Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||
---|---|---|---|---|---|---|---|
GWIXP425ABBT | Intel |
![]() Packaging: Bulk Package / Case: 492-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: Intel® IXP42X Voltage - I/O: 3.3V Supplier Device Package: 492-PBGA (35x35) Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Part Status: Active |
на замовлення 3734 шт: термін постачання 21-31 дні (днів) |
|
|||
HH80552RE083512 | Intel |
![]() Packaging: Bulk Package / Case: 775-BLGA Mounting Type: Surface Mount Speed: 3.06GHz Operating Temperature: 69.2°C (TC) Core Processor: Intel® Celeron® D Processor 347 Voltage - I/O: 1.25V, 1.325V Supplier Device Package: 775-LGA (37.5x37.5) Number of Cores/Bus Width: 1 Core, 64-Bit Part Status: Active |
на замовлення 259285 шт: термін постачання 21-31 дні (днів) |
|
|||
FWIXP422ABB | Intel |
![]() Packaging: Bulk Package / Case: 492-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: Intel® IXP42X Voltage - I/O: 3.3V Supplier Device Package: 492-PBGA (35x35) Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Part Status: Active |
на замовлення 1662 шт: термін постачання 21-31 дні (днів) |
|
|||
![]() |
5962-8961402MXA | Intel |
![]() Packaging: Bulk Package / Case: 32-CDIP Mounting Type: Through Hole Memory Size: 1Mbit Memory Type: Non-Volatile Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: EPROM - UV Memory Format: EPROM Supplier Device Package: 32-CDIP Part Status: Active Access Time: 250 ns Memory Organization: 128K x 8 DigiKey Programmable: Not Verified |
на замовлення 3553 шт: термін постачання 21-31 дні (днів) |
|
||
EP1C4F400C8NAB | Intel |
![]() Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 4000 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 400 Total RAM Bits: 78336 Part Status: Obsolete Number of I/O: 301 DigiKey Programmable: Not Verified |
товар відсутній |
||||
![]() |
EPM1270GT144C5 | Intel |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 6.2 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 116 DigiKey Programmable: Not Verified |
товар відсутній |
|||
![]() |
EPM1270GT144C3N | Intel |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 6.2 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 116 DigiKey Programmable: Not Verified |
товар відсутній |
|||
![]() |
EPM1270GF256C4 | Intel |
![]() Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 6.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 212 DigiKey Programmable: Not Verified |
товар відсутній |
|||
![]() |
EPM1270GT144C3 | Intel |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 980 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 6.2 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 1270 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 116 DigiKey Programmable: Not Verified |
товар відсутній |
|||
![]() |
MD2148H | Intel |
![]() Packaging: Bulk Package / Case: 18-CDIP Mounting Type: Through Hole Memory Size: 4Kbit Memory Type: Volatile Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: SRAM - Asynchronous Memory Format: SRAM Supplier Device Package: 18-CDIP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 1K x 4 DigiKey Programmable: Not Verified |
на замовлення 209 шт: термін постачання 21-31 дні (днів) |
|
||
EPM7128SQC160-15YY | Intel |
![]() Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
EPM7128SQC160-10YY | Intel |
![]() Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
EPM7128SQC160-15ES | Intel |
![]() Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
![]() |
EPM7128SQCI100-10 | Intel |
![]() Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 84 DigiKey Programmable: Not Verified |
товар відсутній |
|||
EPM7128SQC160-10ES | Intel |
![]() Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
EPM7128SQC160-7YY | Intel |
![]() Packaging: Tray Package / Case: 160-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
||||
EPM570F100C5NAA | Intel |
Description: IC CPLD 440MC 8.7NS 100FBGA Packaging: Tray Package / Case: 100-LBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 8.7 ns Supplier Device Package: 100-FBGA (11x11) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
товар відсутній |
||||
![]() |
AN87C196JQ | Intel |
![]() Packaging: Bulk Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 12KB (12K x 8) RAM Size: 488 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: EPROM Core Processor: 87C196JQ Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SSIO, UART/USART Supplier Device Package: 52-PLCC Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
на замовлення 3864 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
AN8398JC | Intel |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 347 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
EPM570GM256C5N | Intel |
![]() Packaging: Tray Package / Case: 256-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 256-MBGA (11x11) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 160 DigiKey Programmable: Not Verified |
товар відсутній |
|||
![]() |
EPM570GT144C5 | Intel |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 116 DigiKey Programmable: Not Verified |
товар відсутній |
|||
|
1SX280LN3F43E2VGS1 | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43E2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43I1VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50I2LG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55E3VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43E3VGS1 | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55E2LG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43E2VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50E2VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN2F43E2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55I1VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU2F50E2VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU2F50E1VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH2F55E1VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55E2VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43E1VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH2F55I1VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN2F43I2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50I1VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43E3VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50E2VGS1 | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Discontinued at Digi-Key |
товар відсутній |
|||
|
1SX280LN3F43I2LG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU2F50E2LG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55E1VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55I2VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN2F43E2VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN3F43I2VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU2F50I2VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50I2VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH2F55E2VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50I3VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH2F55I2VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LN2F43E1VG | Intel |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH2F55E2LG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55I2LG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU2F50I2LG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LH3F55I3VG | Intel |
![]() Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
|
1SX280LU3F50E3VG | Intel |
![]() Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
|||
EPM7256AETI144-7AA | Intel |
Description: IC CPLD 256MC 7.5NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 5000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 164 DigiKey Programmable: Not Verified |
товар відсутній |
GWIXP425ABBT |
![]() |
Виробник: Intel
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 3734 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
12+ | 1898.14 грн |
HH80552RE083512 |
![]() |
Виробник: Intel
Description: IC MPU INTEL CEL 3.06GHZ 775LGA
Packaging: Bulk
Package / Case: 775-BLGA
Mounting Type: Surface Mount
Speed: 3.06GHz
Operating Temperature: 69.2°C (TC)
Core Processor: Intel® Celeron® D Processor 347
Voltage - I/O: 1.25V, 1.325V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 1 Core, 64-Bit
Part Status: Active
Description: IC MPU INTEL CEL 3.06GHZ 775LGA
Packaging: Bulk
Package / Case: 775-BLGA
Mounting Type: Surface Mount
Speed: 3.06GHz
Operating Temperature: 69.2°C (TC)
Core Processor: Intel® Celeron® D Processor 347
Voltage - I/O: 1.25V, 1.325V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 1 Core, 64-Bit
Part Status: Active
на замовлення 259285 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
28+ | 771.51 грн |
FWIXP422ABB |
![]() |
Виробник: Intel
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 1662 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
15+ | 1540.93 грн |
5962-8961402MXA |
![]() |
Виробник: Intel
Description: IC EPROM 1MBIT 32CDIP
Packaging: Bulk
Package / Case: 32-CDIP
Mounting Type: Through Hole
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EPROM - UV
Memory Format: EPROM
Supplier Device Package: 32-CDIP
Part Status: Active
Access Time: 250 ns
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Description: IC EPROM 1MBIT 32CDIP
Packaging: Bulk
Package / Case: 32-CDIP
Mounting Type: Through Hole
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EPROM - UV
Memory Format: EPROM
Supplier Device Package: 32-CDIP
Part Status: Active
Access Time: 250 ns
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
на замовлення 3553 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10+ | 2444.12 грн |
EP1C4F400C8NAB |
![]() |
Виробник: Intel
Description: IC FPGA 301 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 4000
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 400
Total RAM Bits: 78336
Part Status: Obsolete
Number of I/O: 301
DigiKey Programmable: Not Verified
Description: IC FPGA 301 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 4000
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 400
Total RAM Bits: 78336
Part Status: Obsolete
Number of I/O: 301
DigiKey Programmable: Not Verified
товар відсутній
EPM1270GT144C5 |
![]() |
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
товар відсутній
EPM1270GT144C3N |
![]() |
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
товар відсутній
EPM1270GF256C4 |
![]() |
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 212
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 6.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 212
DigiKey Programmable: Not Verified
товар відсутній
EPM1270GT144C3 |
![]() |
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
товар відсутній
MD2148H |
![]() |
Виробник: Intel
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1K x 4
DigiKey Programmable: Not Verified
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1K x 4
DigiKey Programmable: Not Verified
на замовлення 209 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
28+ | 834.76 грн |
EPM7128SQC160-15YY |
![]() |
Виробник: Intel
Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
EPM7128SQC160-10YY |
![]() |
Виробник: Intel
Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
EPM7128SQC160-15ES |
![]() |
Виробник: Intel
Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
EPM7128SQCI100-10 |
![]() |
Виробник: Intel
Description: IC CPLD 128MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 84
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 84
DigiKey Programmable: Not Verified
товар відсутній
EPM7128SQC160-10ES |
![]() |
Виробник: Intel
Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
EPM7128SQC160-7YY |
![]() |
Виробник: Intel
Description: IC CPLD 128MC 7.5NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 7.5NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
EPM570F100C5NAA |
Виробник: Intel
Description: IC CPLD 440MC 8.7NS 100FBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 100-FBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 8.7NS 100FBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 100-FBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
товар відсутній
AN87C196JQ |
![]() |
Виробник: Intel
Description: 16-BIT, OTPROM, 8096 CPU, 8MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 488 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: EPROM
Core Processor: 87C196JQ
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSIO, UART/USART
Supplier Device Package: 52-PLCC
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: 16-BIT, OTPROM, 8096 CPU, 8MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 488 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: EPROM
Core Processor: 87C196JQ
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSIO, UART/USART
Supplier Device Package: 52-PLCC
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
на замовлення 3864 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
70+ | 300.28 грн |
AN8398JC |
![]() |
Виробник: Intel
Description: MICROCONTROLLER, 16-BIT, MROM, 8
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 16-BIT, MROM, 8
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 347 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
8+ | 2972.05 грн |
EPM570GM256C5N |
![]() |
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
товар відсутній
EPM570GT144C5 |
![]() |
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
товар відсутній
1SX280LN3F43E2VGS1 |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43I1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50I2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55E3VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43E3VGS1 |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN2F43E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55I1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU2F50E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU2F50E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH2F55E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH2F55I1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN2F43I2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50I1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43E3VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50E2VGS1 |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
товар відсутній
1SX280LN3F43I2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU2F50E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55I2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN2F43E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN3F43I2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU2F50I2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50I2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH2F55E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50I3VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH2F55I2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LN2F43E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH2F55E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55I2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU2F50I2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LH3F55I3VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
1SX280LU3F50E3VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
EPM7256AETI144-7AA |
Виробник: Intel
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
товар відсутній