Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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AGIA040R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948BGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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DK-DEV-AGI027RBES | Intel |
Description: DEV KIT AGILEX-I AGIB027 Packaging: Bulk For Use With/Related Products: AGIB027 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Agilex I-Series SoC FPGA PCIe Card |
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AGIA035R39A2E3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2E3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A1I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A2I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A2I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A1I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A1I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A2I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA035R39A1I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIC035R39A1I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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AGIA040R39A1I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
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EPM7064AETC100-7 | Intel |
![]() Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 3V ~ 3.6V Number of I/O: 68 DigiKey Programmable: Not Verified |
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EPM7064BTC100-5 | Intel |
![]() Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 5 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 68 DigiKey Programmable: Not Verified |
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EP1SGX25CF672C5 | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25CF672C7 | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25CF672C7N | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672C5 | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672C7 | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672I6N | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
товар відсутній |
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EP1SGX25DF672C7N | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
товар відсутній |
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EP1SGX25CF672I6N | Intel |
![]() Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
товар відсутній |
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HLDC-DDR4-4GB-A | Intel |
Description: DAUGHTER CARD HILO DDR4 4GB Packaging: Bulk Function: SDRAM Type: Memory Contents: Board(s) Utilized IC / Part: EDY4016AABG-DR-F Platform: Arria |
товар відсутній |
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10M40DDF256C8G | Intel |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 180 шт: термін постачання 21-31 дні (днів) |
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SPTSBP3PCCWA002 | Intel |
Description: OPTOELECTRONICS Packaging: Bulk Connector Type: LC Mounting Type: Pluggable, SFP28 Applications: Optical Data Rate: 100Gbps |
товар відсутній |
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10M40DDF484C8G | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
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10M40DDF672C8G | Intel |
![]() Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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10M40DDF484I7G | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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10M40DDF672I7G | Intel |
![]() Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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EPM2210GF256C3 | Intel |
![]() Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 204 DigiKey Programmable: Not Verified |
товар відсутній |
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EPM2210GF256C4N | Intel |
![]() Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 204 DigiKey Programmable: Not Verified |
товар відсутній |
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EPM2210F256C4RR | Intel |
Description: IC CPLD 1700MC 9.1NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
товар відсутній |
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EPM2210F256C5NGA | Intel |
Description: IC CPLD 1700MC 11.2NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 11.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
товар відсутній |
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EPM2210F256C5RR | Intel |
Description: IC CPLD 1700MC 11.2NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 11.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
товар відсутній |
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EPM2210F324C4RR | Intel |
Description: IC CPLD 1700MC 9.1NS 324FBGA Packaging: Tray Package / Case: 324-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 324-FBGA (19x19) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 272 DigiKey Programmable: Not Verified |
товар відсутній |
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5SEEBF45C4G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
товар відсутній |
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5SEEBF45I4G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
товар відсутній |
AGIA040R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
DK-DEV-AGI027RBES |
Виробник: Intel
Description: DEV KIT AGILEX-I AGIB027
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex I-Series SoC FPGA PCIe Card
Description: DEV KIT AGILEX-I AGIB027
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex I-Series SoC FPGA PCIe Card
товар відсутній
AGIA035R39A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A1I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A2I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A2I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A1I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A1I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A2I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA035R39A1I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIC035R39A1I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
AGIA040R39A1I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній
EPM7064AETC100-7 |
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Виробник: Intel
Description: IC CPLD 64MC 7.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 7.5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 68
DigiKey Programmable: Not Verified
товар відсутній
EPM7064BTC100-5 |
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Виробник: Intel
Description: IC CPLD 64MC 5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25CF672C5 |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25CF672C7 |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25CF672C7N |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25DF672C5 |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25DF672C7 |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25DF672I6N |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25DF672C7N |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX25CF672I6N |
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Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
HLDC-DDR4-4GB-A |
Виробник: Intel
Description: DAUGHTER CARD HILO DDR4 4GB
Packaging: Bulk
Function: SDRAM
Type: Memory
Contents: Board(s)
Utilized IC / Part: EDY4016AABG-DR-F
Platform: Arria
Description: DAUGHTER CARD HILO DDR4 4GB
Packaging: Bulk
Function: SDRAM
Type: Memory
Contents: Board(s)
Utilized IC / Part: EDY4016AABG-DR-F
Platform: Arria
товар відсутній
10M40DDF256C8G |
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Виробник: Intel
Description: IC FPGA/CPLD NV 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 9042.7 грн |
25+ | 7314.36 грн |
SPTSBP3PCCWA002 |
Виробник: Intel
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
товар відсутній
10M40DDF484C8G |
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Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 9700.07 грн |
25+ | 7845.61 грн |
10M40DDF672C8G |
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Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10984.67 грн |
25+ | 8885.76 грн |
10M40DDF484I7G |
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Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12932.68 грн |
25+ | 10461.94 грн |
10M40DDF672I7G |
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Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 14647.74 грн |
25+ | 11847.23 грн |
EPM2210GF256C3 |
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Виробник: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
EPM2210GF256C4N |
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Виробник: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
EPM2210F256C4RR |
Виробник: Intel
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
EPM2210F256C5NGA |
Виробник: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
EPM2210F256C5RR |
Виробник: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
EPM2210F324C4RR |
Виробник: Intel
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
товар відсутній
5SEEBF45C4G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
5SEEBF45I4G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній