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MT28F800B3WG-9 B TR MT28F800B3WG-9 B TR Micron Technology Inc. MT28F(008,800)B3.pdf Description: IC FLASH 8MBIT PARALLEL 48TSOP I
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Part Status: Obsolete
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 1M x 8, 512K x 16
DigiKey Programmable: Not Verified
товар відсутній
MT58L256L18D1T-6 MT58L256L18D1T-6 Micron Technology Inc. MICTS01103-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 4MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 18
на замовлення 17906 шт:
термін постачання 21-31 дні (днів)
45+510.37 грн
Мінімальне замовлення: 45
MT58V1MV18DT-6 MT58V1MV18DT-6 Micron Technology Inc. MICTS01167-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1M x 18
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
16+1427.83 грн
Мінімальне замовлення: 16
MT29F1T08GBLCEJ4:C TR Micron Technology Inc. Description: QLC 1T 128GX8 VBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT29F1T08GBLCEJ4:C Micron Technology Inc. Description: QLC 1T 128GX8 VBGA
Packaging: Box
Part Status: Active
товар відсутній
MT29F1T08GBLCEJ4-QM:C Micron Technology Inc. Description: QLC 1T 128GX8 VBGA
Packaging: Box
Part Status: Active
товар відсутній
MT29F1T08GBLCEJ4-M:C TR Micron Technology Inc. Description: QLC 1T 128GX8 VBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT29F1T08GBLCEJ4-M:C Micron Technology Inc. Description: QLC 1T 128GX8 VBGA
Packaging: Box
Part Status: Active
товар відсутній
MT29F1T08GBLCEJ4-QM:C TR Micron Technology Inc. Description: QLC 1T 128GX8 VBGA
Packaging: Tape & Reel (TR)
Part Status: Active
товар відсутній
EDS6432AFTA-75TI-E-D Micron Technology Inc. Description: SDRAM 2MX32 PLASTIC TSOP 3.3V EX
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
M29F400FT55M32 Micron Technology Inc. M29F(200,400,800,160)F(T,B)_Rev.C,5,2018.pdf Description: IC FLASH 4MBIT PARALLEL 44SO
Packaging: Tray
Package / Case: 44-SOIC (0.496", 12.60mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 55ns
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
товар відсутній
MT41K512M8RG-093:N Micron Technology Inc. Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tray
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
товар відсутній
MT41K512M8RG-093:N TR Micron Technology Inc. 4gb_ddr3l.pdf?rev=305217e2f9bd4ef48d7c6f353dfc064c Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
товар відсутній
N25Q128A13EV741 Micron Technology Inc. Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
товар відсутній
N25Q128A13BSFH0F N25Q128A13BSFH0F Micron Technology Inc. Description: IC FLASH 128MBIT SPI 108MHZ 16SO
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
товар відсутній
N25Q128A13EW7DFF Micron Technology Inc. Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AUT:C Micron Technology Inc. Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AAT:C Micron Technology Inc. Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AUT:C TR Micron Technology Inc. Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AIT:C TR Micron Technology Inc. Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 WT:C TR Micron Technology Inc. z42n_embedded_lpddr4x_lpddr4.pdf Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AIT:C Micron Technology Inc. Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 WT:C Micron Technology Inc. z42n_embedded_lpddr4x_lpddr4.pdf Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AAT:C TR Micron Technology Inc. Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F1G32D2DS-023 WT ES:B TR MT62F1G32D2DS-023 WT ES:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 3.2 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 FAAT:B MT62F2G32D4DS-023 FAAT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 IT:B MT62F2G32D4DS-023 IT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F1G32D2DS-023 WT ES:B MT62F1G32D2DS-023 WT ES:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 WT ES:B TR MT62F2G32D4DS-023 WT ES:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AUT:B MT62F2G32D4DS-023 AUT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AUT:B TR MT62F2G32D4DS-023 AUT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AAT:B TR MT62F2G32D4DS-023 AAT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 WT ES:B MT62F2G32D4DS-023 WT ES:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 WT:B MT62F2G32D4DS-023 WT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
на замовлення 1050 шт:
термін постачання 21-31 дні (днів)
1+4779.55 грн
10+ 4143.44 грн
25+ 4052.67 грн
50+ 3723.1 грн
100+ 3259.58 грн
MT62F2G32D4DS-023 WT:B TR MT62F2G32D4DS-023 WT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 IT:B TR MT62F2G32D4DS-023 IT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AIT:B TR MT62F2G32D4DS-023 AIT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AIT:B MT62F2G32D4DS-023 AIT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AAT:B MT62F2G32D4DS-023 AAT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 FAAT:B TR MT62F2G32D4DS-023 FAAT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D8DR-031 WT:B Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D8DR-031 WT:B TR Micron Technology Inc. Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M256M32JE-12 NIT:A TR Micron Technology Inc. gddr6_sgram_networking_brief.pdf Description: GDDR6 8G 256MX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61M256M32JE-12 NIT:A Micron Technology Inc. gddr6_sgram_networking_brief.pdf Description: GDDR6 8G 256MX32 FBGA
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-14:C Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
на замовлення 1241 шт:
термін постачання 21-31 дні (днів)
1+2345.3 грн
10+ 2123.84 грн
25+ 2050.14 грн
50+ 1863.14 грн
100+ 1640.09 грн
250+ 1595.96 грн
MT61K512M32KPA-16:C Micron Technology Inc. gddr6_sgram_16gb_brief.pdf?rev=739320c171da46069cc8ba7d7aca73f7 Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
на замовлення 1244 шт:
термін постачання 21-31 дні (днів)
1+2345.3 грн
10+ 2123.84 грн
25+ 2050.14 грн
50+ 1863.14 грн
100+ 1640.09 грн
250+ 1595.96 грн
MT61K512M32KPA-14:C TR Micron Technology Inc. gddr6_sgram_16gb_brief.pdf?rev=739320c171da46069cc8ba7d7aca73f7 Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-21:U Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-24:U TR Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 12 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-16:C TR Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-21:U TR Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 AAT:C TR Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 N:C TR Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 AAT:C Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 NIT:C Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 N:C Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 NIT:C TR Micron Technology Inc. Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT58L512L18FS-8.5 MT58L512L18FS-8.5 Micron Technology Inc. MICTS01178-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 8MBIT PAR 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 512K x 18
DigiKey Programmable: Not Verified
на замовлення 17071 шт:
термін постачання 21-31 дні (днів)
51+447.8 грн
Мінімальне замовлення: 51
MT58L256L32PT-6 MT58L256L32PT-6 Micron Technology Inc. MICTS00952-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 8MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 32
DigiKey Programmable: Not Verified
на замовлення 786 шт:
термін постачання 21-31 дні (днів)
31+665.3 грн
Мінімальне замовлення: 31
MT58L512Y36PT-5 MT58L512Y36PT-5 Micron Technology Inc. MICTS01166-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Standard
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.1 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
на замовлення 423 шт:
термін постачання 21-31 дні (днів)
17+1383.36 грн
Мінімальне замовлення: 17
MT28F800B3WG-9 B TR MT28F(008,800)B3.pdf
MT28F800B3WG-9 B TR
Виробник: Micron Technology Inc.
Description: IC FLASH 8MBIT PARALLEL 48TSOP I
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Part Status: Obsolete
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 1M x 8, 512K x 16
DigiKey Programmable: Not Verified
товар відсутній
MT58L256L18D1T-6 MICTS01103-1.pdf?t.download=true&u=5oefqw
MT58L256L18D1T-6
Виробник: Micron Technology Inc.
Description: IC SRAM 4MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 18
на замовлення 17906 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
45+510.37 грн
Мінімальне замовлення: 45
MT58V1MV18DT-6 MICTS01167-1.pdf?t.download=true&u=5oefqw
MT58V1MV18DT-6
Виробник: Micron Technology Inc.
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1M x 18
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
16+1427.83 грн
Мінімальне замовлення: 16
MT29F1T08GBLCEJ4:C TR
Виробник: Micron Technology Inc.
Description: QLC 1T 128GX8 VBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT29F1T08GBLCEJ4:C
Виробник: Micron Technology Inc.
Description: QLC 1T 128GX8 VBGA
Packaging: Box
Part Status: Active
товар відсутній
MT29F1T08GBLCEJ4-QM:C
Виробник: Micron Technology Inc.
Description: QLC 1T 128GX8 VBGA
Packaging: Box
Part Status: Active
товар відсутній
MT29F1T08GBLCEJ4-M:C TR
Виробник: Micron Technology Inc.
Description: QLC 1T 128GX8 VBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT29F1T08GBLCEJ4-M:C
Виробник: Micron Technology Inc.
Description: QLC 1T 128GX8 VBGA
Packaging: Box
Part Status: Active
товар відсутній
MT29F1T08GBLCEJ4-QM:C TR
Виробник: Micron Technology Inc.
Description: QLC 1T 128GX8 VBGA
Packaging: Tape & Reel (TR)
Part Status: Active
товар відсутній
EDS6432AFTA-75TI-E-D
Виробник: Micron Technology Inc.
Description: SDRAM 2MX32 PLASTIC TSOP 3.3V EX
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
M29F400FT55M32 M29F(200,400,800,160)F(T,B)_Rev.C,5,2018.pdf
Виробник: Micron Technology Inc.
Description: IC FLASH 4MBIT PARALLEL 44SO
Packaging: Tray
Package / Case: 44-SOIC (0.496", 12.60mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 55ns
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
товар відсутній
MT41K512M8RG-093:N
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tray
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
товар відсутній
MT41K512M8RG-093:N TR 4gb_ddr3l.pdf?rev=305217e2f9bd4ef48d7c6f353dfc064c
Виробник: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
товар відсутній
N25Q128A13EV741
Виробник: Micron Technology Inc.
Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
товар відсутній
N25Q128A13BSFH0F
N25Q128A13BSFH0F
Виробник: Micron Technology Inc.
Description: IC FLASH 128MBIT SPI 108MHZ 16SO
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
товар відсутній
N25Q128A13EW7DFF
Виробник: Micron Technology Inc.
Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AUT:C
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AAT:C
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AUT:C TR
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AIT:C TR
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 WT:C TR z42n_embedded_lpddr4x_lpddr4.pdf
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AIT:C
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 WT:C z42n_embedded_lpddr4x_lpddr4.pdf
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT53E2G32D4DE-046 AAT:C TR
Виробник: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F1G32D2DS-023 WT ES:B TR
MT62F1G32D2DS-023 WT ES:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 3.2 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 FAAT:B
MT62F2G32D4DS-023 FAAT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 IT:B
MT62F2G32D4DS-023 IT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F1G32D2DS-023 WT ES:B
MT62F1G32D2DS-023 WT ES:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 WT ES:B TR
MT62F2G32D4DS-023 WT ES:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AUT:B
MT62F2G32D4DS-023 AUT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AUT:B TR
MT62F2G32D4DS-023 AUT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AAT:B TR
MT62F2G32D4DS-023 AAT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 WT ES:B
MT62F2G32D4DS-023 WT ES:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 WT:B
MT62F2G32D4DS-023 WT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
на замовлення 1050 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+4779.55 грн
10+ 4143.44 грн
25+ 4052.67 грн
50+ 3723.1 грн
100+ 3259.58 грн
MT62F2G32D4DS-023 WT:B TR
MT62F2G32D4DS-023 WT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 IT:B TR
MT62F2G32D4DS-023 IT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AIT:B TR
MT62F2G32D4DS-023 AIT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AIT:B
MT62F2G32D4DS-023 AIT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 AAT:B
MT62F2G32D4DS-023 AAT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D4DS-023 FAAT:B TR
MT62F2G32D4DS-023 FAAT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D8DR-031 WT:B
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT62F2G32D8DR-031 WT:B TR
Виробник: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M256M32JE-12 NIT:A TR gddr6_sgram_networking_brief.pdf
Виробник: Micron Technology Inc.
Description: GDDR6 8G 256MX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61M256M32JE-12 NIT:A gddr6_sgram_networking_brief.pdf
Виробник: Micron Technology Inc.
Description: GDDR6 8G 256MX32 FBGA
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-14:C
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
на замовлення 1241 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+2345.3 грн
10+ 2123.84 грн
25+ 2050.14 грн
50+ 1863.14 грн
100+ 1640.09 грн
250+ 1595.96 грн
MT61K512M32KPA-16:C gddr6_sgram_16gb_brief.pdf?rev=739320c171da46069cc8ba7d7aca73f7
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
на замовлення 1244 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+2345.3 грн
10+ 2123.84 грн
25+ 2050.14 грн
50+ 1863.14 грн
100+ 1640.09 грн
250+ 1595.96 грн
MT61K512M32KPA-14:C TR gddr6_sgram_16gb_brief.pdf?rev=739320c171da46069cc8ba7d7aca73f7
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-21:U
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-24:U TR
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 12 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-16:C TR
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61K512M32KPA-21:U TR
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 AAT:C TR
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 N:C TR
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 AAT:C
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 NIT:C
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 N:C
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT61M512M32KPA-14 NIT:C TR
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
MT58L512L18FS-8.5 MICTS01178-1.pdf?t.download=true&u=5oefqw
MT58L512L18FS-8.5
Виробник: Micron Technology Inc.
Description: IC SRAM 8MBIT PAR 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 512K x 18
DigiKey Programmable: Not Verified
на замовлення 17071 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
51+447.8 грн
Мінімальне замовлення: 51
MT58L256L32PT-6 MICTS00952-1.pdf?t.download=true&u=5oefqw
MT58L256L32PT-6
Виробник: Micron Technology Inc.
Description: IC SRAM 8MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 32
DigiKey Programmable: Not Verified
на замовлення 786 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
31+665.3 грн
Мінімальне замовлення: 31
MT58L512Y36PT-5 MICTS01166-1.pdf?t.download=true&u=5oefqw
MT58L512Y36PT-5
Виробник: Micron Technology Inc.
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Standard
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.1 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
на замовлення 423 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
17+1383.36 грн
Мінімальне замовлення: 17
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