Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35275) > Сторінка 443 з 588
Фото | Назва | Виробник | Інформація |
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SPC5675KF0MJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
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MK20DN512VLQ10557 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 100 |
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74AUP1G08GX/S500125 | NXP USA Inc. |
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на замовлення 1278900 шт: термін постачання 21-31 дні (днів) |
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74AUP1G08GM/S711115 | NXP USA Inc. |
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на замовлення 344009 шт: термін постачання 21-31 дні (днів) |
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74LVC06APW-Q100J | NXP USA Inc. |
![]() Packaging: Bulk Features: Open Drain Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 5.5V Current - Output High, Low: -, 32mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.08V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 2.5ns @ 5V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 10 µA |
на замовлення 5322 шт: термін постачання 21-31 дні (днів) |
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ON5441518 | NXP USA Inc. |
Description: NOW NEXPERIA ON5441 - RF MOSFET Packaging: Bulk Part Status: Active |
на замовлення 32000 шт: термін постачання 21-31 дні (днів) |
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OM5596/N5441C3U02, | NXP USA Inc. | Description: BOARD DEMO NFC |
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MPC8247VRTIEA557 | NXP USA Inc. |
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PHPT610035PK115 | NXP USA Inc. |
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LPC12D27FBD100/301551 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, IrDA, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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S9S08DZ60F2MLFR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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PZU16BL315 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
на замовлення 139300 шт: термін постачання 21-31 дні (днів) |
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PZU15DB2115 | NXP USA Inc. |
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на замовлення 114000 шт: термін постачання 21-31 дні (днів) |
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PZU11B3A115 | NXP USA Inc. |
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на замовлення 30000 шт: термін постачання 21-31 дні (днів) |
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PZU10BL315 | NXP USA Inc. |
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на замовлення 95000 шт: термін постачання 21-31 дні (днів) |
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PZU18B3A115 | NXP USA Inc. |
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на замовлення 32000 шт: термін постачання 21-31 дні (днів) |
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PZU10DB2,115 | NXP USA Inc. |
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PZU18BA,115 | NXP USA Inc. |
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PZU15BA115 | NXP USA Inc. | Description: DIODE ZENER SINGLE |
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PZU14B2A115 | NXP USA Inc. |
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PZU15B1115 | NXP USA Inc. |
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PZU16B1A115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: 150°C (TJ) Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOD-323 Part Status: Active Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 12 V |
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PZU13B1A115 | NXP USA Inc. |
Description: DIODE ZENER SINGLE Packaging: Bulk Tolerance: ±2% Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SOD-323 Part Status: Active Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 100 nA @ 10 V |
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PZU16B2A115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
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PZU16BA115 | NXP USA Inc. |
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LPC54114J256BD64151 | NXP USA Inc. |
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BZX84-C15/CH/LF1VL | NXP USA Inc. |
![]() Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 15 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V |
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MC34VR500V1ES557 | NXP USA Inc. |
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SPC5645BF0VLU1R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 160K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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SPC5645BF0VLU1 | NXP USA Inc. | Description: IC MCU 32BIT 2MB FLASH 176LQFP |
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PEMB1,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 2 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V Resistor - Base (R1): 22kOhms Resistor - Emitter Base (R2): 22kOhms Supplier Device Package: SOT-666 Part Status: Active |
на замовлення 62840 шт: термін постачання 21-31 дні (днів) |
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OM15080-K32W | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: K32W041, K32W061 Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5.x Supplied Contents: Board(s) Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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BZX84J-B22,115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 22 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: SOD-323F Power - Max: 550 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V |
на замовлення 22665 шт: термін постачання 21-31 дні (днів) |
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PCF8553DTT/AY | NXP USA Inc. |
Description: LCD DRIVER Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C, SPI Configuration: 40 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Grade: Automotive Current - Supply: 1.2 µA Qualification: AEC-Q100 |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MPC8248CZQTIEA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete |
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BUK6218-40C | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 42A (Tc) Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V Power Dissipation (Max): 60W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V |
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74LVC332PWJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.08V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 10 µA |
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RDDRONE-BMS772 | NXP USA Inc. |
Description: BMS772 DRONE BATT DEV KIT Packaging: Bulk Function: Battery Cell Controller Type: Power Management Supplied Contents: Board(s) Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PTN36043BXZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 18-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Applications: USB Current - Supply: 113mA Supplier Device Package: 18-X2QFN (2.4x2) Signal Conditioning: Input Equalization, Output De-Emphasis |
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PTN36043BXZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 18-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Applications: USB Current - Supply: 113mA Supplier Device Package: 18-X2QFN (2.4x2) Signal Conditioning: Input Equalization, Output De-Emphasis |
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LD6816CX4/18H,315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.8V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
на замовлення 17975 шт: термін постачання 21-31 дні (днів) |
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UCANS32K1SIC | NXP USA Inc. | Description: CAN IMPROVEMENT CAPABILITY EVB |
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KIT-UCANS32K1SIC | NXP USA Inc. |
![]() Packaging: Box Function: CAN Transceiver Type: Interface Utilized IC / Part: S32K1, SE050, TJA1463 Supplied Contents: Board(s), Cable(s), Accessories Primary Attributes: 5V Power Supply Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TJA1441BT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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TJA1441BT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 10451 шт: термін постачання 21-31 дні (днів) |
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TJA1145ATK/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 800 mV Duplex: Full Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 3841 шт: термін постачання 21-31 дні (днів) |
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TJA1442AT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
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TJA1442AT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 349 шт: термін постачання 21-31 дні (днів) |
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TJA1145ATK/FD/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 800 mV Duplex: Full Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 7620 шт: термін постачання 21-31 дні (днів) |
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TJA1101BHN/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 36-HVQFN (6x6) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
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TJA1101BHN/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 36-HVQFN (6x6) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
на замовлення 13104 шт: термін постачання 21-31 дні (днів) |
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TJA1462BT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 100 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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TJA1443ATK/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
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TJA1443ATK/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 1998 шт: термін постачання 21-31 дні (днів) |
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74AHCT2G126DP-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
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SC16C554DBIA68512 | NXP USA Inc. | Description: IC UART QUAD |
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SPC5675KFF0VJM2R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active |
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SPC5675KFF0VJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active |
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BUK661R8-30C,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V Power Dissipation (Max): 263W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: D2PAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V |
на замовлення 1473 шт: термін постачання 21-31 дні (днів) |
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BUK764R2-80E,118 | NXP USA Inc. |
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на замовлення 338 шт: термін постачання 21-31 дні (днів) |
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SPC5675KF0MJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MK20DN512VLQ10557 |
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Виробник: NXP USA Inc.
Description: KINETIS K10: CORTEX M4 RISC MICR
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
Description: KINETIS K10: CORTEX M4 RISC MICR
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
товар відсутній
74AUP1G08GX/S500125 |
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Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5X2SON
Description: IC GATE AND 1CH 2-INP 5X2SON
на замовлення 1278900 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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4948+ | 4.55 грн |
74AUP1G08GM/S711115 |
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Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 6XSON
Description: IC GATE AND 1CH 2-INP 6XSON
на замовлення 344009 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4121+ | 5.37 грн |
74LVC06APW-Q100J |
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Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Features: Open Drain
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.5ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 10 µA
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Features: Open Drain
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.5ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 10 µA
на замовлення 5322 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3050+ | 7.02 грн |
ON5441518 |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA ON5441 - RF MOSFET
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA ON5441 - RF MOSFET
Packaging: Bulk
Part Status: Active
на замовлення 32000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
381+ | 60.06 грн |
MPC8247VRTIEA557 |
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Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Description: POWERQUICC 32 BIT POWER ARCHITEC
товар відсутній
PHPT610035PK115 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
товар відсутній
LPC12D27FBD100/301551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 152 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
54+ | 429.57 грн |
S9S08DZ60F2MLFR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 938.21 грн |
10+ | 709.37 грн |
100+ | 587.31 грн |
1000+ | 480.72 грн |
PZU16BL315 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PZU16BL ZENER DIODE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PZU16BL ZENER DIODE
Packaging: Bulk
Part Status: Active
на замовлення 139300 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
15000+ | 1.52 грн |
PZU15DB2115 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
на замовлення 114000 шт:
термін постачання 21-31 дні (днів)PZU11B3A115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PZU11B3A ZENER DIOD
Description: NOW NEXPERIA PZU11B3A ZENER DIOD
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)PZU10BL315 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PZU10BL ZENER DIODE
Description: NOW NEXPERIA PZU10BL ZENER DIODE
на замовлення 95000 шт:
термін постачання 21-31 дні (днів)PZU18B3A115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PZU18B3A ZENER DIOD
Description: NOW NEXPERIA PZU18B3A ZENER DIOD
на замовлення 32000 шт:
термін постачання 21-31 дні (днів)PZU16B1A115 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 16V 320MW SOD323
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
Description: DIODE ZENER 16V 320MW SOD323
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
товар відсутній
PZU13B1A115 |
Виробник: NXP USA Inc.
Description: DIODE ZENER SINGLE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Description: DIODE ZENER SINGLE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
товар відсутній
PZU16B2A115 |
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товар відсутній
PZU16BA115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PZU16BA ZENER DIODE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PZU16BA ZENER DIODE
Packaging: Bulk
Part Status: Active
товар відсутній
LPC54114J256BD64151 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
товар відсутній
BZX84-C15/CH/LF1VL |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 15V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Description: DIODE ZENER 15V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
товар відсутній
SPC5645BF0VLU1R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
PEMB1,115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PEMB1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
Part Status: Active
Description: NOW NEXPERIA PEMB1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
Part Status: Active
на замовлення 62840 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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7340+ | 3.04 грн |
OM15080-K32W |
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Виробник: NXP USA Inc.
Description: EVAL BOARD K32W041 K32W061
Packaging: Bulk
For Use With/Related Products: K32W041, K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD K32W041 K32W061
Packaging: Bulk
For Use With/Related Products: K32W041, K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2512.04 грн |
BZX84J-B22,115 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 22V 550MW SOD323F
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 550 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
Description: DIODE ZENER 22V 550MW SOD323F
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 550 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
на замовлення 22665 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
8768+ | 2.28 грн |
PCF8553DTT/AY |
Виробник: NXP USA Inc.
Description: LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100
Description: LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2000+ | 53.16 грн |
MPC8248CZQTIEA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
товар відсутній
BUK6218-40C |
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Виробник: NXP USA Inc.
Description: PFET, 42A I(D), 40V, 0.028OHM, 1
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V
Description: PFET, 42A I(D), 40V, 0.028OHM, 1
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V
товар відсутній
74LVC332PWJ |
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Виробник: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 10 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 10 µA
товар відсутній
RDDRONE-BMS772 |
Виробник: NXP USA Inc.
Description: BMS772 DRONE BATT DEV KIT
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Supplied Contents: Board(s)
Part Status: Active
Description: BMS772 DRONE BATT DEV KIT
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Supplied Contents: Board(s)
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8561 грн |
PTN36043BXZ |
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Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
товар відсутній
PTN36043BXZ |
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Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
товар відсутній
LD6816CX4/18H,315 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
на замовлення 17975 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3328+ | 6.41 грн |
KIT-UCANS32K1SIC |
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Виробник: NXP USA Inc.
Description: CAN IMPROVEMENT CAPABILITY KIT
Packaging: Box
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: S32K1, SE050, TJA1463
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 5V Power Supply
Embedded: Yes, MCU, 32-Bit
Description: CAN IMPROVEMENT CAPABILITY KIT
Packaging: Box
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: S32K1, SE050, TJA1463
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 5V Power Supply
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10745.35 грн |
TJA1441BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 45.8 грн |
5000+ | 41.9 грн |
TJA1441BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 10451 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 107.96 грн |
10+ | 92.98 грн |
25+ | 88.21 грн |
100+ | 68 грн |
250+ | 63.56 грн |
500+ | 56.17 грн |
1000+ | 43.62 грн |
TJA1145ATK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 3841 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 217.45 грн |
10+ | 188.16 грн |
25+ | 177.85 грн |
100+ | 144.66 грн |
250+ | 137.24 грн |
500+ | 123.15 грн |
1000+ | 102.16 грн |
2500+ | 97.05 грн |
TJA1442AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
TJA1442AT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 349 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 121.65 грн |
10+ | 104.92 грн |
25+ | 98.99 грн |
100+ | 79.15 грн |
250+ | 74.32 грн |
TJA1145ATK/FD/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 7620 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 229.61 грн |
10+ | 198.41 грн |
25+ | 187.52 грн |
100+ | 152.53 грн |
250+ | 144.71 грн |
500+ | 129.85 грн |
1000+ | 107.72 грн |
2500+ | 102.33 грн |
TJA1101BHN/0Z |
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Виробник: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4000+ | 124.26 грн |
TJA1101BHN/0Z |
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Виробник: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
на замовлення 13104 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 247.86 грн |
10+ | 214.15 грн |
25+ | 202.42 грн |
100+ | 164.65 грн |
250+ | 156.2 грн |
500+ | 140.16 грн |
1000+ | 116.27 грн |
TJA1462BT/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 45.31 грн |
TJA1443ATK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
TJA1443ATK/0Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1998 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 116.33 грн |
10+ | 100.08 грн |
25+ | 94.97 грн |
100+ | 73.22 грн |
250+ | 68.44 грн |
500+ | 60.49 грн |
1000+ | 46.97 грн |
74AHCT2G126DP-Q100125 |
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товар відсутній
SPC5675KFF0VJM2R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
товар відсутній
SPC5675KFF0VJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
товар відсутній
BUK661R8-30C,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
Description: MOSFET N-CH 30V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
на замовлення 1473 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
245+ | 93.52 грн |
BUK764R2-80E,118 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 80V 120A D2PAK
Description: MOSFET N-CH 80V 120A D2PAK
на замовлення 338 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
202+ | 109.27 грн |