| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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| EPM7256AETI144-7AA | Intel |
Description: IC CPLD 256MC 7.5NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 5000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 164 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| QCIXF1002ED | Intel |
Description: NETWORK PROC 3.3V 165.89MHZ 432P Packaging: Bulk Package / Case: 304-BGA Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2756 шт: термін постачання 21-31 дні (днів) |
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KD82750PB-25 | Intel |
 Description: CONSUMER CIRCUIT, CMOS, PQFP132Packaging: Bulk Package / Case: 132-BQFP Mounting Type: Surface Mount Function: Processor Voltage - Supply: 4.5V ~ 5.5V Applications: Video Display Standards: DVI 1.0 Supplier Device Package: 132-PQFP (24.13x24.13) Part Status: Active Control Interface: Serial |
на замовлення 2063 шт: термін постачання 21-31 дні (днів) |
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KU82307-25 | Intel |
Description: DMA CONTROLLER, CMOS, PQFP132 Packaging: Bulk Package / Case: 132-QFP Bumpered Function: Controller Interface: Bus Operating Temperature: 0°C ~ 70°C (TC) Voltage - Supply: 4.75V ~ 5.25V Current - Supply: 180mA Supplier Device Package: 132-QFP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 912 шт: термін постачання 21-31 дні (днів) |
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EP2S130F1020C5NRB | Intel |
Description: IC FPGA 742 I/O 1020FBGA Packaging: Tray Package / Case: 1020-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 132540 Supplier Device Package: 1020-FBGA (33x33) Number of LABs/CLBs: 6627 Part Status: Obsolete Number of I/O: 742 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| 5962-9310502MYA | Intel |
Description: IC MPU 80486 33MHZ 196CQFP Packaging: Bulk Package / Case: 196-BCQFP Exposed Pad and Tie Bar Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: -55°C ~ 125°C (TC) Core Processor: 80486DX Voltage - I/O: 5V Supplier Device Package: 196-CQFP (63.76x63.76) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Active |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
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TE28F256P33T95A | Intel |
Description: IC FLASH 256MBIT PAR 56TSOP Packaging: Tray Package / Case: 56-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 256Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 2.3V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 40 MHz Memory Format: FLASH Supplier Device Package: 56-TSOP Part Status: Obsolete Write Cycle Time - Word, Page: 95ns Memory Interface: Parallel Access Time: 95 ns Memory Organization: 16M x 16 DigiKey Programmable: Not Verified |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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1SX165HN1F43E2VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HU1F50I2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HN3F43E3VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HU1F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HN2F43I2VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HU2F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HN3F43I2VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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1SX165HU3F50E3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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EM2280P01QI | Intel |
Description: DC DC CONVERTER 0.5-1.3V Packaging: Tray Features: OCP, OTP, UVLO Package / Case: 152-PowerBFQFN Module Size / Dimension: 0.91" L x 0.71" W x 0.27" H (23.0mm x 18.0mm x 7.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module, Digital Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 16V Efficiency: 92% Current - Output (Max): 80A Supplier Device Package: 152-QFN (23x18) Voltage - Input (Min): 4.5V Voltage - Output 1: 0.5 ~ 1.3V Part Status: Obsolete Number of Outputs: 1 |
товару немає в наявності |
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5CSEBA2U23I7LN | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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10AS066K2F40I1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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10AS066H2F34E1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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10AS066K1F40I1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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| DK-DEV-1SGX-H-0ES | Intel |
Description: DEV KIT STRATIX 10 ENG SAMPLE Packaging: Box For Use With/Related Products: 1SG280H Type: FPGA Contents: Board(s) Platform: Stratix 10 GX FPGA PCIe Card Part Status: Obsolete |
товару немає в наявності |
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10AS027H4F35I3LG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
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| QSHDC-QSPI-A | Intel |
Description: ARRIA 10 QSPI DAUGHTER CARD Packaging: Bulk Function: FLASH Type: Memory Contents: Board(s) Utilized IC / Part: MT25QU01GBBA8E12- 0SIT Platform: Arria Part Status: Active |
товару немає в наявності |
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EPM7064BFC49-5 | Intel |
Description: IC CPLD 64MC 5NS 49UBGA Packaging: Tray Package / Case: 49-LFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 5 ns Supplier Device Package: 49-UBGA (7x7) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 2.375V ~ 2.625V Part Status: Obsolete Number of I/O: 41 DigiKey Programmable: Not Verified |
товару немає в наявності |
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EPM7064TC44-7YY | Intel |
Description: IC CPLD 64MC 7.5NS 44TQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 44-TQFP (10x10) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| 5SGXEF40I2LAB | Intel |
Description: IC FPGA I/O FBGA Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
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| 5SGXEF40I2LAA | Intel |
Description: IC FPGA I/O FBGA Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
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| 5SGXEF40I2LNAC | Intel |
Description: IC FPGA STRATIX V GX FLIP CHIP Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
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| 5SGXEF40I2LNAD | Intel |
Description: IC FPGA STRATIX V GX FLIP CHIP Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
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| AGIC040R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A1I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2E3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A1I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGIC040R39A2E2VR0 | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
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| F28F020-150 | Intel |
Description: FLASH NOR 2MB TSOP REVERSE 150ns Packaging: Tray Mounting Type: Surface Mount Memory Size: 2Mbit Memory Type: Non-Volatile Voltage - Supply: 12V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 32-TSOP REVERSE Part Status: Active Memory Interface: Parallel Access Time: 70 ns Memory Organization: 256K x 8 DigiKey Programmable: Not Verified |
на замовлення 3372 шт: термін постачання 21-31 дні (днів) |
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| RD48F2100W0YTQ0 | Intel |
Description: STRATAFLASH EMBEDDED MEMORY Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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EP2AGX45DF29I3NAD | Intel |
Description: IC FPGA 364 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 42959 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 1805 Total RAM Bits: 3517440 Part Status: Obsolete Number of I/O: 364 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| EP2AGX45DF25I5G | Intel |
Description: IC FPGA 252 I/O 572FBGA Packaging: Tray Package / Case: 572-BGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 42959 Supplier Device Package: 572-FBGA, FC (25x25) Number of LABs/CLBs: 1805 Total RAM Bits: 3517440 Part Status: Active Number of I/O: 252 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| NE80546RE072256 | Intel |
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA Packaging: Bulk Package / Case: 478-BFCPGA Mounting Type: Through Hole Speed: 2.8GHz Operating Temperature: 67°C (TC) Core Processor: Intel® Celeron® D Voltage - I/O: 1.25V, 1.4V Supplier Device Package: 478-FCPGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit Part Status: Active |
на замовлення 3249 шт: термін постачання 21-31 дні (днів) |
|
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| D2912-A | Intel |
Description: IC PCM CODEC FILTER 16CDIP Packaging: Bulk Package / Case: 16-CDIP Mounting Type: Through Hole Type: PCM Codec Filter Supplier Device Package: 16-CDIP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
|
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 |
5CGXFC4C6F23I7N | Intel |
Description: IC FPGA 240 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 18868 Total RAM Bits: 2862080 Part Status: Active Number of I/O: 240 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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EPM570ZM100C6N | Intel |
Description: IC CPLD 440MC 9NS 100MBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 100-MBGA (6x6) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
товару немає в наявності |
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EPM7064QC100-10YY | Intel |
Description: IC CPLD 64MC 10NS 100QFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
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| AGFB012R24B2I2V | Intel |
Description: IC FPGA AGILEX-F 2486FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24C2I1V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24C2E4X | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24B2E2V | Intel |
Description: IC FPGA AGILEX-F 2486FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24C2E1V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24B2E4X | Intel |
Description: IC FPGA AGILEX-F 2486FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24C3I3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
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| AGFB012R24C3E4X | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
| EPM7256AETI144-7AA |
Виробник: Intel
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
товару немає в наявності
| QCIXF1002ED |
Виробник: Intel
Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2756 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 12253.96 грн |
| KD82750PB-25 |
|
Виробник: Intel
Description: CONSUMER CIRCUIT, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-BQFP
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Active
Control Interface: Serial
Description: CONSUMER CIRCUIT, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-BQFP
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Active
Control Interface: Serial
на замовлення 2063 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 14131.42 грн |
| KU82307-25 |
|
Виробник: Intel
Description: DMA CONTROLLER, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-QFP Bumpered
Function: Controller
Interface: Bus
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 180mA
Supplier Device Package: 132-QFP
Part Status: Active
DigiKey Programmable: Not Verified
Description: DMA CONTROLLER, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-QFP Bumpered
Function: Controller
Interface: Bus
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 180mA
Supplier Device Package: 132-QFP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 912 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4912.64 грн |
| EP2S130F1020C5NRB |
Виробник: Intel
Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
товару немає в наявності
| 5962-9310502MYA |
|
Виробник: Intel
Description: IC MPU 80486 33MHZ 196CQFP
Packaging: Bulk
Package / Case: 196-BCQFP Exposed Pad and Tie Bar
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -55°C ~ 125°C (TC)
Core Processor: 80486DX
Voltage - I/O: 5V
Supplier Device Package: 196-CQFP (63.76x63.76)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active
Description: IC MPU 80486 33MHZ 196CQFP
Packaging: Bulk
Package / Case: 196-BCQFP Exposed Pad and Tie Bar
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -55°C ~ 125°C (TC)
Core Processor: 80486DX
Voltage - I/O: 5V
Supplier Device Package: 196-CQFP (63.76x63.76)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active
на замовлення 92 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 98106.91 грн |
| TE28F256P33T95A |
|
Виробник: Intel
Description: IC FLASH 256MBIT PAR 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.3V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 95ns
Memory Interface: Parallel
Access Time: 95 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Description: IC FLASH 256MBIT PAR 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.3V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 95ns
Memory Interface: Parallel
Access Time: 95 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
на замовлення 101 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 42+ | 523.33 грн |
| 1SX165HN1F43E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HU1F50I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HN3F43E3VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HU1F50E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HN2F43I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HU2F50E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HN3F43I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 1SX165HU3F50E3VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| EM2280P01QI |
|
Виробник: Intel
Description: DC DC CONVERTER 0.5-1.3V
Packaging: Tray
Features: OCP, OTP, UVLO
Package / Case: 152-PowerBFQFN Module
Size / Dimension: 0.91" L x 0.71" W x 0.27" H (23.0mm x 18.0mm x 7.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module, Digital
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 16V
Efficiency: 92%
Current - Output (Max): 80A
Supplier Device Package: 152-QFN (23x18)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.5 ~ 1.3V
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.5-1.3V
Packaging: Tray
Features: OCP, OTP, UVLO
Package / Case: 152-PowerBFQFN Module
Size / Dimension: 0.91" L x 0.71" W x 0.27" H (23.0mm x 18.0mm x 7.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module, Digital
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 16V
Efficiency: 92%
Current - Output (Max): 80A
Supplier Device Package: 152-QFN (23x18)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.5 ~ 1.3V
Part Status: Obsolete
Number of Outputs: 1
товару немає в наявності
| 5CSEBA2U23I7LN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 10AS066K2F40I1HG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 10AS066H2F34E1HG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| 10AS066K1F40I1HG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| DK-DEV-1SGX-H-0ES |
Виробник: Intel
Description: DEV KIT STRATIX 10 ENG SAMPLE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA PCIe Card
Part Status: Obsolete
Description: DEV KIT STRATIX 10 ENG SAMPLE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA PCIe Card
Part Status: Obsolete
товару немає в наявності
| 10AS027H4F35I3LG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
| QSHDC-QSPI-A |
|
Виробник: Intel
Description: ARRIA 10 QSPI DAUGHTER CARD
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: MT25QU01GBBA8E12- 0SIT
Platform: Arria
Part Status: Active
Description: ARRIA 10 QSPI DAUGHTER CARD
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: MT25QU01GBBA8E12- 0SIT
Platform: Arria
Part Status: Active
товару немає в наявності
| EPM7064BFC49-5 |
|
Виробник: Intel
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
товару немає в наявності
| EPM7064TC44-7YY |
|
Виробник: Intel
Description: IC CPLD 64MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
товару немає в наявності
| 5SGXEF40I2LAB |
Виробник: Intel
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
| 5SGXEF40I2LAA |
Виробник: Intel
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
| 5SGXEF40I2LNAC |
Виробник: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
| 5SGXEF40I2LNAD |
Виробник: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
| AGIC040R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A1I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A1I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGIC040R39A2E2VR0 |
|
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
| F28F020-150 |
Виробник: Intel
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
на замовлення 3372 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 100+ | 211.12 грн |
| 300+ | 199.61 грн |
| 500+ | 195.91 грн |
| 1000+ | 180.39 грн |
| RD48F2100W0YTQ0 |
Виробник: Intel
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 34+ | 694.02 грн |
| EP2AGX45DF29I3NAD |
Виробник: Intel
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
товару немає в наявності
| EP2AGX45DF25I5G |
Виробник: Intel
Description: IC FPGA 252 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Active
Number of I/O: 252
DigiKey Programmable: Not Verified
Description: IC FPGA 252 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Active
Number of I/O: 252
DigiKey Programmable: Not Verified
товару немає в наявності
| NE80546RE072256 |
|
Виробник: Intel
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
на замовлення 3249 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 3786.52 грн |
| D2912-A |
|
Виробник: Intel
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 84 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 3104.66 грн |
| 5CGXFC4C6F23I7N |
|
Виробник: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19443.27 грн |
| EPM570ZM100C6N |
|
Виробник: Intel
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
товару немає в наявності
| EPM7064QC100-10YY |
|
Виробник: Intel
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
товару немає в наявності
| AGFB012R24B2I2V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24C2I1V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24C3E3V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24C2E4X |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24B2E2V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24C2E1V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24B2E4X |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24C3I3E |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
| AGFB012R24C3E4X |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності