Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35276) > Сторінка 495 з 588
| Фото | Назва | Виробник | Інформація |
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SA605D/01,112 | NXP USA Inc. |
 Description: RF RCVR ASK/FSK 0HZ-500MHZ 20SOPackaging: Tube Features: RSSI Equipped Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 0Hz ~ 500MHz Modulation or Protocol: ASK, FSK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 8V Applications: FM Remote Receiver Current - Receiving: 5.7mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 20-SO Part Status: Obsolete |
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88W8997-A1-CBQE/AZ | NXP USA Inc. |
Description: 2X2 WAVE2 WIFI + BT Packaging: Tape & Reel (TR) Part Status: Active Package / Case: 161-BGA, WLCSP Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Protocol: 802.11ac, Bluetooth v5.1 Data Rate (Max): 2Mbps Supplier Device Package: 161-WLCSP RF Family/Standard: Bluetooth Serial Interfaces: PCM, SDIO, UART, USB |
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BUK9107-40ATC,118 | NXP USA Inc. |
Description: BUK9107-40ATC - D2PAK Packaging: Bulk Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V FET Feature: Temperature Sensing Diode Power Dissipation (Max): 272W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SOT-426 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±15V Drain to Source Voltage (Vdss): 40 V Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V |
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PCMF3HDMI14SZ | NXP USA Inc. |
Description: CMC Packaging: Bulk Part Status: Active Package / Case: 15-UFBGA, WLCSP Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 3Ohm, C = 0.25pF Height: 0.024" (0.60mm) Attenuation Value: 0.3dB @ 1MHz Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: LC Center / Cutoff Frequency: 6GHz (Cutoff) Resistance - Channel (Ohms): 3 ESD Protection: Yes Number of Channels: 3 |
на замовлення 4500 шт: термін постачання 21-31 дні (днів) |
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| XAUI-RISER-B | NXP USA Inc. |
Description: ETHERNET CARD PHY RISER P4080 Packaging: Bulk For Use With/Related Products: QorIQ™ Accessory Type: Interface Board Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| SPC5748CSK0AMKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
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| SPC5748GHK0AMMN6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA Packaging: Tray Package / Case: 324-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 324-MAPBGA (19x19) Part Status: Active Number of I/O: 246 DigiKey Programmable: Not Verified |
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SPC5748CK1MKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
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SPC5748CK1MMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
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SPC5748CBK0AVMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
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SPC5748CK1MKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
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PCF2123BS/1,512 | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR SPI 16HVQFN Packaging: Tube Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.6V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HVQFN (3x3) Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V Part Status: Discontinued at Digi-Key DigiKey Programmable: Not Verified |
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MC9RS08KB4CWJ | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 126 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Last Time Buy Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 7524 шт: термін постачання 21-31 дні (днів) |
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MC9RS08KB4CWJ | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 126 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Last Time Buy Number of I/O: 18 DigiKey Programmable: Not Verified |
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MWE6IC9100NBR1 | NXP USA Inc. |
Description: IC RF AMP GSM 960MHZ TO272WB Packaging: Bulk Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 960MHz RF Type: GSM, EDGE Voltage - Supply: 28V Gain: 33.5dB Supplier Device Package: TO-272 WB-14 Part Status: Obsolete |
на замовлення 465 шт: термін постачання 21-31 дні (днів) |
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MC9S12XDP512VAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
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MKE02Z32VQH4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 57 |
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MC33596FJER2 | NXP USA Inc. |
Description: UHF RECEIVER Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-LQFP (5x5) Part Status: Not For New Designs |
на замовлення 30000 шт: термін постачання 21-31 дні (днів) |
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%20Renders/768_32-VQFN%20Exposed%20Pad.jpg "MC33596FCAER2") |
MC33596FCAER2 | NXP USA Inc. |
Description: RF RX FSK/OOK 304/315/426 32QFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -20°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-QFN-EP (5x5) Part Status: Not For New Designs |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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74HC4017DB,112 | NXP USA Inc. |
Description: IC DECADE COUNTER 10BIT 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C (TA) Direction: Up Trigger Type: Positive, Negative Timing: Synchronous Supplier Device Package: 16-SSOP Part Status: Active Voltage - Supply: 2 V ~ 6 V Count Rate: 83 MHz Number of Bits per Element: 10 |
на замовлення 846 шт: термін постачання 21-31 дні (днів) |
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| P5CD012X0/T0B38170 | NXP USA Inc. |
Description: P5CD012X0/T0B38170 Packaging: Bulk Speed: 30MHz Program Memory Size: 200KB (200K x 8) RAM Size: 6K x 8 Operating Temperature: -25°C ~ 85°C Program Memory Type: ROM EEPROM Size: 12K x 8 Core Processor: Secure MX51 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V Connectivity: ISO 7816, ISO 14443, UART Part Status: Obsolete |
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MC908JL3ECPE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 28-PDIP Part Status: Obsolete Number of I/O: 23 DigiKey Programmable: Not Verified |
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FRDM-STBA-A8964 | NXP USA Inc. |
Description: DEV BOARD FXLS8964AF ACCEL Packaging: Bulk Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g Interface: I2C, Serial, SPI Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLS8964AF, K22 Supplied Contents: Board(s), Cable(s) Embedded: No Sensing Range: ±2g, 4g, 8g, 16g Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| LS1024ASN7MLA | NXP USA Inc. |
Description: LS1024 - QORIQ LAYERSCAPE 32-BIT Packaging: Bulk Part Status: Active |
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BUK962R1-40E,118 | NXP USA Inc. |
Description: MOSFET N-CH 40V 120A D2PAK Packaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V Power Dissipation (Max): 293W (Tc) Vgs(th) (Max) @ Id: 2.1V @ 1mA Supplier Device Package: D2PAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V |
на замовлення 3369 шт: термін постачання 21-31 дні (днів) |
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T1024NSE7MQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA Packaging: Bulk Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
на замовлення 1063 шт: термін постачання 21-31 дні (днів) |
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MMA8491QR1 | NXP USA Inc. |
Description: ACCELEROMETER 8G I2C 12QFN Packaging: Cut Tape (CT) Package / Case: 12-TQFN Exposed Pad Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±8G Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.5Hz ~ 400Hz Supplier Device Package: 12-QFN (3x3) Sensitivity (LSB/g): 1024 Part Status: Obsolete |
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MMA8452QR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C 16QFN Packaging: Tape & Reel (TR) Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode Package / Case: 16-VFQFN Output Type: I2C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.78Hz ~ 400Hz Supplier Device Package: 16-QFN (3x3) Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g) Part Status: Obsolete |
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MMA8491QR2 | NXP USA Inc. |
Description: ACCELEROMETER 8G I2C 12QFN Packaging: Cut Tape (CT) Package / Case: 12-TQFN Exposed Pad Output Type: I²C Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±8G Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.95V ~ 3.6V Bandwidth: 0.5Hz ~ 400Hz Supplier Device Package: 12-QFN (3x3) Sensitivity (LSB/g): 1024 Part Status: Obsolete |
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FXLS8964AFR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-16G 10DFN Packaging: Tape & Reel (TR) Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Package / Case: 10-VFDFN Output Type: I²C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Part Status: Active |
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| FRDM-KW019032,598 | NXP USA Inc. |
Description: FREEDOM BOARD FOR KW SERIES Packaging: Bulk For Use With/Related Products: KW0x Type: Transceiver; 802.15.4 Supplied Contents: Board(s), Cable(s) Part Status: Active |
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MCF54455VP266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
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| KCF52211CAE80 | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Part Status: Obsolete |
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MK11DX256AVMC5 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 348 шт: термін постачання 21-31 дні (днів) |
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74HC7030N,652 | NXP USA Inc. |
Description: IC FIFO ASYNC/SYNC 64X9 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Function: Asynchronous, Synchronous Memory Size: 576 (64 x 9) Operating Temperature: -40°C ~ 125°C Data Rate: 33MHz Access Time: 36ns Supplier Device Package: 28-DIP Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Part Status: Obsolete Voltage - Supply: 2 V ~ 6 V DigiKey Programmable: Not Verified |
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BC860BW,115 | NXP USA Inc. |
Description: NOW NEXPERIA BC860BW - SMALL SIG Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 200 mW Grade: Automotive Qualification: AEC-Q101 |
на замовлення 108370 шт: термін постачання 21-31 дні (днів) |
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| BF722,115 | NXP USA Inc. |
Description: TRANS NPN 250V 50MA SOT223 Packaging: Bulk Part Status: Active |
на замовлення 5766 шт: термін постачання 21-31 дні (днів) |
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MK50DX256ZCLL10 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 34x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
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LPC54605J256ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
товар відсутній |
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PCA9539D,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 24SO Packaging: Bulk Features: POR Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 18136 шт: термін постачання 21-31 дні (днів) |
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PCA9539D,112 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 24SO Packaging: Bulk Features: POR Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-SO Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74AUP1G885GD125 | NXP USA Inc. |
Description: XOR GATE Packaging: Bulk Package / Case: 8-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Configurable Multiple Function Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Schmitt Trigger Input: No Supplier Device Package: 8-XSON (2x3) Part Status: Active Number of Circuits: 1 |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| T2080NXN8P1B | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Bulk Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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| T2080NXN8P1B | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
товар відсутній |
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| T2080NXN8TTB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
товар відсутній |
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1PS70SB16,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOT323 Packaging: Bulk Part Status: Active |
на замовлення 320700 шт: термін постачання 21-31 дні (днів) |
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1PS70SB46,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA SOT323 Packaging: Bulk Part Status: Active |
на замовлення 418659 шт: термін постачання 21-31 дні (днів) |
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1PS70SB45,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA SOT323 Packaging: Bulk Part Status: Active |
на замовлення 366000 шт: термін постачання 21-31 дні (днів) |
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MPC5566MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 3MB (3M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Active Number of I/O: 256 DigiKey Programmable: Not Verified |
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QN9022/DY | NXP USA Inc. |
Description: IC RF TXRX BLUETOOTH 40VFQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 40-HVQFN (5x5) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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QN9022/DY | NXP USA Inc. |
Description: IC RF TXRX BLUETOOTH 40VFQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Power - Output: 4dBm Protocol: Bluetooth v4.0 Current - Receiving: 9.2mA Current - Transmitting: 8.8mA Supplier Device Package: 40-HVQFN (5x5) GPIO: 31 RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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IP4364CX8/LF/P,135 | NXP USA Inc. |
Description: IC FILTER/ESD PROT 3CH WLCSP8 Packaging: Bulk Part Status: Active |
на замовлення 50119 шт: термін постачання 21-31 дні (днів) |
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| LPC54S016JBD100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 2899 шт: термін постачання 21-31 дні (днів) |
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74LVC1G58GW/S901125 | NXP USA Inc. |
Description: 74LVC1G58GW - LOGIC CIRCUIT Packaging: Bulk Part Status: Active |
товар відсутній |
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PCA9550D,112 | NXP USA Inc. |
Description: IC LED DRVR LINEAR I2C 25MA 8SO Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 400kHz Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 8-SO Dimming: I²C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Part Status: Obsolete |
на замовлення 3925 шт: термін постачання 21-31 дні (днів) |
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MPC8265AVVPIBC | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete |
товар відсутній |
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MPC8314VRAGDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Active Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
на замовлення 335 шт: термін постачання 21-31 дні (днів) |
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MK22FX512VMD12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Not For New Designs Number of I/O: 100 DigiKey Programmable: Not Verified |
товар відсутній |
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TEF6640HW/V101518 | NXP USA Inc. |
Description: IC ONE-CHIP RADIO 64HTQFP Packaging: Bulk Part Status: Active |
на замовлення 161850 шт: термін постачання 21-31 дні (днів) |
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| SAF4000EL/101S23EK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
товар відсутній |
| SA605D/01,112 |
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Виробник: NXP USA Inc.
Description: RF RCVR ASK/FSK 0HZ-500MHZ 20SO
Packaging: Tube
Features: RSSI Equipped
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 0Hz ~ 500MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 8V
Applications: FM Remote Receiver
Current - Receiving: 5.7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: RF RCVR ASK/FSK 0HZ-500MHZ 20SO
Packaging: Tube
Features: RSSI Equipped
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 0Hz ~ 500MHz
Modulation or Protocol: ASK, FSK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 8V
Applications: FM Remote Receiver
Current - Receiving: 5.7mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 20-SO
Part Status: Obsolete
товар відсутній
| 88W8997-A1-CBQE/AZ |
|
Виробник: NXP USA Inc.
Description: 2X2 WAVE2 WIFI + BT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Description: 2X2 WAVE2 WIFI + BT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
товар відсутній
| BUK9107-40ATC,118 |
|
Виробник: NXP USA Inc.
Description: BUK9107-40ATC - D2PAK
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
Description: BUK9107-40ATC - D2PAK
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
товар відсутній
| PCMF3HDMI14SZ |
|
Виробник: NXP USA Inc.
Description: CMC
Packaging: Bulk
Part Status: Active
Package / Case: 15-UFBGA, WLCSP
Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 3Ohm, C = 0.25pF
Height: 0.024" (0.60mm)
Attenuation Value: 0.3dB @ 1MHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: LC
Center / Cutoff Frequency: 6GHz (Cutoff)
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Number of Channels: 3
Description: CMC
Packaging: Bulk
Part Status: Active
Package / Case: 15-UFBGA, WLCSP
Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 3Ohm, C = 0.25pF
Height: 0.024" (0.60mm)
Attenuation Value: 0.3dB @ 1MHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: LC
Center / Cutoff Frequency: 6GHz (Cutoff)
Resistance - Channel (Ohms): 3
ESD Protection: Yes
Number of Channels: 3
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 879+ | 23.63 грн |
| XAUI-RISER-B |
|
Виробник: NXP USA Inc.
Description: ETHERNET CARD PHY RISER P4080
Packaging: Bulk
For Use With/Related Products: QorIQ™
Accessory Type: Interface Board
Part Status: Active
Description: ETHERNET CARD PHY RISER P4080
Packaging: Bulk
For Use With/Related Products: QorIQ™
Accessory Type: Interface Board
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 144922.72 грн |
| SPC5748CSK0AMKU6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| SPC5748GHK0AMMN6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tray
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
товар відсутній
| SPC5748CK1MKU6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| SPC5748CK1MMJ6R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| SPC5748CBK0AVMJ6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
| SPC5748CK1MKU6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
товар відсутній
| PCF2123BS/1,512 |
|
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR SPI 16HVQFN
Packaging: Tube
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HVQFN (3x3)
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
товар відсутній
| MC9RS08KB4CWJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Last Time Buy
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Last Time Buy
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 7524 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 189+ | 201.48 грн |
| MC9RS08KB4CWJ |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Last Time Buy
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Last Time Buy
Number of I/O: 18
DigiKey Programmable: Not Verified
товар відсутній
| MWE6IC9100NBR1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Bulk
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Bulk
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
на замовлення 465 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 5202.75 грн |
| MC9S12XDP512VAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
| MKE02Z32VQH4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
товар відсутній
| MC33596FJER2 |
|
Виробник: NXP USA Inc.
Description: UHF RECEIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Not For New Designs
Description: UHF RECEIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Not For New Designs
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 145+ | 263.82 грн |
| MC33596FCAER2 |
|
Виробник: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Not For New Designs
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Not For New Designs
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 150+ | 253.94 грн |
| 74HC4017DB,112 |
|
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
Description: IC DECADE COUNTER 10BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
на замовлення 846 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 846+ | 28.68 грн |
| P5CD012X0/T0B38170 |
Виробник: NXP USA Inc.
Description: P5CD012X0/T0B38170
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 6K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 12K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
Description: P5CD012X0/T0B38170
Packaging: Bulk
Speed: 30MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 6K x 8
Operating Temperature: -25°C ~ 85°C
Program Memory Type: ROM
EEPROM Size: 12K x 8
Core Processor: Secure MX51
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.5V
Connectivity: ISO 7816, ISO 14443, UART
Part Status: Obsolete
товар відсутній
| MC908JL3ECPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
товар відсутній
| FRDM-STBA-A8964 |
|
Виробник: NXP USA Inc.
Description: DEV BOARD FXLS8964AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8964AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
Description: DEV BOARD FXLS8964AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8964AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6291.5 грн |
| LS1024ASN7MLA |
|
Виробник: NXP USA Inc.
Description: LS1024 - QORIQ LAYERSCAPE 32-BIT
Packaging: Bulk
Part Status: Active
Description: LS1024 - QORIQ LAYERSCAPE 32-BIT
Packaging: Bulk
Part Status: Active
товар відсутній
| BUK962R1-40E,118 |
|
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V
Description: MOSFET N-CH 40V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 87.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 13160 pF @ 25 V
на замовлення 3369 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 303+ | 71.39 грн |
| T1024NSE7MQA |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
на замовлення 1063 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7146.08 грн |
| MMA8491QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 8G I2C 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-TQFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±8G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.5Hz ~ 400Hz
Supplier Device Package: 12-QFN (3x3)
Sensitivity (LSB/g): 1024
Part Status: Obsolete
Description: ACCELEROMETER 8G I2C 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-TQFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±8G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.5Hz ~ 400Hz
Supplier Device Package: 12-QFN (3x3)
Sensitivity (LSB/g): 1024
Part Status: Obsolete
товар відсутній
| MMA8452QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
Description: ACCELEROMETER 2-8G I2C 16QFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
Package / Case: 16-VFQFN
Output Type: I2C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.78Hz ~ 400Hz
Supplier Device Package: 16-QFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 256 (±8g)
Part Status: Obsolete
товар відсутній
| MMA8491QR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 8G I2C 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-TQFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±8G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.5Hz ~ 400Hz
Supplier Device Package: 12-QFN (3x3)
Sensitivity (LSB/g): 1024
Part Status: Obsolete
Description: ACCELEROMETER 8G I2C 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-TQFN Exposed Pad
Output Type: I²C
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±8G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 0.5Hz ~ 400Hz
Supplier Device Package: 12-QFN (3x3)
Sensitivity (LSB/g): 1024
Part Status: Obsolete
товар відсутній
| FXLS8964AFR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I²C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
товар відсутній
| FRDM-KW019032,598 |
Виробник: NXP USA Inc.
Description: FREEDOM BOARD FOR KW SERIES
Packaging: Bulk
For Use With/Related Products: KW0x
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Description: FREEDOM BOARD FOR KW SERIES
Packaging: Bulk
For Use With/Related Products: KW0x
Type: Transceiver; 802.15.4
Supplied Contents: Board(s), Cable(s)
Part Status: Active
товар відсутній
| MCF54455VP266 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
товар відсутній
| KCF52211CAE80 |
товар відсутній
| MK11DX256AVMC5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 348 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1035.53 грн |
| 10+ | 783.25 грн |
| 80+ | 648.43 грн |
| 74HC7030N,652 |
|
Виробник: NXP USA Inc.
Description: IC FIFO ASYNC/SYNC 64X9 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Asynchronous, Synchronous
Memory Size: 576 (64 x 9)
Operating Temperature: -40°C ~ 125°C
Data Rate: 33MHz
Access Time: 36ns
Supplier Device Package: 28-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
Description: IC FIFO ASYNC/SYNC 64X9 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Asynchronous, Synchronous
Memory Size: 576 (64 x 9)
Operating Temperature: -40°C ~ 125°C
Data Rate: 33MHz
Access Time: 36ns
Supplier Device Package: 28-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
товар відсутній
| BC860BW,115 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BC860BW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Grade: Automotive
Qualification: AEC-Q101
Description: NOW NEXPERIA BC860BW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Grade: Automotive
Qualification: AEC-Q101
на замовлення 108370 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 13172+ | 1.4 грн |
| BF722,115 |
|
на замовлення 5766 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2556+ | 8.4 грн |
| MK50DX256ZCLL10 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
| LPC54605J256ET100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| PCA9539D,118 |
|
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 18136 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 575+ | 66.15 грн |
| PCA9539D,112 |
|
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 24SO
Packaging: Bulk
Features: POR
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 575+ | 66.15 грн |
| 74AUP1G885GD125 |
|
Виробник: NXP USA Inc.
Description: XOR GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 1
Description: XOR GATE
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 1
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1567+ | 13.3 грн |
| T2080NXN8P1B |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29913.33 грн |
| T2080NXN8P1B |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товар відсутній
| T2080NXN8TTB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товар відсутній
| 1PS70SB16,115 |
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 200MA SOT323
Packaging: Bulk
Part Status: Active
Description: DIODE SCHOTTKY 30V 200MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 320700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9982+ | 2.14 грн |
| 1PS70SB46,115 |
|
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 418659 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10051+ | 2.28 грн |
| 1PS70SB45,115 |
|
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Bulk
Part Status: Active
на замовлення 366000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10051+ | 2.28 грн |
| MPC5566MZP132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| QN9022/DY |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3000+ | 193.47 грн |
| QN9022/DY |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX BLUETOOTH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 40-HVQFN (5x5)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| IP4364CX8/LF/P,135 |
|
на замовлення 50119 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3206+ | 6.84 грн |
| LPC54S016JBD100 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 2899 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 82+ | 466.83 грн |
| PCA9550D,112 |
|
Виробник: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
на замовлення 3925 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 357+ | 63.87 грн |
| MPC8265AVVPIBC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8314VRAGDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
на замовлення 335 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4412.03 грн |
| 10+ | 3470.5 грн |
| 108+ | 3134.62 грн |
| MK22FX512VMD12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Not For New Designs
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
| TEF6640HW/V101518 |
на замовлення 161850 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 39+ | 565.37 грн |
| SAF4000EL/101S23EK |
товар відсутній