB |
|
Виробник: NXP USA Inc.
Description: SC18IS606 I2C/SPI BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS606
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Description: SC18IS606 I2C/SPI BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS606
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
товар відсутній
| SC18IS604-EVB |
|
Виробник: NXP USA Inc.
Description: SC18IS604 SPI/I2C BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS604
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Description: SC18IS604 SPI/I2C BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS604
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4722.24 грн |
| PEMI2QFN/WM,115 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Description: FILTER RC(PI) 200 OHM/16PF SMD
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4121+ | 5.55 грн |
| LPC2210FBD144/01551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
товар відсутній
| OM67200JP |
|
Виробник: NXP USA Inc.
Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| LD6805K/22P,115 |
|
Виробник: NXP USA Inc.
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3206+ | 6.84 грн |
| LD6805K/25H,115 |
|
Виробник: NXP USA Inc.
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 54231 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3206+ | 6.84 грн |
| LD6806F/18H,115 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 7746 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2219+ | 9.73 грн |
| PZU602DB2115 |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
на замовлення 5987 шт:
термін постачання 21-31 дні (днів)| CBT16212DGG,112 |
|
Виробник: NXP USA Inc.
Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
на замовлення 875 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 494+ | 42.39 грн |
| 8MPLUSLPD4-PEVK |
|
Виробник: NXP USA Inc.
Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 49147.45 грн |
| 74LVC16374ADL,112-NXP |
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
товар відсутній
| MCIMX286CVM4CR2 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
товар відсутній
| MCIMX286DVM4CR |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
товар відсутній
| MCIMX286CVM4C |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
товар відсутній
| MCIMX285AVM4C |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
товар відсутній
| CBT3306PW-Q100118 |
|
Виробник: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
на замовлення 2729 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2729+ | 9.93 грн |
| BZX84-C3V3/LF1VL |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Description: DIODE ZENER 3.3V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
товар відсутній
| MC908KX2CDWE-NXP |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 4263 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 52+ | 443.26 грн |
| 74ABT821DB,112 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
на замовлення 708 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 489+ | 43.26 грн |
| N74F5074D,602 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Description: IC FF D-TYPE DUAL 1BIT 14SO
на замовлення 495 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 286+ | 72.97 грн |
| N74F273AN,602 |
|
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
на замовлення 1852 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 642+ | 33.43 грн |
| BZX84-C3V3/LF1R |
|
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 3.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
товар відсутній
| 74LVC14AWP112 |
товар відсутній
| MC9S08DN32AMLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 108+ | 332.13 грн |
| K32W041AK |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 405.24 грн |
| 10+ | 348.06 грн |
| 25+ | 313.21 грн |
| 80+ | 267.82 грн |
| 230+ | 241.69 грн |
| 440+ | 216.87 грн |
| 2450+ | 170.91 грн |