MT61K512M32KPA-16:C TR Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
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Технічний опис MT61K512M32KPA-16:C TR Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP, Packaging: Tape & Reel (TR), Package / Case: 180-TFBGA, Mounting Type: Surface Mount, Memory Size: 16Gbit, Memory Type: Volatile, Operating Temperature: 0°C ~ 95°C (TC), Voltage - Supply: 1.3095V ~ 1.3905V, Technology: SGRAM - GDDR6, Clock Frequency: 8 GHz, Memory Format: DRAM, Supplier Device Package: 180-FBGA (12x14), Part Status: Active, Memory Interface: POD_135, Memory Organization: 512M x 32, DigiKey Programmable: Not Verified.
Інші пропозиції MT61K512M32KPA-16:C TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| MT61K512M32KPA-16:C TR | Виробник : Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Cut Tape (CT) Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 8 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
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MT61K512M32KPA-16:C TR | Виробник : Micron |
 DRAM GDDR6 16G 512MX32 FBGA DDP |
товар відсутній |