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74HCT132D-Q100,118 74HCT132D-Q100,118 NXP USA Inc. PHGLS25305-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND SCHMIT 4CH 2IN 14SO
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2340 шт:
термін постачання 21-31 дні (днів)
2340+11.18 грн
Мінімальне замовлення: 2340
BUK7620-100A,118 NXP USA Inc. Description: MOSFET N-CH 100V 63A D2PAK
Packaging: Bulk
Part Status: Active
на замовлення 21494 шт:
термін постачання 21-31 дні (днів)
485+44.55 грн
Мінімальне замовлення: 485
BSC9131NXE1KHKB BSC9131NXE1KHKB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
KIT50XS4200EKEVB NXP USA Inc. KT50XS4200UG.pdf Description: EVALUATION KIT - MC50XS4200 DUA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
товар відсутній
T1022NSE7PQB T1022NSE7PQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товар відсутній
SA56004AD,118 SA56004AD,118 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
товар відсутній
SA56004ED,118 SA56004ED,118 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
товар відсутній
SA56004CD,112 SA56004CD,112 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
товар відсутній
SA56004FD,112 SA56004FD,112 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
товар відсутній
MCIMX253CJM4A MCIMX253CJM4A NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Active
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART
на замовлення 449 шт:
термін постачання 21-31 дні (днів)
1+1633.28 грн
10+ 1261.46 грн
80+ 1077.18 грн
MCIMX253DJM4 MCIMX253DJM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
товар відсутній
MCIMX253CJM4 MCIMX253CJM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
товар відсутній
MCIMX253CVM4 MCIMX253CVM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
товар відсутній
P3T1085UK-ARD P3T1085UK-ARD NXP USA Inc. UM11766.pdf Description: P3T1085UK ARD SHIELD EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1085UK
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+7732.23 грн
P3T1085UKAZ NXP USA Inc. Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Part Status: Active
Features: Shutdown Mode
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
товар відсутній
P3T1085UKZ NXP USA Inc. P3T1085UK.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Part Status: Active
Features: Shutdown Mode
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
товар відсутній
TDA8035HN/C1,151 TDA8035HN/C1,151 NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 344 шт:
термін постачання 21-31 дні (днів)
4+98.82 грн
10+ 84.82 грн
25+ 80.54 грн
80+ 62.07 грн
230+ 58.02 грн
Мінімальне замовлення: 4
TDA8035HN/C1,118 TDA8035HN/C1,118 NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 11321 шт:
термін постачання 21-31 дні (днів)
4+98.82 грн
10+ 84.82 грн
25+ 80.54 грн
100+ 62.06 грн
250+ 58.02 грн
500+ 51.27 грн
1000+ 39.81 грн
2500+ 37.16 грн
Мінімальне замовлення: 4
TDA8029HL/C207151 TDA8029HL/C207151 NXP USA Inc. Description: MICROCONTROLLER, 8 BIT, 8051 CPU
Packaging: Bulk
Part Status: Active
товар відсутній
TDA8023TT/C1 TDA8023TT/C1 NXP USA Inc. TDA8023.pdf Description: IC SMART CARD INTERFACE 28-TSSOP
Packaging: Bulk
Part Status: Active
товар відсутній
NTSX2102TLH NTSX2102TLH NXP USA Inc. NTSX2102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
товар відсутній
NTSX2102TLH NTSX2102TLH NXP USA Inc. NTSX2102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 2916 шт:
термін постачання 21-31 дні (днів)
5+66.14 грн
10+ 56.72 грн
25+ 53.86 грн
100+ 41.51 грн
250+ 38.81 грн
500+ 34.29 грн
1000+ 26.63 грн
Мінімальне замовлення: 5
NTS0101GM,115 NTS0101GM,115 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
NTS0101GM,115 NTS0101GM,115 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
LPC2368FBD100,518 NXP USA Inc. LPC2364_65_66_67_68.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 100-LQFP (14x14)
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7TDMI-S
Data Converters: A/D 6x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 70
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
товар відсутній
TJA1021TK/20/S1Z TJA1021TK/20/S1Z NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MPF5030BMDA0ES NXP USA Inc. PF5030_SDS.pdf Description: POWER MANAGEMENT IC, S32, NON-PR
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Voltage - Supply: 3.3V ~ 5.25V
на замовлення 433 шт:
термін постачання 21-31 дні (днів)
1+427.19 грн
10+ 375.25 грн
25+ 368.09 грн
40+ 342.93 грн
80+ 307.7 грн
230+ 306.55 грн
DSC-MULTILINK DSC-MULTILINK NXP USA Inc. DSCMLTECHSUM.pdf Description: DSC MULTILINK
Packaging: Box
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
товар відсутній
PCA9411AUKZ PCA9411AUKZ NXP USA Inc. PCA9411.pdf Description: IC REG BOOST 5.25V 500MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.25V
Part Status: Active
товар відсутній
NX1WP10Z NXP USA Inc. NX1WP10_DS.pdf Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Wireless Power Receiver
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
товар відсутній
BB131 NXP USA Inc. Description: VARIABLE CAPACITANCE DIODE, VERY
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-323
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16
на замовлення 547000 шт:
термін постачання 21-31 дні (днів)
3572+10.89 грн
Мінімальне замовлення: 3572
KW45B41Z82AFTBR KW45B41Z82AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z52AFTBT KW45B41Z52AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z82AFTBT KW45B41Z82AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z52AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFTBR KW45B41Z83AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z82AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z53AFTBR KW45B41Z53AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z53AFTBT KW45B41Z53AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z82AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFTBT KW45B41Z83AFTBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z52AFTBR KW45B41Z52AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z53AFPBT NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z-EVK NXP USA Inc. KW45.pdf Description: KW45B41Z-EVK
Packaging: Bulk
Part Status: Active
Frequency: 2.4GHz
For Use With/Related Products: KW45B41Z
Type: Transceiver; Bluetooth® 5.x (BLE)
товар відсутній
MD7IC2755GNR1 MD7IC2755GNR1 NXP USA Inc. MD7IC2755N.pdf Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 25dB
Current - Supply: 275mA
P1dB: 44.8dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Obsolete
товар відсутній
MPC8255AVVMHBB MPC8255AVVMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
MK11DX128VMC5 MK11DX128VMC5 NXP USA Inc. KNTSK1XFMLYFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
SP5748CBK0AVKU2R SP5748CBK0AVKU2R NXP USA Inc. Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
товар відсутній
MCIMX6L8DVN10AC MCIMX6L8DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
товар відсутній
MCIMX6L8DVN10ACR MCIMX6L8DVN10ACR NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
товар відсутній
MHT1005HSR3 NXP USA Inc. Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товар відсутній
MHT1005HSR3 NXP USA Inc. Description: IC LDMOS TRANS 120V NI-780S
Packaging: Bulk
Part Status: Obsolete
на замовлення 1750 шт:
термін постачання 21-31 дні (днів)
38+1050.47 грн
Мінімальне замовлення: 38
TEF7094AHN/V205Y NXP USA Inc. Description: TEF7094AHN
Packaging: Tape & Reel (TR)
Part Status: Active
товар відсутній
BSC9131NJE1HHHB BSC9131NJE1HHHB NXP USA Inc. Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
MK10DX64VFM5 MK10DX64VFM5 NXP USA Inc. K10P32M50SF0.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
товар відсутній
SSL1523P/N2,112 SSL1523P/N2,112 NXP USA Inc. SSL152X.pdf Description: IC LED DRIVER OFFL 2A 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 10kHz ~ 200kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 145°C (TJ)
Applications: Lighting
Current - Output / Channel: 2A
Internal Switch(s): Yes
Topology: Flyback
Supplier Device Package: 8-DIP
Voltage - Supply (Min): 80V
Voltage - Supply (Max): 276V
Part Status: Obsolete
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)
311+75.48 грн
Мінімальне замовлення: 311
X-PLUTUS-FAMPC16 NXP USA Inc. Description: PLUTUS-FAMPC16
Packaging: Bulk
Part Status: Obsolete
товар відсутній
N74F04D,623 N74F04D,623 NXP USA Inc. N74F04.pdf Description: IC INVERTR HEX COMM 6.9MA 14SOIC
Packaging: Bulk
Part Status: Active
на замовлення 70395 шт:
термін постачання 21-31 дні (днів)
2664+7.69 грн
Мінімальне замовлення: 2664
74HCT132D-Q100,118 PHGLS25305-1.pdf?t.download=true&u=5oefqw
74HCT132D-Q100,118
Виробник: NXP USA Inc.
Description: IC GATE NAND SCHMIT 4CH 2IN 14SO
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2340 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2340+11.18 грн
Мінімальне замовлення: 2340
BUK7620-100A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 63A D2PAK
Packaging: Bulk
Part Status: Active
на замовлення 21494 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
485+44.55 грн
Мінімальне замовлення: 485
BSC9131NXE1KHKB BSC9131.pdf
BSC9131NXE1KHKB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
KIT50XS4200EKEVB KT50XS4200UG.pdf
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC50XS4200 DUA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
товар відсутній
T1022NSE7PQB T1FAMILYFS.pdf
T1022NSE7PQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
товар відсутній
SA56004AD,118 SA56004X.pdf
SA56004AD,118
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
товар відсутній
SA56004ED,118 SA56004X.pdf
SA56004ED,118
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Active
товар відсутній
SA56004CD,112 SA56004X.pdf
SA56004CD,112
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
товар відсутній
SA56004FD,112 SA56004X.pdf
SA56004FD,112
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
товар відсутній
MCIMX253CJM4A IMX25CEC.pdf
MCIMX253CJM4A
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Active
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPI, SSI, SSP, UART
на замовлення 449 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1633.28 грн
10+ 1261.46 грн
80+ 1077.18 грн
MCIMX253DJM4 IMX25CEC.pdf
MCIMX253DJM4
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
товар відсутній
MCIMX253CJM4 IMX25CEC.pdf
MCIMX253CJM4
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
товар відсутній
MCIMX253CVM4 IMX25CEC.pdf
MCIMX253CVM4
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Part Status: Obsolete
товар відсутній
P3T1085UK-ARD UM11766.pdf
P3T1085UK-ARD
Виробник: NXP USA Inc.
Description: P3T1085UK ARD SHIELD EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1085UK
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+7732.23 грн
P3T1085UKAZ
Виробник: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Part Status: Active
Features: Shutdown Mode
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
товар відсутній
P3T1085UKZ P3T1085UK.pdf
Виробник: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Part Status: Active
Features: Shutdown Mode
Package / Case: 6-XFBGA, WLCSP
Output Type: 2-Wire Serial, I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 6-WLCSP (1.18x.84)
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
товар відсутній
TDA8035HN/C1,151 TDA8035.pdf
TDA8035HN/C1,151
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 344 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+98.82 грн
10+ 84.82 грн
25+ 80.54 грн
80+ 62.07 грн
230+ 58.02 грн
Мінімальне замовлення: 4
TDA8035HN/C1,118 TDA8035.pdf
TDA8035HN/C1,118
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
на замовлення 11321 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+98.82 грн
10+ 84.82 грн
25+ 80.54 грн
100+ 62.06 грн
250+ 58.02 грн
500+ 51.27 грн
1000+ 39.81 грн
2500+ 37.16 грн
Мінімальне замовлення: 4
TDA8029HL/C207151
TDA8029HL/C207151
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, 8051 CPU
Packaging: Bulk
Part Status: Active
товар відсутній
TDA8023TT/C1 TDA8023.pdf
TDA8023TT/C1
Виробник: NXP USA Inc.
Description: IC SMART CARD INTERFACE 28-TSSOP
Packaging: Bulk
Part Status: Active
товар відсутній
NTSX2102TLH NTSX2102.pdf
NTSX2102TLH
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
товар відсутній
NTSX2102TLH NTSX2102.pdf
NTSX2102TLH
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 5.5 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
на замовлення 2916 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+66.14 грн
10+ 56.72 грн
25+ 53.86 грн
100+ 41.51 грн
250+ 38.81 грн
500+ 34.29 грн
1000+ 26.63 грн
Мінімальне замовлення: 5
NTS0101GM,115 NTS0101.pdf
NTS0101GM,115
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
NTS0101GM,115 NTS0101.pdf
NTS0101GM,115
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
LPC2368FBD100,518 LPC2364_65_66_67_68.pdf
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 100-LQFP (14x14)
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7TDMI-S
Data Converters: A/D 6x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 70
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
товар відсутній
TJA1021TK/20/S1Z TJA1021.pdf
TJA1021TK/20/S1Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MPF5030BMDA0ES PF5030_SDS.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, S32, NON-PR
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Voltage - Supply: 3.3V ~ 5.25V
на замовлення 433 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+427.19 грн
10+ 375.25 грн
25+ 368.09 грн
40+ 342.93 грн
80+ 307.7 грн
230+ 306.55 грн
DSC-MULTILINK DSCMLTECHSUM.pdf
DSC-MULTILINK
Виробник: NXP USA Inc.
Description: DSC MULTILINK
Packaging: Box
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
товар відсутній
PCA9411AUKZ PCA9411.pdf
PCA9411AUKZ
Виробник: NXP USA Inc.
Description: IC REG BOOST 5.25V 500MA 9WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-UFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 500mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 3MHz
Voltage - Input (Max): 5.25V
Topology: Boost
Supplier Device Package: 9-WLCSP (1.24x1.24)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 5.25V
Part Status: Active
товар відсутній
NX1WP10Z NX1WP10_DS.pdf
Виробник: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Wireless Power Receiver
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
товар відсутній
BB131
Виробник: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE, VERY
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio Condition: C0.5/C28
Supplier Device Package: SOD-323
Part Status: Active
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 16
на замовлення 547000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3572+10.89 грн
Мінімальне замовлення: 3572
KW45B41Z82AFTBR KW45.pdf
KW45B41Z82AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFPBT KW45.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z52AFTBT KW45.pdf
KW45B41Z52AFTBT
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z82AFTBT KW45.pdf
KW45B41Z82AFTBT
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z52AFPBT KW45.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFTBR KW45.pdf
KW45B41Z83AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFPBR KW45.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z82AFPBR KW45.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z53AFTBR KW45.pdf
KW45B41Z53AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z53AFTBT KW45.pdf
KW45B41Z53AFTBT
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z82AFPBT KW45.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z83AFTBT KW45.pdf
KW45B41Z83AFTBT
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
товар відсутній
KW45B41Z52AFTBR KW45.pdf
KW45B41Z52AFTBR
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z53AFPBT KW45.pdf
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tray
Part Status: Active
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Data Rate (Max): 2Mbps
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, PWM, SPI, UART
Current - Receiving: 4.1mA ~ 10.01mA
Current - Transmitting: 4.6mA ~ 22.4mA
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
KW45B41Z-EVK KW45.pdf
Виробник: NXP USA Inc.
Description: KW45B41Z-EVK
Packaging: Bulk
Part Status: Active
Frequency: 2.4GHz
For Use With/Related Products: KW45B41Z
Type: Transceiver; Bluetooth® 5.x (BLE)
товар відсутній
MD7IC2755GNR1 MD7IC2755N.pdf
MD7IC2755GNR1
Виробник: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 25dB
Current - Supply: 275mA
P1dB: 44.8dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-270 WB-14 GULL
Part Status: Obsolete
товар відсутній
MPC8255AVVMHBB MPC8260A.pdf
MPC8255AVVMHBB
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
MK11DX128VMC5 KNTSK1XFMLYFS.pdf
MK11DX128VMC5
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
SP5748CBK0AVKU2R
SP5748CBK0AVKU2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
товар відсутній
MCIMX6L8DVN10AC IMX6SLCEC.pdf
MCIMX6L8DVN10AC
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
товар відсутній
MCIMX6L8DVN10ACR IMX6SLCEC.pdf
MCIMX6L8DVN10ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
товар відсутній
MHT1005HSR3
Виробник: NXP USA Inc.
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Tape & Reel (TR)
Part Status: Obsolete
товар відсутній
MHT1005HSR3
Виробник: NXP USA Inc.
Description: IC LDMOS TRANS 120V NI-780S
Packaging: Bulk
Part Status: Obsolete
на замовлення 1750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
38+1050.47 грн
Мінімальне замовлення: 38
TEF7094AHN/V205Y
Виробник: NXP USA Inc.
Description: TEF7094AHN
Packaging: Tape & Reel (TR)
Part Status: Active
товар відсутній
BSC9131NJE1HHHB
BSC9131NJE1HHHB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
MK10DX64VFM5 K10P32M50SF0.pdf
MK10DX64VFM5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
товар відсутній
SSL1523P/N2,112 SSL152X.pdf
SSL1523P/N2,112
Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL 2A 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 10kHz ~ 200kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 145°C (TJ)
Applications: Lighting
Current - Output / Channel: 2A
Internal Switch(s): Yes
Topology: Flyback
Supplier Device Package: 8-DIP
Voltage - Supply (Min): 80V
Voltage - Supply (Max): 276V
Part Status: Obsolete
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
311+75.48 грн
Мінімальне замовлення: 311
X-PLUTUS-FAMPC16
Виробник: NXP USA Inc.
Description: PLUTUS-FAMPC16
Packaging: Bulk
Part Status: Obsolete
товар відсутній
N74F04D,623 N74F04.pdf
N74F04D,623
Виробник: NXP USA Inc.
Description: IC INVERTR HEX COMM 6.9MA 14SOIC
Packaging: Bulk
Part Status: Active
на замовлення 70395 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2664+7.69 грн
Мінімальне замовлення: 2664
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