Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35278) > Сторінка 484 з 588
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
JN5148/Z01,515 | NXP USA Inc. |
 Description: IC RF TXRX+MCU 802.15.4 56HVQFNPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Sensitivity: -96.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB ROM, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.75dBm Protocol: Zigbee® Current - Receiving: 17.5mA Data Rate (Max): 667kbps Current - Transmitting: 15mA Supplier Device Package: 56-HVQFN (8x8) GPIO: 21 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||
| NCF2961VHN3/0200EY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
товар відсутній |
||||||||||||||||
 |
MKL36Z256VMP4 | NXP USA Inc. |
Description: KINETIS KL36: 48MHZ CORTEX-M0+ U |
товар відсутній |
|||||||||||||||
 |
S912ZVHY32F1VLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP |
товар відсутній |
|||||||||||||||
 |
S9S12HY32J0CLH557 | NXP USA Inc. |
Description: 16-BIT MCU, S12 CORE, 32KB FLASH |
товар відсутній |
|||||||||||||||
 |
S9S12HY32J0VLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP |
товар відсутній |
|||||||||||||||
 |
S912ZVHY32F1CLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 4x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 73 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||
 |
S9S12HY32J0CLHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||
 |
S912ZVHY32F1VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFP |
товар відсутній |
|||||||||||||||
| SL3S1205FUD2/HAA | NXP USA Inc. |
Description: UCODE Packaging: Tape & Reel (TR) Package / Case: Die Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: Wafer |
товар відсутній |
||||||||||||||||
 |
BGU7258X | NXP USA Inc. |
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 5GHz ~ 6GHz RF Type: ISM Voltage - Supply: 3V ~ 3.6V Gain: 14dB Current - Supply: 13mA Noise Figure: 1.6dB Test Frequency: 6GHz Supplier Device Package: 6-HXSON (1.6x1.6) |
на замовлення 18117 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| BGU7051118 | NXP USA Inc. | Description: IC AMP LNA FOR WIRELESS 10HVSON |
товар відсутній |
||||||||||||||||
 |
BGU7045115 | NXP USA Inc. |
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP |
товар відсутній |
|||||||||||||||
 |
BGU7063,518 | NXP USA Inc. |
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.92GHz ~ 1.98GHz RF Type: Cellular Voltage - Supply: 4.75V ~ 5.25V Gain: 37.5dB Current - Supply: 230mA Noise Figure: 0.9dB P1dB: -12.5dBm Test Frequency: 1.95GHz Supplier Device Package: 16-HLQFN (8x8) |
товар відсутній |
|||||||||||||||
| MKW21D256VHA5 | NXP USA Inc. |
Description: KINETIS KW21D: 802.15.4 WIRELESS |
товар відсутній |
||||||||||||||||
| ASL9115FHNZ | NXP USA Inc. | Description: IC LED DRIVER 36HVQFN |
товар відсутній |
||||||||||||||||
| ASL5115FHNZ | NXP USA Inc. |
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 36-HVQFN (6x6) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Part Status: Active |
товар відсутній |
||||||||||||||||
 |
PESD5V0L1USF,315 | NXP USA Inc. |
Description: NOW NEXPERIA PESD5V0L1USF - TRAN Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 12pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.2A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DSN0603-2 Unidirectional Channels: 1 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 10.5V Power - Peak Pulse: 11W Power Line Protection: No Part Status: Active |
на замовлення 11762273 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
LPC1812JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
товар відсутній |
|||||||||||||||
 |
74LVC1G27GF,132 | NXP USA Inc. |
Description: IC GATE NOR 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 3 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
на замовлення 169560 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
74AUP1Z04GF132 | NXP USA Inc. |
Description: NOW NEXPERIA 74AUP1Z04GF - BUS D |
на замовлення 89970 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
74LVC1G38GF132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1G38GF - NAND |
на замовлення 75000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
74AUP1G06GF,132-NXP | NXP USA Inc. | Description: IC INVERTER OD 1CH 1-INP 6XSON |
товар відсутній |
|||||||||||||||
|
|
74AUP1G58GF,132-NXP | NXP USA Inc. | Description: LOGIC CIRCUIT, CMOS, PDSO6 |
товар відсутній |
|||||||||||||||
 |
NTS0101GF,132 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 6-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-XSON, SOT891 (1x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
товар відсутній |
|||||||||||||||
|
|
NTS0101GF,132 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 6-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-XSON, SOT891 (1x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
товар відсутній |
|||||||||||||||
 |
74AUP1G11GF,132 | NXP USA Inc. |
Description: IC GATE AND 1CH 3-INP 6-XSON |
на замовлення 8383 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
SL2S2602FTBX | NXP USA Inc. |
Description: ICODE Packaging: Tape & Reel (TR) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: ISO 15693 Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 1.3V Standards: ISO 15693, ISO 18000-3 Supplier Device Package: 3-XSON (1x1.45) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| SL2S1502FTBX | NXP USA Inc. |
Description: ICODE ILT Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 15693, ISO 18000-3 Supplier Device Package: Wafer Part Status: Active |
товар відсутній |
||||||||||||||||
| SL2S2602FUD/BGZ | NXP USA Inc. | Description: IC RFID TRANSP 13.56MHZ WAFER |
товар відсутній |
||||||||||||||||
 |
MCZ33905DD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP Part Status: Active |
товар відсутній |
|||||||||||||||
 |
MCZ33905DS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP Part Status: Active |
товар відсутній |
|||||||||||||||
|
|
MCZ33905DD3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
товар відсутній |
|||||||||||||||
 |
MCZ33905S5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
товар відсутній |
|||||||||||||||
|
|
MCZ33905BS5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
товар відсутній |
|||||||||||||||
| MW7IC2220NBR1 | NXP USA Inc. |
Description: NARROW BAND HIGH POWER AMPLIFIER Packaging: Bulk |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
 |
FS32K142HFT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
товар відсутній |
|||||||||||||||
|
|
FS32K142HFT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 577 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
CBTL05023BS,118 | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TA) Applications: Thunderbolt -3db Bandwidth: 5GHz Supplier Device Package: 24-HVQFN (3x3) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Obsolete Number of Channels: 2 |
товар відсутній |
|||||||||||||||
|
|
CBTL05023BS,118 | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TA) Applications: Thunderbolt -3db Bandwidth: 5GHz Supplier Device Package: 24-HVQFN (3x3) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Obsolete Number of Channels: 2 |
товар відсутній |
|||||||||||||||
 |
PZU30BA115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
товар відсутній |
|||||||||||||||
|
|
PZU3.0BA115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
товар відсутній |
|||||||||||||||
 |
PEMI2QFN/CR,115 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/21PF SMD Packaging: Bulk Package / Case: 6-XFDFN Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 21pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 14dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 2 |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
74AVC16T245EV/G518 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES |
на замовлення 1985 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
74AVCH16T245DGV112 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES Packaging: Bulk Part Status: Active |
на замовлення 5956 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
74AVC16T245DGV-Q100118 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES |
товар відсутній |
|||||||||||||||
 |
74AVCH16T245DGG118 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES |
товар відсутній |
|||||||||||||||
|
|
74AVCH16T245EV,518 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 56VFBGA |
на замовлення 26441 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
S912XEG128J2CAL | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 112LQFP |
товар відсутній |
|||||||||||||||
 |
MPC885VR66-NXP | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Part Status: Active Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 264 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| OM13502UL | NXP USA Inc. |
Description: PCF2117 LCD DEMO BOARD |
товар відсутній |
||||||||||||||||
 |
BZX100A115 | NXP USA Inc. |
Description: DIODE ZENER SINGLE |
товар відсутній |
|||||||||||||||
 |
MC9S08AC60MPUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||
 |
MC9S08AC60MFGE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
товар відсутній |
|||||||||||||||
 |
MC68360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Packaging: Bulk Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MC68360AI25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP |
товар відсутній |
|||||||||||||||
 |
MC68360ZQ33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA |
товар відсутній |
|||||||||||||||
 |
ON5520215 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET |
товар відсутній |
|||||||||||||||
| ON5275/C1135 | NXP USA Inc. | Description: MOSFET RF, SOT223 |
товар відсутній |
||||||||||||||||
| ON5087115 | NXP USA Inc. | Description: RF SMALL SIGNAL TRANSISTOR BIPOL |
товар відсутній |
| JN5148/Z01,515 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| NCF2961VHN3/0200EY |
товар відсутній
| S9S12HY32J0CLH557 |
|
Виробник: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 32KB FLASH
Description: 16-BIT MCU, S12 CORE, 32KB FLASH
товар відсутній
| S912ZVHY32F1CLL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
товар відсутній
| S9S12HY32J0CLHR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
товар відсутній
| SL3S1205FUD2/HAA |
Виробник: NXP USA Inc.
Description: UCODE
Packaging: Tape & Reel (TR)
Package / Case: Die
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Description: UCODE
Packaging: Tape & Reel (TR)
Package / Case: Die
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
товар відсутній
| BGU7258X |
|
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 14dB
Current - Supply: 13mA
Noise Figure: 1.6dB
Test Frequency: 6GHz
Supplier Device Package: 6-HXSON (1.6x1.6)
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 14dB
Current - Supply: 13mA
Noise Figure: 1.6dB
Test Frequency: 6GHz
Supplier Device Package: 6-HXSON (1.6x1.6)
на замовлення 18117 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 40.3 грн |
| 10+ | 34.19 грн |
| 25+ | 30.93 грн |
| 100+ | 25.37 грн |
| 250+ | 22.27 грн |
| 500+ | 19.68 грн |
| 1000+ | 15.28 грн |
| BGU7063,518 |
|
Виробник: NXP USA Inc.
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.92GHz ~ 1.98GHz
RF Type: Cellular
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37.5dB
Current - Supply: 230mA
Noise Figure: 0.9dB
P1dB: -12.5dBm
Test Frequency: 1.95GHz
Supplier Device Package: 16-HLQFN (8x8)
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.92GHz ~ 1.98GHz
RF Type: Cellular
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37.5dB
Current - Supply: 230mA
Noise Figure: 0.9dB
P1dB: -12.5dBm
Test Frequency: 1.95GHz
Supplier Device Package: 16-HLQFN (8x8)
товар відсутній
| ASL5115FHNZ |
|
Виробник: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
товар відсутній
| PESD5V0L1USF,315 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PESD5V0L1USF - TRAN
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 12pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 11W
Power Line Protection: No
Part Status: Active
Description: NOW NEXPERIA PESD5V0L1USF - TRAN
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 12pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 11W
Power Line Protection: No
Part Status: Active
на замовлення 11762273 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5052+ | 4.56 грн |
| LPC1812JBD144551 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
товар відсутній
| 74LVC1G27GF,132 |
|
Виробник: NXP USA Inc.
Description: IC GATE NOR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC GATE NOR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
на замовлення 169560 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3909+ | 5.67 грн |
| 74AUP1Z04GF132 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1Z04GF - BUS D
Description: NOW NEXPERIA 74AUP1Z04GF - BUS D
на замовлення 89970 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1797+ | 12.18 грн |
| 74LVC1G38GF132 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G38GF - NAND
Description: NOW NEXPERIA 74LVC1G38GF - NAND
на замовлення 75000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3390+ | 6.45 грн |
| 74AUP1G06GF,132-NXP |
Виробник: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
товар відсутній
| NTS0101GF,132 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
| NTS0101GF,132 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
товар відсутній
| 74AUP1G11GF,132 |
|
Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6-XSON
Description: IC GATE AND 1CH 3-INP 6-XSON
на замовлення 8383 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2533+ | 8.6 грн |
| SL2S2602FTBX |
|
Виробник: NXP USA Inc.
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5000+ | 13.23 грн |
| SL2S1502FTBX |
|
Виробник: NXP USA Inc.
Description: ICODE ILT
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Wafer
Part Status: Active
Description: ICODE ILT
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Wafer
Part Status: Active
товар відсутній
| MCZ33905DD5EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Part Status: Active
товар відсутній
| MCZ33905DS5EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Part Status: Active
товар відсутній
| MCZ33905DD3EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
товар відсутній
| MCZ33905S5EK |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
товар відсутній
| MCZ33905BS5EKR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
товар відсутній
| MW7IC2220NBR1 |
|
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 2837.07 грн |
| FS32K142HFT0VLHT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 577 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 706.32 грн |
| 10+ | 534.39 грн |
| 80+ | 442.43 грн |
| CBTL05023BS,118 |
|
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
товар відсутній
| CBTL05023BS,118 |
|
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
товар відсутній
| PEMI2QFN/CR,115 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/21PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 14dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Description: FILTER RC(PI) 20 OHM/21PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 14dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3806+ | 5.62 грн |
| 74AVC16T245EV/G518 |
|
Виробник: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
на замовлення 1985 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 217+ | 98.87 грн |
| 74AVCH16T245DGV112 |
|
на замовлення 5956 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 413+ | 52.06 грн |
| 74AVC16T245DGV-Q100118 |
|
Виробник: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
товар відсутній
| 74AVCH16T245EV,518 |
|
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56VFBGA
Description: IC TRANSLATOR BIDIR 56VFBGA
на замовлення 26441 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 265+ | 80.96 грн |
| MPC885VR66-NXP |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 264 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 3883.5 грн |
| MC9S08AC60MPUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
| MC9S08AC60MFGE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
товар відсутній
| MC68360AI25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 8339.5 грн |