| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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1SG110HN1F43E2VGS1 | Intel |
 Description: IC FPGA 688 I/O 1760FBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1100000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 137500 Number of I/O: 688 DigiKey Programmable: Not Verified |
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1SG210HN1F43E2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2100000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 262500 Number of I/O: 688 DigiKey Programmable: Not Verified |
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1SG110HN2F43I2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1100000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 137500 Number of I/O: 688 DigiKey Programmable: Not Verified |
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1SG110HN2F43I2VGAS | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1100000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 137500 Number of I/O: 688 DigiKey Programmable: Not Verified |
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| DK-DEV-AGI027-RA | Intel |
Description: AGILEX I-SERIES DEV KIT AGI027 Packaging: Bulk For Use With/Related Products: AGIB027 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Agilex I-Series SoC FPGA PCIe Card |
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| DK-DEV-AGI027R1BES | Intel |
Description: AGILEX I-SERIES DEV KIT AGI027 Packaging: Bulk For Use With/Related Products: AGIB027 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Agilex I-Series SoC FPGA PCIe Card |
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1ST085EN1F43E1VG | Intel |
Description: IC FPGA 440 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1SG210HU1F50E2VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2100000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 262500 Number of I/O: 704 DigiKey Programmable: Not Verified |
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EP1C3T144C6 | Intel |
Description: IC FPGA 104 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 2910 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 291 Total RAM Bits: 59904 Number of I/O: 104 DigiKey Programmable: Not Verified |
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1SG280HH2F55E1VGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1SG280HH2F55E1VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1SG280HH2F55E1VGAS | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1ST110EN1F43E1VG | Intel |
Description: IC FPGA 440 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1100000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 137500 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1SG280HN2F43E2LGAS | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
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1SG280HN2F43E2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
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1SG280HN2F43E2LGS3 | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
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1ST085EN1F43I2VG | Intel |
Description: IC FPGA 440 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 850000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 106250 Number of I/O: 440 DigiKey Programmable: Not Verified |
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EP1SGX40DF1020I6N | Intel |
Description: IC FPGA 624 I/O 1020FBGA Packaging: Tray Package / Case: 1020-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 41250 Supplier Device Package: 1020-FBGA (33x33) Number of LABs/CLBs: 4125 Total RAM Bits: 3423744 Number of I/O: 624 DigiKey Programmable: Not Verified |
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1SG280HU1F50I1VGAS | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HU1F50I1VG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 350000 Number of I/O: 704 DigiKey Programmable: Not Verified |
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1SG280HH1F55E1VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1SG280HH1F55E1VGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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EPCQL512F24IN | Intel |
Description: IC QUAD-SERIAL LOW VOLTAGE CONFI Packaging: Tray Package / Case: 24-TBGA Mounting Type: Surface Mount Memory Size: 512MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 2V Supplier Device Package: 24-FBGA (6x8) DigiKey Programmable: Not Verified |
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| EVB-ER6230QI | Intel |
Description: EVALUATION BOARD FOR ER6230QI: 3 Packaging: Bulk Voltage - Output: 1V, 1.2V, 1.5V, 1.8V, 2.5V or 3.3V Voltage - Input: 2.7V ~ 6.6V Current - Output: 3A Frequency - Switching: 1.9MHz Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: ER6230QI Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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EVB-EN6382QI | Intel |
Description: EVAL BOARD FOR EN6382QI Packaging: Bulk Voltage - Input: 3V ~ 6.5V Current - Output: 8A Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: EN6382QI Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| IP-ETH-HTILEKRCR | Intel |
Description: KR/CR (AN/LT) OPTION FOR H-TILE Packaging: Electronic Delivery Type: License |
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| IPR-ETH-HTILEKRCR | Intel |
Description: RENEWAL FOR KR/CR (AN/LT) OPTION Packaging: Electronic Delivery Type: License |
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| IP-ETH-ETILEHIP | Intel |
Description: PROTOTYPE Packaging: Bulk Type: License Applications: Programming |
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| IP-ETH-HTILEHIP | Intel |
Description: PROTOTYPE Packaging: Bulk Type: License Applications: Programming |
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| IPR-ETH-ETILEHIP | Intel |
Description: ETHERNET KR/CR Packaging: Bulk |
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| IPR-ETH-HTILEHIP | Intel |
Description: ETHERNET KR/CR Packaging: Bulk |
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| DK-SOC-10AS066S-E | Intel |
Description: DEV KIT ARRIA 10 SX SOC VER D Packaging: Bulk |
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1ST085ES1F50E2VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST110ES1F50E2VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1325000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 112197632 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST085ES1F50E1VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST085ES1F50I2VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST085ES1F50E2LG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST110ES1F50E1VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1325000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 112197632 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST110ES1F50I2VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1325000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 112197632 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST085ES1F50I1VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST110ES1F50E2LG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 1325000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 112197632 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST085ES1F50I2LG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 841000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 71303168 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST110ES1F50I1VG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 1325000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 112197632 Number of I/O: 440 DigiKey Programmable: Not Verified |
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1ST110ES1F50I2LG | Intel |
Description: IC FPGA STRATIX10TX 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 1325000 Supplier Device Package: 2397-FBGA, FC (50x50) Total RAM Bits: 112197632 Number of I/O: 440 DigiKey Programmable: Not Verified |
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| FW21555AB | Intel |
Description: 21555 - NON-TRANSPARENT PCI-TO- Packaging: Bulk Package / Case: 304-BBGA Mounting Type: Surface Mount Interface: PCI Voltage - Supply: 3V ~ 3.6V Applications: PCI-to-PCI Bridge Supplier Device Package: 304-PBGA (31x31) |
на замовлення 15605 шт: термін постачання 21-31 дні (днів) |
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| RJ80530MZ001256 | Intel |
Description: TUALITAN PENTIUM PROCESSOR Packaging: Bulk |
на замовлення 4368 шт: термін постачання 21-31 дні (днів) |
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1SX250HH3F55I3VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH3F55E2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH3F55E1VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH3F55I2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SX250HH2F55E2VG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SG250HH3F55E2LG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 312500 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1SX250HH3F55E2LG | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2500K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
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1SG280HH3F55I2VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1SG280HH2F55E2VG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
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1SG280HH2F55E2VGAS | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
товар відсутній |
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1SG280HH2F55E2VGS3 | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 350000 Number of I/O: 1160 DigiKey Programmable: Not Verified |
товар відсутній |
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1SG250HH3F55E3XG | Intel |
Description: IC FPGA 1160 I/O 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 2912-FBGA, FC (55x55) Number of LABs/CLBs: 312500 Number of I/O: 1160 DigiKey Programmable: Not Verified |
товар відсутній |
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1SX280HH2F55E2VGS3 | Intel |
Description: IC FPGA STRATIX 10 2912FBGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA |
товар відсутній |
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| AGIC035R39A2E2V | Intel |
Description: IC Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товар відсутній |
| 1SG110HN1F43E2VGS1 |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| 1SG210HN1F43E2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| 1SG110HN2F43I2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| 1SG110HN2F43I2VGAS |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| DK-DEV-AGI027-RA |
Виробник: Intel
Description: AGILEX I-SERIES DEV KIT AGI027
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex I-Series SoC FPGA PCIe Card
Description: AGILEX I-SERIES DEV KIT AGI027
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex I-Series SoC FPGA PCIe Card
товар відсутній
| DK-DEV-AGI027R1BES |
|
Виробник: Intel
Description: AGILEX I-SERIES DEV KIT AGI027
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex I-Series SoC FPGA PCIe Card
Description: AGILEX I-SERIES DEV KIT AGI027
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex I-Series SoC FPGA PCIe Card
товар відсутній
| 1ST085EN1F43E1VG |
|
Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1SG210HU1F50E2VG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| EP1C3T144C6 |
|
Виробник: Intel
Description: IC FPGA 104 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 2910
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 291
Total RAM Bits: 59904
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: IC FPGA 104 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 2910
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 291
Total RAM Bits: 59904
Number of I/O: 104
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH2F55E1VGS3 |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH2F55E1VG |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH2F55E1VGAS |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110EN1F43E1VG |
|
Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 137500
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HN2F43E2LGAS |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HN2F43E2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HN2F43E2LGS3 |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
| 1ST085EN1F43I2VG |
|
Виробник: Intel
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA 440 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 850000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 106250
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX40DF1020I6N |
|
Виробник: Intel
Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU1F50I1VGAS |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HU1F50I1VG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH1F55E1VG |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH1F55E1VGS3 |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| EPCQL512F24IN |
|
Виробник: Intel
Description: IC QUAD-SERIAL LOW VOLTAGE CONFI
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 512MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 2V
Supplier Device Package: 24-FBGA (6x8)
DigiKey Programmable: Not Verified
Description: IC QUAD-SERIAL LOW VOLTAGE CONFI
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 512MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 2V
Supplier Device Package: 24-FBGA (6x8)
DigiKey Programmable: Not Verified
товар відсутній
| EVB-ER6230QI |
|
Виробник: Intel
Description: EVALUATION BOARD FOR ER6230QI: 3
Packaging: Bulk
Voltage - Output: 1V, 1.2V, 1.5V, 1.8V, 2.5V or 3.3V
Voltage - Input: 2.7V ~ 6.6V
Current - Output: 3A
Frequency - Switching: 1.9MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: ER6230QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Description: EVALUATION BOARD FOR ER6230QI: 3
Packaging: Bulk
Voltage - Output: 1V, 1.2V, 1.5V, 1.8V, 2.5V or 3.3V
Voltage - Input: 2.7V ~ 6.6V
Current - Output: 3A
Frequency - Switching: 1.9MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: ER6230QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4754.67 грн |
| EVB-EN6382QI |
|
Виробник: Intel
Description: EVAL BOARD FOR EN6382QI
Packaging: Bulk
Voltage - Input: 3V ~ 6.5V
Current - Output: 8A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EN6382QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Description: EVAL BOARD FOR EN6382QI
Packaging: Bulk
Voltage - Input: 3V ~ 6.5V
Current - Output: 8A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EN6382QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4754.67 грн |
| IP-ETH-HTILEKRCR |
Виробник: Intel
Description: KR/CR (AN/LT) OPTION FOR H-TILE
Packaging: Electronic Delivery
Type: License
Description: KR/CR (AN/LT) OPTION FOR H-TILE
Packaging: Electronic Delivery
Type: License
товар відсутній
| IPR-ETH-HTILEKRCR |
Виробник: Intel
Description: RENEWAL FOR KR/CR (AN/LT) OPTION
Packaging: Electronic Delivery
Type: License
Description: RENEWAL FOR KR/CR (AN/LT) OPTION
Packaging: Electronic Delivery
Type: License
товар відсутній
| IP-ETH-ETILEHIP |
товар відсутній
| IP-ETH-HTILEHIP |
товар відсутній
| DK-SOC-10AS066S-E |
|
товар відсутній
| 1ST085ES1F50E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110ES1F50E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST085ES1F50E1VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST085ES1F50I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST085ES1F50E2LG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110ES1F50E1VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110ES1F50I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST085ES1F50I1VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110ES1F50E2LG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST085ES1F50I2LG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 841000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 71303168
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110ES1F50I1VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| 1ST110ES1F50I2LG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
товар відсутній
| FW21555AB |
|
Виробник: Intel
Description: 21555 - NON-TRANSPARENT PCI-TO-
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
Description: 21555 - NON-TRANSPARENT PCI-TO-
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
на замовлення 15605 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 2195.95 грн |
| RJ80530MZ001256 |
на замовлення 4368 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 1699.69 грн |
| 1SX250HH3F55I3VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH3F55E2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH3F55E1VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH3F55I2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SX250HH2F55E2VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SG250HH3F55E2LG |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SX250HH3F55E2LG |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2500K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| 1SG280HH3F55I2VG |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH2F55E2VG |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH2F55E2VGAS |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG280HH2F55E2VGS3 |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SG250HH3F55E3XG |
|
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 312500
Number of I/O: 1160
DigiKey Programmable: Not Verified
товар відсутній
| 1SX280HH2F55E2VGS3 |
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
товар відсутній
| AGIC035R39A2E2V |
Виробник: Intel
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товар відсутній